CN218100986U

CN218100986U - Thin film capacitor with efficient heat dissipation

Info

Publication number: CN218100986U
Application number: CN202221829767.1U
Authority: CN
Inventors: 徐挺; 周斌迁; 陈华国; 王婷
Original assignee: Taizhou Haoda Electrical Machinery Co ltd
Current assignee: Taizhou Haoda Electrical Machinery Co ltd
Priority date: 2022-07-15
Filing date: 2022-07-15
Publication date: 2022-12-20
Anticipated expiration: 2032-07-15

Abstract

The utility model discloses a film capacitor with high-efficient radiating, including shell and the condenser inner core of setting in the shell inside, the condenser inner core outside is provided with the heat dissipation frame, the heat dissipation frame includes: the heat dissipation cover is wrapped on the outer side of the capacitor inner core, and the heat dissipation fins are arranged on the outer surface of the heat dissipation cover; and a heat conduction insulating layer is arranged on the outer side of each heat dissipation fin, and the outer side of each heat dissipation fin is in contact with the shell. Film capacitor with high-efficient radiating can effectively dispel the heat to condenser inner core through setting up the heat dissipation frame, dispel the heat simultaneously the frame can be stably fixed condenser inner core inside the shell, avoids it to take place the skew, and the heat dissipation wing outside still is provided with heat conduction insulation layer to strengthen the radiating effect of heat dissipation frame.

Description

Thin film capacitor with efficient heat dissipation

Technical Field

The utility model relates to a film capacitor technical field, concretely relates to film capacitor with high-efficient heat dissipation.

Background

The capacitor is one of the electronic components widely used in electronic devices, and widely applied to the aspects of isolating direct current and alternating current, coupling bypass, filtering, tuning loops and the like in circuits, and can be divided into an electrolyte capacitor, a paper capacitor, a mica capacitor, a ceramic capacitor, a thin film capacitor and the like according to different media, wherein the thin film capacitor is widely applied to places such as power noise bypass, analog signal cross connection and the like due to the characteristics of no polarity, high insulation impedance, wide frequency response, small dielectric loss and the like. The film capacitor is usually made by using a metal foil or a metallized film layer as an electrode, and winding the metal foil or the metallized film layer and a plastic film such as polyethylene, polypropylene, polystyrene or polycarbonate into a cylindrical shape after overlapping both ends.

However, the thin film capacitor has a weak large current tolerance capability, particularly, the thin film capacitor has a poor heat dissipation effect, the capacitor core is easy to accumulate heat and raise the temperature, once the temperature of the capacitor is too high, the current capacity and the voltage resistance are affected, the service life of the capacitor is affected, and the operation of equipment is greatly affected. Heat dissipation of the capacitor is particularly important due to the fact that heat generation inside the capacitor is unavoidable.

SUMMERY OF THE UTILITY MODEL

The utility model discloses not enough to prior art exists, provide the film capacitor who has high-efficient heat dissipation, concrete technical scheme is as follows:

film capacitor with high-efficient heat dissipation includes the shell and sets up the inside condenser core in the shell, the condenser core outside is provided with the heat dissipation frame, the heat dissipation frame includes:

a heat dissipation cover which is wrapped outside the capacitor inner core,

the heat dissipation fins are arranged on the outer surface of the heat dissipation cover;

and a heat conduction insulating layer is arranged on the outer side of each heat dissipation fin, and the outer side of each heat dissipation fin is in contact with the shell.

As an improvement of the technical scheme, the heat dissipation fins are provided with heat dissipation holes.

As an improvement of the technical scheme, the heat dissipation holes comprise longitudinal heat dissipation holes and transverse heat dissipation holes, and the longitudinal heat dissipation holes and the transverse heat dissipation holes are uniformly formed in the surfaces of the heat dissipation fins.

As an improvement of the technical scheme, the contact surface of the heat dissipation fin and the shell is a convex surface.

As an improvement of the technical scheme, a plurality of heat insulation cavities are arranged in the shell and are uniformly arranged at intervals.

Compared with the prior art, the utility model, its technical effect as follows:

film capacitor with high-efficient radiating can effectively dispel the heat to condenser inner core through setting up the heat dissipation frame, dispel the heat simultaneously and put up condenser inner core stable fixation inside the shell, avoid it to take place the skew, the heat dissipation wing outside still is provided with heat conduction insulation layer to strengthen the radiating effect of heat dissipation frame.

Drawings

Fig. 1 is a schematic view of an external structure of a thin film capacitor with efficient heat dissipation according to the present invention;

fig. 2 is a schematic view of the internal structure of the thin film capacitor with high heat dissipation efficiency according to the present invention;

fig. 3 is a top view of the thin film capacitor with high heat dissipation efficiency according to the present invention;

FIG. 4 is a schematic view of a partial structure of the heat dissipating fin of the present invention;

fig. 5 is a schematic view of the internal structure of the housing of the present invention;

reference numerals are as follows: 10. a housing; 20. an inner core of the capacitor; 30. a heat dissipation frame; 40. a thermally conductive insulating layer; 11. a thermally insulating cavity; 31. a heat dissipation cover; 32. heat dissipation fins; 321. heat dissipation holes; 3211. longitudinal heat dissipation holes; 3212. and transverse heat dissipation holes.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Examples

As shown in fig. 1, fig. 2, fig. 3, film capacitor with high-efficient heat dissipation, film capacitor includes shell 10 and sets up at shell 10 inside and shell shape size assorted condenser inner core 20, the condenser inner core 20 outside is provided with heat dissipation frame 30, heat dissipation frame 30 is including the heat exchanger 31 of parcel condenser inner core 20 and the heat dissipation fin 32 of setting at heat exchanger 31 surface that looses. The heat conducting insulating layer 40 is arranged on the outer side of the heat dissipation fins 32, and the outer side of the heat dissipation fins 32 is in contact with the shell 10. The utility model discloses a shell 10 provides the support to condenser inner core 20's installation to fix condenser inner core 20 inside shell 10 through heat dissipation frame 30, make it can not take place the skew when removing or using, heat dissipation frame 30 also can dispel the heat to condenser inner core 20 through heat-conduction is effectual simultaneously, heat-conducting insulation layer 40 can strengthen the heat dissipation of heat dissipation frame 30 on the one hand, on the other hand also can be isolated with condenser inner core 20 and shell 10, provide insulating effect, prevent that static from taking place.

As a further optimization and improvement, in order to further enhance the heat dissipation effect of the heat insulating layer 40 on the heat dissipation frame 30, the heat dissipation fins 32 are provided with heat dissipation holes 321, and when the heat insulating layer 40 is filled, the contact area between the heat dissipation fins 32 and the heat dissipation holes 321 is increased, so as to achieve a better heat dissipation effect.

As a further optimization and improvement, as shown in fig. 3 and 4, the heat dissipation holes 321 include longitudinal heat dissipation holes 3211 and transverse heat dissipation holes 3212, and the longitudinal heat dissipation holes 3211 and the transverse heat dissipation holes 3212 are uniformly formed on the surface of the heat dissipation fins 32, so as to better perform further heat dissipation through the heat conductive insulating layer 40.

As a further optimization improvement, in order to avoid the poor insulation effect inside the capacitor caused by the excessively large contact area of the heat dissipation fins 32 and the housing 10, the contact surface of the heat dissipation fins 32 and the housing 10 is a cambered surface. And the cambered surface is a convex surface. The heat dissipation fins 32 are arranged in line contact with the housing 10, and the contact area between the heat dissipation fins 32 and the housing 10 is effectively reduced.

As a further optimized modification, as shown in fig. 5, in order to further enhance the heat dissipation effect of the film capacitor, a plurality of heat insulation cavities 11 are arranged inside the housing 10, and the heat insulation cavities are uniformly spaced. The heat dissipation effect of the film capacitor can be further enhanced by the arrangement of the heat insulation cavity 11.

Thin film capacitor with high-efficient heat dissipation specifically adjusts the principle as follows:

the capacitor inner core 20 can be effectively cooled by the cooling frame 30, the capacitor inner core 20 can be stably fixed inside the shell 10 by the cooling frame 30, so that the capacitor inner core is prevented from deviating, and the heat conducting insulating layer 40 is arranged outside the cooling fins 32, so that the cooling effect of the cooling frame 30 is enhanced.

It is noted that, in this document, relational terms such as first and second, and the like, if any, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising one of 8230; \8230;" 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and any modifications, equivalents, improvements, etc. made within the spirit and principles of the present invention should be included within the scope of the present invention.

Claims

1. Film capacitor with high-efficient heat dissipation includes shell (10) and sets up at inside capacitor core (20) of shell (10), capacitor core (20) outside is provided with heat dissipation frame (30), its characterized in that: the heat dissipation frame (30) includes:

a heat dissipation cover (31) which is wrapped outside the capacitor inner core (20),

a heat dissipation fin (32) provided on the outer surface of the heat dissipation cover (31);

and a heat conduction insulating layer (40) is arranged on the outer side of each heat dissipation fin (32), and the outer side of each heat dissipation fin (32) is in contact with the shell (10).

2. The film capacitor with high efficiency heat dissipation as defined in claim 1, wherein: the heat dissipation fins (32) are provided with heat dissipation holes (321).

3. The film capacitor with high efficiency heat dissipation of claim 2, wherein: the heat dissipation holes (321) comprise longitudinal heat dissipation holes (3211) and transverse heat dissipation holes (3212), and the longitudinal heat dissipation holes (3211) and the transverse heat dissipation holes (3212) are uniformly formed in the surfaces of the heat dissipation fins (32).

4. The film capacitor with high efficiency heat dissipation of claim 1, wherein: the contact surface of the heat dissipation fins (32) and the shell (10) is a convex surface.

5. The film capacitor with high efficiency heat dissipation of claim 1, wherein: a plurality of heat insulation cavities (11) are arranged in the shell (10), and the heat insulation cavities are arranged at equal intervals.