CN218140396U

CN218140396U - Rear cover of electronic product

Info

Publication number: CN218140396U
Application number: CN202221928944.1U
Authority: CN
Inventors: 杨洪; 章颂云
Original assignee: Dongguan Julong Gaoke Electronic Technology Co ltd
Current assignee: Dongguan Julong Gaoke Electronic Technology Co ltd
Priority date: 2022-07-22
Filing date: 2022-07-22
Publication date: 2022-12-27
Anticipated expiration: 2032-07-22

Abstract

The utility model discloses a rear cover of an electronic product, which comprises a substrate layer, a hardening layer, a first texture layer, a second texture layer, a PVD layer, an ink layer, an adhesive layer and a reinforcing layer, wherein the substrate layer is a PMMA/PC composite board and is provided with a PMMA surface and a PC surface; the hardened layer is arranged on the PMMA surface, and the first texture layer is arranged on one side, far away from the base material layer, of the surface of the hardened layer; the second texture layer is arranged on the PC surface; the PVD layer is arranged on one side, far away from the base material layer, of the second texture layer; the ink layer is arranged on one side of the PVD layer far away from the base material layer; the bonding layer is arranged on one side of the ink layer away from the base material layer; the enhancement layer is located the adhesive linkage and is kept away from the one side of substrate layer. This lid behind electronic product uses PMMA PC composite sheet as the substrate layer, can reduce the cost and the weight of lid behind the electronic product, and is equipped with first texture layer and second texture layer, has two texture structure, improves the texture performance by a wide margin, improves the outward appearance effect and the user experience degree of product, realizes dazzling the effect of various texture.

Description

Rear cover of electronic product

Technical Field

The utility model relates to a consumer electronics product technology field, more specifically relate to a lid behind electronic product.

Background

With the advent of the 5G era, more and more electronic products become necessities of life of people, and the use of the electronic products is more and more common and is developing towards the design direction of convenience, multifunction and beauty. When consumers shop for these products, the aesthetic appearance of the design has become an important purchasing factor besides the functions of software and hardware.

Metal mobile phones (such as mobile phones made of aluminum alloy materials formed by aluminum alloy mobile phone back covers) are gradually eliminated due to the influence of metal on signals, PMMA/PC composite boards cannot influence mobile phone signals due to the characteristics of plastic materials, high surface hardness (glass imitation effect) can be achieved through processes such as surface curtain coating, and colorful decoration effects can be achieved through processes such as UV transfer printing, PVD/silk screen printing and the like on the inner layers, so that the PMMA/PC composite boards are widely adopted in mobile phone back covers. But the experience effect is not good because of single texture structure behind present electronic product, hardly realizes dazzling the effect of various texture.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a lid behind electronic product, substrate layer are PMMA PC composite sheet, can avoid influence signal, and can realize that the cost of lid behind the electronic product is lower, the thickness is thinner, especially can realize two texture structure, improve the texture performance, improve outward appearance effect and user experience degree, realize dazzling the effect of various texture.

In order to achieve the purpose, the utility model discloses an electronic product rear cover, which comprises a substrate layer, a hardening layer, a first texture layer, a second texture layer, a PVD layer, an ink layer, an adhesive layer and a reinforcing layer, wherein the substrate layer is a PMMA/PC composite board and is provided with a PMMA surface and a PC surface; the hardened layer is arranged on the PMMA surface, and the first texture layer is arranged on one side, far away from the base material layer, of the surface of the hardened layer; the second texture layer is arranged on the PC surface; the PVD layer is arranged on one side, far away from the base material layer, of the second texture layer; the ink layer is arranged on one side, away from the base material layer, of the PVD layer; the bonding layer is arranged on one side of the ink layer away from the base material layer; the enhancement layer is located the adhesive linkage keeps away from the one side of substrate layer.

Compared with the prior art, the utility model discloses a lid behind electronic product to PMMA PC composite sheet is as the substrate layer, can reduce the cost and the weight of lid behind the electronic product, and is equipped with first texture layer and second texture layer, has two texture structure, improves the texture performance by a wide margin, improves the outward appearance effect and the user experience degree of product, realizes dazzling the effect of various texture.

Preferably, the thickness of the hardened layer is 10-20 microns.

Preferably, the thickness of the substrate layer is 0.05-0.175 mm.

Preferably, the thickness of the second texture layer is 8-15 microns.

Preferably, the thickness of the PVD layer is 40-450nm.

Preferably, the thickness of the ink layer is 15-45 microns.

Preferably, the thickness of the bonding layer is 10-30 microns.

Preferably, the thickness of the reinforcing layer is 0.1-0.5mm.

Preferably, the reinforcing layer comprises epoxy resin and glass fiber.

Preferably, the hardness of the side of the hardening layer away from the substrate layer is not less than 3H.

Drawings

Fig. 1 is a schematic structural view of the rear cover of the electronic product of the present invention.

Description of the symbols:

the electronic product comprises a rear cover 100 of an electronic product, a base material layer 10, a hardening layer 20, a first texture layer 30, a second texture layer 40, a PVD layer 50, an ink layer 60, an adhesive layer 70 and a reinforcing layer 80.

Detailed Description

In order to explain the technical contents, structural features, objects and effects of the present invention in detail, the following description is made in conjunction with the embodiments and the accompanying drawings.

Referring to fig. 1, the present invention provides a rear cover 100 for an electronic product, which includes a substrate layer 10, a hardened layer 20, a first texture layer 30, a second texture layer 40, a PVD layer 50, an ink layer 60, an adhesive layer 70, and a reinforcing layer 80. The electronic product may be, but is not limited to, a mobile phone, a tablet computer, etc.

Referring to fig. 1, the substrate layer 10 is a PMMA/PC composite board having a PMMA surface and a PC surface, the PMMA/PC composite board has a transparent glass imitation effect, and does not affect a mobile phone signal, and the substrate layer 10 is used as a support structure of the rear cover 100 of the electronic product, and is matched with the support function of the reinforcement layer 80, so that the substrate layer 10 can be thinner, and the rear cover 100 of the electronic product can be thinner and more resistant to falling. Preferably, the thickness of the substrate layer 10 may be, but is not limited to, 0.05-0.175 mm, for example, the thickness of the substrate layer 10 may be, but is not limited to, 0.05mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.175mm.

Referring to fig. 1, the hardened layer 20 is disposed on the PMMA surface, and specifically, the hardened layer 20 is formed by coating the hardened solution on the PMMA surface of the substrate layer 10 by a roll-to-roll coating apparatus, and then baking to volatilize the solvent, so that the hardened layer 20 has improved compression resistance and wear resistance. In a preferred embodiment, the hardness of the side of the hardened layer 20 away from the substrate layer 10 is not less than 3H; in another preferred embodiment, the wear resistance of the steel wool on the side of the surface of the hardened layer 20 away from the substrate layer 10 under the external force of 1KG is not less than 500 times. Preferably, the thickness of the hardened layer 20 may be, but is not limited to, 10-20 microns, for example, the hardened layer 20 may be, but is not limited to, 10 microns, 11 microns, 12 microns, 13 microns, 14 microns, 15 microns, 16 microns, 17 microns, 18 microns, 19 microns, 20 microns.

Referring to fig. 1, the first texture layer 30 is disposed on a side of the surface of the hardened layer 20 away from the substrate layer 10, that is, the first texture layer 30 is formed on the surface of the hardened layer 20, for example, in a preferred embodiment, after the solvent is evaporated by baking to form the hardened layer 20, a rubbing film with a desired texture structure is laminated on the surface of the hardened layer 20, and is pre-cured by an LED lamp, and the rubbing film is removed to obtain the first texture layer 30.

Referring to fig. 1, the second texture layer 40 is disposed on the PC surface, and the second texture layer 40 may be formed on the PC surface of the substrate layer 10 by using a UV transfer process, but is not limited thereto, and can also be realized by using a laser technology, and the second texture layer 40 has a reflection effect on light. The second texture layer 40 may include, but is not limited to, patterns, words, and the like, and may also be a combination of patterns and words. Further, the thickness of the second texture layer 40 is 8-15 microns, for example, the thickness of the second texture layer 40 may be, but is not limited to, 8 microns, 9 microns, 10 microns, 11 microns, 12 microns, 13 microns, 14 microns, 15 microns.

Referring to fig. 1, the PVD layer 50 is disposed on a side of the second texture layer 40 away from the substrate layer 10, and specifically, but not limited to, the PVD layer 50 is formed on the surface of the second texture layer 40 by magnetron sputtering. In a preferred embodiment, the PVD layer 50 comprises silicon and niobium, such as by magnetron sputtering, on the surface of the second texture layer 40 to form the PVD layer 50. Further, the thickness of the PVD layer 50 is 40-450nm, preferably 80-400nm, for example, the thickness of the PVD layer 50 may be, but not limited to, 40nm, 80nm, 120nm, 160nm, 200nm, 240nm, 280nm, 320nm, 360nm, 400nm, 450nm.

Referring to fig. 1, the ink layer 60 is disposed on a side of the PVD layer 50 away from the substrate layer 10, specifically, the ink layer 60 is formed on the surface of the PVD layer 50 by silk-screen printing or spraying, and the PVD layer 50 is protected by the ink layer 60. In a preferred embodiment, the ink layer 60 is preferably water-based ink, but may also be oil-based ink, and may be selected from inks of various colors for silk-screen printing to achieve various color pearlescent effects, and a flame retardant material may be added to the ink to improve the fire-retardant property. Further, the thickness of the ink layer 60 is 15-45 microns, such as the thickness of the ink layer 60 can be, but is not limited to, 15 microns, 20 microns, 25 microns, 30 microns, 35 microns, 40 microns, 45 microns.

Referring to fig. 1, the bonding layer 70 is disposed on a side of the ink layer 60 away from the substrate layer 10, the ink layer 60 and the reinforcing layer 80 are bonded by the bonding layer 70, and specifically, glue may be coated on the surface of the ink layer 60 by a roll coating apparatus to form the bonding layer 70. Further, the thickness of the adhesive layer 70 is 10-30 microns, such as the thickness of the adhesive layer 70 can be, but is not limited to, 10 microns, 12 microns, 14 microns, 16 microns, 18 microns, 20 microns, 22 microns, 24 microns, 26 microns, 28 microns, 30 microns.

Referring to fig. 1, the reinforcing layer 80 is disposed on a side of the adhesive layer 70 away from the substrate layer 10, and the reinforcing layer 80 has a supporting function, so that the substrate layer 10 can be thinner, and the reinforcing layer 80 is combined on the surface of the adhesive layer 70 by a UV transfer apparatus. Preferably, the reinforcing layer 80 includes epoxy resin and glass fiber, the glass fiber not only can provide fiber texture to achieve a richer colorful texture effect, but also forms the reinforcing layer 80 to enhance the strength of the product, and of course, other high molecular compounds can be contained in the reinforcing layer 80. Further, the thickness of the reinforcing layer 80 is 0.1 to 0.5mm, for example, the thickness of the reinforcing layer 80 may be, but not limited to, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm.

The utility model discloses among the technical scheme of lid 100 behind the electronic product to PMMA PC composite sheet is as substrate layer 10, can reduce behind the electronic product cost and the weight of lid 100, and is equipped with first texture layer 30 and second texture layer 40, has double texture structure, improves the texture performance by a wide margin, improves the outward appearance effect and the user experience degree of product, realizes dazzling the effect of various textures.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention, so that the present invention will not be limited by the accompanying claims.

Claims

1. An electronic product rear cover, comprising:

the base material layer is a PMMA/PC composite board and is provided with a PMMA surface and a PC surface;

the hardening layer is arranged on the PMMA surface;

the first texture layer is arranged on one side, far away from the base material layer, of the surface of the hardening layer;

the second texture layer is arranged on the PC surface;

the PVD layer is arranged on one side, far away from the base material layer, of the second texture layer;

the ink layer is arranged on one side, away from the base material layer, of the PVD layer;

the bonding layer is arranged on one side, far away from the base material layer, of the ink layer;

the enhancement layer is located the adhesive linkage keeps away from one side of substrate layer.

2. The electronic product rear cover according to claim 1, wherein the hardened layer has a thickness of 10 to 20 μm.

3. The electronic product rear cover of claim 1, wherein the thickness of the substrate layer is 0.05-0.175 mm.

4. The electronic product rear cover of claim 1, wherein the thickness of the second texture layer is 8-15 microns.

5. The electronic product back cover of claim 1, wherein the PVD layer has a thickness of 40 to 450nm.

6. The electronic product rear cover of claim 1, wherein the ink layer has a thickness of 15-45 microns.

7. The electronic product rear cover according to claim 1, wherein the adhesive layer has a thickness of 10 to 30 μm.

8. The electronic product rear cover according to claim 1, wherein the thickness of the reinforcing layer is 0.1-0.5mm.

9. The electronic article back cover of claim 1, wherein the reinforcement layer comprises epoxy and fiberglass.

10. The electronic product rear cover according to claim 1, wherein a side of the hardened layer away from the base material layer has a hardness of not less than 3H.