CN214255038U - 3D structured light and laser emission module thereof - Google Patents
3D structured light and laser emission module thereof Download PDFInfo
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- CN214255038U CN214255038U CN202120536573.1U CN202120536573U CN214255038U CN 214255038 U CN214255038 U CN 214255038U CN 202120536573 U CN202120536573 U CN 202120536573U CN 214255038 U CN214255038 U CN 214255038U
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Abstract
The utility model discloses a 3D structured light and laser emission module thereof, the laser emission module includes: the laser device comprises a bracket and a laser fixed inside the bracket; the collimating lens is arranged in the bracket and arranged on the light emergent side of the laser; the circuit board is connected with the laser and the TEC temperature controller is fixed relative to the bracket; a thermally conductive gel in contact with both the TEC temperature controller and the laser. The structural design of the laser emission module can effectively solve the problem that the thermal conduction transmission between the TEC temperature controller and the laser is slow.
Description
Technical Field
The utility model relates to an imaging technology field, more specifically say, relate to a 3D structured light and laser emission module thereof.
Background
With the development of science and technology and the pursuit of people for good life, the development and application of 3D vision technology by people are accelerated, and the demands of a plurality of industries such as robots, intelligent security, AR/VR, motion sensing games, unmanned planes, new retail, logistics and the like on deep vision are more and more prominent at present. The current technical scheme capable of realizing 3D imaging mainly comprises 3D structured light, binocular stereo vision and other schemes. The 3D structured light is distinguished by the advantages of high precision, low cost, low power consumption and the like, and the 3D structured light mainly comprises a laser emitting module, an infrared receiving module, a color imaging module and the like.
Because the laser temperature of the laser emission module is unstable, a temperature control system is needed to control the wavelength of the LD laser. The laser temperature control device comprises a TEC temperature controller, wherein the TEC temperature controller is used for controlling the temperature of the laser, a heat conduction silica gel, a lower heat dissipation gasket, heat conduction silicone grease and a metal heat dissipation shell are sequentially arranged between the TEC temperature controller and the laser, heat needs to sequentially pass through the heat conduction silica gel, the lower heat dissipation gasket, the heat conduction silicone grease and the metal heat dissipation shell when the heat is transferred between the TEC temperature controller and the laser, and finally the control of the temperature of the laser is achieved.
As mentioned above, the thermal conduction between the TEC temperature controller and the laser needs to pass through 4 layers of components (thermal conductive silica gel, lower heat dissipation pad, thermal conductive silicone grease, and metal heat dissipation case). At the beginning of work, the laser can not reach the set wavelength fast, makes the infrared picture that infrared module was shot can not reach work luminance fast, leads to equipment depth map integrality can not reach the operating requirement fast, finally shows that the product is slow to external reaction, especially under low temperature environment. In addition, the heat conduction silicone grease used for heat conduction can volatilize a small amount under high-temperature work, and the heat conduction silicone grease is attached to the surface of the collimating lens or the diffractive optical element through a gap of the module structure, so that a speckle point diagram is influenced, and the product is abnormal. The service life of the heat-conducting silicone grease is generally 2 years, and the heat-conducting efficiency is reduced after the silicone grease is expired.
SUMMERY OF THE UTILITY MODEL
In view of this, the first objective of the present invention is to provide a laser emission module, the structural design of which can effectively solve the problem of slow heat conduction transmission between the TEC temperature controller and the laser, and the second objective of the present invention is to provide a 3D structured light including the above laser emission module.
In order to achieve the first object, the present invention provides the following technical solutions:
a laser emitting module comprising:
the laser device comprises a bracket and a laser fixed inside the bracket;
the collimating lens is arranged in the bracket and arranged on the light emergent side of the laser;
the circuit board is connected with the laser and the TEC temperature controller is fixed relative to the bracket;
a thermally conductive gel in contact with both the TEC temperature controller and the laser.
Preferably, in the laser emission module, the laser emission module further includes a heat dissipation casing disposed in the support, and the laser is fixed in the heat dissipation casing.
Preferably, in the laser emission module, the circuit board is fixedly connected to a side of the laser device away from the collimating mirror, and the TEC temperature controller is located on a side of the circuit board away from the laser device.
Preferably, in the laser emission module, the heat conducting gel is filled in a gap between the laser, the circuit board and the TEC temperature controller.
Preferably, in the laser emission module, a gap is formed between the circuit board and the TEC temperature controller, and the heat conducting gel is filled in the gap between the circuit board and the TEC temperature controller.
Preferably, in the laser emission module, the heat dissipation shell is bonded to the bracket through glue.
Preferably, among the above-mentioned laser emission module, be provided with first supporting bench on the inner wall of heat dissipation shell, be provided with on the laser instrument can with the second supporting bench of first supporting bench laminating, first supporting bench with the second supporting bench passes through glue and bonds.
Preferably, in the laser emission module, a clamping groove is formed in the support, and a clamping protrusion capable of being clamped in the clamping groove is arranged on one side of the collimating mirror, which is away from the laser;
one side of the collimating mirror, which is close to the laser, is abutted against the heat dissipation shell.
Preferably, in the laser emission module, the laser emission module further includes a diffractive optical element disposed on a side of the collimating mirror facing away from the laser.
A3D structured light comprising a laser emission module as described in any of the above.
The utility model provides a laser emission module includes support, laser instrument, collimating mirror, circuit board, TEC temperature controller and heat conduction gel.
Wherein the laser is fixed inside the bracket. The collimating lens is also arranged inside the bracket, and the collimating lens is positioned on the light-emitting side of the laser. The circuit board is connected with the laser, and specifically, the circuit board and the support are relatively fixed. The TEC temperature controller is also fixed relative to the bracket. Specifically, the TEC temperature controller may be fixedly connected to the bracket, or the TEC temperature controller may be fixedly connected to another component so that the TEC temperature controller is fixed relative to the bracket. The heat conducting gel is in contact with both the TEC temperature controller and the laser, namely, the heat is transferred between the TEC temperature controller and the laser through the heat conducting gel.
When using the laser emission module that above-mentioned embodiment provided, owing to set up the heat conduction gel that all contacts with TEC temperature controller and laser instrument, so heat-conduction between TEC temperature controller and the laser instrument only needs through heat conduction gel, needn't pass through heat conduction silica gel again, lower radiating gasket, multilayer heat transfer medium such as heat conduction silicone grease, and heat conduction gel is soft to have better surface affinity, plasticity is good, make heat conduction efficiency show the promotion, thereby the temperature that makes the laser instrument reaches the operating requirement fast, improve the product and react to the external world. In addition, no longer use heat conduction silicone grease to conduct heat among the laser emission module that this application provided, and then attached to collimating mirror or diffraction optical element surface after having avoided heat conduction silicone grease to volatilize, lead to the unusual condition of product. The heat conducting gel has stable property and long service life of 10 years, and the use stability of the product is greatly improved.
In order to achieve the second objective, the present invention further provides a 3D structured light, wherein the 3D structured light includes any one of the laser emitting modules. Because the laser emission module has the technical effects, the 3D structured light with the laser emission module also has the corresponding technical effects.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a cross-sectional view of a laser emitting module provided in an embodiment of the present invention.
In fig. 1:
the device comprises a diffraction optical element 1, a collimating mirror 2, a heat dissipation shell 3, a laser 4, a circuit board 5, heat conducting gel 6, a TEC temperature controller 7 and a support 8.
Detailed Description
A first object of the utility model is to provide a laser emission module, the slow problem of the heat-conduction transmission of TEC temperature controller and laser instrument 4 can be solved effectively to the structural design of this laser emission module, the utility model discloses a second object is to provide a 3D structured light including above-mentioned laser emission module.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left" and "right" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the indicated position or element must have a specific orientation, be constituted in a specific orientation, and be operated, and thus, are not to be construed as limitations of the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Referring to fig. 1, the laser emitting module provided by the present invention includes a bracket 8, a laser 4, a collimating mirror 2, a circuit board 5, a TEC temperature controller 7, and a heat conducting gel 6.
Wherein the laser 4 is fixed inside the holder 8. The collimator lens 2 is also arranged inside the holder 8 and the collimator lens 2 is located at the light exit side of the laser 4. The circuit board 5 is connected to the laser 4, and specifically, the circuit board 5 is fixed relative to the holder 8. The TEC temperature controller 7 is also fixed relative to the support 8. Specifically, the TEC temperature controller 7 may be fixedly connected to the bracket 8, or the TEC temperature controller 7 may be fixedly connected to other components to fix the TEC temperature controller 7 and the bracket 8 relative to each other. The heat conducting gel 6 is in contact with both the TEC temperature controller 7 and the laser 4, i.e. heat transfer between the TEC temperature controller 7 and the laser 4 is performed through the heat conducting gel 6.
Use during the laser emission module that above-mentioned embodiment provided, because set up the heat conduction gel 6 with TEC temperature controller 7 and the equal contact of laser instrument 4, so heat-conduction between TEC temperature controller 7 and the laser instrument 4 only needs through heat conduction gel 6, needn't pass through heat conduction silica gel again, lower radiating gasket, multilayer heat transfer medium such as heat conduction silicone grease, and 6 softly have better surface affinity of heat conduction gel, the plasticity is good, make heat conduction efficiency show the promotion, thereby make the temperature of laser instrument 4 reach the temperature of working requirement fast, improve the product and react to the external world. In addition, no longer use heat conduction silicone grease to conduct heat among the laser emission module that this application provided, and then attached to collimating mirror 2 or 1 surface of diffraction optical element after having avoided heat conduction silicone grease to volatilize, lead to the unusual condition of product. The heat conducting gel 6 has stable property and long service life of 10 years, and the use stability of the product is greatly improved.
Specifically, the heat conductive gel 6 may be compressed to a very small thickness, and the thickness of the heat conductive gel 6 may be not higher than 0.1mm, which is not limited herein.
In order to further improve the heat dissipation effect, the laser emission module further comprises a heat dissipation shell 3 arranged in the support 8, and the laser 4 is fixed in the heat dissipation shell 3. The heat dissipation shell 3 is fixedly connected with the support 8, and the heat dissipation shell 3 can be a metal heat dissipation shell to improve the heat dissipation effect.
As shown in fig. 1, specifically, the circuit board 5 is fixedly connected to a side of the laser 4 facing away from the collimating mirror 2, and the TEC temperature controller 7 is located on a side of the circuit board 5 facing away from the laser 4. In other words, the circuit board 5 is located between the laser 4 and the TEC temperature controller 7.
The gaps among the laser 4, the circuit board 5 and the TEC temperature controller 7 are filled with the heat conducting gel 6. Namely, the heat conducting gel 6 can be filled in a gap enclosed by the circuit board 5, the laser 4, the TEC temperature controller 7 and the heat dissipation housing 3, so that the heat conducting gel 6 is in contact with both the side of the laser 4 facing away from the collimating mirror 2 and the heat dissipation surface of the TEC temperature controller 7, thereby realizing heat conduction between the laser 4 and the TEC temperature controller 7.
There may be a gap between the circuit board 5 and the TEC temperature controller 7, and the gap between the circuit board 5 and the TEC temperature controller 7 is also filled with a heat conductive gel 6. So set up, also can realize TEC temperature controller 7 to the temperature control of circuit board 5, prevent that circuit board 5 high temperature, job stabilization nature reduces.
In a specific embodiment, the heat dissipation housing 3 and the bracket 8 are bonded by glue. Of course, the heat dissipation housing 3 and the bracket 8 may be clamped or screwed in an interference fit manner, which is not limited herein.
In addition, a first supporting platform is arranged on the inner wall of the heat dissipation shell 3, a second supporting platform which can be attached to the first supporting platform is arranged on the laser 4, and the first supporting platform and the second supporting platform are bonded through glue. Of course, the laser 4 and the heat dissipation housing 3 may be clamped, screwed, etc., and are not limited herein.
As shown in fig. 1, a clamping groove is formed in the bracket 8, and a clamping protrusion capable of being clamped in the clamping groove is arranged on one side of the collimating lens 2 departing from the laser 4. One side of the collimating mirror 2 close to the laser 4 is abutted against the heat dissipation shell 3, and one side of the collimating mirror 2 close to the laser 4 is abutted against the top end of the heat dissipation shell 3. So set up, realized the spacing of alignment straight mirror 2. Alternatively, the collimator lens 2 may be bonded inside the holder 8, which is not limited herein.
The laser emission module may further include a diffractive optical element 1 disposed on a side of the collimating mirror 2 facing away from the laser 4. The laser 4 emits infrared light with a certain angle to the collimating lens 2, the collimating lens 2 collimates the infrared light into parallel light to reach the diffraction optical element, and the diffraction microstructure of the diffraction optical element diffracts the parallel light into a speckle dot diagram. The diffractive optical element 1 may be bonded to the holder 8 by glue, which is not limited herein.
Based on the laser emission module that provides in the above-mentioned embodiment, the utility model also provides a 3D structured light, this 3D structured light include arbitrary laser emission module in the above-mentioned embodiment. Since the laser emitting module in the above embodiment is adopted in the 3D structured light, please refer to the above embodiment for the beneficial effect of the 3D structured light.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Claims (10)
1. A laser emission module, comprising:
the device comprises a bracket (8) and a laser (4) fixed inside the bracket (8);
the collimating lens (2) is arranged in the support (8), and the collimating lens (2) is arranged on the light emergent side of the laser (4);
the circuit board (5) is connected with the laser (4), and the TEC temperature controller (7) is fixed relative to the bracket (8);
a thermally conductive gel (6), the thermally conductive gel (6) in contact with both the TEC temperature controller (7) and the laser (4).
2. The laser emission module of claim 1, further comprising a heat dissipation housing (3) disposed in the bracket (8), wherein the laser (4) is fixed in the heat dissipation housing (3).
3. The laser emission module according to claim 2, wherein the circuit board (5) is fixedly connected with a side of the laser (4) facing away from the collimating mirror (2), and the TEC temperature controller (7) is located on a side of the circuit board (5) facing away from the laser (4).
4. The laser emission module of claim 3, wherein the gaps between the laser (4), the circuit board (5) and the TEC temperature controller (7) are filled with the heat conducting gel (6).
5. The laser emission module of claim 3, wherein a gap is formed between the circuit board (5) and the TEC temperature controller (7), and the gap between the circuit board (5) and the TEC temperature controller (7) is filled with the heat conducting gel (6).
6. Laser radiation module according to claim 2, characterized in that the heat dissipation housing (3) and the support (8) are bonded together by glue.
7. The laser emission module of claim 2, wherein a first supporting platform is arranged on the inner wall of the heat dissipation shell (3), a second supporting platform which can be attached to the first supporting platform is arranged on the laser (4), and the first supporting platform and the second supporting platform are bonded through glue.
8. The laser emission module according to claim 2, wherein a clamping groove is formed in the bracket (8), and a clamping protrusion capable of being clamped in the clamping groove is arranged on one side of the collimating mirror (2) away from the laser (4);
one side of the collimating lens (2) close to the laser (4) is abutted against the heat dissipation shell (3).
9. The laser emission module according to claim 1, further comprising a diffractive optical element (1) arranged on a side of the collimator lens (2) facing away from the laser (4).
10. A 3D structured light comprising the laser emitting module of any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120536573.1U CN214255038U (en) | 2021-03-15 | 2021-03-15 | 3D structured light and laser emission module thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120536573.1U CN214255038U (en) | 2021-03-15 | 2021-03-15 | 3D structured light and laser emission module thereof |
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| CN214255038U true CN214255038U (en) | 2021-09-21 |
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| CN202120536573.1U Active CN214255038U (en) | 2021-03-15 | 2021-03-15 | 3D structured light and laser emission module thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115084998A (en) * | 2022-06-07 | 2022-09-20 | 立臻精密智造(昆山)有限公司 | Lens module and intelligent terminal |
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2021
- 2021-03-15 CN CN202120536573.1U patent/CN214255038U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115084998A (en) * | 2022-06-07 | 2022-09-20 | 立臻精密智造(昆山)有限公司 | Lens module and intelligent terminal |
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