CN218064803U - External heat radiation structure of semiconductor lighting assembly - Google Patents
External heat radiation structure of semiconductor lighting assembly Download PDFInfo
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- CN218064803U CN218064803U CN202221264750.6U CN202221264750U CN218064803U CN 218064803 U CN218064803 U CN 218064803U CN 202221264750 U CN202221264750 U CN 202221264750U CN 218064803 U CN218064803 U CN 218064803U
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Abstract
The utility model provides an external heat radiation structure of semiconductor lighting assembly, include: the external heat dissipation block is positioned on the left side of the shell of the lighting assembly, and the left side surface of the external heat dissipation block is provided with an air vent; the heat dissipation fan is positioned inside the external heat dissipation block, and the left end of the heat dissipation fan is connected with the small motor; the arc-shaped heat dissipation net cover is located on the right side of the lighting assembly shell, and fixing blocks are welded on the surfaces of the upper end and the lower end of the arc-shaped heat dissipation net cover. The utility model provides a daily semiconductor lighting assembly who uses not have external heat radiation structure, can only dispel the heat through the louvre, lead to semiconductor lighting assembly radiating effect relatively poor, influence the radiating problem of semiconductor lighting assembly.
Description
Technical Field
The utility model relates to a semiconductor lighting assembly field, concretely relates to external heat radiation structure of semiconductor lighting assembly.
Background
The semiconductor lighting is a new lighting technology, the basic device of the semiconductor lighting is a light emitting diode, the semiconductor lighting is a semiconductor solid light emitting device, a solid semiconductor chip is used as a light emitting material, excess energy is released through carrier recombination in a semiconductor to cause photon emission, red, yellow, blue, green, cyan, orange, purple and white light is directly emitted, a daily used semiconductor lighting assembly does not have an external heat dissipation structure, and heat can be dissipated only through a heat dissipation hole, so that the heat dissipation effect of the semiconductor lighting assembly is poor, and the heat dissipation of the semiconductor lighting assembly is influenced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects in the prior art, an external heat dissipation structure of a semiconductor lighting assembly is provided so as to solve the problem that the heat dissipation effect of the semiconductor lighting assembly is poor and the heat dissipation of the semiconductor lighting assembly is influenced because the semiconductor lighting assembly used in daily life does not have the external heat dissipation structure and can only dissipate heat through a heat dissipation hole.
In order to achieve the above object, an external heat dissipation structure of a semiconductor lighting assembly is provided, which comprises:
the external heat dissipation block is positioned on the left side of the shell of the lighting assembly, and the surface of the left side of the external heat dissipation block is provided with an air vent;
the heat dissipation fan is positioned inside the external heat dissipation block, and the left end of the heat dissipation fan is connected with the small motor;
the arc heat dissipation mesh enclosure is located on the right side of the lighting assembly shell, and fixing blocks are welded on the surfaces of the upper end and the lower end of the arc heat dissipation mesh enclosure.
Furthermore, a lampshade is fixed at the lower end of the shell of the lighting assembly, and a bulb is arranged in the lampshade; and the bulb is connected with the inside of the lighting assembly shell, and the lighting element is arranged inside the lighting assembly shell.
Furthermore, the external radiating block, the radiating fan and the arc radiating net cover form an external radiating structure of the illuminating element, and the upper end of the external radiating block is provided with the timing controller.
Furthermore, an air inlet notch is formed in the left side of the shell of the lighting assembly, and a dustproof screen plate is fixed on the right side of the external heat dissipation block; and the dustproof screen plate is positioned at the left side of the air inlet notch.
Further, an air outlet notch is formed in the right side of the lighting assembly shell, the upper end and the lower end of the cooling fan are fixed to the inner wall of the external cooling block through the connecting block, and cooling meshes are formed in the side face of the arc-shaped cooling mesh enclosure.
Furthermore, five groups of radiating fins are fixed inside the arc radiating mesh enclosure; and the radiating fins are distributed in an annular equal distance, and the fixed block is fixed with the right end of the lighting assembly shell through a fastening screw.
The beneficial effects of the utility model reside in that, the utility model discloses an external heat radiation structure of semiconductor lighting assembly utilizes external radiating block, radiator fan and arc heat dissipation screen panel are fixed in the semiconductor lighting assembly outside, the external heat radiation structure of lighting assembly has been constituted, through the inside radiator fan of external radiating block, blow the air outlet notch department with the inside heat of lighting assembly, the heat on lighting element surface is conveniently taken away fast, accelerate the inside heat dissipation of lighting assembly, the radiating channel who constitutes through the radiating fin of the inside distribution of arc heat dissipation screen panel, derive the heat in the same direction as radiating channel to the outside, make things convenient for thermal circulation, be convenient for effectual improvement semiconductor lighting assembly radiating effect, the radiating problem of influence semiconductor lighting assembly has been solved.
Drawings
Fig. 1 is a schematic view of an elevational cross-sectional structure of an external heat dissipation structure of a semiconductor lighting assembly according to an embodiment of the present invention.
Fig. 2 is a schematic view of a connection structure of the lighting assembly and the external heat dissipation structure in a top view according to an embodiment of the present invention.
Fig. 3 is a schematic view of a top view cross-sectional structure of an arc-shaped heat dissipation mesh enclosure according to an embodiment of the present invention.
1. A lighting assembly housing; 11. an air inlet notch; 12. an air outlet notch; 13. a lamp shade; 2. a heat dissipation block is arranged outside; 21. a vent hole; 22. a dustproof screen plate; 23. a timing controller; 3. a heat radiation fan; 31. a small-sized motor; 32. a joining block; 4. an arc-shaped heat dissipation mesh enclosure; 41. radiating meshes; 42. a heat dissipating fin; 43. a fixed block; 44. a fastening screw; 5. a lighting element; 6. a bulb.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
Fig. 1 is the utility model discloses external heat radiation structure of semiconductor lighting assembly looks straight section structure schematic diagram, fig. 2 do the utility model discloses lighting assembly and external heat radiation structure look down connection structure schematic diagram, fig. 3 do the utility model discloses arc heat dissipation screen panel looks down section structure schematic diagram.
Referring to fig. 1 to 3, the utility model provides an external heat radiation structure of semiconductor lighting assembly, include: the heat dissipation device comprises an external heat dissipation block 2, a heat dissipation fan 3 and an arc-shaped heat dissipation mesh enclosure 4.
And the external radiating block 2 is positioned on the left side of the lighting assembly shell 1, and the left side surface of the external radiating block 2 is provided with an air vent 21.
The radiator fan 3 is positioned inside the external radiating block 2, and the left end of the radiator fan 3 is connected with a small-sized motor 31.
The arc heat dissipation mesh enclosure 4 is located on the right side of the lighting assembly shell 1, and fixing blocks 43 are welded on the surfaces of the upper end and the lower end of the arc heat dissipation mesh enclosure 4.
The semiconductor lighting assembly for daily use does not have an external heat dissipation structure, and can only dissipate heat through a heat dissipation hole, so that the heat dissipation effect of the semiconductor lighting assembly is poor, and the heat dissipation problem of the semiconductor lighting assembly is influenced. Therefore, the utility model discloses an external heat radiation structure of semiconductor lighting assembly utilizes external radiating block, radiator fan and arc heat dissipation screen panel are fixed in the semiconductor lighting assembly outside, the external heat radiation structure of lighting assembly has been constituted, through the inside radiator fan of external radiating block, blow the air outlet notch department with the inside heat of lighting assembly, conveniently take away the heat on lighting element surface fast, accelerate the inside heat dissipation of lighting assembly, the radiating channel who constitutes through the radiating fin of the inside distribution of arc heat dissipation screen panel, derive the heat to the outside along radiating channel, make things convenient for thermal circulation, be convenient for effectual improvement semiconductor lighting assembly radiating effect, the radiating problem of influence semiconductor lighting assembly has been solved.
A lampshade 13 is fixed at the lower end of the lighting assembly shell 1, and a bulb 6 is arranged in the lampshade 13; and the light bulb 6 is connected with the inside of the lighting assembly housing 1, inside the lighting assembly housing 1 the lighting element 5 is arranged.
The light bulb 6 is connected with the lighting element 5 inside the lighting assembly shell 1 through a wire, so that the lighting element 5 controls the light bulb 6 to light up. When the lighting element 5 works in hot seasons, a large amount of heat can be generated, and an external heat dissipation structure is needed for rapid and efficient heat dissipation.
The external radiating block 2, the radiating fan 3 and the arc-shaped radiating mesh enclosure 4 form an external radiating structure of the lighting element 5, and the upper end of the external radiating block 2 is provided with the timing controller 23.
The external heat dissipation structure is convenient for the lighting element 5 to dissipate heat quickly, and avoids the damage of the lighting element 5 caused by high temperature. The timing controller 23 is used for controlling the start of the small motor 31 in a timing manner, so that the heat dissipation fan 3 can be driven by the small motor 31 to dissipate heat conveniently.
An air inlet notch 11 is formed in the left side of the lighting assembly shell 1, and a dustproof screen plate 22 is fixed on the right side of the external heat dissipation block 2; and the dustproof mesh plate 22 is positioned at the left side of the air inlet slot 11.
Inside dustproof mesh plate 22 avoided the dust to get into lighting assembly casing 1 from air inlet slot 11, radiator fan 3 starts the wind that produces and blows into air inlet slot 11 in, blows the inside heat of lighting assembly casing 1 from the left side to right side air-out slot 12 department.
The right side of the lighting assembly shell 1 is provided with an air outlet notch 12, the upper end and the lower end of the cooling fan 3 are fixed with the inner wall of the external cooling block 2 through the connecting block 32, and the side surface of the arc-shaped cooling mesh enclosure 4 is provided with a cooling mesh 41.
The hot-blast that air-out notch 12 blew off distributes away through arc heat dissipation screen panel 4, is convenient for take away the inside heat of lighting assembly casing 1 fast. The heat dissipation mesh 41 facilitates the heat dissipation of the hot air from the arc side surface of the arc heat dissipation mesh enclosure 4.
Five groups of radiating fins 42 are fixed inside the arc radiating mesh enclosure 4; the heat dissipating fins 42 are distributed in an annular and equidistant manner, and the fixing block 43 is fixed to the right end of the lighting module housing 1 by a fastening screw 44.
The five groups of radiating fins 42 divide the joint of the arc-shaped radiating mesh enclosure 4 and the air outlet notch 12 into six groups of radiating channels, and the heat is led out to the outside of the arc-shaped radiating mesh enclosure 4 along the radiating channels, so that the radiating effect of the semiconductor lighting assembly is improved conveniently.
The utility model discloses an external heat radiation structure of semiconductor lighting assembly can effectively solve and influence the radiating problem of semiconductor lighting assembly, makes things convenient for thermal circulation, and the effectual improvement semiconductor lighting assembly radiating effect of being convenient for is applicable to the external heat radiation structure of semiconductor lighting assembly.
Claims (6)
1. An external heat radiation structure of a semiconductor lighting assembly is characterized by comprising:
the external heat dissipation block (2) is positioned on the left side of the lighting assembly shell (1), and a vent hole (21) is formed in the left side surface of the external heat dissipation block (2);
the radiating fan (3) is positioned inside the external radiating block (2), and the left end of the radiating fan (3) is connected with a small motor (31);
arc heat dissipation screen panel (4), be located lighting components casing (1) right side, arc heat dissipation screen panel (4) upper and lower end surface all welds fixed block (43).
2. The external heat dissipation structure of a semiconductor lighting assembly as defined in claim 1, wherein a lampshade (13) is fixed at the lower end of the lighting assembly housing (1), and a bulb (6) is installed inside the lampshade (13); and the bulb (6) is connected with the inside of the lighting assembly shell (1), and the lighting assembly shell (1) is internally provided with a lighting element (5).
3. The external heat dissipation structure of a semiconductor lighting assembly as defined in claim 1, wherein the external heat dissipation block (2), the heat dissipation fan (3) and the arc-shaped heat dissipation mesh (4) form the external heat dissipation structure of the lighting element (5), and the timing controller (23) is mounted at the upper end of the external heat dissipation block (2).
4. The external heat dissipation structure of a semiconductor lighting assembly according to claim 1, wherein an air inlet slot (11) is formed in the left side of the lighting assembly housing (1), and a dustproof mesh plate (22) is fixed to the right side of the external heat dissipation block (2); and the dustproof screen (22) is positioned at the left side of the air inlet notch (11).
5. The external heat dissipation structure of a semiconductor lighting assembly according to claim 1, wherein an air outlet slot (12) is formed in the right side of the lighting assembly housing (1), the upper end and the lower end of the heat dissipation fan (3) are fixed to the inner wall of the external heat dissipation block (2) through a connection block (32), and heat dissipation mesh holes (41) are formed in the side surface of the arc-shaped heat dissipation mesh enclosure (4).
6. The external heat dissipation structure of a semiconductor lighting assembly as defined in claim 1, wherein five groups of heat dissipation fins (42) are fixed inside the arc-shaped heat dissipation mesh (4); and radiating fins (42) are distributed in an annular equal distance, and the fixed block (43) is fixed with the right end of the lighting assembly shell (1) through a fastening screw (44).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221264750.6U CN218064803U (en) | 2022-05-24 | 2022-05-24 | External heat radiation structure of semiconductor lighting assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221264750.6U CN218064803U (en) | 2022-05-24 | 2022-05-24 | External heat radiation structure of semiconductor lighting assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218064803U true CN218064803U (en) | 2022-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221264750.6U Active CN218064803U (en) | 2022-05-24 | 2022-05-24 | External heat radiation structure of semiconductor lighting assembly |
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| CN (1) | CN218064803U (en) |
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2022
- 2022-05-24 CN CN202221264750.6U patent/CN218064803U/en active Active
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