CN218103565U - Panel of heating equipment and heating equipment - Google Patents

Abstract

The utility model discloses a firing equipment's panel and firing equipment, the panel includes: a substrate having a thermal conductivity of less than or equal to 1W/(m.K), the substrate including a thinned region and having a working face; and the toughening layer is arranged on one side of the substrate, which is back to the working surface, and surrounds the thinning area. According to the panel provided by the embodiment of the utility model, the mechanical strength and toughness of the substrate can be improved by arranging the toughening layer, so that the substrate is not easy to crack; through setting up the attenuate region and toughening layer encircles the regional setting of attenuate, can improve the accuracy and the sensitivity of temperature measurement, heating equipment can in time make a response under unusual user state, avoids the base plate to work for a long time under unusual high temperature and leads to the fracture, and toughening layer can reduce the regional external force that receives of attenuate, can avoid again toughening layer to attract external force to the attenuate region, has improved the regional mechanical stability of attenuate and the stability of toughening layer.

Description

Panel of heating equipment and heating equipment

Technical Field

The utility model relates to a kitchen appliance technical field, more specifically relates to a firing equipment's panel and firing equipment.

Background

In the related art, the material selection of the heating device panel is greatly affected by thermal shock and the like, so that some materials are difficult to be directly used as the panel. For example, the expansion coefficient of the rock plate is high, and the rock plate is not heat-resistant and is easy to crack when cooked. In some related technologies, thermal stress is relieved by increasing the porosity of the rock plate, but the method causes the mechanical strength of the rock plate to be greatly reduced, and the risk that a user collides in the using process to cause the panel to be broken is increased.

In addition, under the influence of the forming process, the panel made of partial materials is thick and light-tight, and the panel made of partial materials is low in heat conductivity coefficient and poor in heat transfer, so that the temperature of the container to be heated is difficult to be transferred to a temperature sensing probe below through a rock plate only in a heat conduction mode, the temperature control is seriously delayed, and the panel is easy to crack when the panel is abnormally used, such as dry burning.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, an object of the utility model is to provide a panel of firing equipment, the problem that the base plate is easily cracked has been solved to the panel, and has improved the temperature measurement precision.

Another object of the utility model is to provide a firing equipment of above-mentioned panel.

According to the utility model discloses heating equipment's panel, include: a substrate having a thermal conductivity of less than or equal to 1W/(m.K), the substrate including a thinned region, and the substrate having a working face for placement of a container to be heated; the layer toughens, the layer toughens is located the backing of base plate one side of working face, just the layer toughens encircles the regional setting of attenuate.

According to the panel of the heating equipment provided by the embodiment of the utility model, the mechanical strength of the substrate can be improved by arranging the toughening layer, the toughness of the substrate is increased, and the energy of external force applied to the substrate is absorbed, so that the material selection of the substrate can be more diversified, and meanwhile, the substrate is ensured not to be easily cracked by thermal stress when being subjected to cold and hot impact, and is also prevented from being easily cracked when being subjected to mechanical impact; and through setting up the attenuate region and toughening layer encircles the regional setting of attenuate, can improve the accuracy and the sensitivity of temperature measurement, heating equipment can in time react under unusual user state, avoids the base plate to work for a long time under unusual high temperature and leads to the fracture, and toughening layer can reduce the external force that the attenuate region received, can avoid again toughening layer to attract external force to the attenuate region, has improved the regional mechanical stability of attenuate and the stability of toughening layer.

In addition, the panel of the heating device according to the above embodiment of the present invention may also have the following additional technical features:

according to some embodiments of the utility model, the attenuate is regional for the through-hole, perhaps, the regional thickness of attenuate with the ratio of the maximum thickness of base plate is more than or equal to 0.4.

According to the utility model discloses a some embodiments, the inward flange of layer toughens with form between the regional border of attenuate and predetermine the clearance, predetermine the clearance with the ratio of the regional external diameter of attenuate is more than or equal to 2.

According to the utility model discloses a some embodiments, the ratio of predetermine the clearance with the regional external diameter of attenuate is less than or equal to 9.

According to some embodiments of the utility model, the base plate has the heating workspace, the thinning region sets up the heating workspace, the inward flange on layer of toughening with the interval at the regional center of thinning is more than or equal to the radial 2/3 of heating workspace.

According to some embodiments of the present invention, the toughening layer surrounds the heating work area.

According to some embodiments of the invention, the distance between the inner edge of the toughening layer and the boundary of the heating working area is less than or equal to 1/3 of the radius of the heating working area.

According to some embodiments of the present invention, the temperature resistance of the toughening layer is 300 to 500 ℃.

According to some embodiments of the utility model, the layer that toughens passes through viscose layer bonding setting and is in on the base plate.

According to some embodiments of the invention, the toughening layer is a mesh structure.

According to some embodiments of the invention, the toughening layer is a high temperature resistant inorganic material; the rock plate is a cordierite system, a mullite system or a cordierite and mullite composite material.

According to some embodiments of the invention, the porosity of the substrate is 10% to 30%. According to the utility model discloses firing equipment, a serial communication port, include heating element and according to the utility model discloses firing equipment's panel, heating element locates toughening layer dorsad one side of base plate.

According to some embodiments of the utility model, under the heating element operating condition, the panel the working face with the surface temperature difference that the working face carried on the back mutually is less than or equal to 500 ℃.

According to some embodiments of the utility model, the heating element is in projection on the panel is located the regional of establishing that toughens layer encloses, the inward flange of toughening layer with the interval at heating element's center is less than or equal to heating element radial 6/5.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a front view of a panel according to an embodiment of the present invention;

fig. 2 is a bottom view of a panel according to an embodiment of the present invention.

Reference numerals are as follows:

a panel 100; a substrate 10; thinning the region 101; a toughening layer 20; a hollowed-out portion 201.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and for simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

In the description of the invention, "a first feature" or "a second feature" may include one or more of the features, "a plurality" means two or more, the first feature may be "on" or "under" the second feature, including the first and second features being in direct contact, or may include the first and second features being in contact through another feature not in direct contact, but in between, and the first feature being "on", "above" or "over" the second feature may include the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature.

A panel 100 of a heating apparatus and a heating apparatus having the same according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

In some embodiments, the heating device may be an induction cooker or the like, wherein the induction cooker does not need open fire heating, and the heating component (such as a heating coil panel) is used for generating a magnetic field to generate eddy current heating on the surface of the magnetic conductive cookware. The induction cooker is convenient to cook and high in safety.

In the related art, the material selection of the heating device panel is greatly affected by thermal shock and the like, so that some materials are difficult to be directly used as the panel. For example, in some related art, a lithium-aluminum-silicon glass ceramic material is used for a panel of a heating apparatus (e.g., a panel of an induction cooker), which has a low expansion coefficient and high strength, so that there is no fear of cracking when cooking on the glass ceramic. With the development of the times, the rock plate material is pursued by young people due to the unique appearance and texture, and the rock plate instead of the microcrystalline panel becomes a hot development direction of the market. But the expansion coefficient of the rock plate is high, and the rock plate is not heat-resistant and easy to crack during cooking, so that great potential safety hazards exist.

In other related techniques, by introducing voids in the rock plate, the voids can relieve thermal stresses and avoid cracking as the rock plate expands when heated. However, the mechanical strength and porosity of rock plates are inversely proportional. Along with the increase of porosity, the mechanical strength of rock plate reduces by a wide margin, and the user takes place to collide with in the use and leads to the broken risk increase of panel.

Based on this, the utility model provides a panel 100 can improve the problem that panel 100 does not heat-resisting fracture and mechanical strength are low, improves the use in the user use and experiences and the security performance.

According to the utility model discloses heating equipment includes heating element and according to the utility model discloses heating equipment's of embodiment panel 100. The heating element may be disposed at one side of the panel 100 in the thickness direction, such as the lower side shown in fig. 1, so that the magnetic conductive pot can be heated by the heating element while waiting for the heating container to be placed on the panel 100.

Referring to fig. 1 and 2, a panel 100 of a heating apparatus according to an embodiment of the present invention may include: a substrate 10 and a toughening layer 20.

Specifically, the substrate 10 has a working surface for placing a container to be heated, and the toughening layer 20 is disposed on a side of the substrate 10 facing away from the working surface, i.e., on a side of the substrate 10 facing the heating element, which is located on a side of the toughening layer 20 facing away from the substrate 10, e.g., on a lower side as viewed in fig. 1. Through locating toughening layer 20 at the non-working face of base plate 10, make toughening layer 20 can strengthen the toughness and the mechanical strength of base plate 10, and toughening layer 20 can absorb the energy of the external force that base plate 10 receives, improves the homogeneity of base plate 10 atress, avoids base plate 10 to be fragile because of colliding with, reduces base plate 10 and takes place cracked possibility to toughening layer 20 can protect base plate 10 can not be by the thermal stress pulling crack when receiving cold and hot impact.

In some embodiments, the toughening layer 20 is disposed at least at an edge portion of the substrate 10. That is, the toughening layer 20 may be provided only at the edge portion where the substrate 10 is more likely to crack, or the toughening layer 20 may be provided on the entire non-working surface of the non-thinned region of the substrate 10. The toughening layer 20 can improve the absorption capacity of the external force applied to the edge of the substrate 10, reduce the speed of crack propagation at the edge of the substrate 10, and reduce the risk of cracking at the edge of the substrate 10.

The mechanical strength of the central portion of the substrate 10 is found to be 20% to 50% higher than that of the corners. This is because the cracks tend to release stress at the edges, and the resistance to the cracks propagating to the edges when the substrate 10 at the edges is subjected to mechanical impact tends to be small, and thus the cracks are prone to crack; on the contrary, when the substrate 10 at the center is subjected to mechanical impact, the resistance to crack propagation to the edge tends to be large, and thus cracking is not easy.

Therefore, the embodiment of the present invention adopts a scheme of at least providing the toughening layer 20 on the back edge of the substrate 10 to reinforce the structural strength of the substrate 10, so that the toughening layer 20 can pertinently reinforce the structural strength of the substrate 10 near the edge region, i.e. pertinently reinforce the mechanical strength of the region which is more easily cracked under impact.

The toughening layer 20 is arranged to absorb the energy of the external force applied to the substrate 10, so that the material selection of the substrate 10 is less limited, and the substrate 10 can be made of a material with a relatively small expansion coefficient, such as microcrystalline glass, or a material with a relatively large expansion coefficient, such as a ceramic plate (e.g., a rock plate).

In some embodiments, the substrate 10 may be any material with a thermal conductivity less than or equal to 1W/(m.K). The excessive heat of the heated container to be heated is prevented from being conducted to the substrate 10 and the lower side of the substrate 10 in the heating process, so that the risk of cracking of the substrate 10 is favorably reduced, and the risk of cracking between the substrate 10 and the toughening layer 20 is favorably reduced.

In some embodiments, the substrate 10 may be a rock plate, which has more diversified and unique textures and handfeel, so that the appearance and texture of the panel 100 can be richer to meet the high requirements of the times for appearance effect. The toughening layer 20 is arranged on the non-working surface of the substrate 10, so that the toughening layer 20 can be prevented from influencing the appearance of the panel 100, and the exposed surface of the panel 100 is ensured to have the unique appearance and texture of a rock plate.

In the embodiment of the present invention, as shown in fig. 1 and fig. 2, the substrate 10 may have the thinning region 101, the thickness of the thinning region 101 is smaller than the thickness of other regions of the substrate 10, the thinning region 101 may be used to be opposite to the temperature measurement component (e.g., the temperature sensing probe) of the heating device, the toughening layer 20 is disposed around the thinning region 101, in other words, the toughening layer 20 has the hollow portion 201, and the projection of the thinning region 101 on the toughening layer 20 falls into the region where the hollow portion 201 is located.

Therefore, the toughening layer 20 is staggered with the thinning area 101, and the toughening layer 20 is staggered with the temperature measuring component, so that the temperature measuring component is not shielded from the thinning area 101, and the temperature measuring precision of the temperature measuring component on the thinning area 101 is improved, for example, the temperature measuring component can penetrate through the hollow part 201 and can be in contact with the thinning area 101 for temperature measurement. And, through setting up attenuate region 101, make base plate 10 form local thickness attenuate structure, the back of thickness attenuate, wait to heat the container and pass through attenuate region 101 and give the time of temperature measurement component with the temperature transfer and shorten greatly, avoid forming the risk that the increase of the difference in temperature increase base plate 10 that increases between the working face of base plate 10 and the non-working face takes place to break, accuse temperature response speed obtains promoting to lead to base plate 10 to ftracture under the unusual user state such as avoiding being in dry combustion for a long time.

On the other hand, when the substrate 10 is partially thinned, the impact resistance of the entire substrate 10 is lowered due to the difference in impact resistance between the thinned region 101 and the non-thinned region of the substrate 10. The impact resistance of the substrate 10 is improved by arranging the toughening layer 20 on the substrate 10, the thinning region 101 is subjected to processes such as machining, and therefore the substrate 10 may have defects such as microcracks at the thinning region 101, and at the moment, by arranging the toughening layer 20 far away from the thinning region 101, on one hand, the non-thinning region can absorb and decompose part of external force due to the existence of the toughening layer 20, and the possibility of cracking of the substrate 10 is reduced; on the other hand, the toughening layer 20 is not arranged in the thinning region 101, so that the toughening layer 20 in the non-thinning region can attract, counteract and decompose external force, the external force applied to the thinning region 101 can be reduced, and the phenomenon that the toughening layer 20 attracts the external force to the thinning region 101 when the toughening layer 20 is arranged in the thinning region 101 can be avoided, so that the mechanical stability of the thinning region 101 is improved.

In addition, the thinning area 101 is arranged to ensure the temperature measurement accuracy, and other areas of the substrate 10 can be selected with thicker thickness, so that the difficulty of the forming process is reduced, the production efficiency and the qualification rate are improved, the mechanical strength of the substrate 10 is improved, and the risk of cracking of the substrate 10 due to mechanical impact is reduced. The substrate 10 can also be selected from materials with low thermal conductivity, for example, materials with thermal conductivity less than or equal to 1W/(m.K), so that the problems of difficult temperature detection, serious temperature control delay, easy cracking during dry burning and the like can be avoided, and the diversity and safety of the material selection of the substrate 10 can be improved.

It should be noted that "thinned region 101" is to be understood in a broad sense, that is, a groove may be formed in the substrate 10, a groove bottom wall of the groove is formed as the thinned region 101, and the thinned region 101 is a solid plate with a smaller thickness; or a through hole is formed in the substrate 10, the thinning region 101 is formed at the through hole, in other words, the thickness of the thinning region 101 is 0, and at the moment, the temperature measuring component can penetrate through the through hole to be directly contacted with the container to be heated, so that the temperature measurement is more sensitive and accurate. This can both avoid because the too big, the untimely fracture problem that causes of accuse temperature of base plate 10 positive and negative two-sided difference in temperature, all is in above embodiment the utility model discloses a within the scope of protection.

Since the toughening layer 20 is disposed around the thinned region 101, as shown in fig. 2, the ratio of the projected area of the toughening layer 20 on the substrate 10 to the area of the substrate 10 is less than 1. In other words, the toughening layer 20 does not completely cover the non-working surface of the substrate 10. Compared with the area of the substrate 10, the area of the toughening layer 20 is smaller, so that the influence of the toughening layer 20 on the heat conduction of the substrate 10 can be reduced, the overall vertical heat conduction capability of the panel 100 is improved, and the influence of excessive heat absorbed by the toughening layer 20 on the connection reliability between the toughening layer 20 and the substrate 10 is avoided.

Compared with other non-thinning areas, the temperature of the non-working surface of the thinning area 101 is relatively higher, the toughening layer 20 is arranged to avoid the thinning area 101, and the higher temperature area can be avoided, so that the toughening layer 20 is prevented from losing efficacy, and the connection reliability of the toughening layer 20 and the substrate 10 is ensured.

According to the panel 100 of the heating device provided by the embodiment of the present invention, the mechanical strength of the substrate 10 can be improved by the toughening layer 20, the toughness of the substrate 10 is increased, the energy of the external force applied to the substrate 10 is absorbed, the material selection of the substrate 10 can be more diversified, and meanwhile, the substrate 10 is not easily cracked by the thermal stress when being subjected to the thermal shock, and the substrate 10 is also prevented from being easily cracked when being subjected to the mechanical shock; and through setting up attenuate region 101 and toughening layer 20 encircles attenuate region 101 and set up, can improve the accuracy and the sensitivity of temperature measurement, heating equipment can in time react under unusual user state, avoids base plate 10 to work for a long time under unusual high temperature and leads to the fracture, and toughening layer 20 can reduce the external force that attenuate region 101 received, can avoid toughening layer 20 to attract external force to attenuate region 101 again, has improved the mechanical stability of attenuate region 101 and the stability of toughening layer 20.

Because the panel 100 of the heating device according to the embodiment of the present invention has the above-mentioned beneficial technical effects, according to the heating device of the embodiment of the present invention, the mechanical strength of the substrate 10 can be improved by providing the toughening layer 20, the toughness of the substrate 10 is increased, and the energy of the external force applied to the substrate 10 is absorbed, so that the material selection of the substrate 10 can be more diversified, and at the same time, it is ensured that the substrate 10 is not easily cracked by thermal stress when being subjected to thermal shock, and the substrate 10 is also prevented from being easily cracked when being subjected to mechanical shock; and through setting up attenuate region 101 and toughening layer 20 encircles attenuate region 101 and set up, can improve the accuracy and the sensitivity of temperature measurement, heating equipment can in time react under unusual user state, avoids base plate 10 to work for a long time under unusual high temperature and leads to the fracture, and toughening layer 20 can reduce the external force that attenuate region 101 received, can avoid toughening layer 20 to attract external force to attenuate region 101 again, has improved the mechanical stability of attenuate region 101 and the stability of toughening layer 20.

In some embodiments of the present invention, as shown in fig. 2, the toughening layer 20 surrounds the thinning region 101 to define a hollow 201 in the middle region, in other words, the middle region of the toughening layer 20 is provided with a through hole, so that the toughening layer 20 forms an approximate annular structure. The hollow 201 may be opposite to the middle region of the substrate 10, in other words, the toughening layer 20 is not disposed on the middle region of the substrate 10.

For the substrate 10, the temperature is typically higher in the central region than in the edge region, e.g., the central region of the substrate 10 is often opposite the heating element of the heating apparatus. By providing the hollowed-out portion 201 in the middle region of the toughening layer 20, the heating element can be at least partially staggered from the toughening layer 20 in the horizontal direction.

The region where the high temperature is generated during cooking is the region opposite the heating element, such as the region directly above the heating element. During cooking, in particular during dry-cooking, the temperature of the region of the underside of the base plate 10 directly above the heating element is high, for example often exceeding 300 degrees, and the maximum temperature may even reach 350 degrees. While the temperature of the region directly above the non-heated element on the underside of the substrate 10 is lower, e.g. only up to 180 degrees. If the toughening layer 20 is located in the high temperature region, the high temperature carbonization phenomenon is easy to occur, even the odor is generated, and the toughening layer 20 located in the low temperature region can be firmly connected to the substrate 10.

Therefore, in the embodiment of the present invention, by providing the hollow portion 201 in the middle region of the toughening layer 20, the region surrounded by the hollow portion 201 is at least partially a high temperature region opposite to the heating element, and the toughening layer 20 is not provided in the region; at least part of the toughening layer 20 is located in a low-temperature region staggered with the heating assembly, so that the temperature of the toughening layer 20 is lower, the structural damage of the toughening layer 20 is avoided, and the damage of a connecting structure between the toughening layer 20 and the substrate 10 is also avoided. Therefore, the toughening layer 20 is prevented from softening, deforming, smelling or even losing efficacy, the toughening layer 20 can be ensured to be reliably connected with the substrate 10, and the mechanical strength of the substrate 10 is ensured to be stably enhanced.

Because the middle part mechanical strength of base plate 10 is higher than marginal mechanical strength, therefore, some embodiments of the utility model adopt the local scheme that sets up toughening layer 20 in base plate 10 back, adopt the middle part promptly to have the structural strength of toughening layer 20 reinforcing base plate 10 of fretwork portion 201, make toughening layer 20 can strengthen base plate 10 pertinence and be close to marginal area's structural strength, pertinence strengthens the mechanical strength who receives the region of assaulting more easy fracture promptly pertinence, and set up fretwork portion 201 in the region of assaulting difficult fracture, under the not enough circumstances of mechanical strength has been solved, cause toughening layer 20 high temperature and blacken or produce the peculiar smell when avoiding dry combustion, have high use value.

In some embodiments of the utility model, the base plate 10 has the heating workspace, the higher region of base plate 10 temperature in the firing equipment heating process promptly to the temperature at heating workspace center is higher than the temperature at heating workspace edge, treats that the heating container and heating workspace are placed relatively, can realize high-efficient heating. The thinning area 101 is arranged in the heating working area, so that the temperature measuring component can detect the temperature of a higher temperature area, and therefore when the problem of dry burning occurs, response measures are found and taken in time, and the timeliness of temperature control is improved.

In addition, the distance between the inner edge of the toughening layer 20 and the center of the thinning-out region 101 is more than or equal to 2/3 of the radius of the heating working area. So that the toughening layer 20 avoids the center of the heating working area, thereby avoiding the area with higher heat, avoiding the toughening layer 20 from blackening or generating peculiar smell, and ensuring the connection reliability of the toughening layer 20 and the substrate 10. This reduces the heat applied to the toughening layer 20, reduces the deformation of the toughening layer 20, and improves the impact resistance of the substrate 10.

In some embodiments, the toughening layer 20 is disposed around the heating working area, in other words, a projection of the heating working area on the toughening layer 20 falls within the area of the hollow portion 201. In other words, the open area of the hollow-out portion 201 is greater than or equal to the area of the heating working area; in other words, the toughening layer 20 is not disposed in the heating working area, and the heating working area and the toughening layer 20 are completely staggered. Toughening layer 20 avoids the higher regional effect of heat better, avoids toughening layer 20 to blacken or the effect that produces the peculiar smell is better, effectively reduces being heated of toughening layer 20, reduces toughening layer 20's deformation, and toughening layer 20 is higher with base plate 10's connection reliability, guarantees to improve base plate 10's impact resistance.

In some embodiments, the distance between the inner edge of the toughening layer 20 and the boundary of the heating working area is less than or equal to 1/3 of the radius of the heating working area, i.e. the distance between the edge of the hollow-out portion 201 and the boundary of the heating working area is H, and H/R is less than or equal to 1/3. On the premise that the toughening layer 20 and the heating working area are arranged in a staggered manner, the toughening layer 20 is prevented from covering too small area on the substrate 10 to influence the toughness enhancing effect.

According to some embodiments of the utility model, the critical value of the stress intensity factor of toughening layer 20 is greater than the critical value of the stress intensity factor of base plate 10, makes toughening layer 20 can improve the hardness of base plate 10 and improve toughening layer 20's toughness, can improve the ability that panel 100 absorbed the external impact force on the one hand, and on the other hand can improve panel 100's resistant scraping performance.

According to some embodiments of the present invention, as shown in fig. 2, the aperture of the hollow 201 is D1, and 140mm is not less than D1 and not more than 260mm. For example, in some embodiments, the aperture of the hollowed-out portion 201 is 150mm, 170mm, 190mm, 200mm, 220mm, 240mm, and the like. The diameter of the heating component commonly used at present is 150 mm-210 mm, and the aperture of the hollow part 201 is in the size range, so that the heating component can be matched with most heating components, and the problems of blackening and peculiar smell generation of the toughening layer 20 are solved. Moreover, the problem that the strength of the substrate 10 near the edge with low strength and easy to crack cannot be enhanced due to the overlarge aperture of the hollow portion 201 is avoided.

According to some embodiments of the utility model, the projection of heating element on panel 100 is located and increases tough layer 20 and enclose and establish the region, increases tough layer 20's inward flange and the interval at heating element center less than or equal to heating element radial 6/5, and the aperture of fretwork portion 201 is D1 promptly, and heating element's external diameter is D2, and 1 is less than or equal to D1/D2 and is less than or equal to 1.2. That is to say, for the heating element of different heating equipment, the aperture of hollowed-out portion 201 is determined according to the outer diameter of the heating element, so that the aperture of hollowed-out portion 201 is greater than or equal to the outer diameter of the heating element, the effect of avoiding toughening layer 20 from blackening and generating odor is better, and the aperture of hollowed-out portion 201 is not too large and affects the mechanical strength enhancing effect.

In some embodiments of the present invention, the thinning region 101 may be a through hole formed in the substrate 10, on one hand, there is no shielding between the container to be heated and the temperature measuring assembly, so as to improve the accuracy of temperature measurement as much as possible; on the other hand, the strength of the thinned region 101 is prevented from being too low to crack.

In other embodiments of the present invention, the ratio of the thickness of the thinning region 101 to the maximum thickness of the substrate 10 is greater than or equal to 0.4, i.e. the ratio of the thickness of the plate of the thinning region 101 to the maximum thickness of the substrate 10 is greater than or equal to 0.4 and less than or equal to K < 1. On the one hand, the thinning area 101 can improve the temperature measurement accuracy, on the other hand, the influence on the mechanical strength caused by the over-small thickness of the plate at the thinning area 101 is avoided, and the breakage of the thinning area 101 is avoided.

In some embodiments of the present invention, as shown in fig. 1, the maximum thickness of the substrate 10 is L2, and L2 is not less than 4mm and not more than 10mm. For example, in some embodiments, the thickness of the substrate 10 is equal and L2 everywhere except for the thinned region 101. By arranging the thinning area 101, the maximum thickness of the substrate 10 can be larger, so that the forming feasibility and the production yield of the substrate 10 are ensured, and the risk of cracking of the substrate 10 due to mechanical impact is reduced; on this basis, the thickness of base plate 10 can not too big and lead to overweight or raw materials extravagant, is favorable to reduce cost, improves user's use and experiences. For example, in some embodiments, the maximum thickness of the substrate 10 may be 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, and so forth.

According to some embodiments of the present invention, as shown in fig. 1, the thickness of the thinning region 101 is L1, and L1 is greater than or equal to 0mm and less than or equal to 6mm. When L1=0mm, the substrate 10 is provided with a through hole to form a thinning area 101, and the temperature measuring component can directly penetrate through the through hole and is in contact with a container to be heated to measure the temperature, so that the temperature measurement is more sensitive and more accurate; when L1 is less than or equal to 6mm and is greater than 0mm, the base plate 10 is provided with the groove to form an attenuation area 101, the thickness of the attenuation area 101 is less than or equal to 6mm, the temperature difference between the front side and the back side of the attenuation area 101 can be avoided to be too large, the temperature of the to-be-heated container can be timely transmitted to the temperature measuring component through the attenuation area 101, and the requirement of temperature measuring sensitivity is met. For example, in some embodiments, thinned region 101 can have a thickness of 1mm, 2mm, 3mm, 4mm, 5mm, 6mm, and so forth.

According to the utility model discloses a some embodiments, as shown in fig. 2, form between the inward flange of layer 20 of toughening and the regional 101 border of attenuate and predetermine the clearance, predetermine the clearance and the regional 101 external diameter of attenuate ratio more than or equal to 2 to make layer 20 of toughening keep away from the regional 101 of attenuate that mechanical strength is more weak, thereby reduce layer 20 of toughening and influence the atress of the regional 101 of attenuate, avoid the regional 101 fracture of attenuate, improve the shock resistance of base plate 10.

In some embodiments, the ratio of the predetermined distance to the outer diameter of the thinned region 101 is less than or equal to 9, which can ensure that the toughening layer 20 can effectively attract external forces applied to the non-thinned region, thereby improving the impact resistance of the substrate 10.

According to some embodiments of the present invention, as shown in fig. 2, the diameter of the thinning region 101 is d, and d is not less than 5mm and not more than 30mm. The size of the thinning region 101 can be matched with the size of most of temperature measuring components, so that the temperature measuring components can stretch into the groove to be in contact with the thinning region 101, or the temperature measuring components can penetrate through the through hole to be in direct contact with a container to be heated. In addition, the reduction of the mechanical strength of the substrate 10 caused by the oversize of the thinned region 101 is avoided, and in the embodiment of forming the thinned region 101 by arranging the through hole, the increase of the liquid inlet risk caused by the oversize of the through hole and the oversize gap between the through hole and the temperature measuring component can also be avoided. For example, in some embodiments, the thinned region 101 can have a diameter of 5mm, 10mm, 15mm, 20mm, 25mm, 30mm, and so forth.

In some embodiments of the present invention, the toughening layer 20 may be a high temperature resistant inorganic material, which has high ductility and toughness and can effectively counteract and decompose impact; even if the substrate 10 is broken, the toughening layer 20 generates a tensile force to pull the substrate 10, and in the embodiment with the adhesive layer, the pulling effect can be improved by the cooperation of the adhesive layer.

For example, the material may be an inorganic material capable of resisting a temperature of 300 ℃, so that the toughening layer 20 can bear a high temperature generated by the operation of the heating element, and the toughening layer 20 is prevented from being damaged, blackened or smelled. In addition, in the embodiment of electromagnetic heating, the inorganic material has no influence on the electromagnetic heating, and the high-efficiency heating is ensured.

In some embodiments, toughening layer 20 includes at least an organic binder and inorganic elements such as Si, al, and O. The inorganic material is bonded into an integral structure by an organic binder, for example, the toughening layer 20 may be a reinforcing mesh structure. And the organic binder can realize the adhesion and fixation of the toughening layer 20 and the substrate 10. By providing the hollow portion 201, the organic binder in the toughening layer 20 can be prevented from carbonizing at a high temperature and generating odor, and the reliable connection between the toughening layer 20 and the substrate 10 can be ensured.

In some embodiments, the temperature resistance of toughening layer 20 may be from 300 ℃ to 500 ℃. The temperature resistance of the toughening layer 20 is too low, which can cause the toughening layer 20 to lose efficacy easily when the heating equipment is at a high working temperature or in a long-term use process; the temperature resistance of toughening layer 20 is too high, which may increase the cost and processing difficulty of toughening layer 20. Within the temperature range, the service life and the toughening effect of the toughening layer 20 are ensured, and the production cost of the panel 100 is favorably reduced.

In some embodiments of the present invention, the rock plate may be a cordierite system (Mg-Al-Si-O), a mullite system (Al-Si-O), or a cordierite and mullite composite material, so that the rock plate has obvious pleochroic properties, high-temperature fire resistance, and low thermal expansion rate, which is beneficial to improving the texture of the panel 100 and reducing the risk of cracking of the substrate 10 due to thermal shock.

In some embodiments, the substrate 10 may be formed by powder pressing and sintering at a high temperature, and the manufacturing process is simple, suitable for mass production, and beneficial to reducing the production cost.

In some embodiments of the present invention, the porosity of the substrate 10 is 10% to 30%. For example, in some embodiments, the porosity of the substrate 10 may be 10%, 15%, 20%, 25%, 30%, and so forth. By introducing the pores into the substrate 10, when the substrate 10 is heated to expand, the pores can greatly relieve thermal stress, so that a good cold and heat impact resistance effect is achieved, and cracking is avoided. However, the higher the porosity of the substrate 10, the lower the mechanical strength of the substrate 10, and the more likely it is to be broken when a bump occurs. And this application makes base plate 10 can have higher porosity through set up toughening layer 20 on base plate 10 to utilize the hole to show and alleviate the thermal stress, reduce cold and hot impact fracture risk, and through making the porosity no longer than 30%, avoid guaranteeing base plate 10's mechanical strength because of under the prerequisite of cold and hot impact fracture, avoid because of mechanical shock fracture.

According to the utility model discloses a some embodiments, layer 20 toughens can paste on base plate 10 through the viscose layer, and the stromatolite of viscose layer and layer 20 toughens can slide each other and form the micrometric displacement when base plate 10 receives external force to alleviate the impact force on the base plate 10, improve panel 100's shock resistance.

According to the utility model discloses a some embodiments, layer 20 toughens can be network structure, and network structure can take place certain deformation, can improve layer 20 toughens and offset and the ability of decomposing the impact force to improve panel 100's whole shock resistance.

According to some embodiments of the present invention, as shown in fig. 1 and 2, the toughening layer 20 has the same shape as the outer contour of the substrate 10, so that the toughening layer 20 can perform a complete and complete structural reinforcement effect on the edge of the substrate 10. For example, the outer contour of the substrate 10 is rectangular, the outer contour of the toughening layer 20 is also rectangular, and the two rectangles have the same size, so that the outer edge of the substrate 10 is aligned with the outer edge of the toughening layer 20.

According to some embodiments of the present invention, in the operating state of the heating assembly, the temperature difference between the working surface and the non-working surface (i.e. the surface facing away from the working surface) of the panel 100 is less than or equal to 500 ℃, in other words, the temperature difference between the substrate 10 and the toughening layer 20 facing away from each other is less than or equal to 500 ℃. The substrate 10 is prone to cracking due to too high temperature difference, and the temperature difference of different areas of the substrate 10 can be reduced within the temperature range, so that cracking caused by uneven distribution of thermal stress is avoided.

Other constructions and operations of the heating device according to embodiments of the invention are known to the person skilled in the art and will not be described in detail here.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

In the description herein, references to the description of the terms "embodiment," "specific embodiment," "example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (15)

1. A panel for a heating apparatus, comprising:

a substrate having a thermal conductivity of less than or equal to 1W/(m.K), the substrate including a thinned region, and the substrate having a working face for placement of a container to be heated;

toughening layers are arranged on the back of the substrate and on one side of the working face, and the toughening layers surround the thinning region.

2. The heating device panel according to claim 1, wherein the thinned region is a through hole, or wherein a ratio of a thickness of the thinned region to a maximum thickness of the substrate is greater than or equal to 0.4.

3. The panel of the heating device according to claim 1, characterized in that a preset gap is formed between the inner edge of the toughening layer and the boundary of the thinned region, and the ratio of the preset gap to the outer diameter of the thinned region is greater than or equal to 2.

4. A panel for a heating device according to claim 3, characterized in that the ratio of said preset gap to the outer diameter of said thinned zone is less than or equal to 9.

5. The panel of the heating apparatus as claimed in claim 1, wherein the substrate has a heating working area, the thinning region is disposed in the heating working area, and the distance between the inner edge of the toughening layer and the center of the thinning region is greater than or equal to 2/3 of the radius of the heating working area.

6. The panel of a heating apparatus of claim 5, wherein the toughening layer is disposed around the heating zone.

7. The panel of the heating apparatus of claim 6, wherein the inner edge of the toughening layer is spaced from the heating zone boundary by a distance less than or equal to 1/3 of the radius of the heating zone.

8. The panel of heating equipment according to claim 1, wherein the temperature resistance of the toughening layer is 300 ℃ to 500 ℃.

9. The panel of a heating apparatus of claim 1, wherein the toughening layer is adhesively disposed on the substrate by an adhesive layer.

10. The panel of a heating apparatus of claim 1, wherein the toughening layer is a mesh structure.

11. The panel of a heating apparatus according to claim 1,

the toughening layer is made of a high-temperature-resistant inorganic material;

the substrate is a cordierite system or a mullite system.

12. A panel for a heating apparatus according to any one of claims 1 to 11, wherein the porosity of the substrate is between 10% and 30%.

13. A heating device comprising a panel of a heating device according to any one of claims 1 to 12 and a heating element, the heating element being provided on a side of the toughening layer facing away from the substrate.

14. The heating apparatus of claim 13, wherein in the operating state of the heating assembly, the difference in temperature between the working surface of the panel and the surface opposite the working surface is less than or equal to 500 ℃.

15. The heating apparatus of claim 13, wherein a projection of the heating element on the panel is located within an area encompassed by the toughening layer, and an inner edge of the toughening layer is spaced from a center of the heating element by less than or equal to 6/5 of a radius of the heating element.

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