CN212257182U - Capacitor with heat radiation structure - Google Patents
Capacitor with heat radiation structure Download PDFInfo
- Publication number
- CN212257182U CN212257182U CN202020512217.1U CN202020512217U CN212257182U CN 212257182 U CN212257182 U CN 212257182U CN 202020512217 U CN202020512217 U CN 202020512217U CN 212257182 U CN212257182 U CN 212257182U
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- Prior art keywords
- heat dissipation
- shell
- capacitor
- negative electrode
- positive electrode
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- 239000003990 capacitor Substances 0.000 title claims abstract description 36
- 230000005855 radiation Effects 0.000 title claims description 5
- 230000017525 heat dissipation Effects 0.000 claims abstract description 99
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000000741 silica gel Substances 0.000 claims abstract description 10
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 10
- 238000005253 cladding Methods 0.000 claims abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 24
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 24
- 239000011888 foil Substances 0.000 claims description 24
- 238000002955 isolation Methods 0.000 claims description 18
- 230000000694 effects Effects 0.000 abstract description 9
- 230000006872 improvement Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
A capacitor with a heat dissipation structure comprises a shell, wherein a core cladding is arranged in the shell, a heat dissipation silica gel filling layer is arranged between the core cladding and the shell, and a positive electrode pin and a negative electrode pin are arranged in the core cladding; the top end of the positive electrode pin is fixed with a positive electrode lead, and the top end of the negative electrode pin is fixed with a negative electrode lead; a cover plate is fixed at the top end of the shell, and the positive lead and the negative lead penetrate through the cover plate; a heat dissipation piece is arranged inside the shell and comprises a heat dissipation through hole, a connecting sheet and a heat dissipation column; the heat dissipation through hole penetrates through the shell and is arranged in the shell, and the inner wall of the heat dissipation through hole is connected with a connecting sheet; the connecting piece is connected with the heat dissipation column. The utility model increases the heat dissipation area between the capacitor and the outside through the heat dissipation structure arranged inside the capacitor, and improves the heat dissipation effect of the capacitor; the long-time use can not cause the damage to inner structure yet, prolongs the life of condenser.
Description
Technical Field
The utility model belongs to the technical field of the condenser, in particular to condenser with heat radiation structure.
Background
The capacitor is composed of two conductors which are close to each other and a layer of non-conductive insulating medium is sandwiched between the two conductors; when a voltage is applied between the two plates of the capacitor, the capacitor stores charges; the capacitance of the capacitor is numerically equal to the ratio of the amount of charge on one conductive plate to the voltage between the two plates; the capacitor plays an important role in circuits such as tuning, bypass, coupling, filtering and the like; the tuning circuit of the transistor radio is used, and the coupling circuit, the bypass circuit and the like of the color television are also used; with the change of electronic information technology, the update speed of digital electronic products is faster and faster, and the production and sales volume of consumer electronic products such as flat panel televisions (LCDs and PDPs), notebook computers, and digital cameras is continuously increasing, which drives the growth of capacitor industry.
The existing capacitor has no good heat dissipation structure, so the heat dissipation effect is poor, when the capacitor does not have good heat dissipation capacity, the internal structure is damaged after long-time use, and the service life of the capacitor is seriously shortened.
SUMMERY OF THE UTILITY MODEL
The utility model discloses not enough to prior art exists provides a condenser with heat radiation structure, and concrete technical scheme is as follows:
a capacitor with a heat dissipation structure comprises a shell, wherein a core cladding is arranged in the shell, a heat dissipation silica gel filling layer is arranged between the core cladding and the shell, and a positive electrode pin and a negative electrode pin are arranged in the core cladding; the top end of the positive electrode pin is fixed with a positive electrode lead, and the top end of the negative electrode pin is fixed with a negative electrode lead; a cover plate is fixed at the top end of the shell, and the positive lead and the negative lead penetrate through the cover plate; a heat dissipation piece is arranged inside the shell and comprises a heat dissipation through hole, a connecting sheet and a heat dissipation column; the heat dissipation through hole penetrates through the shell and is arranged in the shell, and the inner wall of the heat dissipation through hole is connected with a connecting sheet; the connecting sheet is connected with the heat dissipation column; and the heat dissipation column is of a hollow structure and is equal to the heat dissipation through hole in length.
Further, the heat dissipation pieces are three and are equidistantly distributed on the top end of the side portion of the outer shell.
Furthermore, a plurality of connecting sheets are equidistantly distributed on the inner wall of the radiating through hole, and the cross section of each connecting sheet is of a fan-shaped structure; and the end part of the connecting sheet is fixed with a heat dissipation column.
Furthermore, a vertical rod is fixed at the bottom of the cover plate, and a fixing plate is fixed at the bottom of the vertical rod; the fixing plate is of a two-thirds circular ring structure and is connected with the heat dissipation through hole in a clamping mode.
Furthermore, a plurality of radiating fins are equidistantly distributed on two sides of the shell, and the radiating fins are as long as the shell.
Further, the core package comprises negative electrode isolation paper, a negative electrode aluminum foil, a positive electrode aluminum foil and positive electrode isolation paper, wherein the negative electrode aluminum foil is arranged on the surface of the negative electrode isolation paper, and the positive electrode aluminum foil is arranged on the surface of the positive electrode isolation paper; the negative electrode aluminum foil wraps the negative electrode pin, and the positive electrode aluminum foil wraps the positive electrode pin.
The utility model has the advantages that:
the capacitor with the heat dissipation structure of the utility model increases the heat dissipation area between the capacitor and the outside through the heat dissipation structure arranged inside the capacitor in a penetrating way, and improves the heat dissipation effect of the capacitor; the long-time use can not cause the damage to inner structure yet, prolongs the life of condenser.
Drawings
Fig. 1 shows a schematic structural diagram of a capacitor with a heat dissipation structure according to the present invention;
fig. 2 shows a schematic internal structure diagram of a core package according to an embodiment of the present invention;
FIG. 3 shows an enlarged schematic view of FIG. 1 at A;
fig. 4 shows a schematic perspective view of the capacitor with a heat dissipation structure according to the present invention.
Shown in the figure: 1. the heat dissipation structure comprises a negative electrode lead 11, a negative electrode pin 2, a positive electrode lead 21, a positive electrode pin 3, a cover plate 31, a vertical rod 32, a fixing plate 4, a heat dissipation fin 5, a shell 6, a heat dissipation silica gel filling layer 7, a core package 71, negative electrode isolation paper 72, a negative electrode aluminum foil 73, a positive electrode aluminum foil 74, positive electrode isolation paper 8, a heat dissipation piece 81, a heat dissipation through hole 82, a connecting piece 83 and a heat dissipation column.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
A capacitor with a heat dissipation structure comprises a shell 5, wherein a core package 7 is arranged inside the shell 5, a heat dissipation silica gel filling layer 6 is arranged between the core package 7 and the shell 5, and the heat dissipation silica gel filling layer 6 not only realizes the fixation of the core package 7, but also is convenient for transmitting heat inside the core package 7 to the outside; and the core bag 7 is internally provided with a positive electrode pin 21 and a negative electrode pin 11; the top end of the positive electrode pin 21 is fixed with a positive electrode lead 2, and the top end of the negative electrode pin 11 is fixed with a negative electrode lead 1; a cover plate 3 is fixed at the top end of the shell 5, and the positive lead 2 and the negative lead 1 penetrate through the cover plate 3;
a heat dissipation member 8 is arranged inside the shell 5, and the heat dissipation member 8 comprises a heat dissipation through hole 81, a connecting sheet 82 and a heat dissipation column 83; the heat dissipation through hole 81 penetrates through the shell 5, and the inner wall of the heat dissipation through hole 81 is connected with a connecting sheet 82; the connecting piece 82 is connected with the heat dissipation column 83; the heat dissipation column 83 is of a hollow structure and has the same length as the heat dissipation through hole 81; the heat dissipation through hole 81 can effectively increase the heat dissipation capacity inside the capacitor, and the heat dissipation is increased by matching with the heat dissipation sheet 82 and the heat dissipation column 83.
As the improvement of the above technical scheme, the heat dissipation members 8 are three and equidistantly distributed at the top end of the side portion of the housing 5, so as to improve the heat dissipation effect.
As an improvement of the above technical solution, a plurality of connecting pieces 82 are equidistantly distributed on the inner wall of the heat dissipation through hole 81, and the cross section of each connecting piece 82 adopts a fan-shaped structure; the end of the connecting piece 82 is fixed with the heat dissipation column 83, so that the heat dissipation area of the capacitor is enlarged, and the heat dissipation effect is improved.
As an improvement of the above technical solution, a vertical rod 31 is fixed at the bottom of the cover plate 3, and a fixing plate 32 is fixed at the bottom of the vertical rod 31; the fixed plate 32 adopts a two-thirds circular ring structure, and the fixed plate 32 is clamped and connected with the heat dissipation through hole 81, so that the firmness and the stability of the connection between the cover plate 3 and the shell 5 are improved.
As an improvement of the above technical solution, a plurality of heat dissipation fins 4 are equidistantly distributed on two sides of the housing 5, and the heat dissipation fins 4 have the same length as the housing 5, so as to improve the heat dissipation effect of the capacitor.
As an improvement of the above technical solution, the core package 7 includes a negative electrode isolation paper 71, a negative electrode aluminum foil 72, a positive electrode aluminum foil 73 and a positive electrode isolation paper 74 inside, the negative electrode isolation paper 71 is provided with the negative electrode aluminum foil 72 on the surface, and the positive electrode isolation paper 74 is provided with the positive electrode aluminum foil 73 on the surface; the negative electrode aluminum foil 72 wraps the negative electrode pin 11, and the positive electrode aluminum foil 73 wraps the positive electrode pin 21.
Fig. 1 shows a schematic overall structure diagram of an embodiment of the present invention, exemplarily, as shown in fig. 1, a core package 7 is disposed inside the housing 5, and a heat dissipation silica gel filling layer 6 is formed by filling heat dissipation silica gel between the core package 7 and the housing 5; the fixation of the core package 7 is realized; the core package 7 has an internal structure as shown in fig. 2, and includes negative electrode isolation paper 71 and positive electrode isolation paper 74, wherein a negative electrode aluminum foil 72 is disposed on the surface of the negative electrode isolation paper 71, and a positive electrode aluminum foil 73 is disposed on the surface of the positive electrode isolation paper 74; the positive electrode aluminum foil 73 is internally wrapped with a positive electrode pin 21, and the negative electrode aluminum foil 72 is internally wrapped with a negative electrode pin 11; the top of the positive pin 21 is fixed with a positive lead 2, and the top of the negative pin 11 is fixed with a negative lead 1; the positive lead 2 and the negative lead 1 penetrate through the cover plate 3, and the cover plate 3 covers the top of the shell 5; the radiating fins 4 are fixed on the two sides of the shell 5, and the radiating fins 4 are of metal structures, so that the integral radiating effect is increased conveniently; the inside of heat dissipation silica gel filling layer 6 is equipped with one or more radiating piece 8, and exemplarily, radiating piece 8 is equipped with three.
Fig. 3 shows an enlarged schematic structural diagram at a in fig. 1 according to an embodiment of the present invention, exemplarily, as shown in fig. 3, the heat dissipation member 8 includes a heat dissipation through hole 81, a connection piece 82, and a heat dissipation pillar 83, the heat dissipation member 8 includes a heat dissipation through hole 81, and the heat dissipation through hole 81 is observed and disposed on the heat dissipation silica gel filling layer 6; the inner wall of the heat dissipation through hole 81 is fixed with a plurality of connecting pieces 82, the connecting pieces 82 are of fan-shaped structures, the connecting pieces 82 are distributed at equal intervals, the cross section of the other end of each connecting piece 82, which is used for fixing the heat dissipation column 83, is of a circular ring-shaped structure, and the heat dissipation column 83 and the connecting pieces 82 are of metal structures and used for increasing the heat dissipation effect. The fixed plate 32 is clamped on the outer side of the through hole 81, the fixed plate 32 is of a two-thirds annular structure, the vertical rod 31 is fixed on the top of the fixed plate 32, and the cover plate 3 is fixed on the top of the vertical rod 31.
Fig. 4 is the perspective structure diagram of the embodiment of the present invention, exemplarily, as shown in the figure, the radiating fins 4 are distributed at the two side walls of the housing 5, just the lateral top end of the housing 5 is provided with the radiating member 8 in a penetrating manner, the top of the housing 5 is provided with the cover plate 3, and the cover plate 3 is provided with the positive lead 2 and then the negative lead 1 in an inner penetrating manner.
The capacitor with the heat dissipation structure of the utility model increases the heat dissipation area between the capacitor and the outside through the heat dissipation structure arranged inside the capacitor in a penetrating way, and improves the heat dissipation effect of the capacitor; the long-time use can not cause the damage to inner structure yet, prolongs the life of condenser.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. A capacitor with a heat radiation structure is characterized in that: the heat dissipation device comprises a shell (5), wherein a core cladding (7) is arranged in the shell (5), a heat dissipation silica gel filling layer (6) is arranged between the core cladding (7) and the shell (5), and a positive pin (21) and a negative pin (11) are arranged in the core cladding (7); a positive lead (2) is fixed at the top end of the positive pin (21), and a negative lead (1) is fixed at the top end of the negative pin (11); a cover plate (3) is fixed at the top end of the shell (5), and the positive lead (2) and the negative lead (1) penetrate through the cover plate (3);
a heat dissipation piece (8) is arranged inside the shell (5), and the heat dissipation piece (8) comprises a heat dissipation through hole (81), a connecting piece (82) and a heat dissipation column (83); the heat dissipation through hole (81) penetrates through the shell (5), and the inner wall of the heat dissipation through hole (81) is connected with a connecting sheet (82); the connecting piece (82) is connected with the heat dissipation column (83); and the heat dissipation column (83) is of a hollow structure and is equal to the heat dissipation through hole (81) in length.
2. A capacitor with a heat dissipating structure as claimed in claim 1, wherein: the heat dissipation pieces (8) are three and are distributed at the top end of the side portion of the shell (5) at equal intervals.
3. A capacitor with a heat dissipating structure as claimed in claim 1, wherein: a plurality of connecting pieces (82) are equidistantly distributed on the inner wall of the heat dissipation through hole (81), and the cross section of each connecting piece (82) adopts a fan-shaped structure; and a heat dissipation column (83) is fixed at the end part of the connecting sheet (82).
4. A capacitor with a heat dissipating structure as claimed in claim 1, wherein: a vertical rod (31) is fixed at the bottom of the cover plate (3), and a fixing plate (32) is fixed at the bottom of the vertical rod (31); the fixing plate (32) is of a two-thirds circular ring structure, and the fixing plate (32) is clamped and connected with the heat dissipation through hole (81).
5. A capacitor with a heat dissipating structure as claimed in claim 1, wherein: a plurality of radiating fins (4) are equidistantly distributed on two sides of the shell (5), and the radiating fins (4) are as long as the shell (5).
6. A capacitor with a heat dissipating structure as claimed in claim 1, wherein: the core package (7) comprises negative electrode isolation paper (71), a negative electrode aluminum foil (72), a positive electrode aluminum foil (73) and positive electrode isolation paper (74), wherein the negative electrode aluminum foil (72) is arranged on the surface of the negative electrode isolation paper (71), and the positive electrode aluminum foil (73) is arranged on the surface of the positive electrode isolation paper (74); the negative electrode aluminum foil (72) wraps the negative electrode pin (11), and the positive electrode aluminum foil (73) wraps the positive electrode pin (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020512217.1U CN212257182U (en) | 2020-04-09 | 2020-04-09 | Capacitor with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020512217.1U CN212257182U (en) | 2020-04-09 | 2020-04-09 | Capacitor with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212257182U true CN212257182U (en) | 2020-12-29 |
Family
ID=73984185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020512217.1U Expired - Fee Related CN212257182U (en) | 2020-04-09 | 2020-04-09 | Capacitor with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212257182U (en) |
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2020
- 2020-04-09 CN CN202020512217.1U patent/CN212257182U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201229 |