CN218072084U

CN218072084U - Electronic equipment shell

Info

Publication number: CN218072084U
Application number: CN202221819749.5U
Authority: CN
Inventors: 孟庆龙; 徐先峰; 薛金洋; 樊小林
Original assignee: Shenzhen Guangdatong Innovative Materials Co ltd
Current assignee: Shenzhen Guangdatong Innovative Materials Co ltd
Priority date: 2022-07-15
Filing date: 2022-07-15
Publication date: 2022-12-16
Anticipated expiration: 2032-07-15

Abstract

The utility model provides an electronic equipment casing. The electronic equipment shell comprises a plate, a supporting frame and an adjusting frame. The plate is disposed on an inner side region of the support frame. The adjusting frame is disposed on an outer side region of the supporting frame. The conditioning frame is adjacent to the sheet material and the conditioning frame is at least partially embedded in the outboard region of the support frame. The utility model provides a pair of electronic equipment casing, through setting up adjusting frame, and adjusting frame and panel border on to during embedding braced frame, thereby adjust the deformation degree of electronic equipment casing.

Description

Electronic equipment shell

Technical Field

The utility model relates to an equipment shell structure, concretely relates to electronic equipment casing.

Background

With the rapid development of computer technology and mobile communication technology, various intelligent mobile electronic devices such as notebook computers, tablet computers, mobile phones and the like are widely used. At the same time, consumer demand for portability of mobile electronic devices has also escalated. This has led to the development of various mobile electronic devices with reduced weight and weight. The present electronic device housing usually uses a structure of combining a carbon fiber plate with a plastic material, such as a plastic material wrapping the edge of the carbon fiber plate, thereby reducing the weight of the housing and increasing the impact strength of the housing. However, the carbon fiber plate is directly combined with the plastic material by in-mold forming, the formed plastic material has a large shrinkage, and the carbon fiber plate has no shrinkage, which may cause deformation of the housing structure and affect the appearance of the housing.

Disclosure of Invention

In view of this, the present invention provides an electronic device housing with adjustable deformation.

The utility model provides an electronic equipment casing. The electronic equipment shell comprises a plate, a supporting frame and an adjusting frame. The sheet material is disposed on an inner side region of the support frame. The adjusting frame is disposed on an outer side region of the supporting frame. The conditioning frame is adjacent to the sheet material and the conditioning frame is at least partially embedded in the outboard region of the support frame.

Optionally, the outer region of the support frame comprises a plug-in slot. The adjusting frame comprises a plug connector. The plug connector is downwards embedded into the plug groove.

Optionally, the inboard region of the support frame comprises a support platform. The outer region of the support frame includes a support base. The supporting platform extends from the upper direction of the supporting base to the inner side of the plate, and the supporting platform is arranged below the plate.

Optionally, the plug slot extends downwardly from an upper portion of the support base.

Optionally, the adjustment frame further comprises a wrap. The lower side of the cladding piece is cladded on the upper side of the supporting base. The inner side of the cladding piece is cladded on the outer side of the plate. The plug connector extends downwards from the lower side of the cladding piece.

Optionally, the supporting platform is provided with a mounting groove on the upper side. The electronic device housing also includes an adhesive layer. The bonding layer is arranged in the mounting groove so as to bond the supporting platform and the plate together.

Optionally, the width of the underside of the plug is greater than or equal to 0.5mm. A ratio between a height of the adjusting frame in a vertical direction and a width of the lower side of the plug is less than or equal to 2.5.

Optionally, the upper side of the supporting platform further includes a first connecting portion and a second connecting portion. The first connecting portion with the second connecting portion set up respectively in the both sides of mounting groove. The width of the first connecting part ranges from 0.03mm to 0.2mm. The width of the second connecting part ranges from 0.03mm to 0.2mm. The thickness range of the plate is 0.4-2.5mm.

Optionally, the adhesive layer has a thickness in the range of 0.02-0.3mm. The cross section of the plug connector is rectangular or trapezoidal.

Optionally, the support frame is a one-shot structure. The adjusting frame is of a secondary forming structure.

The utility model provides a pair of electronic equipment casing, through setting up adjusting frame, and adjusting frame and panel border on to during embedding braced frame, thereby adjust the deformation degree of electronic equipment casing.

Drawings

To illustrate the technical solutions of the embodiments of the present invention more clearly, the drawings of the embodiments will be briefly described below, and it is obvious that the drawings in the following description only relate to some embodiments of the present invention, and are not intended to limit the present invention.

Fig. 1 is a schematic view of an electronic device housing according to an embodiment of the present invention.

Fig. 2 is an enlarged cross-sectional view of the electronic device housing of fig. 1 taken along linebase:Sub>A-base:Sub>A.

Fig. 3 is an enlarged cross-sectional view of the electronic device housing of fig. 1 taken along linebase:Sub>A-base:Sub>A.

Fig. 4 is a schematic partial cross-sectional view of an electronic device casing according to another embodiment of the present invention.

Detailed Description

For making the utility model discloses technical scheme's purpose, technical scheme and effect are clearer, will combine below the utility model discloses the drawing of embodiment is right the utility model discloses technical scheme makes clear, describes completely.

Referring to fig. 1, an embodiment of the present invention provides an electronic device casing 900. Referring to fig. 2 in combination, the electronic device case 900 includes a plate 100, a support frame 200, an adjustment frame 300, and an adhesive layer 400. The sheet material 100 is disposed on the inner side area 201 of the support frame 200. The adjusting frame 300 is disposed on the outer side region 202 of the support frame 200. The conditioning frame 300 is adjacent to the sheet material 100 and the conditioning frame 300 is at least partially embedded in the outer region 202 of the support frame 200. The support frame 200 is a one-step molding structure. The adjusting frame 300 is an over-molded structure. The panel 100 and the support frame 200 are combined through a first in-mold injection molding process. The adjusting frame 300 is combined with the panel and the support frame 200 through a second in-mold injection molding process. The deformation degree of the electronic equipment shell can be adjusted in time by twice in-mold injection molding process.

The board 100 may be one of a composite material, a metal material, and a plastic material, wherein the composite material is one or more of carbon fiber, glass fiber, and kevlar fiber. The supporting frame 200 and the adjusting frame 300 are made of plastic materials, are light in weight, have plasticity, are easy to form, are integrally portable when combined with the board 100 to form the electronic device shell 900, and have the effect of buffering and damping. Specifically, the plastic material may be one of, but not limited to, PC + ABS, PC +10% -60% glass fiber, PA +10% -60% glass fiber, and PPS +10% -60% glass fiber.

Referring to fig. 1 and 2, the thickness D of the sheet 100 ranges from 0.4 to 2.5mm. If the thickness D of the plate 100 is less than 0.4mm, the impact strength of the finished product of the electronic device housing 900 is poor. If thickness D of sheet material 100 is greater than 2.5mm, electronic device housing 900 is not portable enough due to its overall thickness.

Referring to fig. 1 and 2, the support frame 200 includes a support platform 210, a support base 220 and a plug-in slot 230. The inboard region 201 of the support frame 200 includes a support platform 210. The outer region 202 of the support frame 200 includes a support base 220 and a socket 230. The supporting platform 210 extends from the upper side of the supporting base 220 to the inner side of the plate 100, and the supporting platform 210 is disposed below the plate 100. The docking slot 230 extends downward from the upper portion 221 of the support base 220.

Referring to fig. 1 and 2, the upper side 211 of the support platform 210 is provided with a mounting slot 212. The mounting groove 212 is recessed downward from the upper side 211 of the support platform 210. The adhesive layer 400 is filled in the mounting groove 212, and the upper side 211 of the supporting platform 210 further includes a first connecting portion 213 and a second connecting portion 214. The first connecting portion 213 and the second connecting portion 214 are respectively disposed at two sides of the mounting groove 212, and are directly combined with the board 100 by means of in-mold injection molding. Referring to fig. 3 in combination, the width W1 of the first connection portion 213 ranges from 0.03 to 2mm. If the width W1 of the first connection portion 213 is less than 0.03mm, the adhesive layer 400 cannot be sealed when the adhesive layer 400 is filled, resulting in overflow of the adhesive layer 400. If the width W1 of the first connection portion 213 is greater than 2mm, the bonding strength between the first connection portion 213 and the plate 100 is low, and the first connection portion 213 is easily cracked when external force is applied. The width W2 of the second connection part 214 ranges from 0.03 to 2mm. If the width W2 of the second connection portion 214 is less than 0.03mm, the adhesive layer 400 cannot be sealed when the adhesive layer 400 is filled, resulting in overflow of the adhesive layer 400. If the width W2 of the second connection part 214 is greater than 2mm, the bonding strength between the second connection part 214 and the plate material 100 is low, and the second connection part is easily peeled from the plate material 100. The material of the adhesive member 400 may be an instant adhesive, an epoxy adhesive, a hot melt adhesive or a solid adhesive, and may be flexibly selected according to the material of the sheet material 100 and the material of the support frame 200.

Referring to fig. 1 and 2, the adjusting frame 300 includes a plug 310 and a cover 320. The lower side 321 of the covering member 320 covers the upper side 222 of the supporting base 220. Inner side 322 of cladding 320 is clad to outer side 110 of sheet material 100. Plug 310 extends downward from lower side 321 of shroud 320. The socket connector 310 is inserted downward into the socket connector 230 to further enhance the coupling strength of the support frame 200 and the adjustment frame 320. Referring to fig. 3 in combination, width W3 of lower side 311 of plug 310 is greater than or equal to 0.5mm to ensure that plug 310 can be completely filled into plug groove 230 during the molding process. The ratio of height H of adjustment frame 300 in the vertical direction to width W3 of lower side 311 of plug 310 is less than or equal to 2.5, so that surface molding is not shrunk after plug 310 is inserted into slot 230. In the present embodiment, the cross-sectional shape of the plug 310 is rectangular. Referring further to FIG. 4, in other embodiments, the cross-sectional shape of the plug 310 may also be trapezoidal.

Referring to fig. 1 and 2, an adhesive layer 400 is disposed in the mounting groove 212 to adhere the supporting platform 210 and the sheet material 100 together. The thickness W4 of the adhesive layer 400 ranges from 0.02 to 0.3mm. If the thickness W4 of the adhesive layer 400 is less than 0.02mm, the supporting platform 210 and the plate 100 are not tightly adhered, and the bonding strength is low; if the thickness W4 of the adhesive layer 400 is greater than 0.3mm, glue overflow may occur, which may affect the appearance of the electronic device case 900.

While the description and drawings of the present invention have been given for the purpose of illustration and description, it will be understood by those skilled in the art that these embodiments are not intended to limit the scope of the present invention, but are capable of modification in various forms and details without departing from the spirit and scope of the present invention. Accordingly, the scope of the present disclosure is not limited to the above-described embodiments, but should be determined by the claims and the equivalents thereof.

Claims

1. An electronic device casing, comprising a plate material, a supporting frame and an adjusting frame, wherein the plate material is disposed on an inner region of the supporting frame, the adjusting frame is disposed on an outer region of the supporting frame, the adjusting frame is adjacent to the plate material, and the adjusting frame is at least partially embedded in the outer region of the supporting frame.

2. An electronic device housing as claimed in claim 1, characterized in that the outer region of the support frame comprises a plug-in slot and the adjusting frame comprises a plug-in part which is inserted down into the plug-in slot.

3. An electronic device housing as recited in claim 2, wherein the inner region of the support frame comprises a support platform, the outer region of the support frame comprises a support base, the support platform extends from above the support base to the inner side of the board, and the support platform is disposed below the board.

4. An electronic device housing as recited in claim 3, wherein the slot extends downwardly from an upper portion of the support base.

5. The electronic device casing of claim 4, wherein the adjusting frame further comprises a covering member, wherein a lower side of the covering member covers an upper side of the supporting base, an inner side of the covering member covers an outer side of the board, and the plug member extends downward from the lower side of the covering member.

6. An electronic device housing as claimed in claim 5, wherein the supporting platform is provided with a mounting groove at an upper side thereof, the electronic device housing further comprising an adhesive layer disposed in the mounting groove to adhere the supporting platform and the plate together.

7. An electronic equipment enclosure as claimed in claim 6 wherein the width of the underside of the plug is greater than or equal to 0.5mm and the ratio of the height of the adjustment frame in the vertical direction to the width of the underside of the plug is less than or equal to 2.5.

8. The electronic device casing according to claim 7, wherein the upper side of the supporting platform further comprises a first connecting portion and a second connecting portion, the first connecting portion and the second connecting portion are respectively disposed at two sides of the mounting groove, a width of the first connecting portion ranges from 0.03mm to 0.2mm, a width of the second connecting portion ranges from 0.03mm to 0.2mm, and a thickness of the plate ranges from 0.4mm to 2.5mm.

9. An electronic device housing according to claim 8, wherein the thickness of the adhesive layer is in the range of 0.02-0.3mm, and the cross-sectional shape of the plug is rectangular or trapezoidal.

10. An electronic device casing as claimed in any one of claims 1 to 9, wherein the support frame is a one-shot structure and the adjustment frame is a two-shot structure.