CN218067702U - Quick detection mechanism of semiconductor chip - Google Patents
Quick detection mechanism of semiconductor chip Download PDFInfo
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- CN218067702U CN218067702U CN202222306738.3U CN202222306738U CN218067702U CN 218067702 U CN218067702 U CN 218067702U CN 202222306738 U CN202222306738 U CN 202222306738U CN 218067702 U CN218067702 U CN 218067702U
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Abstract
The utility model relates to a semiconductor chip short-term test mechanism, include: detection platform, put thing subassembly, removal detection camera and fixed detection camera. The object placing assembly comprises an X moving plate and a Y moving plate, the X moving plate is arranged on the detection platform in a sliding mode, and the X moving plate can move along the X direction; the Y motion board is used for placing a chip to be detected, the Y motion board is arranged on the X motion board in a sliding mode, and the Y motion board can move along the Y direction. The two opposite sides of the Y moving plate are respectively provided with a mobile detection camera and a fixed detection camera, and the lenses of the mobile detection camera and the fixed detection camera face the Y moving plate; the mobile detection camera is arranged on the detection platform in a sliding mode and can move along the Y direction; the fixed detection camera is fixedly arranged on the detection platform, and the movable detection camera and the fixed detection camera can simultaneously detect the chip on the Y moving plate.
Description
Technical Field
The utility model relates to a detection area especially relates to a semiconductor chip short-term test mechanism.
Background
In the production and processing process of chips, the step of detecting whether flaws exist on the end surface and the side surface of the chip is indispensable, but when the side surfaces of two opposite sides of the chip are detected, the conventional detection mechanism generally detects one side surface firstly and then detects the other side surface, so that the chip needs to move back and forth at least twice in the detection mechanism to complete the detection of the two opposite side surfaces, and the detection efficiency is low.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a semiconductor chip short-term test mechanism aims at solving the problem that chip detection efficiency is low among the prior art.
(II) technical scheme
In order to solve the above problem, the utility model provides a semiconductor chip short-term test mechanism, semiconductor chip short-term test mechanism includes: the system comprises a detection platform, an object placing assembly, a mobile detection camera and a fixed detection camera;
the object placing assembly comprises an X moving plate and a Y moving plate, the X moving plate is arranged on the detection platform in a sliding mode, and the X moving plate can move along the X direction; the Y motion plate is used for placing a chip to be detected, the Y motion plate is arranged on the X motion plate in a sliding mode, and the Y motion plate can move along the Y direction;
the two opposite sides of the Y moving plate are respectively provided with the mobile detection camera and the fixed detection camera, and the lenses of the mobile detection camera and the fixed detection camera face the Y moving plate; the mobile detection camera is arranged on the detection platform in a sliding mode and can move along the Y direction; the fixed detection camera is fixedly arranged on the detection platform, and the mobile detection camera and the fixed detection camera can simultaneously detect the chip on the Y motion plate.
Preferably, a driving mechanism is arranged on the X moving plate, and the driving mechanism can drive the Y moving plate to reciprocate along the Y direction.
Preferably, the Y moving plate is provided with a tooling block in a rotating mode, the Y moving plate is fixedly provided with a first servo motor, an output shaft of the first servo motor can drive the tooling block to rotate, and the tooling block is provided with a station for placing a chip to be detected.
Preferably, a negative pressure hole is formed in the station, and the tool block can adsorb the chip to be detected through the negative pressure hole.
Preferably, a groove is formed in the detection platform along the X direction, an X guide rail is arranged in the groove along the X direction, and the Y moving plate is arranged on the X guide rail in a sliding mode.
Preferably, a Y guide rail is arranged on the detection platform along the Y direction and is positioned outside the groove, the Y motion platform is arranged on the Y guide rail in a sliding manner, and the mobile detection camera is fixedly arranged on the Y motion platform.
Preferably, a second servo motor and a driving screw rod are arranged on the detection platform, the driving screw rod is rotatably arranged on the detection platform, an output shaft of the second servo motor is fixedly connected with one end of the driving screw rod, an internal thread hole matched with the driving screw rod is formed in the Y motion platform, and the second servo motor can drive the Y motion platform to move along the Y direction through the driving screw rod.
Preferably, the central lines of the lenses of the mobile detection camera and the fixed detection camera are perpendicular to the side surface of the chip to be detected.
Preferably, the center lines of the lenses of the moving detection camera and the fixed detection camera are collinear.
(III) advantageous effects
The utility model discloses wait to detect the chip and place on the Y motion board in, and the both sides of Y motion board are provided with respectively and remove detection camera and fixed detection camera. In the detection process, the X motion plate firstly drives the chip to be detected to move to a position between the mobile detection camera and the fixed detection camera, and then the Y motion plate displaces in the Y direction so that the side surface of one side, facing the fixed detection camera, of the chip to be detected is positioned at the focus of the fixed detection camera; the movable detection camera moves in the Y direction, so that the side face, facing to the side of the movable detection camera, of the chip to be detected is located at the focus of the movable detection camera, on the premise that the detection result is accurate, the fixed detection camera and the movable detection camera can simultaneously detect two opposite sides of the chip to be detected, and the detection efficiency is greatly improved.
Drawings
Fig. 1 is a perspective view of the semiconductor chip rapid inspection mechanism of the present invention;
fig. 2 is a front view of the semiconductor chip rapid inspection mechanism of the present invention.
[ instruction of reference ]
1: a detection platform; 11: a groove; 12: an X guide rail; 13: a Y guide rail; 14: a Y motion platform; 21: an X motion plate; 22: a Y motion plate; 23: a drive mechanism; 24: a tooling block; 25: a first servo motor; 3: a movement detection camera; 4: the detection camera is fixed.
Detailed Description
For a better understanding of the present invention, reference will now be made in detail to the present invention, examples of which are illustrated in the accompanying drawings.
It should be noted that all the directional indicators (such as up, down, left, right, front, back, 8230; \8230;) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, descriptions in the present application as to "first", "second", and the like are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
As shown in fig. 1 and fig. 2, the utility model provides a semiconductor chip short-term test mechanism, semiconductor chip short-term test mechanism includes: detection platform 1, put thing subassembly, removal detection camera 3 and fixed detection camera 4.
The object placing assembly comprises an X moving plate 21 and a Y moving plate 22, wherein the X moving plate 21 is arranged on the detection platform 1 in a sliding mode, and the X moving plate 21 can move along the X direction; the Y moving plate 22 is used for placing a chip to be detected, the Y moving plate 22 is slidably disposed on the X moving plate 21, and the Y moving plate 22 can move in the Y direction. The two opposite sides of the Y moving plate 22 are respectively provided with a mobile detection camera 3 and a fixed detection camera 4, and the lenses of the mobile detection camera 3 and the fixed detection camera 4 face the Y moving plate 22; the mobile detection camera 3 is arranged on the detection platform 1 in a sliding mode, and the mobile detection camera 3 can move along the Y direction; the fixed detection camera 4 is fixedly arranged on the detection platform 1, and the movable detection camera 3 and the fixed detection camera 4 can simultaneously detect the chips on the Y motion plate 22.
The utility model discloses in, wait to detect the chip and place on Y motion board 22, Y motion board 22 can drive and wait to detect the chip and move along the Y direction. In the detection process, the X moving plate 21 firstly drives the chip to be detected to move to a position between the mobile detection camera 3 and the fixed detection camera 4, and then the Y moving plate 22 displaces in the Y direction so that the side surface of the side, facing the fixed detection camera 4, of the chip to be detected is located at the focus of the fixed detection camera 4; then the mobile detection camera 3 moves in the Y direction, so that the side face of one side, facing the mobile detection camera 3, of the chip to be detected is located at the focus of the mobile detection camera 3, on the premise that the detection result is accurate, the fixed detection camera 4 and the mobile detection camera 3 can simultaneously detect two opposite sides of the chip to be detected, and the detection efficiency is greatly improved.
In the preferred embodiment, the X moving plate 21 is provided with a driving mechanism 23, and the driving mechanism 23 can drive the Y moving plate 22 to reciprocate in the Y direction. The manner in which the driving mechanism 23 drives the Y moving plate 22 to move on the X moving plate 21 may be: the linear motor drive and the lead screw nut can also be in a gear and rack mode. As shown in fig. 1, in the above-mentioned figure, the driving mechanism 23 drives the Y moving plate 22 to move along the Y direction by providing a gear on the output shaft of the motor and then fixedly providing a rack engaged with the gear on the Y moving plate 22.
Further, the Y moving plate 22 is provided with a tooling block 24 in a rotating manner, and the tooling block 24 is provided with a station for placing a chip to be detected. Wait to detect the chip and can be the bar in this embodiment, wherein wait to detect the chip wait to detect the face for waiting to detect the rectangular shape side of chip, the station can set to the bulge form this moment, the station with wait to detect the bottom surface cooperation of chip, when waiting to detect the chip and place on the station of bulge form, can guarantee to wait to detect the side of waiting to detect the chip and not sheltered from, and then make detection camera 31 can shoot the complete side of waiting to detect the chip. In addition, the station can play a reference role when the chip to be detected is placed, the control requirement that the chip to be detected is placed on the X moving plate 21 automatically is lowered, the fact that the surface to be detected of the chip to be detected is perpendicular to the central line of the lens of the detection camera 31 is guaranteed, and the accuracy of the detection effect is improved.
In the above scheme, because the production process of the chip to be detected has extremely high requirements on the environment, the chip to be detected is generally detected automatically, when the chip to be detected is placed on the station, it cannot be guaranteed that the surface to be detected of the elongated chip to be detected is completely perpendicular to the center line of the lens of the detection camera 31, so the first servo motor 25 is fixedly arranged on the Y moving plate 22, the output shaft of the first servo motor 25 can drive the tool block 24 to rotate, wherein the output shaft of the first servo motor 25 can be connected with the tool block 24 through the gear reducer, and the resolution of the rotation angle of the tool block 24 is improved. The tool block 24 is driven to rotate through the first servo motor 25, so that the opposite two side faces of the strip-shaped chip to be detected are perpendicular to the central line of the corresponding detection camera 31, double-face detection can be carried out, and the accuracy of the result of the double-face detection is improved.
More closely, be provided with the negative pressure hole in the station, frock piece 24 can adsorb through the negative pressure hole and wait to detect the chip. The chip to be detected is adsorbed by the negative pressure, so that the displacement of the chip to be detected when the chip to be detected moves along with the X moving plate 21 is limited, and the movement of the chip to be detected does not influence the detection result. The arrangement of the negative pressure hole can be as follows: the tool block 24 is provided with a plurality of negative pressure channels communicated with the negative pressure holes, and then one end of the hose is connected with the negative pressure channels, and finally the other end of the hose is connected with an external negative pressure pump. Since the hose is flexible and does not affect the movement of the X moving plate 21, the negative pressure state can be always maintained in the negative pressure hole during the movement of the X moving plate 21.
In addition, a groove 11 is arranged on the detection platform 11 along the X direction, an X guide rail 12 is arranged in the groove 11 along the X direction, and the Y motion plate 22 is arranged on the X guide rail 12 in a sliding mode.
The detection platform 11 is provided with a Y guide rail 13 along the Y direction, the Y guide rail 13 is positioned outside the groove 11, the Y motion platform 14 is arranged on the Y guide rail 13 in a sliding manner, and the mobile detection camera 3 is fixedly arranged on the Y motion platform. With X motion plate 21 setting in recess 11, can be convenient for remove the camera lens of detection camera 3, fix the camera lens of detection camera 4 and wait to detect the chip and be in same height level, be convenient for the arrangement of X motion plate 21 on the testing platform 11, improved space utilization in vertical direction. Additionally, the utility model discloses in, X motion board 21 sets up on testing platform 11, can be panel with testing platform 11, and the holistic semiconductor chip short-term test mechanism's of being convenient for installation is convenient for holistic arranging.
In a preferred embodiment, a second servo motor and a driving screw rod are arranged on the detection platform 11, the driving screw rod is rotatably arranged on the detection platform 11, an output shaft of the second servo motor is fixedly connected with one end of the driving screw rod, an internal threaded hole matched with the driving screw rod is arranged on the Y motion platform 14, and the second servo motor can drive the Y motion platform 14 to move along the Y direction through the driving screw rod. In the scheme, the Y motion platform 14 is driven to move in a screw nut mode, the displacement of the Y motion platform 14 is controlled through the second servo motor, the side face, facing one side of the mobile detection camera 3, of the chip to be detected is located at the focus of the mobile detection camera 3, and the accuracy of a detection result is guaranteed.
Finally, the detection platform 11 is further provided with a detection controller electrically connected with the second servo motor, the driving mechanism 23, the mobile detection camera 3 and the fixed detection camera 4, and the detection controller can receive image information detected by the mobile detection camera 3 and the fixed detection camera 4 and control the second servo motor and the driving mechanism 23 according to the image information (firstly, the driving mechanism 23 is controlled to drive the Y moving plate 22 to move along the Y direction so that the side face, corresponding to the fixed detection camera 4, on the chip to be detected is located at the focus of the fixed detection camera 4, and then the second servo motor is controlled to drive the mobile detection camera 3 to move along the Y direction so that the side face, corresponding to the mobile detection camera 3, on the chip to be detected is located at the focus of the mobile detection camera 3). In the most preferred embodiment, the center lines of the lenses of the mobile inspection camera 3 and the fixed inspection camera 4 are perpendicular to the side of the chip to be inspected. The central lines of the lenses of the mobile detection camera 3 and the fixed detection camera 4 on the detection platform 11 are collinear, so that two opposite side surfaces of the chip to be detected can be detected simultaneously, and at the moment, the displacement of the X motion plate 21 can be detected by the side surfaces of the chip to be detected only by being equal to the length of the side surfaces of the chip to be detected theoretically.
How to determine the displacement amount of the mobile inspection camera 3 on the inspection stage 11 in the Y direction is described below: first, the size of the chip to be detected, i.e., the size information of the side surface of the chip to be detected (specifically, the length and height of the side surface of the chip to be detected) is confirmed. In the actual detection process, the size of the chip to be detected is generally a fixed size, so that the size of the chip to be detected can be determined before detection.
Then, the inspection controller determines the theoretical imaging size of the side of the chip to be inspected when the side is at the focus of the movement inspection camera 3 according to the size of the chip to be inspected. In the specific scheme, when the side surface of the chip to be detected is at the focus of the mobile detection camera 3, the theoretical size of the side surface of the chip to be detected during imaging in the detection camera and the theoretical pixel value of the side surface of the chip to be detected during imaging can be determined.
Further, the side surface of the chip to be detected is perpendicular to the center line of the lens of the detection camera 31 by controlling the first servo motor 25 to rotate, and in actual production, the control method of rotating a certain side surface of the object to be detected to be perpendicular to the lens of the camera can be regarded as the prior art.
Further, the inspection controller receives image information detected by the movement inspection camera 3 (the detected image information at this time includes an actual imaging size of the side of the chip to be inspected in the inspection camera 31). When the detection camera 31 detects the chip to be detected, the frame of the chip to be detected is identified by using an image identification algorithm, and at this time, the actual imaging size can be calculated, and the actual pixel value of the side surface of the chip to be detected during actual imaging can be calculated according to the frame of the chip to be detected.
Finally, the amount of displacement of the movement detection camera 3 in the Y direction is adjusted by comparing the difference between the theoretical imaging size and the actual imaging size so that the difference between the theoretical imaging size and the actual imaging size is smaller than a preset value. The mobile detection camera 3 shoots the side face of the chip to be detected to obtain the actual image information of the side face of the chip to be detected, and the actual image information of the chip to be detected is analyzed to judge whether the chip to be detected has flaws or not and meet the requirements.
In addition, the determination of the displacement amount in the Y direction on the moving plate is similar to the above scheme, and is not described in detail. By the method, the two side faces of the chip to be detected are respectively ensured to be positioned at the focus positions of the corresponding mobile detection camera 3 and the fixed detection camera 4, so that the picture definition of the side faces of the chip to be detected, which is shot by the mobile detection camera 3 and the fixed detection camera 4, meets the detection requirement at the same time, and the result is accurate when double-face detection is carried out at the same time.
It should be understood that the above description of the embodiments of the present invention is only for illustrative purposes, and is intended to enable those skilled in the art to understand the content of the present invention and to implement the present invention accordingly, but the present invention is not limited to the above specific embodiments. All changes and modifications within the scope of the claims should be covered by the protection scope of the present invention.
Claims (9)
1. The utility model provides a semiconductor chip short-term test mechanism which characterized in that, semiconductor chip short-term test mechanism includes: the system comprises a detection platform (1), an object placing component, a mobile detection camera (3) and a fixed detection camera (4);
the object placing assembly comprises an X moving plate (21) and a Y moving plate (22), the X moving plate (21) is arranged on the detection platform (1) in a sliding mode, and the X moving plate (21) can move along the X direction; the Y moving plate (22) is used for placing a chip to be detected, the Y moving plate (22) is arranged on the X moving plate (21) in a sliding mode, the Y moving plate (22) can move along the Y direction, and the X direction and the Y direction are perpendicular to each other;
the two opposite sides of the Y moving plate (22) are respectively provided with the moving detection camera (3) and the fixed detection camera (4), and the lenses of the moving detection camera (3) and the fixed detection camera (4) face the Y moving plate (22); the mobile detection camera (3) is arranged on the detection platform (1) in a sliding mode, and the mobile detection camera (3) can move along the Y direction; the fixed detection camera (4) is fixedly arranged on the detection platform (1), and the mobile detection camera (3) and the fixed detection camera (4) can simultaneously detect the chips on the Y motion plate (22).
2. The semiconductor chip rapid inspection mechanism according to claim 1, wherein a driving mechanism (23) is provided on the X moving plate (21), and the driving mechanism (23) can drive the Y moving plate (22) to reciprocate in the Y direction.
3. The semiconductor chip rapid detection mechanism according to claim 1, wherein a tooling block (24) is rotatably disposed on the Y motion plate (22), a first servo motor (25) is fixedly disposed on the Y motion plate (22), an output shaft of the first servo motor (25) can drive the tooling block (24) to rotate, and a station for placing a chip to be detected is disposed on the tooling block (24).
4. The rapid detection mechanism for semiconductor chips as defined in claim 3, wherein a negative pressure hole is provided in the station, and the fixture block (24) can adsorb the chip to be detected through the negative pressure hole.
5. The semiconductor chip rapid detection mechanism according to any one of claims 1 to 4, wherein a groove (11) is disposed on the detection platform (1) along the X direction, an X guide rail (12) is disposed in the groove (11) along the X direction, and the X motion plate (21) is slidably disposed on the X guide rail (12).
6. The semiconductor chip rapid detection mechanism according to claim 5, characterized in that a Y guide rail (13) is disposed on the detection platform (1) along the Y direction, the Y guide rail (13) is located outside the groove (11), a Y motion platform (14) is slidably disposed on the Y guide rail (13), and the mobile detection camera (3) is fixedly disposed on the Y motion platform (14).
7. The rapid detecting mechanism for semiconductor chips as claimed in claim 6, wherein the detecting platform (1) is provided with a second servomotor and a driving screw, the driving screw is rotatably disposed on the detecting platform (1), an output shaft of the second servomotor is fixedly connected to one end of the driving screw, and the Y-moving platform (14) is provided with an internal threaded hole matched with the driving screw, the second servomotor can drive the Y-moving platform (14) to move along the Y-direction through the driving screw.
8. The semiconductor chip rapid detection mechanism according to any one of claims 1 to 4, characterized in that the center lines of the lenses of the mobile detection camera (3) and the fixed detection camera (4) are perpendicular to the side of the chip to be detected.
9. The semiconductor chip rapid inspection mechanism according to claim 8, characterized in that the center lines of the lenses of the moving inspection camera (3) and the fixed inspection camera (4) are collinear.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222306738.3U CN218067702U (en) | 2022-08-31 | 2022-08-31 | Quick detection mechanism of semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222306738.3U CN218067702U (en) | 2022-08-31 | 2022-08-31 | Quick detection mechanism of semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218067702U true CN218067702U (en) | 2022-12-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222306738.3U Active CN218067702U (en) | 2022-08-31 | 2022-08-31 | Quick detection mechanism of semiconductor chip |
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| Country | Link |
|---|---|
| CN (1) | CN218067702U (en) |
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2022
- 2022-08-31 CN CN202222306738.3U patent/CN218067702U/en active Active
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