CN218115599U

CN218115599U - Etching device for fine metal mask plate

Info

Publication number: CN218115599U
Application number: CN202222076517.1U
Authority: CN
Inventors: 白晓鹏; 李泰亨; 申阳; 王丹宇; 赵方方
Original assignee: Yi'an Aifu Wuhan Technology Co ltd
Current assignee: Yi'an Aifu Wuhan Technology Co ltd
Priority date: 2022-08-04
Filing date: 2022-08-04
Publication date: 2022-12-23
Anticipated expiration: 2032-08-04

Abstract

The utility model provides an etching device for a fine metal mask plate, which comprises a main body, a first clamp, a second clamp and a spraying assembly; the first clamp is arranged on the main body; the second clamp is arranged on the main body and is positioned right above the first clamp, a diaphragm plate is arranged between the second clamp and the first clamp, and the surface of the diaphragm plate is arranged along the direction of the plumb line; the two spraying assemblies are symmetrically arranged on the main body, and respectively align to the two plate surfaces of the membrane plate and respectively spray etching liquid towards the two plate surfaces; erect the lamina membranacea and make two faces of lamina membranacea face respectively to the spray assembly through anchor clamps from top to bottom to can spray etching solution to two faces of lamina membranacea simultaneously and realize etching operation simultaneously, thereby shorten the process flow by a wide margin and make the etching effect of two faces of lamina membranacea more have the uniformity.

Description

Etching device for fine metal mask plate

Technical Field

The utility model relates to a mask plate etching technical field especially relates to an etching device for meticulous metal mask plate.

Background

FMM (fine metal mask) is an indispensable material for evaporating organic light emitting layers in the OLED process; the FMM is a thin INVAR metal alloy with dense and hemp holes distributed on it. In the OLED evaporation equipment, the RGB material forms a pixel light emitting layer in the designated area of the LTPS backboard through the holes.

The current chemical etching process for preparing FFM comprises the following steps: substrate cleaning, photoresist coating, double-sided exposure, development, postbaking, first etching, etching barrier layer coating (protecting the first etching pattern), second etching and photoresist stripping. The patent document CN212833993U discloses a common half-etching mask in the current technology.

In the traditional process, two times of etching are carried out, an etching barrier layer is coated on the surface of the substrate after the first etching (the substrate is protected from being etched in the second etching process), and then the second etching is carried out; the two-step etching is adopted because the etching requirements of the two sides of the FMM are different, and particularly the parameters such as the opening size of the holes on the two sides of the FMM facing the LTPS back plate and the FMM facing the evaporation source, the etching depth and the like are different in detail. However, the two-step etching process requires a long time, and needs to coat an etching barrier layer once, which results in high overall manufacturing cost.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides an etching device for meticulous metal mask board for solve present technology and can't etch the two sides of mask board simultaneously, thereby cause the problem that the process is complicated.

The technical scheme of the utility model is realized like this: the utility model provides an etching device for a fine metal mask plate, which comprises a main body, a first clamp, a second clamp and a spraying assembly, wherein the first clamp is arranged on the main body; the first clamp is arranged on the main body; the second clamp is arranged on the main body and is positioned right above the first clamp, a diaphragm plate is arranged between the second clamp and the first clamp, and the surface of the diaphragm plate is arranged along the direction of the plumb line; on two spray assembly symmetries set up the main part, two spray assembly aimed at two faces of lamina membranacea respectively and spray etching liquid respectively towards two faces.

On the basis of above technical scheme, preferred, the main part is cavity box body or hollow shell, can store the etching solution in the main part, sets up first anchor clamps and second anchor clamps in the main part, and the diaphragm sets up above the liquid level of etching solution.

More preferably, the spray assembly comprises a fixed seat and a spray head; the two fixing seats are symmetrically arranged in the main body and respectively face the two plate surfaces of the membrane plate; a plurality of shower nozzles are evenly arranged on the fixing base, and a plurality of shower nozzles on the same fixing base can spray etching solution to one of the plate faces of the diaphragm plate simultaneously.

Further preferably, the spray assembly further comprises a conduit and a pump body; one end of the guide pipe is communicated with the main body and is positioned below the liquid level, the other end of the guide pipe penetrates through the main body and extends to the position above the liquid level, and one end of the guide pipe positioned above the liquid level is simultaneously communicated with a plurality of spray heads on the same fixed seat; the pump body is arranged on the guide pipe and close to one end of the guide pipe communicated with the main body, and the pump body is used for pumping etching liquid in the main body to each spray head through the guide pipe.

Further preferably, the device also comprises a return pipe and a one-way valve; one end of the return pipe is communicated with the middle part of the guide pipe, the other end of the return pipe penetrates through the main body and is inserted into the main body, and the return pipe is used for enabling the etching liquid in the guide pipe to flow back into the main body; the one-way valve is arranged on the return pipe and is used for controlling the on-off of the return pipe.

It is further preferred that the end of the return tube inserted into the body is above the liquid level.

Preferably, the spray assembly further comprises a pressure gauge and an adjusting valve, the pressure gauge is arranged on the guide pipe and is close to the communication end of the guide pipe and the spray head, and the pressure gauge is used for detecting the pressure of the etching solution conveyed to the spray head in the guide pipe; the regulating valve is arranged on the guide pipe and positioned on one side of the pump body, which is far away from the main body, and the regulating valve is used for regulating the unit flow of the etching liquid flowing in the guide pipe.

On the basis of the technical scheme, the mask plate is preferred to further comprise a plurality of light resistance parts, the light resistance parts are symmetrically attached to the two plate surfaces of the mask plate, a gap is reserved between the light resistance parts on the same plate surface, and the light resistance is used for shielding part of the plate surface and enabling the part of the plate surface not to be in contact with etching liquid.

The utility model discloses an etching device for meticulous metal mask board has following beneficial effect for prior art:

the utility model discloses an upper and lower anchor clamps erect the lamina membranacea and make two faces of lamina membranacea respectively towards spray assembly to can spray etching solution to two faces of lamina membranacea simultaneously and realize etching operation simultaneously, thereby shortened the process flow by a wide margin and made the etching effect of two faces of lamina membranacea more have the uniformity.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic front sectional view of the etching apparatus of the present invention.

In the figure: 1. a main body; 2. a first clamp; 3. a second clamp; 4. a spray assembly; 41. a fixed seat; 42. a spray head; 43. a conduit; 44. a pump body; 45. a return pipe; 46. a one-way valve; 47. a pressure gauge; 48. adjusting a valve; 5. and (7) photoresist.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work all belong to the protection scope of the present invention.

The first embodiment is as follows:

as shown in fig. 1, the utility model discloses an etching device for meticulous metal mask board, including main part 1, first anchor clamps 2, second anchor clamps 3, spray assembly 4 and photoresistance 5.

Wherein, the diaphragm in this case is the INVAR metal alloy sheet that has not been subjected to the etching yet.

First anchor clamps 2 set up in main part 1, second anchor clamps 3 set up in main part 1 and lie in directly over first anchor clamps 2, two anchor clamps fix the diaphragm centre gripping between the two about first anchor clamps 2 and the formation of second anchor clamps 3, in order to restrict the diaphragm can not break away from anchor clamps, can the symmetry set up more shallow recess on first anchor clamps 2 and second anchor clamps 3 carry the terminal surface of diaphragm, not only can restrict the diaphragm and remove, and the face that also can not hinder the diaphragm is complete receives the etching. A membrane plate is arranged between the second clamp 3 and the first clamp 2, and the surface of the membrane plate is arranged along the direction of the plumb line, so that two surfaces of the membrane plate are exposed at the same time; it should be noted that although the membrane plate may be disposed obliquely, the membrane plate is preferably disposed vertically in order to ensure the uniformity of etching of the two plate surfaces.

On two spray assembly 4 symmetry set up main part 1, two spray assembly 4 aimed at two faces of lamina membranacea respectively and spray etching solution towards two faces respectively.

The photoresist 5 is symmetrically attached to the two plate surfaces of the membrane plate, a gap is reserved between the photoresist 5 on the same plate surface, and the photoresist 5 is used for shielding part of the plate surface and preventing the part of the plate surface from contacting with the etching solution.

Example two:

on the theoretical basis of the first embodiment, the specific implementation is that the main body 1 is a hollow box or a hollow shell, so that the etching solution can be stored in the main body 1, the first clamp 2 and the second clamp 3 are arranged in the main body 1, and the membrane is arranged above the liquid level of the etching solution, thereby preventing the membrane from directly contacting with the etching solution in the main body 1.

Example three:

on the basis of the second embodiment, specifically, the spraying assembly 4 includes a fixing base 41, a spraying head 42, a conduit 43 and a pump body 44.

Wherein, two fixing bases 41 symmetry sets up in main part 1 and respectively faces two faces of lamina membranacea, and fixing base 41 is used for each shower nozzle 42 of location installation.

A plurality of shower nozzles 42 are arranged vertically and horizontally and are evenly arranged on the fixing base 41 in a matrix manner, a plurality of shower nozzles 42 on the same fixing base 41 can spray etching solution to one of the plate surfaces of the membrane plate at the same time, and usually, the shower nozzles 42 on the same row can spray the plate surface between two adjacent photoresistors 5.

One end of the conduit 43 is communicated with the main body 1 and is positioned below the liquid level, the other end of the conduit 43 penetrates through the main body 1 and extends to above the liquid level, and one end of the conduit 43 above the liquid level is simultaneously communicated with a plurality of spray heads 42 on the same fixed seat 41.

A pump body 44 is disposed on the guide pipe 43 and communicates with one end of the main body 1 near the guide pipe 43, and the pump body 44 is used for pumping the etching solution in the main body 1 to each spray head 42 through the guide pipe 43.

Example four:

on the basis of the third embodiment, since the etching process does not always spray the plate surface of the membrane plate, but the spraying is stopped after a period of time, and the etching solution can sufficiently react with the plate surface, the spraying assembly 4 further includes a return pipe 45 and a check valve 46.

Wherein, one end of the return pipe 45 is communicated with the middle part of the guide pipe 43, the other end of the return pipe 45 penetrates through the main body 1 and is inserted into the main body 1, and the return pipe 45 is used for making the etching liquid in the guide pipe 43 return to the main body 1. Generally, the end of the return pipe 45 inserted into the main body 1 is positioned above the liquid surface, not in the liquid surface, so that the etching liquid can smoothly flow back.

A check valve 46 is provided on the return pipe 45, and the check valve 46 is used to control the opening and closing of the return pipe 45.

Example five:

in addition to the fourth embodiment, the pressure of the etching solution sprayed from the spray head 42 needs to be controlled to prevent the etching solution from breaking through the membrane, so that the spray assembly 4 further includes a pressure gauge 47 and an adjusting valve 48.

Wherein, a pressure gauge 47 is disposed on the conduit 43 and near the communication end of the conduit 43 and the spray head 42, the pressure gauge 47 is used for detecting the pressure of the etching solution conveyed to the spray head 42 in the conduit 43.

The regulating valve 48 is provided on the pipe 43 on the side of the pump body 44 away from the main body 1, and the regulating valve 48 regulates the unit flow rate of the etching liquid flowing through the pipe 43, and controls the pressure of the discharged liquid by regulating the unit flow rate of the etching liquid.

Example six:

any combination of embodiments one to five is also included in the case where there is no technical conflict.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An etching device for a fine metal mask, comprising a main body (1), characterized in that: the device also comprises a first clamp (2), a second clamp (3) and a spraying assembly (4);

the first clamp (2) is arranged on the main body (1);

the second clamp (3) is arranged on the main body (1) and is positioned right above the first clamp (2), a diaphragm plate is arranged between the second clamp (3) and the first clamp (2), and the plate surface of the diaphragm plate is arranged along the direction of a plumb line;

two on the main part (1) is arranged to spraying component (4) symmetry, two spraying component (4) aim at two faces of lamina membranacea respectively and spray etching solution towards two faces respectively.

2. An etching apparatus for fine metal mask according to claim 1, wherein: the main part (1) is a hollow box body or a hollow shell, the etching liquid can be stored in the main part (1), a first clamp (2) and a second clamp (3) are arranged in the main part (1), and the diaphragm plate is arranged on the liquid level of the etching liquid.

3. An etching apparatus for fine metal mask according to claim 2, wherein: the spraying assembly (4) comprises a fixed seat (41) and a spray head (42);

the two fixed seats (41) are symmetrically arranged in the main body (1) and respectively face the two plate surfaces of the diaphragm plate;

the plurality of spray heads (42) are uniformly distributed on the fixed seat (41), and the plurality of spray heads (42) on the same fixed seat (41) can spray etching liquid to one of the plate surfaces of the membrane plate at the same time.

4. An etching apparatus for fine metal mask according to claim 3, wherein: the spraying assembly (4) further comprises a guide pipe (43) and a pump body (44);

one end of the guide pipe (43) is communicated with the main body (1) and is positioned below the liquid level, the other end of the guide pipe (43) penetrates through the main body (1) and extends to the position above the liquid level, and one end of the guide pipe (43) positioned above the liquid level is simultaneously communicated with a plurality of spray heads (42) on the same fixed seat (41);

the pump body (44) is arranged on the guide pipe (43) and is close to one end of the guide pipe (43) communicated with the main body (1), and the pump body (44) is used for pumping the etching liquid in the main body (1) to each spray head (42) through the guide pipe (43).

5. An etching apparatus for fine metal masks according to claim 4, characterized in that: also comprises a return pipe (45) and a one-way valve (46);

one end of the return pipe (45) is communicated with the middle part of the guide pipe (43), the other end of the return pipe (45) penetrates through the main body (1) and is inserted into the main body (1), and the return pipe (45) is used for enabling the etching liquid in the guide pipe (43) to return to the main body (1);

the check valve (46) is arranged on the return pipe (45), and the check valve (46) is used for controlling the on-off of the return pipe (45).

6. An etching apparatus for fine metal mask according to claim 5, wherein: one end of the return pipe (45) inserted into the main body (1) is positioned above the liquid level.

7. An etching apparatus for fine metal mask according to claim 5, wherein: the spraying assembly (4) further comprises a pressure gauge (47) and an adjusting valve (48), the pressure gauge (47) is arranged on the guide pipe (43) and is close to the communication end of the guide pipe (43) and the spray head (42), and the pressure gauge (47) is used for detecting the pressure of the etching liquid conveyed to the spray head (42) in the guide pipe (43);

the regulating valve (48) is arranged on the guide pipe (43) and is positioned on one side of the pump body (44) far away from the main body (1), and the regulating valve (48) is used for regulating the unit flow rate of the etching liquid flowing in the guide pipe (43).

8. An etching apparatus for fine metal mask according to claim 1, wherein: the film plate is characterized by further comprising a plurality of light resistance (5) parts, wherein the light resistance (5) parts are symmetrically attached to two plate surfaces of the film plate, a gap is reserved between the light resistance (5) parts located on the same plate surface, and the light resistance (5) is used for shielding part of the plate surface and enabling the part of the plate surface not to be in contact with etching liquid.