CN218068461U - Heat dissipation type augmented reality head display - Google Patents

Abstract

The utility model discloses a first apparent of heat dissipation type augmented reality, include: the module comprises a circuit board, an LCD panel and an optical module bracket, wherein the optical module bracket is arranged in contact with the LCD panel, the back of the circuit board is provided with a radiating fin, and a triangular hollow area is arranged between the circuit board and the optical module bracket. This heat dissipation type augmented reality head shows through setting up the fin at the circuit board back, sets up triangle-shaped hollow area between circuit board and the optical module support, and the casing left and right sides and top position set up the louvre respectively, and the optical module support sets up with the contact of LCD panel, effectively realizes showing the heat conduction of the inside production of device to the casing outside, improves user experience.

Description

Heat dissipation type augmented reality head display

Technical Field

The utility model relates to a show technical field, especially relate to a heat dissipation type augmented reality head shows.

Background

Augmented reality AR is a technology for calculating the position and angle of camera shooting in real time and adding corresponding images, and the aim of the technology is to sleeve a virtual world on a screen in the real world and perform interaction. The AR technology has wide application in the fields of development and development of sophisticated weapons and aircrafts, visualization of data models, virtual training, entertainment, art and the like. Head-mounted displays are widely used in augmented reality systems to enhance the visual immersion of users.

Because equipment is worn to head-mounted needs integrated multiple sensor, lead to the volume to be bigger than general glasses, simultaneously the gas permeability is lower than general glasses, so wear equipment's the good or bad experience effect that directly concerns the product of heat dissipation, if the heat dissipation can lead to CPU local overheat, produce the phenomenon of falling the frequency, and then influence and watch experience, reduce the life of component simultaneously. The existing head-mounted equipment mainly adopts a fan for heat dissipation, but the fan for heat dissipation has high cost and needs to occupy a large space, and noise generated in the running process of the fan influences user experience.

SUMMERY OF THE UTILITY MODEL

To the fan heat dissipation cost that exists among the above-mentioned prior art higher, need occupy great space, and fan operation process produces the technical problem that the noise influences user experience, the utility model aims to provide a heat dissipation type augmented reality is first apparent.

In order to achieve the above object, the utility model provides a heat dissipation type augmented reality head shows, include: the module comprises a circuit board, an LCD panel and an optical module bracket, wherein the optical module bracket is arranged in contact with the LCD panel, the back of the circuit board is provided with a radiating fin, and a triangular hollow area is arranged between the circuit board and the optical module bracket.

Optionally, the back of the radiating fin is provided with a fish scale-shaped protruding structure, and the fish scale-shaped protruding structure increases the specific surface area of the radiating fin and improves the radiating efficiency.

Optionally, the heat sink is made of aluminum or aluminum alloy, and the heat sink plays a role in dissipating heat of the circuit board and supporting the circuit board.

Optionally, the heat conducting pad is arranged at the contact position of the heat radiating fin and the chip on the circuit board, so that heat generated by the circuit board can be quickly transferred out, and the phenomenon of overhigh temperature of the chip part of the circuit board can not be caused.

Optionally, the heat conducting pad is a heat conducting silica gel pad.

Optionally, the left side, the right side and the top of the casing are respectively provided with at least one heat dissipation hole, so that air convection is formed between the inside of the casing and the outside of the casing through the heat dissipation holes.

Optionally, the positions of the heat dissipation holes at the left side and the right side of the shell correspond to the positions of the triangular hollow areas, so that the triangular hollow areas are communicated with the heat dissipation holes in the shell to form air convection, and heat in the shell can be quickly transferred to the outer side of the shell.

Optionally, the heat dissipation holes are strip-shaped.

Optionally, the louvre inboard sets up dustproof cloth, has both prevented that external dust from getting into the first inside that shows of augmented reality, can not lead to the fact too big hindrance to the air current again.

Optionally, the optical module bracket is made of aluminum or aluminum alloy, and has a supporting effect on the LCD panel while playing a role in dissipating heat of the LCD panel.

Compared with the prior art, the utility model discloses a technological effect does:

(1) The back of the circuit board is provided with the radiating fin, and the heat conducting pad is arranged at the contact position of the radiating fin and the chip on the circuit board, so that heat generated by the circuit board is quickly transferred out, and the purpose of radiating the circuit board is achieved.

(2) The radiating fin and the optical module support are made of light aluminum alloy materials, so that the weight of the augmented reality head is reduced, and the user experience is improved.

(3) The triangular hollow area is communicated with the heat dissipation holes in the shell to form air convection, so that heat in the shell can be quickly transferred to the outer side of the shell, and the purpose of heat dissipation is achieved.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic view of the structure of the components in the housing;

FIG. 2 is a schematic view of the structure of the heat sink and the circuit board;

FIG. 3 is a schematic view of the structure of the heat sink and the heat conducting pad;

FIG. 4 is a schematic view of the structure of the overall heat dissipation hole distribution of the housing;

fig. 5 is a schematic structural view of the distribution of heat dissipation holes on the side surface of the housing.

Description of reference numerals:

the LED module comprises a shell 1, a circuit board 2, an LCD panel 3, an optical module support 4, a radiating fin 5, a triangular hollow area 6, a heat conducting pad 7, a fish scale-shaped protruding structure 8, a radiating hole 9 and dustproof cloth 10.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

The heat dissipation type augmented reality head display provided according to an embodiment of the present invention is described below with reference to the accompanying drawings.

As shown in fig. 1-5, the heat dissipation type augmented reality head comprises: the LED module comprises a shell 1, a circuit board 2, an LCD panel 3, an optical module support 4 and a radiating fin 5, wherein the optical module support 4 is arranged in contact with the LCD panel 3, the radiating fin 5 is arranged on the back of the circuit board 2, and a triangular hollow area 6 is arranged between the circuit board 2 and the optical module support 4.

In the augmented reality, the circuit board 2 is the largest heat source, the chip arranged on the circuit board 2 is the main heat source of the circuit board 2, the heat sink 5 is arranged on the back of the circuit board 2, the heat conducting pad 7 is arranged at the contact position of the heat sink 5 and the chip on the circuit board 2, the fish scale-shaped protruding structure 8 is arranged on the back of the heat sink 5, heat generated by the circuit board 2 is transferred out, specifically, the heat generated by the circuit board 2 is transferred to the heat sink 5 in a heat conduction mode, and the heat received by the heat sink 5 is transferred to the triangular hollow area 6 in a heat convection mode. The heat conducting pad 7 is a heat conducting silica gel pad, and the heat conducting pad 7 is arranged at the contact position of the radiating fin 5 and the chip on the circuit board 2, so that heat generated at the chip is transferred as soon as possible, and the phenomenon that the local temperature of the chip is too high at the circuit board 2 is prevented; the radiating fins 5 are made of aluminum alloy materials, the radiating fins 5 play a certain supporting role for the circuit board 2 while radiating the circuit board 2, and meanwhile, the radiating fins 5 are made of light aluminum alloy, so that the weight of the display head is reduced and the user experience is improved; the fish-scale-shaped protruding structures 8 are arranged on the back of the radiating fin 5, and air flow general spaces are reserved among the fish-scale-shaped protruding structures 8, so that the specific surface area of the radiating fin is increased, and the radiating efficiency is improved.

Optical module support 4 sets up with the contact of LCD panel 3, and optical module support 4 adopts lighter aluminum alloy material, has alleviateed the first apparent weight of augmented reality, has promoted user experience. The heat generated by the LCD panel 3 is transferred to the optical module bracket 4 and then transferred out by the optical module bracket 4, specifically, the heat generated by the LCD panel 3 is transferred to the optical module bracket 4 with a heat dissipation function by a heat conduction manner, and the optical module bracket 4 transfers the received heat to the triangular hollow area 6 by a heat convection manner. The optical module bracket 4 plays a role in supporting the LCD panel 3 while playing a role in heat dissipation for the LCD panel 3.

The left and right sides and the top of the casing 1 are respectively provided with 3 strip-shaped heat dissipation holes 9, the inner sides of the heat dissipation holes 9 are attached with dustproof cloth 10, wherein the positions of the heat dissipation holes 9 at the left and right sides correspond to the positions of the triangular hollow regions 6. Triangle-shaped hollow region 6 shows the outside through set up side by side at the louvre 9 of this regional both sides and augmented reality and communicates with each other, and then show the outside with heat transfer to the first outside of augmented reality, particularly, heat dissipation fin 5 and optical module support 4 are respectively with the heat transfer of circuit board 2 and the production of LCD panel 3 to triangle-shaped hollow region 6, triangle-shaped hollow region 6 shows the outside air convection that forms with the first outside of augmented reality through the louvre 9 of the casing 1 left and right sides, thereby show the outside with heat transfer to the first outside of augmented reality, reach radiating purpose, can understand that there is partial heat simultaneously to show the outside air convection that forms with the first outside of augmented reality of louvre 9 and the first outside of augmented reality of casing 1 top, thereby show the outside with heat transfer to the first outside of augmented reality and reach radiating purpose. The augmented reality head shows and forms the convection current passageway through louvre 9 and the external world and dispel the heat, and external dust also can get into the head inside that shows of augmented reality through louvre 9 in the radiating, and then the influence is watched and is experienced, through setting up dustproof cloth 10 in the inboard of louvre 9, has both prevented that external dust from getting into the head inside that shows of augmented reality, can not lead to the fact too big hindrance to the air circulation again.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. The utility model provides a first apparent of heat dissipation type augmented reality which characterized in that includes:

the module comprises a circuit board, an LCD panel and an optical module bracket, wherein the optical module bracket is arranged in contact with the LCD panel, the back of the circuit board is provided with a radiating fin, and a triangular hollow area is arranged between the circuit board and the optical module bracket.

2. The heat dissipating augmented reality head of claim 1, wherein a back portion of the heat sink is configured as a fish-scale protrusion.

3. The heat dissipating type augmented reality head as claimed in claim 1 or 2, wherein the heat dissipating sheet is made of aluminum or aluminum alloy.

4. The thermal augmented reality head display of claim 1, wherein a thermal pad is disposed at a contact location of the heat sink and the chip on the circuit board.

5. The heat dissipating type augmented reality head display of claim 4, wherein the heat conducting pad is a heat conducting silicone pad.

6. The heat dissipating type augmented reality head display of claim 1, wherein at least one heat dissipating hole is formed at each of the left and right sides and the top of the housing.

7. The heat dissipating type augmented reality head display of claim 6, wherein the heat dissipating holes on the left and right sides of the housing correspond to the triangular hollow regions.

8. The heat dissipating type augmented reality head as claimed in claim 6 or 7, wherein the heat dissipating holes are in the shape of a strip.

9. The heat dissipating type augmented reality head display of claim 6, wherein a dust cloth is disposed inside the heat dissipating hole.

10. The heat dissipating type augmented reality head display of claim 1, wherein the optical module bracket is made of aluminum or aluminum alloy.

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