CN218103998U - Heat dissipation structure for main board of pipeline machine - Google Patents
Heat dissipation structure for main board of pipeline machine Download PDFInfo
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- CN218103998U CN218103998U CN202222064322.5U CN202222064322U CN218103998U CN 218103998 U CN218103998 U CN 218103998U CN 202222064322 U CN202222064322 U CN 202222064322U CN 218103998 U CN218103998 U CN 218103998U
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- heat dissipation
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- main part
- pipeline machine
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Abstract
The utility model discloses a pipeline machine correlation technique field's a heat radiation structure for pipeline machine mainboard, including heat dissipation main part and radiating groove, one side of heat dissipation main part is provided with the chip, the opposite side fixedly connected with mainboard of chip, the heat dissipation main part adopts the aluminum alloy material, the heat dissipation main part comprises heat dissipation frame, connecting seat and heat radiation fins, integrated into one piece is connected with four on the heat dissipation frame the connecting seat, be provided with hexagonal boss on the connecting seat, one side of heat radiation fins is provided with the radiating groove, heat radiation fins with radiating groove interval distribution. The utility model has the advantages of reasonable design, installation convenient to use, through buffer spring's design, when guaranteeing heat dissipation, increased the anti-seismic performance of device, the practicality is stronger, through the design of end cap, water conservancy diversion hole, no. two water conservancy diversion holes and guiding gutter, is convenient for annotate heat conduction silica gel to the device, very big improvement later maintenance's work efficiency, the economic nature is better.
Description
Technical Field
The utility model belongs to the technical field of the pipeline is relevant, specifically speaking relates to a heat radiation structure for pipeline machine mainboard.
Background
With the continuous development of economy, the material living water of people is higher and higher, and the requirement on healthy diet is more urgent. The pipeline machine is also called a pipeline water dispenser and a wall-mounted pipeline water dispenser, is generally used for families, offices and the like, can filter tap water, improves the quality of the tap water, and is popular among people. Traditional pipeline owner's board is less because output, and the heat of production is less, so does not set up heat radiation structure, but along with the application of internet of things in the pipeline machine, the mainboard power of pipeline machine promotes by a wide margin, and the performance and the life of pipeline machine can be influenced then to the high temperature.
In view of this, the present invention is provided.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model lies in overcoming the not enough of prior art, provides a heat radiation structure for pipeline machine mainboard, for solving above-mentioned technical problem, the utility model discloses a technical scheme's basic design is:
the utility model provides a heat radiation structure for pipeline machine mainboard, includes heat dissipation main part and radiating groove, one side of heat dissipation main part is provided with the chip, the opposite side fixedly connected with mainboard of chip, the heat dissipation main part adopts aluminum alloy material, the heat dissipation main part comprises heat dissipation frame, connecting seat and heat radiation fins, integrated into one piece is connected with four on the heat dissipation frame the connecting seat, be provided with hexagonal boss on the connecting seat, one side of heat radiation fins is provided with the radiating groove, heat radiation fins with the radiating groove interval distribution, through the heat dissipation main part with the chip is pressed close to, is convenient for right the chip dispels the heat, reduces the temperature of chip, hexagonal boss is convenient for right the heat dissipation main part is fixed, heat radiation fins with the radiating groove is convenient for dispel the heat.
As a further aspect of the present invention: the heat dissipation frame is close to one side of chip is provided with the guiding gutter, the guiding gutter is the design of S type branch, the guiding gutter is embedded to have heat conduction silica gel, the guiding gutter plays the effect of water conservancy diversion, heat conduction silica gel is convenient for carry out the heat transfer.
As the utility model discloses further scheme again: the connecting device is characterized in that a connecting screw is embedded in one side of the connecting seat, the connecting screw is sleeved with a main board and a buffer spring, the buffer spring is located between the main board and the end of the connecting screw, the connecting screw plays a role in fixed connection, the buffer spring plays a role in buffer protection, and the anti-vibration performance of the device is improved.
As a further aspect of the present invention: the radiating frame is provided with a first flow guide hole and a second flow guide hole in a drilling mode, the first flow guide hole and the second flow guide hole are communicated with the flow guide groove, the first flow guide hole and the second flow guide hole play a flow guide role, and the heat conduction silica gel is convenient to inject.
As the utility model discloses further scheme again: a water conservancy diversion hole with the other end in second water conservancy diversion hole all is embedded to have the end cap, the end cap adopts rubber material, the end cap plays sealed protection's effect.
After the technical scheme is adopted, compared with the prior art, the utility model following beneficial effect has.
The utility model has the advantages of reasonable design, installation convenient to use, through buffer spring's design, when guaranteeing the heat dissipation, increased the anti-seismic performance of device, the practicality is stronger.
The utility model discloses a design of end cap, water conservancy diversion hole, no. two water conservancy diversion holes and guiding gutter is convenient for annotate heat conduction silica gel to the device, very big improvement the work efficiency of later maintenance, the economic nature is better.
The following describes embodiments of the present invention in further detail with reference to the attached drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without undue limitation to the invention. It is obvious that the drawings in the following description are only some embodiments and that for a person skilled in the art, other drawings can also be derived from them without inventive effort. In the drawings:
fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a front view of the present invention;
fig. 3 is a bottom view of the present invention;
fig. 4 is a side view of the present invention.
In the figure: 1-a main board; 2-a connection screw; 3-a heat dissipation main body; 4-a buffer spring; 5-plug; 6-chip; 7-a heat dissipation frame; 8-a connecting seat; 9-radiating fins; 10-a heat dissipation groove; 11-a diversion hole; 12-a diversion trench; 13-second diversion holes; 14-hexagonal boss; 15-heat conducting silica gel.
It should be noted that the drawings and the description are not intended to limit the scope of the inventive concept in any way, but rather to illustrate the inventive concept by those skilled in the art with reference to specific embodiments.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments, and the following embodiments are used for illustrating the present invention, but do not limit the scope of the present invention.
As shown in fig. 1 to 4, a heat dissipation structure for a motherboard of a pipeline machine includes a heat dissipation main body 3 and a heat dissipation groove 10, a chip 6 is disposed on one side of the heat dissipation main body 3, a motherboard 1 is fixedly connected to the other side of the chip 6, the heat dissipation main body 3 is made of an aluminum alloy material, the heat dissipation main body 3 is composed of a heat dissipation frame 7, a connection seat 8 and heat dissipation fins 9, four connection seats 8 are integrally formed on the heat dissipation frame 7, hexagonal bosses 14 are disposed on the connection seat 8, the heat dissipation groove 10 is disposed on one side of each heat dissipation fin 9, the heat dissipation fins 9 and the heat dissipation groove 10 are distributed at intervals, the heat dissipation main body 3 and the chip 6 are close to each other, heat dissipation of the chip 6 is facilitated, the temperature of the chip 6 is reduced, the hexagonal bosses 14 facilitate fixing of the heat dissipation main body 3, and the heat dissipation fins 9 and the heat dissipation groove 10 facilitate heat dissipation.
Wherein, one side that heat dissipation frame 7 is close to chip 6 is provided with guiding gutter 12, and guiding gutter 12 is the design of S type branch, and guiding gutter 12 is embedded to have heat conduction silica gel 15, and guiding gutter 12 plays the effect of water conservancy diversion, and heat conduction silica gel 15 is convenient for carry out the heat transfer.
Connecting screw 2 is embedded to one side of connecting seat 8, and the cover is equipped with mainboard 1 and buffer spring 4 on connecting screw 2, and buffer spring 4 is located between mainboard 1 and connecting screw 2's the end, and connecting screw 2 plays fixed connection's effect, and buffer spring 4 plays the effect of buffering protection, has improved the anti-seismic performance of device.
A first diversion hole 11 and a second diversion hole 13 are drilled on the heat dissipation frame 7, the first diversion hole 11 and the second diversion hole 13 are communicated with the diversion trench 12, and the first diversion hole 11 and the second diversion hole 13 play a role in diversion so as to facilitate injection of the heat conduction silica gel 15.
The other end of the first diversion hole 11 and the other end of the second diversion hole 13 are both embedded with a plug 5, the plug 5 is made of rubber, and the plug 5 plays a role in sealing protection.
The utility model discloses a theory of operation is: during the use, pack heat conduction silica gel 15 in guiding gutter 12, fix the device in mainboard 1 suitable position through connecting screw 2, make the device paste tightly with chip 6, in the use, heat radiation fins 9 can carry out the heat exchange with the heat that chip 6 produced and ambient air, and then play the effect of cooling, and simultaneously, buffer spring 4 can effectually reduce the influence of vibrations to the device, when needs are maintained the device, take off end cap 5, from a guiding hole 11 or No. two guiding holes 13 filling heat conduction silica gel 15 can, it is very convenient to maintain, device structural design is reasonable, easy to install and use, design through buffer spring 4, when guaranteeing radiating, the anti-seismic performance of device has been increased, the practicality is stronger, through end cap 5, a guiding hole 11, no. two guiding holes 13 and guiding gutter 12's design, be convenient for filling heat conduction silica gel 15 to the device, very big improvement later maintenance's work efficiency, economic nature is better.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and although the present invention has been disclosed with reference to the above preferred embodiment, but not to limit the present invention, any person skilled in the art can make some changes or modifications to equivalent embodiments without departing from the scope of the present invention, and any simple modification, equivalent change and modification made to the above embodiments by the technical spirit of the present invention still fall within the scope of the present invention.
Claims (5)
1. The utility model provides a heat radiation structure for pipeline machine mainboard, includes heat dissipation main part (3) and radiating groove (10), its characterized in that, one side of heat dissipation main part (3) is provided with chip (6), opposite side fixedly connected with mainboard (1) of chip (6), heat dissipation main part (3) adopt the aluminum alloy material, heat dissipation main part (3) comprise heat dissipation frame (7), connecting seat (8) and heat radiation fins (9), integrated into one piece is connected with four on heat dissipation frame (7) connecting seat (8), be provided with hexagonal boss (14) on connecting seat (8), one side of heat radiation fins (9) is provided with radiating groove (10), heat radiation fins (9) with radiating groove (10) interval distribution.
2. The heat dissipation structure for the main board of the pipeline machine according to claim 1, wherein a diversion trench (12) is disposed on one side of the heat dissipation frame (7) close to the chip (6), the diversion trench (12) is of an S-shaped design, and a heat-conducting silica gel (15) is embedded in the diversion trench (12).
3. The heat dissipation structure for the main board of the pipeline machine according to claim 1, wherein a connection screw (2) is embedded in one side of the connection seat (8), the connection screw (2) is sleeved with the main board (1) and a buffer spring (4), and the buffer spring (4) is located between the main board (1) and the end of the connection screw (2).
4. The heat dissipation structure for the main board of the pipeline machine according to claim 2, wherein a first diversion hole (11) and a second diversion hole (13) are drilled in the heat dissipation frame (7), and the first diversion hole (11) and the second diversion hole (13) are both communicated with the diversion trench (12).
5. The heat dissipation structure for the main board of the pipeline machine according to claim 4, wherein a plug (5) is embedded in the other end of each of the first diversion hole (11) and the second diversion hole (13), and the plug (5) is made of rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222064322.5U CN218103998U (en) | 2022-08-08 | 2022-08-08 | Heat dissipation structure for main board of pipeline machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222064322.5U CN218103998U (en) | 2022-08-08 | 2022-08-08 | Heat dissipation structure for main board of pipeline machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218103998U true CN218103998U (en) | 2022-12-20 |
Family
ID=84485601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222064322.5U Active CN218103998U (en) | 2022-08-08 | 2022-08-08 | Heat dissipation structure for main board of pipeline machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218103998U (en) |
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2022
- 2022-08-08 CN CN202222064322.5U patent/CN218103998U/en active Active
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