CN218068702U - Distributed water-cooling heat dissipation system of all-in-one computer - Google Patents

Abstract

The utility model discloses a computer all-in-one distributing type water-cooling system, the first end department of the flexible pipe of first flexible pipe and second all is fixed the intercommunication and has the water filling port, and the other end department of the flexible pipe of first flexible pipe and second all is fixed the intercommunication and has the sealing washer, and two first flexible pipes and two flexible pipes of second all are fixed the intercommunication and have the water pipe, and adjustment mechanism is installed to the front side department of stay tube. The adjusting mechanism can adjust the distance between the first telescopic pipe and the second telescopic pipe, and further can change the use width of the heat radiating system, so that the heat radiating system can be suitable for electronic components with different widths, the application range is improved, the heat collecting mechanism can transmit the heat of the electronic components which generate heat to the first telescopic pipe and the two second telescopic pipes for heat radiation, and the heat can be quickly conducted through a plurality of heat conducting contacts and a plurality of heat conducting plates, so that the heat conduction efficiency is improved, and the quick heat radiation of the electronic components is facilitated.

Description

Distributed water-cooling heat dissipation system of all-in-one computer

Technical Field

The utility model relates to an all-in-one computer technical field specifically is a computer all-in-one distributing type water-cooling heat dissipation system.

Background

The concept of integrating a host of a conventional split desktop into a display to form an integrated desktop is first proposed by association groups, and the concept of integrating a host of a conventional split desktop into a display to form an integrated desktop is first proposed by association groups. The idea is that the first brand manufacturer in china with millions of desktop users in one piece integrates the host of their lead split desktop into the display, forming a one-piece desktop. The development direction of an integrated desktop is led by the aid of associated technology and innovative design, electronic elements in the integrated computer generate heat when working in the use process, and distributed water cooling is mostly adopted for heat dissipation at present.

When the existing water-cooling heat dissipation system is used, on one hand, the use width of the existing water-cooling heat dissipation system is difficult to adjust according to actual needs, the existing water-cooling heat dissipation system cannot be suitable for electronic elements with different widths, on the other hand, the heat conduction efficiency is difficult to improve, and the existing water-cooling heat dissipation system is not beneficial to rapid heat dissipation of the electronic elements.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a computer all-in-one distributing type water-cooling system to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a computer all-in-one distributing type water-cooling system, including the stay tube, the both sides of stay tube are respectively the activity grafting have first flexible pipe and the flexible pipe of second, the first end department of first flexible pipe and the flexible pipe of second all is fixed the intercommunication has the water filling port, and the other end department of first flexible pipe and the flexible pipe of second all is fixed the intercommunication has the sealing washer, the quantity of first flexible pipe and the flexible pipe of second is two, it has the water pipe all to fix the intercommunication between two first flexible pipes and two flexible pipes of second, the front side department of stay tube installs adjustment mechanism, adjustment mechanism includes two-way threaded rod, the mount pad, first regulating tube, the second regulating tube, first extension board and second extension board, the outside movable sleeve of two-way threaded rod is equipped with the mount pad, and the threaded sleeve is equipped with first regulating tube and second regulating tube respectively at the both ends of two-way threaded rod, the one end rigid coupling of first regulating tube has first extension board, the one end rigid coupling of second regulating tube has the second extension board, all be connected with heat collection mechanism between two first flexible pipes and two flexible pipes.

Optionally, the first support plate is fixedly connected to the first telescopic tube, and the second support plate is fixedly connected to the second telescopic tube.

Optionally, a drainage hole penetrates through the inside of the sealing ring, and the sealing ring movably abuts against the inner wall of the supporting tube.

Optionally, the mounting seat is fixedly connected to the support tube, and the mounting seat and the support tube are rotatably connected through a bearing.

Optionally, the heat collection mechanism includes conduction board, metal sheet, heat-conducting plate and heat conduction contact, and the metal sheet is installed to the inboard department of conduction board, and the rigid coupling has four heat-conducting plates between conduction board and the metal sheet, and the rigid coupling has ten heat conduction contacts on the inside wall of metal sheet.

Optionally, two ends of the heat-conducting plates are respectively and fixedly connected to the two second telescopic pipes, and the four heat-conducting plates are distributed obliquely.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the adjusting mechanism can adjust the distance between the first telescopic pipe and the second telescopic pipe, so that the use width of the heat dissipation system can be changed, the heat dissipation system can be suitable for electronic elements with different widths, and the application range is widened.

2. The heat collecting mechanism can transfer heat of the heating electronic element into the first telescopic pipe and the two second telescopic pipes to dissipate heat, and can conduct heat quickly through the plurality of heat conducting contacts and the plurality of heat conducting plates, so that the heat conduction efficiency is improved, and the quick heat dissipation of the electronic element is facilitated.

Drawings

Fig. 1 is a schematic diagram of the overall structure of the distributed water-cooling heat dissipation system of the all-in-one computer of the present invention;

fig. 2 is a schematic structural diagram of an adjusting mechanism in the distributed water-cooling heat dissipation system of the all-in-one computer;

fig. 3 is the utility model relates to a structural schematic diagram of heat collection mechanism in computer all-in-one machine distributing type water-cooling heat dissipation system.

In the figure: 1. supporting a pipe; 2. a first telescopic tube; 3. a second telescopic tube; 4. a water injection port; 5. a water pipe; 6. an adjustment mechanism; 61. a bidirectional threaded rod; 62. a mounting seat; 63. a first regulating pipe; 64. a second regulating tube; 65. a first support plate; 66. a second support plate; 7. a heat collection mechanism; 71. a conductive plate; 72. a metal plate; 73. a heat conducting plate; 74. a thermally conductive contact; 8. and (5) sealing rings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1 to 3, the utility model provides a computer all-in-one distributing type water-cooling heat dissipation system, including stay tube 1, the both sides of stay tube 1 are respectively the activity grafting have first flexible pipe 2 and the flexible pipe 3 of second, the one end department of first flexible pipe 2 and the flexible pipe 3 of second all is fixed the intercommunication has water filling port 4, and the other end department of first flexible pipe 2 and the flexible pipe 3 of second all is fixed the intercommunication has sealing washer 8, the inside of sealing washer 8 runs through there is the drain hole, and the activity of sealing washer 8 supports and leans on the inner wall of stay tube 1, the quantity of first flexible pipe 2 and the flexible pipe 3 of second is two, all be fixed the intercommunication has water pipe 5 between two first flexible pipes 2 and two flexible pipes 3 of second.

The adjusting mechanism 6 is installed at the front side of the supporting tube 1, the adjusting mechanism 6 comprises a bidirectional threaded rod 61, an installation seat 62, a first adjusting tube 63, a second adjusting tube 64, a first supporting plate 65 and a second supporting plate 66, the installation seat 62 is movably sleeved outside the bidirectional threaded rod 61, the first adjusting tube 63 and the second adjusting tube 64 are respectively sleeved at two ends of the bidirectional threaded rod 61 through threads, the first supporting plate 65 is fixedly connected to one end of the first adjusting tube 63, the second supporting plate 66 is fixedly connected to one end of the second adjusting tube 64, the first supporting plate 65 is fixedly connected to the first telescopic tube 2, the second supporting plate 66 is fixedly connected to the second telescopic tube 3, the installation seat 62 is fixedly connected to the supporting tube 1, the installation seat 62 is rotatably connected to the supporting tube 1 through a bearing, the adjusting mechanism 6 can adjust the distance between the first telescopic tube 2 and the second telescopic tube 3, the use width of the heat dissipation system can be changed, the heat dissipation system can be suitable for electronic elements with different widths, and the application range is improved.

The heat collecting mechanism 7 is connected between the two first telescopic pipes 2 and the two second telescopic pipes 3, the heat collecting mechanism 7 comprises a conducting plate 71, a metal plate 72, heat conducting plates 73 and heat conducting contacts 74, the metal plate 72 is installed at the inner side of the conducting plate 71, four heat conducting plates 73 are fixedly connected between the conducting plate 71 and the metal plate 72, ten heat conducting contacts 74 are fixedly connected to the inner side wall of the metal plate 72, two ends of each heat conducting plate 73 are fixedly connected to the two second telescopic pipes 3 respectively, the four heat conducting plates 73 are distributed in an inclined mode, the heat collecting mechanism 7 can conduct heat of a heating electronic component into the first telescopic pipe 2 and the two second telescopic pipes 3 to dissipate heat, the heat can be conducted quickly through the heat conducting contacts 74 and the heat conducting plates 73, heat conducting efficiency is improved, and quick heat dissipation of the electronic component is facilitated.

The working principle is as follows: when the device is used, the two-way threaded rod 61 is held by a hand to rotate forwards, the first adjusting pipe 63 and the second adjusting pipe 64 can be driven to move relatively, the first supporting plate 65 and the second supporting plate 66 are driven to move relatively, the first extension pipe 2 and the second extension pipe 3 can be driven to move relatively, similarly, the two-way threaded rod 61 is held by a hand to rotate backwards, the first adjusting pipe 63 and the second adjusting pipe 64 can be driven to move oppositely, the first supporting plate 65 and the second supporting plate 66 are driven to move oppositely, the first extension pipe 2 and the second extension pipe 3 can be driven to move oppositely until the heat conducting contact 74 is abutted against an electronic element, the adjusting mechanism 6 can adjust the distance between the first extension pipe 2 and the second extension pipe 3, the use width of the heat dissipation system can be changed, so that the heat dissipation system can be suitable for electronic elements with different widths, and the application range is improved, then the water injection port 4 on the first extension tube 2 is opened, cooling water is injected into the first extension tube 2, at this time, a part of the cooling water flows into the water pipe 5, the other part of the cooling water flows into the second extension tube 3 through the support tube 1, when the whole system flows into the cooling water, any one of the remaining three water injection ports 4 is opened again for draining, and the heat conducting contact 74 can transfer the heat on the electronic element to the heat conducting plate 73 through the metal plate 72 after contacting with the electronic element, then transfer the heat to the heat conducting plate 71 through the heat conducting plate 73, finally transfer the heat to the two first extension tubes 2 and the two second extension tubes 3, and dissipate the heat rapidly after contacting with the cooling water, so the heat collecting mechanism 7 can transfer the heat of the heated electronic element to the first extension tubes 2 and the two second extension tubes 3 for heat dissipation, moreover, the heat can be quickly conducted through the plurality of heat-conducting contacts 74 and the plurality of heat-conducting plates 73, so that the heat conduction efficiency is improved, and the quick heat dissipation of the electronic element is facilitated.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. A distributed water-cooling heat dissipation system of a computer all-in-one machine comprises a supporting pipe (1) and is characterized in that two sides of the supporting pipe (1) are respectively and movably inserted with a first telescopic pipe (2) and a second telescopic pipe (3), one end of each of the first telescopic pipe (2) and the second telescopic pipe (3) is fixedly communicated with a water injection port (4), the other end of each of the first telescopic pipe (2) and the second telescopic pipe (3) is fixedly communicated with a sealing ring (8), the number of the first telescopic pipe (2) and the second telescopic pipe (3) is two, a water pipe (5) is fixedly communicated between the two first telescopic pipes (2) and the two second telescopic pipes (3), an adjusting mechanism (6) is installed at the front side of the supporting pipe (1), the adjusting mechanism (6) comprises a two-way threaded rod (61), an installation seat (62), a first adjusting pipe (63), a second adjusting pipe (64), a first supporting plate (65) and a second supporting plate (66), an installation seat (62) is sleeved on the outer portion of the two-way threaded rod (61), and one end of the two-way threaded rod (61) is respectively sleeved with a first adjusting plate (63) and one end of the second supporting plate (64), and one end of the second supporting plate (64) is fixedly connected with a second adjusting plate (64), and a heat collecting mechanism (7) is connected between the two first telescopic pipes (2) and the two second telescopic pipes (3).

2. The distributed water-cooling heat dissipation system of the all-in-one computer, according to claim 1, is characterized in that the first support plate (65) is fixedly connected to the first extension pipe (2), and the second support plate (66) is fixedly connected to the second extension pipe (3).

3. The distributed water-cooling heat dissipation system of the all-in-one computer, as recited in claim 1, is characterized in that a drain hole penetrates through the inside of the sealing ring (8), and the sealing ring (8) is movably abutted against the inner wall of the support tube (1).

4. The distributed water-cooling heat dissipation system for the all-in-one computer according to claim 1, wherein the mounting seat (62) is fixedly connected to the support pipe (1), and the mounting seat (62) is rotatably connected to the support pipe (1) through a bearing.

5. The distributed water-cooling heat dissipation system of the all-in-one computer as claimed in claim 1, wherein the heat collection mechanism (7) comprises a conduction plate (71), a metal plate (72), a heat conduction plate (73) and heat conduction contacts (74), the metal plate (72) is installed at the inner side of the conduction plate (71), four heat conduction plates (73) are fixedly connected between the conduction plate (71) and the metal plate (72), and ten heat conduction contacts (74) are fixedly connected to the inner side wall of the metal plate (72).

6. The distributed water-cooling heat dissipation system of the all-in-one computer as claimed in claim 5, wherein two ends of the heat conducting plates (73) are respectively and fixedly connected to the two second telescopic pipes (3), and the four heat conducting plates (73) are all distributed in an inclined manner.

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