CN218102022U - Optical emission subassembly with temperature control - Google Patents
Optical emission subassembly with temperature control Download PDFInfo
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- CN218102022U CN218102022U CN202222361184.7U CN202222361184U CN218102022U CN 218102022 U CN218102022 U CN 218102022U CN 202222361184 U CN202222361184 U CN 202222361184U CN 218102022 U CN218102022 U CN 218102022U
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- laser
- heating resistor
- thermistor
- temperature control
- heat conducting
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Abstract
The utility model discloses an optical transmitting subassembly with temperature control, which belongs TO the technical field of gas detection, and comprises a TO base and a TO pipe cap, wherein the TO base is provided with a laser and a temperature control assembly, and the TO pipe cap is provided with a lens; the temperature control assembly comprises a heating resistor and a thermistor, and the heating resistor and the thermistor are both electrically connected with an external controller; the heating resistor is provided with a heat conducting piece, and the thermistor and the laser are arranged on the heat conducting piece. The utility model provides a higher technical problem of cost that optical emission subassembly exists among the prior art.
Description
Technical Field
The utility model relates to a gaseous detection technology field, in particular to take temperature control's optical emission subassembly.
Background
With the development of society, people have more and more demands on the fields of gas safety detection, carbon dioxide gas detection, mine gas detection, industrial waste gas detection and the like. The laser gas detection technology is undoubtedly one of the preferable technical schemes in the gas detection field due to the characteristics of high detection sensitivity, high safety, long service life and the like.
At present, in order to ensure the accuracy of the output wavelength of the laser and the stability of long-time work, a BOX type package with TEC temperature control is generally adopted, but the method has the problem of higher cost.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at: the utility model provides a take optical emission subassembly of temperature control, aims at solving the higher technical problem of cost that optical emission subassembly among the prior art exists.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides an optical transmitter subassembly with temperature control, which comprises a TO base and a TO pipe cap, wherein the TO base is provided with a laser and a temperature control component, and the TO pipe cap is provided with a lens;
the temperature control assembly comprises a heating resistor and a thermistor, and the heating resistor and the thermistor are both electrically connected with an external controller;
the heating resistor is provided with a heat conducting piece, and the thermistor and the laser are both arranged on the heat conducting piece.
Optionally, the heat conducting member is in a shape of a sheet, and the heat conducting member is flatly attached to the heating resistor;
the laser is flatly attached to the heat conducting piece, and the light path of the laser is parallel to the upper end face of the heating resistor;
and a reflector is arranged on a light path of laser of the laser, and the reflector is used for enabling the laser TO penetrate through the TO pipe cap.
Optionally, the laser, the heating resistor and the thermistor are all connected with a pin of the TO base in a gold wire bonding mode.
Optionally, the heat conducting member is in a block shape, and the heat conducting member is vertically disposed on the heating resistor;
the laser is attached to the side wall of the heat conducting piece, and the light path of laser of the laser is perpendicular to the upper end face of the heating resistor.
Optionally, the lens is a ball lens or a non-ball lens.
Optionally, the laser is one of a distributed feedback laser, an electro-absorption modulation laser, and a wavelength-locked FP laser.
Optionally, the heating resistor has a resistance value of 10 to 100 ohms.
Optionally, the thermistor is a negative temperature coefficient thermistor.
The utility model provides an above-mentioned one or more technical scheme can have following advantage or has realized following technological effect at least:
the utility model provides a take temperature control's optical transmission subassembly utilizes heating resistor to produce heat to carry out the heat exchange through heat-conducting piece with heating resistor and laser instrument, through the temperature of thermistor feedback laser instrument, heat the laser instrument to target operating temperature, export suitable wavelength, and for the BOX type encapsulation of taking the TEC control by temperature change, have low in production cost and control circuit advantage simple relatively.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of a temperature controlled optical transmitter sub-assembly according to the present invention;
FIG. 2 is a schematic diagram of another embodiment of a temperature controlled optical transmitter sub-assembly of the present invention;
fig. 3 is a schematic diagram of an application of the optical transmitter subassembly with temperature control according to the present invention.
Wherein, 1, TO base; 2. a TO pipe cap; 3. a heating resistor; 4. a heat conductive member; 5. a thermistor; 6. a laser; 7. a mirror.
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, in the embodiment of the present invention, all the directional indicators (such as up, down, left, right, front, back, 8230) \8230;) are only used to explain the relative position relationship between the components in a specific posture (as shown in the figure), the motion situation, etc., and if the specific posture is changed, the directional indicator is also changed accordingly. In the present invention, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a device or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such device or system. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" comprise 8230; "does not exclude the presence of additional like elements in a device or system comprising the element. In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "connected" may be a fixed connection or a removable connection, or may be integral therewith; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; either internally or in an interactive relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In addition, the technical solutions of the respective embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention.
Example one
Referring to fig. 1 to 3; the present embodiments provide an optical transmitter sub-assembly with temperature control. The optical transmitter sub-assembly may include: the device comprises a TO base 1 and a TO pipe cap 2, wherein a laser 6 and a temperature control assembly are arranged on the TO base 1, and a lens is arranged on the TO pipe cap 2; the temperature control assembly comprises a heating resistor 3 and a thermistor 5, and both the heating resistor 3 and the thermistor 5 are electrically connected with an external controller; the heating resistor 3 is provided with a heat conducting piece 4, and the thermistor 5 and the laser 6 are both arranged on the heat conducting piece 4.
Specifically, the TO base 1 and the TO cap 2 are hermetically connected TO protect the laser 6; the lens is used for coupling the laser of the laser 6 into parallel light; the heat conducting piece 4 is used as a bearing body of the laser 6 and the thermistor 5 and has a circuit lead function and a heat conduction function; an external controller controls a temperature control component in the optical transmitter subassembly, as shown in an application schematic diagram in fig. 3, the controller enables the heating resistor 3 to generate heat for heating the laser 6 through a heating circuit, the thermistor 5 feeds back the temperature of the laser 6 to the controller, the temperature fed back by the controller can be the surface temperature of the laser 6 or the temperature near the laser 6, when the temperature of the laser 6 reaches a target temperature, the controller supplies power to the laser 6 through a laser power supply circuit, and the laser 6 works.
In the embodiment, the optical emission subassembly with the temperature control utilizes the heating resistor 3 to generate heat, the heating resistor 3 and the laser 6 are subjected to heat exchange through the heat conducting piece 4, the temperature of the laser 6 is fed back through the thermistor 5, the laser 6 is heated to the target working temperature, and a proper wavelength is output. Or the temperature control is realized by the heating resistor 3, and the temperature of the laser 6 can be accurately controlled by matching with a peripheral control circuit, so that the output wavelength of the laser 6 can be accurately controlled, and the cost is greatly saved on the premise of ensuring the performance of products.
In one embodiment, as shown in fig. 1, the heat conduction member 4 is in a sheet shape, and the heat conduction member 4 is flatly attached to the heating resistor 3; the laser 6 is flatly attached to the heat conducting piece 4, and the light path of the laser 6 is parallel to the upper end surface of the heating resistor 3; and a reflecting mirror 7 is arranged on the light path of the laser 6, and the reflecting mirror 7 is used for enabling the laser TO penetrate through the TO pipe cap 2.
Specifically, in this embodiment, the laser 6 is flatly attached to the heat conducting member 4, and the heat conducting member 4 is flatly attached to the upper end surface of the heating resistor 3, which is a vertical or inclined arrangement with respect to the laser 6, and thus, the advantages of convenient processing and high production efficiency are obtained.
Preferably, the reflector 7 may be a right-angled trapezoid with the slope facing the laser 6, which has the advantage of high structural strength.
Further, the laser 6, the heating resistor 3 and the thermistor 5 are all connected with pins of the TO base 1 in a gold wire bonding mode.
In another embodiment, as shown in fig. 2, the heat conduction member 4 is in a block shape, and the heat conduction member 4 is vertically disposed on the heating resistor 3; the laser 6 is attached to the side wall of the heat conducting member 4, and the optical path of the laser 6 is perpendicular to the upper end surface of the heating resistor 3.
Specifically, unlike the above embodiment, in the present embodiment, the optical path of the laser 6 is perpendicular to the upper end surface of the heating resistor 3, so that the mirror 7 does not need to be additionally provided. In addition, heat-conducting piece 4 is massive and perpendicular to heating resistor 3's up end, and its shape can be the cuboid, when laser instrument 6 laminates on heat-conducting piece 4's lateral wall, can guarantee laser instrument 6's light path perpendicular to heating resistor 3's up end, reduces the processing degree of difficulty, promotes production efficiency.
Preferably, the operating temperature setting of the laser 6 is determined in conjunction with the output wavelength of the laser 6, taking into account the wavelength variation due to the laser 6 being heated to a temperature higher than ambient temperature, so that the laser 6 is able to output the correct wavelength at the target operating temperature set by the laser 6; in addition, the working temperature range of the whole machine and the luminous output capability of the laser 6 need to be considered. The working temperature of the laser 6 is set to be too high, which can expand the working temperature range of the whole machine, but has the defect that the luminous capability of the laser 6 is reduced; the working temperature of the laser 6 is set to be too low, so that the working temperature range of the whole machine is narrowed although the light emitting capability of the laser 6 is strong. In the present embodiment, the target operating temperature of the laser 6 is set at 50 to 70 ℃.
Further, the lens is one of a ball lens and a non-ball lens.
Specifically, the laser light emitted by the laser 6 can be reduced to be adjusted to be a quasi-parallel beam by adjusting the coupling focal length, and in this embodiment, the coupling focal length can be adjusted by adjusting the height of the heat conducting member 4.
Optionally, the laser 6 is one of a distributed feedback laser 6, an electro-absorption modulation laser 6, and a wavelength-locked FP laser 6.
Optionally, the heating resistor 3 has a resistance value of 10 to 100 ohms.
Alternatively, the thermistor 5 is a negative temperature coefficient type thermistor 5.
Specifically, the negative temperature coefficient type thermistor 5 has the advantages of high sensitivity, wide working temperature range, small size and convenience in use, and improves the accuracy of temperature detection of the laser 6, thereby improving the precision of the output wavelength of the laser 6.
It should be noted that the numbers of the embodiments of the present invention are merely for description, and do not represent the merits of the embodiments. The above is only the optional embodiment of the present invention, and not therefore the limit of the patent scope of the present invention, all the concepts of the present invention utilize the equivalent structure transformation of the content of the specification and the attached drawings, or directly or indirectly applied to other related technical fields, all included in the patent protection scope of the present invention.
Claims (8)
1. An optical transmitting subassembly with temperature control is characterized by comprising a TO base and a TO pipe cap, wherein a laser and a temperature control assembly are arranged on the TO base, and a lens is arranged on the TO pipe cap;
the temperature control assembly comprises a heating resistor and a thermistor, and the heating resistor and the thermistor are both electrically connected with an external controller;
the heating resistor is provided with a heat conducting piece, and the thermistor and the laser are both arranged on the heat conducting piece.
2. The optical transmitter subassembly with temperature control of claim 1, wherein: the heat conducting piece is in a sheet shape and is flatly attached to the heating resistor;
the laser is flatly attached to the heat conducting piece, and the light path of the laser is parallel to the upper end face of the heating resistor;
and a reflector is arranged on a laser path of the laser, and is used for enabling the laser TO penetrate through the TO pipe cap.
3. The optical transmitter subassembly of claim 2, wherein: the laser, the heating resistor and the thermistor are connected with a pin of the TO base in a gold wire bonding mode.
4. The optical transmitter subassembly with temperature control of claim 1, wherein: the heat conducting piece is in a block shape and is vertically arranged on the heating resistor;
the laser is attached to the side wall of the heat conducting piece, and the light path of laser of the laser is perpendicular to the upper end face of the heating resistor.
5. The optical transmitter subassembly of claim 4, wherein: the lens is a spherical lens or a non-spherical lens.
6. The optical transmitter subassembly of any of claims 1-5, wherein: the laser is one of a distributed feedback laser, an electro-absorption modulation laser and a wavelength locking FP laser.
7. The optical transmitter subassembly of claim 6, wherein: the resistance value of the heating resistor is 10 to 100 ohms.
8. The optical transmitter subassembly of claim 6, wherein: the thermistor is a negative temperature coefficient thermistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222361184.7U CN218102022U (en) | 2022-09-06 | 2022-09-06 | Optical emission subassembly with temperature control |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222361184.7U CN218102022U (en) | 2022-09-06 | 2022-09-06 | Optical emission subassembly with temperature control |
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| Publication Number | Publication Date |
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| CN218102022U true CN218102022U (en) | 2022-12-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202222361184.7U Active CN218102022U (en) | 2022-09-06 | 2022-09-06 | Optical emission subassembly with temperature control |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024027157A1 (en) * | 2022-08-05 | 2024-02-08 | 首传激光科技(上海)有限公司 | Laser gas sensor temperature control method and packaging structure |
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2022
- 2022-09-06 CN CN202222361184.7U patent/CN218102022U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024027157A1 (en) * | 2022-08-05 | 2024-02-08 | 首传激光科技(上海)有限公司 | Laser gas sensor temperature control method and packaging structure |
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