CN218086209U - Film sticking device - Google Patents

Abstract

The application provides a film sticking device which comprises a film, a suction nozzle and a top column, wherein the film sticking device is also provided with a film sticking station, and the suction nozzle can stick a chip on the film at the film sticking station; the top column is arranged coaxially with the suction nozzle positioned at the film pasting station, and the top column is used for supporting the lower part of the film when the chip is pasted on the film with the suction nozzle. This application not only can support the diaphragm through the setting of fore-set, prevents that the diaphragm is impaired, and supports the precision height to the paster precision of chip has been guaranteed. Meanwhile, the top column corresponds to a single chip, so that the requirement on manufacturing accuracy is lower, and the film sticking safety of all chips cannot be influenced due to a small inclination.

Description

Film sticking device

Technical Field

The application belongs to the technical field of semiconductors, and more specifically relates to a pad pasting device.

Background

The wafer is a carrier of the chips, and after a certain number of chips are etched on the wafer by full utilization, the wafer is cut into a block of chips. The chip is a necessary component of many electronic devices, and when the electronic devices are produced, film pasting and feeding are needed for chip feeding, that is, thousands of chips are pasted on the UV film and then fed. Chip film is generally adhered after the chip is sucked by a suction nozzle, and the film is easily damaged because the force of the suction nozzle is difficult to control.

SUMMERY OF THE UTILITY MODEL

An object of this application embodiment is to provide a pad pasting device to the suction nozzle pad pasting that exists among the solution prior art is the easy impaired technical problem of diaphragm.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: the film sticking device comprises a film, a suction nozzle and a top column, and is further provided with a film sticking station, wherein the suction nozzle can stick a chip on the film at the film sticking station; the top column is coaxial with the suction nozzle located at the film pasting station, and the top column is used for supporting the chip below the film when the chip is pasted on the film by the suction nozzle.

In a possible design, the diameter of the top pillar is arranged to match the diameter of the suction end of the suction nozzle.

In a possible design, the film sticking device further comprises a top column base and a buffer piece, wherein the buffer piece is installed on the top column base, and the top column is installed on the buffer piece.

In one possible design, the buffer is a compression spring.

In a possible design, the film sticking device further comprises a top column driving structure, and the top column driving structure is used for driving the top column to lift.

In one possible design, the jack post drive structure includes:

a top post driving member for outputting a rotational motion;

and the transmission belt structure is connected with the output shaft of the ejection column driving piece, and the ejection column is installed on the transmission belt of the transmission belt structure.

In a possible design, the film pasting device further comprises a film pasting driving structure, the film is installed on the film pasting driving structure, and the film pasting driving structure is used for driving the film to move so that the suction nozzle can paste the chip on different positions of the film.

In one possible design, the film sticking driving structure comprises a film sticking driving part, a first direction conveying assembly and a second direction conveying assembly;

the first direction conveying assembly is connected with the output end of the film pasting driving piece, the second direction conveying assembly is connected with the output end of the first direction conveying assembly, and the film is arranged at the output end of the second direction conveying assembly;

the conveying direction of the first direction conveying assembly is perpendicular to the conveying direction of the second direction conveying assembly.

In one possible design, a peripheral edge of the diaphragm is provided with a diaphragm ring for tensioning the diaphragm;

the film sticking device also comprises a film sticking seat, a convex ring and a tensioning driving piece;

the film ring, the convex ring and the tensioning driving piece are all arranged on the film sticking seat; the convex ring is arranged right below the diaphragm;

the tensioning driving piece is used for driving the convex ring and/or the diaphragm to move so that the convex ring abuts against the periphery of the diaphragm to tension the diaphragm.

In a possible design, a mounting structure is arranged on the film sticking seat, the mounting structure is formed with a slot, and the film is detachably inserted into the slot.

The application provides a pad pasting device's beneficial effect lies in: the utility model provides a pad pasting device sets up the fore-set through the below at the diaphragm, and the fore-set with be located the coaxial setting of suction nozzle of pad pasting station, when the suction nozzle is located the chip with the chip subsides on the diaphragm, the fore-set just supports in the below of diaphragm, and fore-set and the coaxial setting of suction nozzle, then the fore-set is used in the reverse collineation of the power on chip and diaphragm with the suction nozzle, not only can support the diaphragm and prevent that the diaphragm is impaired, and support the precision height to the paster precision of chip has been guaranteed. Meanwhile, the top column corresponds to a single chip, so that the requirement on manufacturing accuracy is lower, and the film sticking safety of all chips cannot be influenced due to a small inclination.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments or the prior art description will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings may be obtained according to these drawings without inventive labor.

Fig. 1 is a schematic perspective view of a film sticking device according to an embodiment of the present disclosure;

FIG. 2 is a schematic view showing a state of film sticking by a suction nozzle in the embodiment of the present application;

FIG. 3 is a schematic structural view of the support structure of FIG. 1;

fig. 4 is a schematic structural view of the film sticking seat, the convex ring, the tension driving member and the film in fig. 1.

Wherein, in the figures, the respective reference numerals:

9. a film pasting device;

91. a film sticking driving structure; 911. a film pasting driving piece; 912. a first direction conveying group; 913. a second directional transport assembly;

92. a film pasting seat;

93. a convex ring;

94. a tensioning drive;

95. a membrane disc; 951. a membrane; 952. a membrane ring;

96. a mounting structure; 961. inserting slots;

97. a support structure; 971. a top pillar; 972. a jack post seat; 973. a buffer member; 974. propping against the driving structure; 9741. a top post drive; 9742. a conveyor belt structure; 975. a base;

12. a suction nozzle;

200. and (3) a chip.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1, a film laminating apparatus 9 according to an embodiment of the present application will now be described. The film sticking device 9 is used for sticking thousands of chips on the film sheet 951 for the production.

Referring to fig. 1 to 3, the film sticking apparatus 9 includes a film 951, a suction nozzle 12 and a supporting structure 97.

Wherein the support structure 97 includes a top post 971. The film sticking device 9 also has a film sticking station, and when the suction nozzle 12 is at the film sticking station, the suction nozzle 12 can stick the chip 200 on the film 951. The top column 971 is arranged right below the film pasting station, the top column 971 is arranged coaxially with the suction nozzle 12 located at the film pasting station, and the top column 971 is used for supporting below the film 951 when the suction nozzle 12 pastes the chip on the film 951.

It should be noted here that, the membrane 951 needs to be attached with thousands of chips 200, and therefore, after each attachment, the position of the membrane 951 needs to be changed so that the suction nozzle 12 attaches the chips 200 to different positions of the membrane 951; also, the suction nozzle 12 can suck only one chip 200 at a time, and therefore, after each chip 200 is attached, the suction nozzle 12 needs to be moved to suck another chip 200. If a film sticking station is set, the suction nozzle 12 is moved to the film sticking station and the position of the diaphragm 951 where the chip 200 needs to be stuck is moved to the film sticking station every time of film sticking, so that film sticking can be realized. In the process of film pasting, the film pasting station is always unchanged, and the suction nozzle 12 and the film 951 move after each film pasting.

The suction nozzles 12 can be conveyed by a conveying device, for example, in a circumferential direction, the conveying device has a plurality of suction nozzles 12 distributed in the circumferential direction, each time the conveying device rotates, one of the suction nozzles 12 is conveyed to a position right above the film pasting station, and then the suction nozzle 12 is moved downward, and when the suction nozzle 12 moves downward to the film pasting station, the suction nozzle 12 can paste the chip 200 on a correct position of the film 951. Of course, the suction nozzle 12 can also be conveyed horizontally by the conveying device; or the chips 200 are picked up one by one from a tray by a robot hand and then attached to a film.

The utility model provides a pad pasting device 9, set up a post 971 through the below at diaphragm 951, and a post 971 and the coaxial setting of suction nozzle 12 that is located the pad pasting station, when suction nozzle 12 pastes chip 200 and locates on diaphragm 951, a post 971 just supports in the below of diaphragm 951, and a post 971 and the coaxial setting of suction nozzle 12, then a post 971 and suction nozzle 12 are used in the reverse collineation of the power on chip 200 and diaphragm 951, not only can support diaphragm 951 and prevent that diaphragm 951 is impaired, and support the precision height, thereby the paster precision of chip 200 has been guaranteed. Meanwhile, the top pillar 971 corresponds to a single chip 200, so that the requirement on manufacturing accuracy is lower, and the film sticking safety of all chips 200 cannot be affected by a small inclination.

In one embodiment, the top post 971 is configured to have a diameter that is compatible with the diameter of the suction end of the suction nozzle 12. The suction end of the suction nozzle 12 refers to an end of the suction nozzle 12 for sucking the chip 200, that is, a bottom end of the suction nozzle 12.

This embodiment sets up to the absorption end diameter looks adaptation with suction nozzle 12 through top post 971 diameter to make, chip 200 and diaphragm 951 receive the butt of the same area in both sides, thereby make top post 971's support effect better, the slope can not appear and support and lead to the condition that chip 200 damaged.

It is understood that in other embodiments of the present application, the diameter of the top pillar 971 may be increased or decreased as appropriate without affecting the chip 200 mounting.

In one embodiment, referring to fig. 3, the film sticking device 9 further includes a top pillar base 972 and a cushion member 973, the cushion member 973 is mounted on the top pillar base 972, and the top pillar 971 is mounted on the cushion member 973.

In the embodiment, through the arrangement of the buffer piece 973, when the suction nozzle 12 patches, and the suction nozzle 12 pushes the membrane 951 to move downwards, the top column 971 can buffer in the vertical direction, so that the membrane 951 is prevented from being damaged by the top column 971; meanwhile, after one chip 200 is attached, when the membrane 951 is moved, the top columns 971 can also vertically buffer, so that the membrane 951 is prevented from being damaged by the top columns 971.

Preferably, the buffering member 973 is a compression spring, which has good elasticity and simple structure. It is understood that in other embodiments of the present application, the damping member 973 may be other elastic members, such as an elastic sheet, or a cushion, such as a cushion made of a flexible material.

In an embodiment, referring to fig. 3, the film sticking device 9 further includes a top pillar driving structure 974, the top pillar 971 is installed on the top pillar driving structure 974, specifically, the top pillar base 972 is installed on the top pillar driving structure 974, and the top pillar driving structure 974 is used for driving the top pillar 971, the top pillar base 972 and the buffer member 973 to synchronously lift.

In the actual film sticking, every time one film piece 951 is fully stuck with the chip 200, the film piece 951 needs to be completely transported out of a film sticking station, and the film piece 951 is taken out to replace the empty film piece 951; the top column 971 is driven to descend by the top column driving structure 974, so that the top column 971 is prevented from interfering with the dismounting and mounting of the diaphragm 951, and the top column 971 is prevented from being damaged by the dismounting and mounting of the diaphragm 951.

Specifically, referring to fig. 3, the top pillar driving structure 974 includes a top pillar driving member 9741 and a belt structure 9742. The top post drive 9741 is used to output rotational motion; the conveyor belt structure 9742 is connected to an output shaft of the jack post driver 9741, and the jack posts 971 are mounted on a conveyor belt of the conveyor belt structure 9742, and more particularly, the jack post holders 972 are mounted on the conveyor belt.

When the device is used, one driving wheel of the conveying belt structure 9742 is driven to rotate by the ejection column driving part 9741, so that the conveying belt is driven to move, and the ejection column seat 972 and the ejection column 971 are driven to lift.

Referring to fig. 3, the film sticking device 9 further includes a base 975, and the driving member 9741 and the conveyer belt structure 9742 are mounted on the base 975.

In one embodiment, referring to fig. 1 and 4, the film sticking device 9 includes a film sticking driving structure 91, the film 951 is mounted on the film sticking driving structure 91, and the film sticking driving structure 91 is used for driving the film 951 to move so that the suction nozzles 12 stick the chips 200 to different positions of the film 951.

Before each lamination, the membrane 951 may be moved to a proper position by the lamination driving structure 91, and then the chip 200 may be attached to the membrane 951 by the suction nozzle 12. The moving position of the membrane 951 can be calculated according to a system, so that all the chips 200 are exactly positioned on a circle after being attached, and the adjacent chips 200 are arranged at equal intervals.

The film sticking driving structure 91 comprises a film sticking driving member 911, a first direction conveying assembly 912 and a second direction conveying assembly 913; the first direction conveying assembly 912 is connected with the output end of the film sticking driving component 911, the second direction conveying assembly 913 is connected with the output end of the first direction conveying assembly 912, the film 951 is installed at the output end of the second direction conveying assembly 913, and the conveying direction of the first direction conveying assembly 912 is perpendicular to the conveying direction of the second direction conveying assembly 913.

In this embodiment, the first direction conveying assembly 912 and the second direction conveying assembly 913 cooperate to adjust the position coordinates of the chip 200 on the film 951 along the X axis and the Y axis, so as to realize the precise placement of each chip 200.

In one embodiment, referring to fig. 1 and 4, the film sticking device 9 includes a film disc 95, the film disc 95 includes a film sheet 951 and a film ring 952, and the film ring 952 is installed on a peripheral edge of the film sheet 951 for tensioning the film sheet 951. Wherein, diaphragm 951 is the UV membrane preferably, installs membrane ring 952 at the edge of a week of UV membrane for the UV membrane is in the tensioning state, does benefit to chip 200 pad pasting.

The film sticking device 9 further comprises a film sticking seat 92, a convex ring 93 and a tensioning driving piece 94. The film sticking seat 92 is installed at the output end of the second direction conveying assembly 913, the film ring 952, the convex ring 93 and the tensioning driving member 94 are all installed on the film sticking seat 92, and the convex ring 93 is arranged right below the film 951. The tensioning driving member 94 is used for driving the convex ring 93 and/or the membrane 951 to move, so that the convex ring 93 abuts against a peripheral edge of the membrane 951 to tension the membrane 951, that is, the convex ring 93 and the membrane 951 approach each other to abut against each other, thereby tensioning the membrane 951.

In this embodiment, the tension driving member 94 is a linear cylinder, the output end of the tension driving member 94 is connected to the membrane ring 952, and the tension driving member 94 drives the membrane ring 952 to move downward to make the convex ring 93 abut against the lower side surface of the membrane 951.

It is understood that in other embodiments of the present application, the tension driver 94 may be connected to the protruding ring 93, and the protruding ring 93 is driven to move upward to abut against the diaphragm 951; or by separately driving the protruding ring 93 and the membrane ring 952, so that the protruding ring 93 and the membrane 951 are close to each other, and the protruding ring 93 abuts against the membrane ring 952, which is not limited herein.

In one embodiment, the film 951 is removably mounted to the lamination drive structure 91 so that the jaws 113 can remove the film 951 from the lamination device 9.

Specifically, the film holder 92 is provided with a mounting structure 96, and the film 951 is detachably mounted on the mounting structure 96. The mounting structure 96 is formed with a slot 961, the slot 961 horizontally penetrates the mounting structure 96, and the membrane 951 is inserted into the slot 961. When the film 951 needs to be taken out, the clamping jaws 113 are driven by the horizontal conveying structure 112 to move and clamp the film 951, so that the film 951 is taken out.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. The film sticking device is characterized by comprising a film, a suction nozzle and a top column, and is also provided with a film sticking station, wherein the suction nozzle can stick a chip on the film at the film sticking station; the top column is coaxial with the suction nozzle located at the film pasting station, and the top column is used for supporting the chip below the film when the chip is pasted on the film by the suction nozzle.

2. The film laminating apparatus of claim 1, wherein the diameter of the top post is configured to match the diameter of the suction end of the suction nozzle.

3. The film pasting device of claim 1, further comprising a post base and a cushioning member, wherein said cushioning member is mounted to said post base, and wherein said post is mounted to said cushioning member.

4. The film attachment device of claim 3, wherein the buffer is a compression spring.

5. The film sticking device as recited in claim 1, further comprising a top post driving structure for driving the top post to lift.

6. The film pasting device as defined in claim 5, wherein said top post driving structure comprises:

a jack post driver for outputting rotational motion;

and the transmission belt structure is connected with the output shaft of the ejection column driving piece, and the ejection column is installed on the transmission belt of the transmission belt structure.

7. The film sticking device according to any one of claims 1 to 6, further comprising a film sticking driving structure, wherein the film is mounted on the film sticking driving structure, and the film sticking driving structure is used for driving the film to move so that the suction nozzle sticks the chip to different positions of the film.

8. The film laminating apparatus of claim 7, wherein the film laminating drive mechanism comprises a film laminating drive member, a first direction transport assembly, and a second direction transport assembly; the first direction conveying assembly is connected with the output end of the film pasting driving piece, the second direction conveying assembly is connected with the output end of the first direction conveying assembly, the film is installed at the output end of the second direction conveying assembly, and the conveying direction of the first direction conveying assembly is perpendicular to the conveying direction of the second direction conveying assembly.

9. The film sticking device as claimed in claim 7, wherein a film ring for tensioning the film is installed on one circumferential edge of the film;

the film sticking device also comprises a film sticking seat, a convex ring and a tensioning driving piece, wherein the film ring, the convex ring and the tensioning driving piece are all arranged on the film sticking seat; the convex ring is arranged right below the diaphragm, and the tensioning driving part is used for driving the convex ring and/or the diaphragm to move so that the convex ring abuts against the periphery of the diaphragm to tension the diaphragm.

10. The film sticking device as recited in claim 9, wherein the film sticking seat is provided with a mounting structure, the mounting structure is formed with a slot, and the film is detachably inserted into the slot.

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