CN218096559U - Gas water heater - Google Patents

Abstract

The application discloses gas heater belongs to the technical field of kitchen thermoelectric devices to solve present gas heater occupation space's technical problem. The gas heater includes: the shell is provided with an inner cavity, and an air inlet and an air outlet which are communicated with the inner cavity; the hot water module is arranged in the inner cavity and used for providing hot water; the heat exchange module comprises a semiconductor heat exchanger, a heat exchange assembly and an accommodating box, wherein part of the semiconductor heat exchanger is arranged in the accommodating box and is used for exchanging heat with a heat exchange medium in the accommodating box, and the heat exchange assembly is connected with the accommodating box so as to exchange heat with air entering the inner cavity through the air inlet through the heat exchange medium and discharge the heat-exchanged air out of the inner cavity from the air outlet. The semiconductor heat exchanger has a smaller structure, so that the occupied space in the inner cavity can be reduced, and the volume of the whole gas water heater is reduced on the whole.

Description

Gas water heater

Technical Field

The application belongs to the technical field of kitchen thermoelectric devices, and particularly relates to a gas water heater.

Background

A gas water heater is a common one of kitchen appliances. Depending on the installation environment, the indoor-installed balance machine, the forced air exhauster, and the outdoor-installed outdoor machine are roughly classified. Most of the indoor installation places are bathrooms, kitchens or balconies. The main installation place is a kitchen, the gas water heater has single function and only provides domestic hot water due to the limitation of house type and gas pipelines. In order to solve the problem of the stuffiness of the kitchen in summer, the use of kitchen refrigeration products in the kitchen is gradually increased. The traditional wall-mounted air conditioner or the special kitchen air conditioner needs to be provided with an outdoor unit and occupies precious kitchen space, the mobile air conditioner has low refrigeration power, and the exhaust is indoor or needs to be specially provided with a large-diameter exhaust pipe to be communicated with the outside, so that the use is inconvenient. Although products such as kitchen heaters can save space, the refrigeration effect is poor.

In the correlation technique, above-mentioned domestic gas instantaneous water heater and kitchen refrigeration product all set up alone for the kitchen that originally the space is not abundant becomes more crowded, and the kitchen refrigeration product refrigeration effect that can save space is unsatisfactory, therefore present kitchen refrigeration product all can not compromise refrigeration effect and installation space.

SUMMERY OF THE UTILITY MODEL

The application aims at solving the technical problem of occupying space of the gas water heater at least to a certain extent. To this end, the present application provides a gas water heater.

The embodiment of the application provides a gas heater includes:

the shell is provided with an inner cavity, and an air inlet and an air outlet which are communicated with the inner cavity;

the hot water module is arranged in the inner cavity and used for providing hot water;

the heat exchange module comprises a semiconductor heat exchanger, a heat exchange assembly and a containing box, wherein part of the semiconductor heat exchanger is arranged in the containing box and used for exchanging heat with a heat exchange medium in the containing box, the heat exchange assembly is connected with the containing box so as to exchange heat with air entering the inner cavity through the air inlet through the heat exchange medium, and the air after heat exchange is discharged out of the inner cavity from the air outlet.

The semiconductor heat exchanger is simple in structure and small in heat exchange effect, meanwhile, the semiconductor heat exchanger is small in structure, occupied space in the inner cavity can be reduced, and the size of the whole gas water heater is reduced on the whole. And the semiconductor heat exchanger has a simple structure and lower cost, and the manufacturing cost of the gas water heater is reduced on the whole.

In an alternative embodiment of the present application, the semiconductor heat exchanger includes a first heat exchanging end and a second heat exchanging end, and the first heat exchanging end is disposed in the accommodating box.

After being electrified, one end of the semiconductor heat exchanger has a refrigerating function, and the other end of the semiconductor heat exchanger has a heating function, namely one of the first heat exchanging end and the second heat exchanging end is a heating end, and the other end of the semiconductor heat exchanger is a refrigerating end. If the heat exchange module operates in a heating mode, the first heat exchange end is a heating end, the second heat exchange end is a cooling end, the first heat exchange end heats a heat exchange medium, the heated heat exchange medium enters the heat exchange assembly, heat is released through the heat exchange assembly and exchanges heat with air in the inner cavity to heat the air in the inner cavity, and the heated air is discharged from the air outlet, so that the temperature of the installation environment is increased.

In an optional embodiment of the present application, the heat exchange module further includes a heat dissipation channel, a portion of the heat dissipation channel extends into the inner cavity, and the second heat exchange end is disposed in the heat dissipation channel.

The first heat exchange end of the semiconductor heat exchanger exchanges heat with a heat exchange medium, and the second heat exchange end is mainly used for heat dissipation. Under the condition that the heat exchange module operates in a heating mode, the first heat exchange end is a heating end, the second heat exchange end is a refrigerating end, and cold energy generated by the refrigerating end is discharged from the heat dissipation channel, so that the heat exchange efficiency of the heat exchange module and a heat exchange medium is accelerated.

In an alternative embodiment of the present application, the hot water module includes an exhaust passage, and the heat dissipation passage communicates with the exhaust passage.

The heat dissipation channel is communicated with the exhaust channel, so that hot air in the heat dissipation channel and waste gas in the exhaust channel are exhausted out of the inner cavity through the same channel, the structure of the gas water heater is reduced, and the size of the gas water heater is reduced.

In an optional embodiment of the present application, a connection port is disposed on the exhaust channel, and one end of the heat dissipation channel, which is far away from the semiconductor heat exchanger, is communicated with the exhaust port.

For the hot water module, only the connecting port is arranged on the exhaust channel, and other structures are not added, so that the manufacturing cost of the whole gas water heater is reduced.

In the optional embodiment of this application, heat exchange assembly includes evaporation heat exchanger and driver, evaporation heat exchanger with hold the case and connect and form circulation circuit, the driver is installed on circulation circuit, be used for with heat exchange medium in the holding case transmits to evaporation heat exchanger, evaporation heat exchanger is used for passing through heat exchange medium heat absorption refrigeration.

The heat exchange medium is liquid, the driver can be a water pump, the liquid heat exchange medium flows into the evaporation heat exchanger through the water pump, and after entering the evaporation heat exchanger, the heat exchange medium exchanges heat with air in the inner cavity to heat or refrigerate the air.

In an optional embodiment of the present application, the heat exchange assembly includes a connecting pipe, a driver, a spraying part and a heat exchange filler, the spraying part is connected to the spraying part through the connecting pipe, the driver is installed on the connecting pipe, and the spraying part and the heat exchange filler are arranged at an interval;

the driver is used for transmitting the heat exchange medium in the containing box to the spraying piece, and the heat exchange medium is sprayed on the heat exchange filler through the spraying piece so as to absorb heat and refrigerate the heat exchange medium.

Under the condition that the heat exchange medium is sprayed on the heat exchange filler, the contact area of the heat exchange medium and air is increased, and the heat exchange efficiency of the heat exchange medium and the air is improved, so that the heating or refrigerating effect of the heat exchange module is improved.

In an optional embodiment of the present application, the heat exchange filler has a water inlet end and a water outlet end, the water inlet end is spaced from the spray member, and the water outlet end is communicated with the accommodating box.

One end of the heat exchange filler is filled with the heat exchange medium, and the other end of the heat exchange filler is filled with the heat exchange medium, so that the flow path of the heat exchange medium in the heat exchange filler can be increased, the contact time of the heat exchange medium and the air in the inner cavity is prolonged, and the heat exchange effect of the heat exchange medium is improved.

In an alternative embodiment of the present application, the heat exchange filler is at least one of honeycomb, tongue-shaped and net-shaped.

When the heat exchange medium is sprayed on the heat exchange filler, the contact area between the heat exchange medium and the air is increased, and the heat exchange efficiency between the heat exchange medium and the air is improved, so that the heating or refrigerating effect of the heat exchange module is improved.

In an optional embodiment of the present application, the inner chamber has a hot water chamber and a heat exchange chamber which are independent of each other, the hot water module is installed in the hot water chamber, and the heat exchange module is installed in the heat exchange chamber.

The hot water chamber and the heat exchange chamber are arranged independently, so that the hot water module and the heat exchange module do not influence each other in work. The heat exchange module and the hot water module are two independent integrated modules, the two modules can work independently, and the gas water heater can be independently maintained when one module breaks down, so that the maintenance cost of the gas water heater is reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the description below are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 shows a schematic structural diagram of a gas water heater provided by an embodiment of the application.

Fig. 2 shows a schematic structural diagram of a gas water heater provided in other embodiments of the present application.

Fig. 3 shows a schematic structural diagram of a hot water module of a gas water heater provided in an embodiment of the present application.

Reference numerals: 100-gas water heater, 110-shell, 112-inner cavity, 113-hot water cavity, 114-heat exchange cavity, 116-partition, 117-heat exchange port, 120-heat exchange module, 121-semiconductor heat exchanger, 1212-first heat exchange port, 1214-second heat exchange port, 122-heat exchange assembly, 1221-connecting pipe, 1222-driver, 1223-spray part, 1224-heat exchange filler, 1225-water inlet port, 1226-water outlet port, 1227-evaporation heat exchanger, 123-containing box, 1232-ice making cavity, 1234-ice storage cavity, 1236-liquid storage cavity, 125-heat exchange fan, 126-heat dissipation channel, 127-check valve, 128-heat dissipation fan, 130-hot water module, 131-exhaust channel, 132-connecting port, 133-combustion chamber, 134-combustion heat exchanger, 135-gas inlet pipeline, 136-air inlet device, 137-ignition needle, 138-water pipe, 2-water inlet pipe, 1384-water outlet pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without making creative efforts belong to the protection scope of the present invention.

It should be noted that all the directional indications in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a certain posture, and if the certain posture is changed, the directional indication is changed accordingly.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "secured" are to be construed broadly, and thus, for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

A gas water heater is a common one of kitchen appliances. Depending on the installation environment, the indoor-installed balance machine, the forced air exhauster, and the outdoor-installed outdoor machine are roughly classified. Most of the indoor installation places are bathrooms, kitchens or balconies. The main installation place is the kitchen, and the gas water heater has single function and only provides domestic hot water due to limitation of house type and gas pipelines. In order to solve the problem of kitchen stuffiness in summer, kitchen refrigeration products are increasingly used in the kitchen. The traditional wall-mounted air conditioner or the special kitchen air conditioner needs to be provided with an outdoor unit and occupies precious kitchen space, the mobile air conditioner has low refrigeration power, and the exhaust is indoor or needs to be specially provided with a large-diameter exhaust pipe to be communicated with the outside, so that the use is inconvenient. Although products such as kitchen heaters can save space, the refrigeration effect is poor.

In the correlation technique, above-mentioned domestic gas instantaneous water heater and kitchen refrigeration product all set up alone for the kitchen that originally the space is not abundant becomes more crowded, and the kitchen refrigeration product refrigeration effect that can save space is unsatisfactory, therefore present kitchen refrigeration product all can not compromise refrigeration effect and installation space. The application provides a gas heater can improve above-mentioned problem, and the gas heater integration hot water function and the refrigeration function that this application provided can refrigerate when boiling water with same gas heater, and two kinds of functions can be realized to same product, can save installation space.

The application is described below with reference to specific embodiments in conjunction with the following drawings:

referring to fig. 1, an embodiment of the present application provides a gas water heater 100, and the gas water heater 100 provided in the embodiment of the present application exchanges heat with a heat exchange medium through a semiconductor heat exchanger 121, the semiconductor heat exchanger 121 has a simple structure and a small heat exchange effect, and meanwhile, the semiconductor heat exchanger 121 has a small structure, so that the occupied space in the inner cavity 112 can be reduced, and the volume of the whole gas water heater 100 is reduced as a whole.

In the embodiment of the present application, the gas water heater 100 includes:

a housing 110, the housing 110 having an inner cavity 112 and an air inlet and an air outlet communicating with the inner cavity 112;

the hot water module 130, the hot water module 130 is set up in the cavity 112, is used for providing the hot water;

the heat exchange module 120, the heat exchange module 120 includes a semiconductor heat exchanger 121, a heat exchange assembly 122 and a containing box 123, a part of the semiconductor heat exchanger 121 is installed in the containing box 123 for exchanging heat with a heat exchange medium in the containing box 123, the heat exchange assembly 122 is connected with the containing box 123 to exchange heat with air entering the inner cavity 112 through the air inlet through the heat exchange medium, so that the air after heat exchange is discharged out of the inner cavity 112 from the air outlet.

In this embodiment, the semiconductor heat exchanger 121 is disposed in the accommodating box 123 and exchanges heat with the heat exchange medium in the accommodating box 123, and the heat exchange medium after exchanging heat can exchange heat with the air in the inner cavity 112, so that the air after exchanging heat is discharged out of the inner cavity 112 from the air outlet, thereby cooling or heating the installation environment.

Because the installation environment of the gas water heater 100 provided by the application is mostly installed in a kitchen, a user can generate a large amount of heat when cooking, so that the temperature of the kitchen is higher. Therefore, most of the operation refrigeration modes of the heat exchange module 120 are that the semiconductor heat exchanger 121 refrigerates the heat exchange medium in the accommodating box 123, the heat exchange medium flows into the heat exchange assembly 122 again, the heat of the air entering the inner cavity 112 from the air inlet is absorbed through the heat exchange assembly 122, the air is refrigerated, and the refrigerated air is discharged into the kitchen from the air outlet, so that the kitchen can be rapidly cooled, and the experience of a user during cooking is improved.

In the embodiment of the application, the semiconductor heat exchanger 121 exchanges heat with a heat exchange medium, the semiconductor heat exchanger 121 has a simple structure and a small heat exchange effect, and meanwhile, the semiconductor heat exchanger 121 has a small structure, so that the occupied space in the inner cavity 112 can be reduced, and the size of the whole gas water heater 100 is reduced on the whole.

Also, the semiconductor heat exchanger 121 has a simple structure and a low cost, and reduces the manufacturing cost of the gas water heater 100 as a whole.

In some embodiments, the semiconductor heat exchanger 121 includes a first heat exchanging end 1212 and a second heat exchanging end 1214, the first heat exchanging end 1212 being disposed within the housing box 123.

After being powered on, one end of the semiconductor heat exchanger 121 has a cooling function, and the other end has a heating function, that is, one of the first heat exchanging end 1212 and the second heat exchanging end 1214 is a heating end, and the other is a cooling end. If the heat exchange module 120 operates in the heating mode, the first heat exchange end 1212 is a heating end, the second heat exchange end 1214 is a cooling end, the first heat exchange end 1212 heats a heat exchange medium, the heated heat exchange medium enters the heat exchange assembly 122, heat is released through the heat exchange assembly 122, the heat exchange medium exchanges heat with air in the inner cavity 112 to heat air in the inner cavity 112, and the heated air is discharged from the air outlet, so that the temperature of the installation environment is increased.

If the heat exchange module 120 operates in the hot and cold mode, the first heat exchange end 1212 is a cooling end, the second heat exchange end 1214 is a heating end, the first heat exchange end 1212 cools the heat exchange medium, the cooled heat exchange medium enters the heat exchange assembly 122 again, the heat of the air in the inner cavity 112 is absorbed by the heat exchange assembly 122 to cool the air in the inner cavity 112, and the cooled air is discharged from the air outlet again, so that the temperature of the installation environment is reduced.

In some embodiments, the heat exchanging module 120 further includes a heat dissipating channel 126, a portion of the heat dissipating channel 126 extends into the inner cavity 112, and the second heat exchanging end 1214 is disposed in the heat dissipating channel 126.

The first heat exchanging end 1212 of the semiconductor heat exchanger 121 exchanges heat with a heat exchanging medium, and the second heat exchanging end 1214 is mainly used for dissipating heat. Under the condition that the heat exchange module 120 operates in the heating mode, the first heat exchange end 1212 is a heating end, the second heat exchange end 1214 is a cooling end, and cooling energy generated by the cooling end is discharged from the heat dissipation channel 126, so that the heat exchange efficiency with the heat exchange medium is increased. Under the condition that the heat exchange module 120 operates in the heating mode, the first heat exchange end 1212 is a heating end, the second heat exchange end 1214 is a cooling end, and heat generated at the heating end is discharged from the heat dissipation channel 126.

Since the semiconductor heat exchanger 121 is installed in the inner cavity 112, the heat dissipation channel 126 extends into the inner cavity 112, and if the second heat exchange end 1214 is located outside the inner cavity 112, the heat dissipation channel 126 may not extend into the inner cavity 112.

In some embodiments, the hot water module 130 includes an exhaust passage 131, and the heat dissipation passage 126 communicates with the exhaust passage 131.

In some embodiments, the hot water module 130 mainly uses combustion gas to heat water entering the hot water chamber 113, the exhaust channel 131 is mainly used to exhaust waste gas after combustion, the heat dissipation channel 126 is mainly used to exhaust hot air after heat exchange with the semiconductor heat exchanger 121 to the outside of the inner cavity 112, and the heat dissipation channel 126 is communicated with the exhaust channel 131, so that the hot air in the heat dissipation channel 126 and the waste gas in the exhaust channel 131 are exhausted to the outside of the inner cavity 112 through the same channel, the structure of the gas water heater 100 is also reduced, and the volume of the gas water heater 100 is reduced.

In some embodiments, a connection port 132 is disposed on the exhaust channel 131, and an end of the heat dissipation channel 126 away from the semiconductor heat exchanger 121 communicates with the exhaust port.

In some embodiments, a check valve 127 is disposed on the heat dissipation channel 126, and the check valve 127 is used to prevent the hot air in the exhaust channel 131 from flowing into the heat dissipation channel 126.

The check valve 127 allows air flow from the heat dissipation channel to the exhaust channel 131 of the hot water module 130, but prevents air of the hot water module 130 from flowing backward to the heat dissipation channel. By installing the check valve 127 on the heat dissipation channel, the smoke in the hot water module 130 is prevented from entering the inner cavity 112 of the outer shell 110 of the gas water heater 100, and further the smoke in the gas water heater 100 is prevented from being blown into the kitchen.

In some embodiments, the heat dissipation channel 126 and the exhaust channel 131 are disposed above the internal cavity 112. The exhaust channel 131 and the heat dissipation channel 126 are both disposed above the inner cavity 112, and exhaust gas and hot gas can be exhausted by using the flowing direction of the gas itself without providing other driving components.

Wherein, heat exchange module 120 still includes radiator fan 128, and radiator fan 128 sets up in the semiconductor heat exchanger 121 and keeps away from the one side of heat transfer mouth 117, and at the in-process of heat exchange module 120 work, radiator fan 125 bloies to semiconductor heat exchanger 121 to take away the heat on the semiconductor heat exchanger 121, refrigerate the heat transfer medium through semiconductor heat exchanger 121.

In some embodiments, the heat exchange module 120 further includes a heat exchange fan 125, the heat exchange fan 125 is disposed at the air outlet, and when the heat exchange module 120 is in operation, the heat exchange fan 125 is activated to discharge the air in the inner cavity 112 after exchanging heat with the evaporative heat exchanger 1227 to the outside of the inner cavity 112 through the air outlet. Under the condition that the gas heat exchanger is installed in the kitchen, the heat exchange module 120 operates in the cooling mode, and the heat exchange fan 125 discharges cold air in the inner cavity 112 from the air outlet, thereby cooling the kitchen environment.

As for the accommodating box 123, the accommodating box 123 is mainly used for accommodating a heat exchange medium, and heats or refrigerates the heat exchange medium through the semiconductor heat exchanger 121, since the installation environment of the gas water heater 100 is mainly a kitchen, and the heat exchange module 120 mainly applies a refrigeration mode, for the refrigeration mode, the accommodating box 123 can be set to an ice making cavity 1232, an ice storage cavity 1234 and a liquid storage cavity 1236 which are independent of each other, the first heat exchange end 1212 of the semiconductor heat exchanger 121 is disposed in the ice making cavity 1232, and the heat exchange assembly 122 is communicated with the liquid storage cavity 1236. The first heat exchange end 1212 of the semiconductor heat exchanger 121 directly extends into the ice making chamber 1232, the first heat exchange end 1212 directly contacts with a heat exchange medium in the ice making chamber 1232, and the first heat exchange end 1212 exchanges heat with the heat exchange medium, so that the heat exchange medium is condensed into ice, and the ice cubes can store cold. After the ice cubes in the ice storage chamber 1234 reach the preset height, the ice cubes can be stored in the ice storage chamber 1234, and after the ice cubes in the ice making chamber 1232 are reduced, the ice making chamber 1232 can continue to make ice, so as to provide sufficient cold energy for the heat exchange module 120 in the refrigeration mode. When the heat exchange module 120 starts the refrigeration mode, the ice blocks in the ice storage cavity 1234 enter the liquid storage cavity 1236 to form an ice-water mixture with the heat exchange medium in the liquid storage cavity 1236, the temperature of the whole ice-water mixture is low, the heat exchange medium in the liquid storage cavity 1236 enters the heat exchange assembly 122, heat exchange is carried out between the heat exchange assembly 122 and the air in the inner cavity 112, the air is refrigerated, and the refrigerated air is discharged from the air outlet, so that the whole kitchen can be refrigerated.

In some embodiments, ice making chamber 1232 is disposed above ice storage chamber 1234, and ice storage chamber 1234 is disposed above reservoir chamber 1236.

The ice making chamber 1232, the ice storage chamber 1234 and the liquid storage chamber 1236 are sequentially arranged from top to bottom, so that transportation of ice cubes can be facilitated, and the ice cubes can enter the ice storage chamber 1234 from the ice making chamber 1232 and enter the liquid storage chamber 1236 from the ice storage chamber 1234. Specifically, the ice discharging mechanism may be arranged to transfer the ice cubes in the ice making chamber 1232 into the ice storage chamber 1234, and then transfer the ice cubes in the ice storage chamber 1234 into the liquid storage chamber 1236. An openable and closable structure may be disposed at the bottom of the ice making chamber 1232, and when ice cubes in the ice making chamber 1232 are transported into the ice storage chamber 1234, the openable and closable structure at the bottom of the ice making chamber 1232 is opened, and the ice cubes in the ice making chamber 1232 may enter the ice storage chamber 1234. An openable and closable structure may be also provided at the bottom of the ice storage chamber 1234, so that when ice cubes in the ice storage chamber 1234 are transported into the ice storage chamber 1234, the opening structure at the bottom of the ice storage chamber 1234 is opened, and the ice cubes in the ice storage chamber 1234 may enter the liquid storage chamber 1236. The specific transport mode may not be particularly limited.

If there is no heat exchange medium in the ice making chamber 1232, if ice is to be made again, the heat exchange medium needs to be added to the ice making chamber 1232 again. The heat exchange medium can be replenished manually or automatically. Heat exchange media can be supplemented through the liquid storage cavity 1236 or the heat exchange assembly 122, a bypass pipeline is arranged on the ice making cavity 1232, and the other end of the bypass pipeline is communicated to the lower portion of the liquid storage cavity 1236 and/or the heat exchange assembly 122. The ice making cavity 1232 is communicated with the heat exchange assembly 122 and/or the liquid storage cavity 1236 by arranging the bypass pipeline, so that a part of water in the heat exchange assembly 122 and/or the liquid storage cavity 1236 can flow back to the ice making cavity 1232, and after ice cubes in the ice making cavity 1232 are discharged, liquid is supplemented in the ice making cavity 1232, and ice is made again.

In some embodiments, the heat exchange assembly 122 includes an evaporation heat exchanger 1227 and a driver 1222, the evaporation heat exchanger 1227 is connected with the accommodating box 123 to form a circulation loop, the driver 1222 is installed on the circulation loop, and is used for transmitting the heat exchange medium in the accommodating box 123 to the evaporation heat exchanger 1227, and the evaporation heat exchanger 1227 is used for absorbing heat and cooling through the heat exchange medium.

In some embodiments, the heat exchange medium is a liquid, the driver 1222 may be a water pump, the liquid heat exchange medium flows into the evaporation heat exchanger 1227 through the water pump, and the heat exchange medium enters the evaporation heat exchanger 1227 and exchanges heat with the air in the inner cavity 112 to heat or cool the air.

It is easy to understand that, besides the evaporation heat exchanger 1227 and the driver 1222 are used together to realize the heat exchange between the heat exchange medium and the air, other ways may also be used, specifically as follows:

referring to fig. 2, the heat exchange assembly 122 may further include a connection pipe 1221, a driver 1222, a spraying piece 1223, and heat exchange packing 1224, the spraying piece 1223 is connected to the spraying piece 1223 through the connection pipe 1221, the driver 1222 is installed on the connection pipe 1221, and the spraying piece 1223 and the heat exchange packing 1224 are arranged at an interval; the driver 1222 transfers the heat exchange medium in the accommodating box 123 to the spray 1223, and sprays the heat exchange packing 1224 through the spray 1223, so that the heat exchange medium absorbs heat and is cooled.

Likewise, if the heat exchange medium is a liquid, the driver 1222 may be a water pump. The driver 1222 transports the heat exchange medium from the receiving cavity to the spraying member 1223, the spraying member 1223 sprays the heat exchange medium on the heat exchange packing 1224, and the heat exchange medium contacts with the air in the inner cavity 112, so as to exchange heat with the air, and heat or cool the air.

In some embodiments, the heat exchange filler 1224 is a porous structure, and when the heat exchange medium is sprayed on the heat exchange filler 1224, the contact area between the heat exchange medium and the air is increased, so that the heat exchange efficiency between the heat exchange medium and the air is improved, and the heating or cooling effect of the heat exchange module 120 is improved.

In some embodiments, the heat exchange packing 1224 has an inlet end 1225 and an outlet end 1226, the inlet end 1225 being spaced from the spray 1223, the outlet end 1226 being in communication with a fluid reservoir 1236 containing box 123.

Wherein, the end 1225 of intaking and the end 1226 of water outlet set up relatively, that is to say, heat transfer filler 1224 one end advances heat transfer medium, and the other end goes out heat transfer medium, can increase the flow path of heat transfer medium in heat transfer filler 1224 to increase the contact time of heat transfer medium and the air in inner chamber 112, improve heat transfer medium's heat transfer effect.

In some embodiments, heat exchange filler 1224 is at least one of honeycomb, tongue-shaped, mesh-shaped. The shape of the heat exchange filler 1224 may be at least one of a honeycomb shape, a volute shape and a net shape, and when the heat exchange medium is sprayed on the heat exchange filler 1224, the contact area between the heat exchange medium and the air is increased, and the heat exchange efficiency between the heat exchange medium and the air is improved, so that the heating or cooling effect of the heat exchange module 120 is improved.

In some embodiments, the inner cavity 112 has a hot water chamber 113 and a heat exchange chamber 114 which are independent from each other, the air inlet and the air outlet are both communicated with the heat exchange chamber 114, the hot water module 130 is installed in the hot water chamber 113, and the heat exchange module 120 is installed in the heat exchange chamber 114.

In some embodiments, the hot water chamber 113 and the heat exchange chamber 114 are independent from each other, so that the hot water module 130 and the heat exchange module 120 do not interfere with each other. That is, the heat exchange module 120 and the hot water module 130 are two separately integrated modules, and can work separately therebetween, and can be maintained separately when one of the modules fails, thereby reducing the maintenance cost of the gas water heater 100.

The hot water module 130 heats water introduced into the hot water chamber 113 by mainly burning gas, and a large amount of heat is generated during the combustion of the gas. Likewise, heat exchange module 120 also generates heat during operation. Under the condition that only the hot water module 130 works, the hot water module 130 generates a large amount of heat, which may cause the ambient temperature of the heat exchange module 120 not working to rise, and the heat exchange module 120 does not work and can not automatically dissipate heat, and the service life of the heat exchange module 120 is affected by the overhigh ambient temperature. Similarly, in the condition that only the heat exchange module 120 operates, and the heat exchange module 120 mainly operates in the cooling mode, the ambient temperature in the whole inner cavity 112 may be relatively low, and the service life of the hot water module 130 may also be affected.

Under the condition that the two work at the same time, the hot water module 130 is used for providing hot water, the hot water is heated mainly through gas combustion, the hot water chamber 113 can generate a large amount of heat, and the temperature in the hot water chamber 113 is high. And heat exchange module 120 mainly operates the refrigeration mode, and the temperature in heat exchange cavity 114 is lower relatively, and hot water cavity 113 and heat exchange cavity 114 set up independently each other, can avoid hot-blast and the cold wind in the heat exchange cavity 114 in the hot water cavity 113 to concatenate each other, influence heat exchange module 120's refrigeration effect.

In some embodiments, a partition 116 is disposed within the housing 110, and the partition 116 divides the inner cavity 112 into a hot water chamber 113 and a heat exchange chamber 114 that are independent of each other.

In some embodiments, the hot water chamber 113 and the heat exchange chamber 114 are separated by the partition 116, and the hot water chamber 113 and the heat exchange chamber 114 which are independent of each other can be implemented in the inner chamber 112, so that the hot water chamber 113 and the heat exchange chamber 114 are independently arranged in the same inner chamber 112, thereby reducing the volume of the whole gas water heater 100 as a whole and reducing the occupied space of the gas water heater 100.

In order to further reduce the heat exchange between the hot water chamber 113 and the refrigeration chamber, in some embodiments, the partition 116 has a heat insulation function, and specifically, the partition 116 may be made of a heat insulation material, or the partition 116 is provided with a heat insulation layer made of a heat insulation material. In other embodiments, both the hot water module 130 and the heat exchange module 120 may be coated with insulation. By arranging the heat insulation material, the heat exchange between the hot water chamber 113 and the refrigeration chamber is further reduced, and the hot water temperature and the refrigeration temperature are ensured.

The partition 116 may be disposed horizontally, vertically or obliquely, or the partition 116 may also be a shaped plate to match the external shape of the hot water module 130 and the heat exchange module 120. In some embodiments, the partition 116 is a straight plate and is disposed in a vertical direction, so that the hot water chamber 113 and the refrigeration chamber are disposed side by side in a horizontal direction, and by disposing the hot water chamber 113 and the refrigeration chamber to be distributed side by side in the horizontal direction, the overall height of the gas water heater 100 can be reduced, and the installation is facilitated.

Referring to fig. 3, in some embodiments, the hot water module 130 further includes a combustion chamber 133 and a combustion heat exchanger 134, the combustion chamber 133 is communicated with both the gas pipe and the exhaust passage 131, when hot water needs to be provided, gas enters the combustion chamber 133 through the gas pipe to be combusted, and hot flue gas generated by the combustion is discharged to the outside through the exhaust passage 131. The combustion heat exchanger 134 is connected to a water pipe 138, water flows in the combustion heat exchanger 134, and the combustion heat exchanger 134 exchanges heat with the combustion chamber 133, thereby heating the water in the combustion heat exchanger 134. The combustion heat exchanger 134 may specifically extend into the combustion chamber 133 or be wound outside the combustion chamber 133, or the combustion heat exchanger 134 is formed by opening a flow channel in a cavity wall of the combustion chamber 133, and the implementation structure of the heat exchange between the combustion heat exchanger 134 and the combustion chamber 133 is not limited in this application.

In some embodiments, the hot water module 130 further includes a gas inlet pipe 135, an air intake device 136, an ignition needle 137, and other accessories, the gas inlet pipe 135 is communicated between the combustion chamber 133 and the gas pipe, a gas proportional valve is disposed on the gas inlet pipe 135, so that the control device can adjust the supply amount of the gas according to the water flow and the set hot water temperature, and an air outlet of the air intake device 136 is communicated with the combustion chamber 133 to provide sufficient air to the combustion chamber 133 under the control of the control device. In some embodiments, the combustion heat exchanger 134 is provided with a water flow sensor and a water temperature sensor for detecting the flow and temperature of the tap water, respectively, and the water temperature sensors may be provided in plural, for example, two water temperature sensors are provided, and the two water temperature sensors are respectively installed on the water inlet pipe 1382 and the water outlet pipe 1384 of the combustion heat exchanger 134, and can detect the cold water temperature and the heating temperature of the tap water, respectively, so as to facilitate the control device to automatically control the operating states of the gas proportional valve and the air intake device 136.

To sum up, the gas water heater that this application embodiment provided, in this application embodiment, carries out the heat transfer through semiconductor heat exchanger 121 and heat transfer medium, and semiconductor heat exchanger 121 simple structure, the heat transfer effect is little, and semiconductor heat exchanger 121 structure is less simultaneously, can reduce the occupation space in inner chamber 112, has reduced the volume of whole gas water heater 100 on the whole.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.

Claims (10)

1. A gas water heater, comprising:

a housing (110), the housing (110) having an interior cavity (112) and an air inlet and an air outlet in communication with the interior cavity (112);

a hot water module (130), the hot water module (130) disposed within the inner chamber (112) for providing hot water;

the heat exchange module (120) comprises a semiconductor heat exchanger (121), a heat exchange assembly (122) and an accommodating box (123), part of the semiconductor heat exchanger (121) is installed in the accommodating box (123) and used for exchanging heat with a heat exchange medium in the accommodating box (123), and the heat exchange assembly (122) is connected with the accommodating box (123) so as to exchange heat with air entering the inner cavity (112) through the air inlet through the heat exchange medium and discharge the air after heat exchange to the outside of the inner cavity (112) from the air outlet.

2. Gas water heater according to claim 1, characterized in that the semiconductor heat exchanger (121) comprises a first heat exchanging end (1212) and a second heat exchanging end (1214), the first heat exchanging end (1212) being arranged inside the containing tank (123).

3. The gas water heater of claim 2, wherein the heat exchange module (120) further comprises a heat dissipation channel (126), a portion of the heat dissipation channel (126) extending into the inner chamber (112), the second heat exchanging end (1214) being disposed within the heat dissipation channel (126).

4. A gas water heater according to claim 3, characterized in that the hot water module (130) comprises an exhaust channel (131), the heat dissipation channel (126) communicating with the exhaust channel (131).

5. The gas water heater (100) according to claim 4, wherein the exhaust channel (131) is provided with a connecting port (132), and an end of the heat dissipation channel (126) far away from the semiconductor heat exchanger (121) is communicated with an exhaust port.

6. The gas water heater of any one of claims 1 to 5, characterized in that the heat exchange assembly (122) comprises an evaporating heat exchanger (1227) and a driver (1222), the evaporating heat exchanger (1227) is connected with the accommodating box (123) to form a circulation loop, the driver (1222) is installed on the circulation loop and used for transmitting the heat exchange medium in the accommodating box (123) to the evaporating heat exchanger (1227), and the evaporating heat exchanger (1227) is used for absorbing heat and refrigerating through the heat exchange medium.

7. Gas water heater according to any one of claims 1-2, characterized in that the heat exchange assembly (122) comprises a connecting pipe (1221), a driver (1222), a spray piece (1223) and a heat exchange packing (1224), the spray piece (1223) is connected to the spray piece (1223) through the connecting pipe (1221), the driver (1222) is mounted on the connecting pipe (1221), and the spray piece (1223) is arranged at a distance from the heat exchange packing (1224);

the driver (1222) is used for conveying the heat exchange medium in the accommodating box (123) to the spraying piece (1223), and spraying the heat exchange medium on the heat exchange filler (1224) through the spraying piece (1223) so as to absorb heat and refrigerate the heat exchange medium.

8. Gas water heater according to claim 7, characterized in that said heat exchange packing (1224) has a water inlet end (1225) and a water outlet end (1226), said water inlet end (1225) being arranged spaced from said sprinkler (1223), said water outlet end (1226) being in communication with said containment tank (123).

9. The gas water heater of claim 7, wherein the heat exchanging filler (1224) is at least one of honeycomb, tongue-shaped, and mesh.

10. The gas water heater according to any one of claims 1-5, characterized in that the inner chamber (112) has a hot water chamber (113) and a heat exchange chamber (114) which are independent of each other, the hot water module (130) is installed in the hot water chamber (113), and the heat exchange module (120) is installed in the heat exchange chamber (114).

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