CN218101200U - Silicon chip carrier with identification code - Google Patents
Silicon chip carrier with identification code Download PDFInfo
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- CN218101200U CN218101200U CN202221232101.8U CN202221232101U CN218101200U CN 218101200 U CN218101200 U CN 218101200U CN 202221232101 U CN202221232101 U CN 202221232101U CN 218101200 U CN218101200 U CN 218101200U
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Abstract
The utility model relates to an integrated circuit processing technology field provides a silicon chip carrier with identification code, and it includes: a silicon wafer carrier body; the silicon wafer loader comprises an identification code assembly, wherein the identification code assembly is arranged on a silicon wafer loader body and comprises a cover plate, an identification piece and a bottom plate, the cover plate, the identification piece and the bottom plate are sequentially stacked and fixed along the height direction, and the identification code is arranged on the identification piece. The utility model provides a silicon chip carrier with identification code, the identification code is processed on the identification sheet, the identification sheet assembly is formed by respectively stacking the cover plate and the bottom plate on the upper surface and the lower surface of the identification sheet, the identification sheet assembly is arranged on the silicon chip carrier body, and the identification code can be identified by the scanning device; the identification piece component can be made of high-temperature-resistant and corrosion-resistant materials, so that the identification code has good high-temperature resistance, corrosion resistance and wear resistance in the integrated circuit processing environment, and is long in service life.
Description
Technical Field
The utility model relates to an integrated circuit processing technology field especially relates to a silicon chip carrier with identification code.
Background
The silicon chip processing procedures of the integrated circuit are numerous, and manufacturers need to scan and identify the silicon chip processing flow for product traceability. The silicon chip itself has no identification, so manufacturers make the identification on the surface of the carrier for processing the silicon chip, that is, make the identification on the silicon chip carrier, most commonly used is a bar code, and can also be a data chip.
For common use plastic products, bar codes may be laser etched onto the surface of the product. However, the integrated circuit silicon wafer processing needs to be ultra-clean, although laser etching plastics only generate a trace amount of carbon particles, the carbon particles are conductive, short circuit of the integrated circuit can be caused, the silicon wafer processing link can be polluted, secondary pollution is caused, the carbon particles are unacceptable in the integrated circuit manufacturing process, the quality of the integrated circuit can be reduced, and the service life of the integrated circuit is influenced. In addition, integrated circuit processing requires a number of highly corrosive chemicals, such as hydrofluoric acid, concentrated nitric acid, sodium hydroxide, potassium hydroxide, hydrogen peroxide, etc., and the processing environment is at a relatively high temperature, even up to 180 ℃. Therefore, bar codes of commonly used materials and conventional bar code fabrication methods cannot be used in integrated circuits.
SUMMERY OF THE UTILITY MODEL
The utility model provides a silicon chip carrier with identification code for solve the defect that the unable direct processing bar code of processing preparation environment of silicon chip carrier among the prior art.
The utility model provides a silicon chip carrier with identification code, include:
a silicon wafer carrier body;
the silicon wafer loader comprises an identification code assembly, wherein the identification code assembly is arranged on a silicon wafer loader body and comprises a cover plate, an identification piece and a bottom plate, the cover plate is fixedly stacked with the bottom plate along the height direction, and the identification code assembly is arranged on the identification piece.
According to the utility model provides a pair of silicon chip loader with identification code, the identification piece is glass piece, potsherd and plastic sheet one of them.
According to the utility model provides a pair of silicon chip loader with identification code, the apron is soluble polytetrafluoroethylene piece.
According to the utility model provides a pair of silicon chip carrier with identification code, the bottom plate is soluble polytetrafluoroethylene piece.
According to the utility model provides a pair of silicon chip carrier with identification code, the surface of silicon chip carrier body is formed with the recess, the identification code subassembly is located the silicon chip carrier body on the recess.
According to the utility model provides a pair of silicon chip carrier with identification code, the identification code subassembly adopt the mode of welding or joint install in silicon chip carrier body in the recess.
According to the utility model provides a pair of silicon chip carrier with identification code, the apron is sealed to be fixed in the upper surface of discernment piece, the bottom plate is sealed to be fixed in the lower surface of discernment piece.
According to the utility model provides a pair of silicon chip carrier with identification code, the apron the identification piece with seal through the welding between the bottom plate in order to form the identification code subassembly.
According to the utility model provides a pair of silicon chip carrier with identification code, the identification code includes bar code or two-dimensional code of sculpture or air brushing on the identification code.
The utility model provides a silicon wafer loader with identification code, the identification code is processed on the identification piece, the identification piece assembly is formed by respectively stacking the cover plate and the bottom plate on the upper surface and the lower surface of the identification piece, the identification piece assembly is installed on the silicon wafer loader body, and the identification code can be identified by the scanning device; the identification piece component can be made of high-temperature-resistant and corrosion-resistant materials, so that the identification code has good high-temperature resistance, corrosion resistance and wear resistance in the integrated circuit processing environment, and the service life is long.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the following briefly introduces the drawings required for the embodiments or the prior art descriptions, and obviously, the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a silicon wafer carrier with an identification code according to the present invention;
FIG. 2 is a flow chart of a method for manufacturing a silicon wafer carrier with an identification code according to the present invention;
reference numerals are as follows:
1: a silicon wafer carrier body; 11: a groove; 2: a cover plate; 3: identification sheet 4: a base plate.
Detailed Description
To make the objects, technical solutions and advantages of the present invention clearer, the drawings of the present invention are combined to clearly and completely describe the technical solutions of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The following describes a silicon wafer carrier with identification code according to the present invention with reference to fig. 1. The silicon wafer carrier with the identification code comprises: silicon chip carrier body 1 and identification code subassembly.
Wherein, the identification code subassembly is located on silicon chip carrier body 1, and the identification code subassembly includes apron 2, discernment piece 3 and bottom plate 4, and apron 2, discernment piece 3 and bottom plate 4 stack in proper order along the direction of height and fix, are equipped with the identification code on the discernment piece 3.
Specifically, a position area for mounting the identification code component may be configured on the silicon wafer carrier body 1, and may be in the form of a groove 11 or a card slot. The identification code component is composed of a cover plate 2, an identification piece 3 and a bottom plate 4, wherein the identification piece 3 is provided with an identification code for identification of a scanning device, and the cover plate 2, the bottom plate 4 and the identification piece 3 are made of high-temperature-resistant and corrosion-resistant materials so as to ensure that the high-temperature environment in the processing process of the integrated circuit can be borne. The identification code on the identification piece 3 can be processed by adopting a laser etching or spray painting mode, the identification piece 3 is made of a non-transparent material, and the cover plate 2 and the bottom plate 4 are made of transparent materials, so that the scanning device can identify the identification code on the identification piece 3, and the silicon wafer carrier body 1 is identified.
Further, the identification sheet 3 is one of a non-transparent glass sheet, a ceramic sheet and a plastic sheet; the cover plate 2 is a transparent soluble polytetrafluoroethylene sheet; the bottom plate 4 is a transparent soluble polytetrafluoroethylene sheet. It should be understood that the identification patch 3 may be made of other high temperature, corrosion resistant, non-transparent materials, and the cover plate 2 and the base plate 4 may be made of other high temperature, corrosion resistant, transparent materials.
The utility model provides a silicon wafer loader with identification code, which processes the identification code on the identification sheet 3, forms the identification sheet assembly by respectively stacking the cover plate 2 and the bottom plate 4 on the upper and lower surfaces of the identification sheet 3, installs the identification sheet assembly on the silicon wafer loader body 1, and the identification code can be identified by the scanning device; the identification piece component can be made of high-temperature-resistant and corrosion-resistant materials, so that the identification code has good high-temperature resistance, corrosion resistance and wear resistance in the integrated circuit processing environment, and is long in service life.
In one embodiment of the present invention, a groove 11 is formed on the surface of the silicon wafer carrier body 1, and the identification code assembly is disposed on the groove 11 of the silicon wafer carrier body 1. In this embodiment, a groove 11 may be formed on the outer surface of the silicon wafer carrier body 1, the groove 11 is used for mounting the identification wafer assembly, and the identification wafer assembly may be fixed in the groove 11 by welding or clamping for identification by the scanning device.
In one embodiment of the present invention, the cover plate 2 is fixed to the upper surface of the identification sheet 3 in a sealing manner, and the bottom plate 4 is fixed to the lower surface of the identification sheet 3 in a sealing manner. In the present embodiment, the cover plate 2 and the bottom plate 4 are welded to hermetically fix the identification sheet 3 therebetween, so as to form an identification sheet assembly with good sealing performance, specifically, the cover plate 2 and the bottom plate 4 can be welded by ultrasonic welding or hot melt welding, so as to ensure that the identification sheet 3 in the middle is not deformed and the sealing performance around the identification sheet assembly is ensured.
In one embodiment of the present invention, the identification code includes a bar code or a two-dimensional code etched or painted on the identification sheet 3. It should be understood that, according to the identification code that the scanning device can recognize, other identification code modes can be adopted, and the invention is not limited to the bar code and the two-dimensional code, and the invention is in the protection scope as long as the identification function is provided.
As shown in fig. 2, the present invention further provides a method for manufacturing a silicon wafer carrier with an identification code as the above embodiment. The manufacturing method comprises the following steps:
s1, processing an identification code on an identification sheet 3;
s2, the identification sheet 3 is hermetically fixed between the bottom plate 4 and the cover plate 2 to form an identification code assembly;
and S3, arranging the identification code assembly in the silicon wafer loader body 1.
Wherein, the step S1 specifically comprises the following steps:
the identification sheet 3 is made of one of a non-transparent glass sheet, a ceramic sheet and a plastic sheet, and a bar code or a two-dimensional code is laser etched or inkjet printed on the identification sheet. The identification sheet 3 is ensured to have enough high temperature resistance, can withstand the high temperature of 400 ℃ during welding and cannot be melted or deformed; meanwhile, the identification piece 3 is required to be made of a material with good corrosion resistance, and the silicon wafer manufacturing environment is not polluted in the using process.
The step S2 specifically includes:
s21, respectively attaching the soluble polytetrafluoroethylene sheets (PFA sheets) to the upper surface and the lower surface of the identification sheet 3 by respectively adopting transparent soluble polytetrafluoroethylene sheets (PFA sheets) for welding and sealing;
and S22, cutting the assembly welded and sealed in the S21 step. The PFA piece has the advantages of high temperature resistance, corrosion resistance and the like, the cover plate 2, the identification piece 3 and the bottom plate 4 are made of melt-weldable PFA pieces generally, and the silicon wafer carrier body 1 is also made of PFA materials, so that the manufactured identification code assembly and the silicon wafer carrier body 1 are welded together.
Step S3 specifically includes:
the identification code assembly is arranged in the groove 11 of the silicon wafer carrier body 1 in a welding or clamping manner.
Further, the welding mode in step S21 and step S3 can adopt ultrasonic welding or hot melt welding, so as to ensure that the identification sheet 3 is not deformed, the periphery sealing performance and the identification code assembly are connected with the silicon wafer carrier body 1 to form a whole.
The utility model provides a pair of silicon chip loader's preparation method with identification code is fixed in 3 sealedly between bottom plate 4 and the apron 2 with the identification piece, guarantees that the identification code on the identification piece 3 can not corroded and wearing and tearing, and the identification code subassembly of formation both has high temperature resistant, corrosion resisting property, possesses wear resistance again, guarantees product long service life.
Based on the above description, the utility model provides a silicon chip carrier's with identification code concrete implementation step:
firstly, selecting materials for the cover plate 2, the identification sheet 3 and the bottom plate 4, and respectively manufacturing the cover plate, the identification sheet and the bottom plate by adopting PFA sheets;
secondly, performing laser etching on the identification sheet 3 to manufacture a bar code;
thirdly, respectively attaching the cover plate 2 and the bottom plate 4 to the upper surface and the lower surface of the identification piece 3, and welding the peripheries of the identification piece and the bottom plate to form an integral structure, so that the identification piece 3 is completely covered inside the cover plate 2 and the bottom plate 4 to form an identification piece assembly;
fourthly, cutting the identification sheet assembly to enable the bar code of the identification sheet 3 to be positioned in the middle position and the size to meet the installation requirement of the silicon wafer carrier body 1;
and fifthly, installing the identification sheet assembly cut in the fourth step in the groove 11 of the carrier body 1 through welding or clamping.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (9)
1. A silicon wafer carrier having an identification code, comprising:
a silicon wafer carrier body;
the silicon wafer loader comprises an identification code assembly, wherein the identification code assembly is arranged on a silicon wafer loader body and comprises a cover plate, an identification piece and a bottom plate, the cover plate is fixedly stacked with the bottom plate along the height direction, and the identification code assembly is arranged on the identification piece.
2. The silicon wafer carrier with identification code of claim 1, wherein the identification sheet is one of a glass sheet, a ceramic sheet and a plastic sheet.
3. The silicon wafer carrier with identification code as claimed in claim 1, wherein the cover plate is a soluble polytetrafluoroethylene sheet.
4. The silicon wafer carrier with identification code as claimed in claim 1, wherein the bottom plate is a soluble polytetrafluoroethylene sheet.
5. The silicon wafer carrier with the identification code of claim 1, wherein a groove is formed on the surface of the silicon wafer carrier body, and the identification code component is arranged on the groove of the silicon wafer carrier body.
6. The silicon wafer carrier with the identification code of claim 5, wherein the identification code assembly is mounted in the groove of the silicon wafer carrier body by welding or clamping.
7. The silicon wafer carrier with identification code of claim 1, wherein the cover plate is hermetically fixed on the upper surface of the identification sheet, and the bottom plate is hermetically fixed on the lower surface of the identification sheet.
8. The silicon wafer carrier with identification code of claim 6, wherein the cover plate, the identification plate and the bottom plate are sealed by welding to form the identification code assembly.
9. The silicon wafer carrier with the identification code according to any one of claims 1 to 8, wherein the identification code comprises a bar code or a two-dimensional code etched or painted on the identification sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221232101.8U CN218101200U (en) | 2022-05-18 | 2022-05-18 | Silicon chip carrier with identification code |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221232101.8U CN218101200U (en) | 2022-05-18 | 2022-05-18 | Silicon chip carrier with identification code |
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| Publication Number | Publication Date |
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| CN218101200U true CN218101200U (en) | 2022-12-20 |
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| CN202221232101.8U Active CN218101200U (en) | 2022-05-18 | 2022-05-18 | Silicon chip carrier with identification code |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117457545A (en) * | 2023-12-20 | 2024-01-26 | 北京市塑料研究所有限公司 | Method for forming identification code of silicon wafer carrier |
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2022
- 2022-05-18 CN CN202221232101.8U patent/CN218101200U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117457545A (en) * | 2023-12-20 | 2024-01-26 | 北京市塑料研究所有限公司 | Method for forming identification code of silicon wafer carrier |
| CN117457545B (en) * | 2023-12-20 | 2024-03-12 | 北京市塑料研究所有限公司 | Method for forming identification code of silicon wafer carrier |
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