CN218062955U

CN218062955U - Radiator screw mounting structure

Info

Publication number: CN218062955U
Application number: CN202221625564.0U
Authority: CN
Inventors: 陈康; 张健能; 姜田子; 刘凯
Original assignee: New H3C Technologies Co Ltd Hefei Branch
Current assignee: New H3C Technologies Co Ltd Hefei Branch
Priority date: 2022-06-27
Filing date: 2022-06-27
Publication date: 2022-12-16
Anticipated expiration: 2032-06-27

Abstract

The application provides radiator mounting screw structure, including backplate, PCB board on the backplate, PCB board setting chip, the radiator passes through the fix with screw with the backplate, and it is fixed with the backplate that the elastic component passes the PCB board from the radiator to establish the cover on the screw, is equipped with limit structure on the screw, and when the screw installation, the elastic component is spacing by limit structure, and the installation is accomplished to the screw, and the elastic component breaks away from limit structure's spacing. This application owing to receive limit structure's power in the installation, the even atress installation of screw realization easily, after the screw installation is accomplished, with the elastic component break away from limit structure can.

Description

Radiator screw mounting structure

Technical Field

The application relates to the technical field of communication equipment, in particular to a radiator screw mounting structure.

Background

As the power consumption and size of the chip are increased, the size and weight of the corresponding heat sink are also increased, and the fastening force required by the heat sink is also increased. However, the bearing force of the wafer is low without the protection of the heat sink, and the wafer is easily damaged when the heat spreader is assembled. The conventional screw assembling scheme is that after one screw is assembled, the next screw is assembled. In the background of large-size bare wafer chips, the wafer is easily damaged due to uneven stress among the screws during mounting.

Therefore, a low stress heat sink assembly scheme is urgently needed for large-sized bare DIE chips, i.e., bare DIE chips.

Disclosure of Invention

To overcome the problems in the related art, the present application provides a screw mounting structure of a heat sink.

According to this application embodiment's radiator mounting screw structure, including backplate, the PCB board on the backplate, the PCB board sets up the chip, the radiator passes through the fix with screw with the backplate, and it is fixed with the backplate that the elastic component passes the PCB board from the radiator to establish on the screw, is equipped with limit structure on the screw, and when the screw was installed, the elastic component was spacing by limit structure, and the installation was accomplished to the screw, and the elastic component breaks away from limit structure's spacing. Because the force of the limiting structure is applied in the installation process, the screw is easy to realize uniform stress installation, and after the screw is installed, the elastic piece is separated from the limiting structure.

Preferably, the limiting structure comprises a screw post with a hole and a limiting post, and the limiting post is inserted into the hole for limiting. The limiting column is convenient to use.

Preferably, the elastic member includes a spring or an elastic silicone rubber. Simple structure and convenient use.

Preferably, the limiting structure comprises a screw column with a threaded hole and a threaded rod, and the threaded rod can be screwed into the threaded hole of the screw column. Simple structure and easy operation.

Preferably, if the elastic element is a spring, when the screw is installed, the threaded rod is screwed into the screw post, and the protruding length of the threaded rod is more than half of the inner diameter of the spring. The spring is not easy to be separated.

Preferably, the chip comprises a wafer and a substrate, the wafer abuts against the heat sink, and the substrate is welded on the PCB through solder balls. Large size bare DIE chips (i.e., bare wafer chips) are suitable.

Further, a heat conducting pad is arranged between the radiator and the chip. Heat conduction is accelerated through the heat conduction pad, and the heat conduction effect is better, is favorable to the heat dissipation.

Preferably, the elastic member may be wholly or partially restricted by the stopper structure. The stress position of the elastic element can be adjusted according to the installation stress requirement.

Furthermore, when the radiator is installed, the elastic part has no elasticity to the radiator and the PCB, and the height of the compressed elastic part is less than or equal to the height between the upper surface of the PCB and the lower surface of the radiator;

when the radiator is installed, the elastic piece has elasticity relative to the radiator and the PCB, and the compressed height of the elastic piece is larger than or equal to the allowable minimum compression amount.

The technical scheme provided by the embodiment of the application can have the following beneficial effects:

this application is owing to receive limit structure's power in the installation, and the even atress installation of screw realization is easily accomplished, after the screw installation is accomplished, with the elastic component break away from limit structure can.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments consistent with the present application and, together with the application, serve to explain the principles of the application.

FIG. 1 is a schematic structural diagram of the present application;

FIG. 2 is an uninstalled schematic view of an embodiment of the present application;

FIG. 3 is a schematic view of an installation according to an embodiment of the present application;

FIG. 4 is a schematic view of a second embodiment of the present application shown uninstalled;

fig. 5 is a schematic installation diagram of the second embodiment of the present application.

Reference numerals:

1-backboard 2-PCB 3-chip 31-substrate 32-wafer 4-spring (elastic part) 5-screw 6-radiator 7-heat conducting pad 8-limit structure 81-hole 82-limit column 91-threaded hole 92-threaded rod

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the application, as detailed in the appended claims.

In order to solve the problems existing in the background art, the mounting structure of the radiator screw 5 in the embodiment of the application, as shown in fig. 1, the mounting structure comprises a back plate 1, a PCB 2 on the back plate, the PCB 2 is provided with a chip 3, a radiator 6 is fixed with the back plate 1 through a screw 5, an elastic part 4 is sleeved on the screw 5 and penetrates through the PCB 2 from the radiator 6 to be fixed with the back plate 1, a limiting structure 8 is arranged on the screw 5, when the screw 5 is mounted, the elastic part 4 is limited by the limiting structure 8, the mounting of the screw 5 is completed, and the elastic part 4 is separated from the limit of the limiting structure 8. When the back plate is installed, the acting force between the back plate 1 and the radiator 6 can be well controlled due to the elastic force generated under the action of the limiting structure 8, the screws 5 are stressed uniformly easily when being installed, and the damage to the chip is reduced. After the screw 5 is installed, the elastic member 4 is separated from the limiting structure 8. The elastic member in the embodiment of the present application includes a spring 4 or an elastic silicone. Simple structure and convenient use. Of course, other structures with the same effect and function may be adopted, and are not described in detail herein. In the following embodiments, a spring is exemplified. The chip 3 in the embodiment of the present application may be a large-sized bare DIE chip, i.e., a bare wafer chip. The chip 32 and the substrate 31 are included, the chip 32 is abutted against the heat radiator 6 for heat radiation, and the substrate is welded on the PCB 2 through solder balls. The elastic member in this embodiment may be partially or entirely limited by the limiting structure 8, so as to compress the elastic member, so that the elastic member generates a compression elastic force to support the heat sink 6 to be fixed with the backplate 1. The screws are then installed so that the screws 5 are evenly stressed easily when installed.

The limit node of the present application provides two embodiments, which are not limited to the illustrated embodiments, and all of the embodiments having the same effects and effects are within the scope of the present embodiment.

The first embodiment is as follows:

the limiting structure 8 comprises a hole 81 on the screw column and a limiting column 82. Before the screw 5 is to be installed, the spring 4 is compressed to the desired position, and then the limiting post 82 is inserted into the screw hole for limiting, as shown in fig. 2-3. The spring 4 may be partially or fully constrained within the position of the restraint post 82. Of course, the screw post may be provided with holes at a plurality of positions. Thereby being suitable for the installation requirements of screws with different stress requirements. The hole is a hole with smooth inner wall.

Example two:

the stop formation 8 comprises a screw post with a threaded bore 91 and a threaded rod 92, the threaded rod 92 being threadably rotatable into the screw post. The spring 4 may be partially or fully constrained in a position limited by the threaded rod 92, as shown in fig. 4-5. Of course, the screw post may be provided with a plurality of positions of the screw hole 91. Thereby being suitable for the installation requirements of the screws with different stress requirements.

In order to prevent the spring 4 from being easily removed, when the screw 5 is installed, the threaded rod 92 is screwed into the threaded hole 91 on the screw column, and the protruding length of the screw rod is more than half of the inner diameter of the spring 4.

As shown in fig. 1, in the embodiment of the present application, when the heat sink 6 is mounted, the spring 4 has no elastic force on the heat sink 6 and the PCB 2, and the height of the compressed spring 4 is less than or equal to the height between the upper surface of the PCB 2 and the lower surface of the heat sink 6;

when the heat sink 6 is mounted, the spring 4 has elasticity relative to the space between the heat sink 6 and the PCB 2, and the height of the compressed spring 4 is larger than or equal to the minimum allowable compression amount.

When the screws 5 are installed, the springs 4 generate appropriate compression elasticity, and can effectively support the radiator 6 and the back plate 1 to be fixed.

The embodiment of the present application further includes a thermal pad 7 between the heat sink 6 and the chip 3, as shown in fig. 1. The heat conduction is accelerated through the heat conduction pad 7, so that the heat conduction effect is better, and the heat dissipation is facilitated. The heat conducting pad in the embodiment of the present application may be a heat conducting silicone grease or a heat conducting phase change material. The thermally conductive material is typically 0.5mm larger on one side than the wafer size of the chip.

All the above-mentioned embodiments refer to the directional terms such as upper, lower, left, right, front, rear, horizontal, vertical, left, right, etc., and the directional terms are used in the drawings.

It will be understood that the present application is not limited to the precise arrangements that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.

The present invention is not limited to the above embodiments, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. Radiator mounting screw structure, PCB board including backplate, on the backplate set up the chip, its characterized in that, the radiator passes through with the backplate the fix with screw, the cover is established the elastic component on the screw and is followed the radiator passes the PCB board with the backplate is fixed, be equipped with limit structure on the screw, when the screw installation, the elastic component receives limit structure's spacing, the installation is accomplished to the screw, the elastic component breaks away from limit structure's spacing.

2. The heat sink screw mounting structure according to claim 1, wherein the stopper structure includes a screw post with a hole and a stopper post, the stopper post being inserted into the hole to be stopped.

3. A heat sink screw mounting structure according to claim 1, wherein said elastic member comprises a spring or an elastic silicone.

4. The heat sink screw mounting structure of claim 1, wherein the retaining structure comprises a screw post with a threaded hole and a threaded rod that is threadably rotated into the threaded hole of the screw post.

5. The radiator screw mounting structure according to claim 4, wherein if the elastic member is a spring, the screw is screwed into the screw post when the screw is mounted, and the protruding length of the threaded rod is more than half of the inner diameter of the spring.

6. The heat sink screw mounting structure of claim 1, wherein the die comprises a die and a substrate, the die abuts against the heat sink, and the substrate is soldered to the PCB via solder balls.

7. The heat sink screw mounting structure according to claim 1, wherein a thermal pad is provided between the heat sink and the chip.

8. The heat sink screw mounting structure according to claim 1, wherein the elastic member may be entirely or partially restricted by the stopper structure.

9. The heat sink screw mounting structure of claim 8, wherein when the heat sink is mounted, the elastic member has no elastic force on the heat sink and the PCB, and the height of the compressed elastic member is less than or equal to the height between the upper surface of the PCB and the lower surface of the heat sink;

when the radiator is installed, the elastic piece has elasticity relative to the space between the radiator and the PCB, and the height of the compressed elastic piece is larger than or equal to the allowable minimum compression amount.