CN218059183U - Quartz wafer coating tool and coating device - Google Patents
Quartz wafer coating tool and coating device Download PDFInfo
- Publication number
- CN218059183U CN218059183U CN202222101012.6U CN202222101012U CN218059183U CN 218059183 U CN218059183 U CN 218059183U CN 202222101012 U CN202222101012 U CN 202222101012U CN 218059183 U CN218059183 U CN 218059183U
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- plate
- bottom plate
- quartz wafer
- positioning
- strengthening rib
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Abstract
The utility model provides a quartz wafer coating film frock and coating device, including a quartz wafer coating film frock for fix a position quartz wafer, quartz wafer coating film frock is including folding the combination bottom plate, locating plate and the apron of establishing in proper order, and combination bottom plate includes first strengthening rib, second strengthening rib and two base plates of relative setting, is connected with the at least three first strengthening ribs that extend between two base plates on the first direction, and is adjacent form the interval between the first strengthening rib, and is adjacent be connected with at least one second strengthening rib that extends on the second direction between the first strengthening rib, first direction and second direction mutually perpendicular, second strengthening rib in the adjacent interval misplaces each other. This scheme has changed the strengthening rib arrangement of bottom plate in the coating film frock of quartz chip to this increases the bearing structure to every wafer, thereby increases the intensity of coating film frock, makes quartz chip be difficult for the dislocation when arranging the coating film frock in, and the laminating is tighter.
Description
Technical Field
The utility model belongs to the coating device field especially relates to a quartz wafer coating film frock and coating device.
Background
With the progress of science and technology, quartz is used as a common natural material to find many new applications, and quartz wafers are widely applied to the fields of semiconductors, electronic communications, computers and the like.
According to the quartz wafer coating tool in the related art, quartz wafers can be discharged in a single piece mode, the parts, needing coating, on the quartz wafers are exposed, the parts, needing no coating, are covered, and the bottom plate reinforcing ribs of the quartz wafer coating tool are usually arranged in a shape like a Chinese character 'jing'.
However, the bottom plate of the quartz wafer coating tool in the related art has the disadvantages that the strength of the bottom plate is weaker and the bottom plate is easily deformed when the quartz wafer is fixed due to unreasonable style of the reinforcing ribs, so that the quartz wafer is easily dislocated or attached in the coating tool, the pattern of a coated film layer is dislocated or deformed, and the coating cannot meet the performance requirement of the quartz crystal.
SUMMERY OF THE UTILITY MODEL
The technical purpose of the utility model is to provide a quartz wafer coating film frock and coating film device aims at realizing improving the intensity of coating film frock bottom plate.
In order to solve the technical problem, the utility model relates to a realize like this, a quartz wafer coating frock for fix a position quartz wafer, quartz wafer coating frock is including folding built-up plate, locating plate and the apron established in proper order, built-up plate includes first strengthening rib, second strengthening rib and two first base plates of relative setting, two be connected with the at least three that extends in the first direction between the first base plate first strengthening rib is adjacent form the interval between the first strengthening rib, and is adjacent be connected with at least one second strengthening rib that extends in the second direction between the first strengthening rib, first direction with second direction mutually perpendicular, adjacent second strengthening rib in the interval misplaces each other.
Furthermore, the combined bottom plate comprises a first bottom plate, a second bottom plate, a third bottom plate and a magnetic suction assembly fixed on the first bottom plate, the second bottom plate and the third bottom plate are consistent in outline shape and size and are provided with the first reinforcing ribs and the second reinforcing ribs, the second bottom plate is assembled on the first bottom plate, and the third bottom plate is assembled on the second bottom plate.
Furthermore, a first opening area is arranged on the first base plate, and the first opening area is formed by the enclosure of the two adjacent first reinforcing ribs and the two adjacent second reinforcing ribs on the first base plate.
Furthermore, the magnetic suction assembly comprises a plurality of magnets, a second open hole area formed by the two adjacent first reinforcing ribs and the two adjacent second reinforcing ribs on the second bottom plate in a surrounding manner is arranged on the second bottom plate, and first magnet placing holes for embedding the magnets are arranged on the first reinforcing ribs of the second bottom plate at intervals;
and/or the second reinforcing rib of the second bottom plate is provided with a first magnet placing hole for embedding the magnet.
Furthermore, the third bottom plate is provided with second magnet placing holes corresponding to the first magnet placing holes in the second bottom plate one to one, and the area of the third bottom plate corresponding to the second hole-opening area in the second bottom plate is provided with at least two first small holes.
Furthermore, the positioning plate is provided with first magnetic permeable holes which are in one-to-one correspondence with the second magnet placing holes on the third bottom plate, and the positioning plate is provided with slot positions which are in one-to-one correspondence with the first small holes on the third bottom plate.
Furthermore, the cover plate is provided with second small holes which are in one-to-one correspondence with the slot positions on the positioning plate.
Further, the combined bottom plate with be equipped with first plate electrode between the locating plate, be equipped with on the first plate electrode with on the locating plate slot position one-to-one first electrode and with on the locating plate first pass through the second of magnetic hole one-to-one, the locating plate with be equipped with the second plate electrode between the apron, be equipped with on the second plate electrode with on the locating plate slot position one-to-one second electrode and with on the locating plate first pass through the third of magnetic hole one-to-one, the first plate electrode with the outline of second plate electrode with the locating plate the shape size of outline is unanimous, the first plate electrode with equally divide on the second plate electrode and do not be equipped with two relative second base plates, the intermediate position of second base plate is equipped with the second locating hole respectively.
Furthermore, the combined bottom plate, the positioning plate and the cover plate are consistent in outline shape and size, two opposite first base plates are respectively arranged on the combined bottom plate, the positioning plate and the cover plate, and first positioning holes are respectively arranged at corresponding positions of the middle positions of the base plates of the combined bottom plate, the positioning plate and the cover plate.
The utility model also provides a coating device, include as above-mentioned quartz wafer coating frock.
Compared with the prior art, the utility model, well quartz wafer coating frock and coating device, beneficial effect lies in:
the locating plate laminating is on the apron in this scheme, and the combination bottom plate superposes in the locating plate and deviates from the apron side to press from both sides the fastening with the locating plate and fix, owing to changed the strengthening rib arrangement of combination bottom plate in the quartz wafer coating film frock, the second strengthening rib in the adjacent interval is misplaced each other, has increased the intensity of coating film frock, when strengthening rib structure laminates the locating plate, the bearing structure of wafer is difficult to produce deformation, make the quartz wafer be difficult for the dislocation when arranging the coating film frock in, the laminating is tighter.
Drawings
FIG. 1 is a schematic diagram of a bottom plate assembly of a quartz wafer coating tool according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a first bottom plate of a quartz wafer coating tool according to an embodiment of the present invention;
fig. 3 is a schematic structural view of a second bottom plate of the quartz wafer coating tool according to the embodiment of the present invention;
fig. 4 is a schematic structural view of a third bottom plate of the quartz wafer coating tool in the embodiment of the present invention;
FIG. 5 is a schematic diagram of a positioning plate of the quartz wafer coating tool according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a cover plate structure of a quartz wafer coating tool according to an embodiment of the present invention;
fig. 7 is a schematic structural view of a first electrode of a quartz wafer coating tool according to an embodiment of the present invention;
fig. 8 is a schematic structural view of a second electrode of the quartz wafer coating tool according to the embodiment of the present invention;
in the drawings, each reference numeral denotes:
1. a combined bottom plate; 2. positioning a plate; 3. a cover plate; 4. a first electrode plate; 5. a second electrode plate; 6. a first substrate; 7. a second substrate; 8. a first positioning hole; 9. a second positioning hole;
11. a first base plate; 12. a second base plate; 13. a third base plate;
21. a first magnetically permeable aperture; 22. a slot position;
31. a second aperture;
41. a first electrode; 42. a second magnetically permeable aperture;
51. a second electrode; 52. a third magnetically permeable aperture;
111. a first reinforcing rib; 112. a second reinforcing rib; 114. a first open area;
121. a second open area; 122. a first magnet placing hole;
131. a first aperture; 132. the second magnet placing hole.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The embodiment is as follows:
in this embodiment, with reference to fig. 1 to 8, a coating apparatus is provided, which includes a quartz wafer coating tool, the quartz wafer coating tool includes a combined base plate 1, a positioning plate 2 and a cover plate 3 stacked in sequence, the combined base plate 1 includes first reinforcing ribs 111, second reinforcing ribs 112 and two first substrates 6 disposed oppositely, at least three first reinforcing ribs 111 extending in a first direction are connected between the two substrates, a space is formed between adjacent first reinforcing ribs 111, at least one second reinforcing rib 112 extending in a second direction is connected between adjacent first reinforcing ribs 111, the first direction and the second direction are perpendicular to each other, and the second reinforcing ribs 112 in adjacent spaces are dislocated from each other.
In this scheme, the laminating of locating plate 2 is on apron 3, 1 superposes in locating plate 2 that deviates from apron 3 side of built-up plate, thereby press from both sides locating plate 2 and press from both sides tightly fixed, owing to changed 1 strengthening rib arrangement of built-up plate in the quartz wafer coating frock, second strengthening rib 112 in the adjacent interval misplaces each other, the intensity of coating frock has been increased, when strengthening rib structure laminates locating plate 2, the bearing structure of wafer is difficult to produce deformation, make the quartz wafer difficult dislocation when arranging the coating frock in, the laminating is tighter.
Referring to fig. 1, the combined bottom plate 1 includes a first bottom plate 11, a second bottom plate 12, a third bottom plate 13, and a magnetic attraction assembly fixed to the first bottom plate 11, the second bottom plate 12, and the third bottom plate 13 have the same outer contour shape and size and are provided with a first reinforcing rib 111 and a second reinforcing rib 112, the second bottom plate 12 is assembled on the first bottom plate 11, and the third bottom plate 13 is assembled on the second bottom plate 12.
In the present embodiment, the first bottom plate 11, the second bottom plate 12, and the third bottom plate 13 may employ a magnetic adsorption material, for example: iron, cobalt, nickel and the alloy material of above-mentioned material, magnetism subassembly of inhaling includes a plurality of magnet, and magnetism subassembly mainly used is in the first bottom plate 11, second bottom plate 12 and third bottom plate 13 through magnetism effect laminating together of inhaling.
In other embodiments, the number of the bottom plates and the number of the magnetic assemblies included in the combined bottom plate 1 may be increased or decreased according to actual conditions, the thickness of the bottom plate may also be determined according to actual conditions, and in addition, the first bottom plate 11, the second bottom plate 12 and the third bottom plate 13 may also be fixedly attached together by screws and nuts.
As shown in fig. 2, the first base plate 11 is provided with a first perforated area 114, and the first perforated area 114 is formed by two adjacent first reinforcing ribs 111 and two adjacent second reinforcing ribs 112 on the first base plate 11 in a surrounding manner.
In the present embodiment, the first reinforcing ribs 111 and the second reinforcing ribs 112 are flat and long, and are arranged in an "i" shape, the first open region 114 defined by the first reinforcing ribs 111 and the second reinforcing ribs 112 is rectangular, and the first reinforcing ribs 111 and the second reinforcing ribs 112 are arranged in this way, so that the strength of the first base plate 11 is increased.
In other embodiments, the shape of the first opening region 114 may be regular rectangle, circle, ellipse, or a combination of these shapes, or irregular shape, but needs to match the opening shape of the silver tool used with the plating tool.
As shown in fig. 3, the second base plate 12 is provided with a second opening area 121 formed by two adjacent first reinforcing ribs 111 and two adjacent second reinforcing ribs 112 on the second base plate 12 in a surrounding manner, the first reinforcing ribs 111 of the second base plate 12 are provided with first magnet placing holes 122 at intervals for embedding magnets, and the magnet placing holes are orderly arranged on the first reinforcing ribs 111.
In this embodiment, the magnet is placed the hole and is used for placing the magnetic attraction subassembly that makes first bottom plate 11, second bottom plate 12 and the laminating of third bottom plate 13, and the hole is placed to magnet equidistant interval orderly's setting on first strengthening rib 111 for the appeal evenly distributed of magnetic attraction subassembly.
In other embodiments, the first and second reinforcing ribs 111 and 112 of the second base plate 12 are also provided with first magnet placing holes 122, and the first magnet placing holes 122 are arranged in order at equal intervals on the second reinforcing rib 112; in other embodiments, the second reinforcing beads 112 of the second base plate 12 are each provided with the first magnet placing hole 122.
As shown in fig. 4, the third base plate 13 is provided with second magnet mounting holes corresponding to the first magnet mounting holes 122 of the second base plate 12, and at least two first small holes 131 are provided in a region of the third base plate 13 corresponding to the second opening region 121 of the second base plate 12.
In this embodiment, the first small holes 131 are rectangular small holes, the first small holes 131 are arranged in a matrix on the second open region 121, and the position of each first small hole 131 corresponds to each coated quartz plate one by one. As shown in fig. 5, the positioning plate 2 is provided with first magnetically permeable holes 21 corresponding to the second magnet holes of the third bottom plate 13, and the positioning plate 2 is provided with slots 22 corresponding to the first small holes 131 of the third bottom plate 13.
In this embodiment, the slot 22 is rectangular for placing and fixing a quartz wafer, and the magnetic permeable hole is used to better permeate out the magnetic attraction of the magnetic component, so that the magnetic component attracts together the structure (the positioning plate 2, the cover plate 3 and the electrode plate) that is not embedded into the magnetic component by the magnetic attraction; in other embodiments, the shape of the magnetically permeable aperture may not correspond to the shape of the magnet placement aperture, but must be in a corresponding position.
As shown in fig. 6, the cover plate 3 is provided with second small holes 31 corresponding to the slots 22 on the positioning plate 2. In this embodiment, the second small hole 31 is a rectangular small hole in correspondence with the slot 22.
As shown in fig. 7 and 8, a first electrode plate 4 is assembled between the combination bottom plate 1 and the positioning plate 2, the first electrode plate 4 is provided with first electrodes 41 corresponding to the slots 22 on the positioning plate 2 one by one and second magnetic through holes 42 corresponding to the first magnetic through holes 21 on the positioning plate 2 one by one, a second electrode 51 plate 5 is assembled between the positioning plate 2 and the cover plate 3, the second electrode 51 plate 5 is provided with second electrodes 51 corresponding to the slots 22 on the positioning plate 2 one by one and third magnetic through holes 52 corresponding to the first magnetic through holes 21 on the positioning plate 2 one by one, the outer contours of the first electrode plate 4 and the second electrode plate 5 are the same as the outer contour of the positioning plate 2 in size, the first electrode plate 4 and the second electrode plate 5 are respectively provided with two second substrates 7 opposite to each other, and the middle position of the second substrate 7 is respectively provided with a second positioning hole 9.
In this embodiment, the electrode arrangement on the first electrode plate 4 and the second electrode plate 5 corresponds to the slot 22 on the positioning plate 2 one-to-one, the electrodes on the electrode plates form an electric field, so that the coating equipment coats a film on the quartz wafer, the magnetic attraction component penetrates out the magnetic attraction force through the magnetic penetration hole, and the first electrode plate 4 and the second electrode plate 5 are adsorbed on the upper and lower surfaces of the positioning plate 2 and fixed with the whole quartz wafer coating tool.
Referring to fig. 2-8, the combined bottom plate 1, the positioning plate 2 and the cover plate 3 have the same outer contour shape and size, the combined bottom plate 1, the positioning plate 2 and the cover plate 3 are respectively provided with two opposite first base plates 6, and the middle positions of the base plates of the combined bottom plate 1, the positioning plate 2 and the cover plate 3 are respectively provided with a first positioning hole 8.
In this embodiment, the bottom assembly 1, the first electrode plate 4, the positioning plate 2, the second electrode plate 5 and the cover plate 3 are sequentially overlapped, tightly attached by the magnetic attraction force generated by the magnetic assembly, and positioned by the positioning hole.
In other embodiments, the bottom plate 1, the positioning plate 2, the cover plate 3, the first electrode plate 4 and the second electrode plate 5 may be positioned by means of a snap fit or the like.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The utility model provides a quartz wafer coating frock for fix a position quartz wafer, its characterized in that, quartz wafer coating frock is including folding combination bottom plate, locating plate and the apron of establishing in proper order, combination bottom plate includes first strengthening rib, second strengthening rib and two first base plates of relative setting, two be connected with the at least three that extends on the first direction between the base plate first strengthening rib, it is adjacent form the interval between the first strengthening rib, it is adjacent be connected with at least one second strengthening rib that extends on the second direction between the first strengthening rib, the first direction with second direction mutually perpendicular, adjacent second strengthening rib in the interval misplaces each other.
2. The quartz wafer coating tool of claim 1, wherein the combined bottom plate comprises a first bottom plate, a second bottom plate, a third bottom plate and a magnetic component fixed on the first bottom plate, the second bottom plate and the third bottom plate have the same outline shape and size and are provided with the first reinforcing ribs and the second reinforcing ribs, the second bottom plate is assembled on the first bottom plate, and the third bottom plate is assembled on the second bottom plate.
3. The quartz wafer coating tool of claim 2, wherein the first bottom plate is provided with a first open area, and the first open area is formed by enclosing two adjacent first reinforcing ribs and two adjacent second reinforcing ribs on the first bottom plate.
4. The quartz wafer coating tool of claim 2, wherein the magnetic component comprises a plurality of magnets, the second bottom plate is provided with a second open area formed by two adjacent first reinforcing ribs and two adjacent second reinforcing ribs on the second bottom plate in an enclosing manner, and the first reinforcing ribs of the second bottom plate are provided with first magnet placing holes at intervals for embedding the magnets;
and/or the second reinforcing rib of the second bottom plate is provided with a first magnet placing hole for embedding the magnet.
5. The quartz wafer coating tool of claim 4, wherein the third base plate is provided with second magnet placing holes corresponding to the first magnet placing holes on the second base plate one to one, and the third base plate is provided with at least two first small holes in an area corresponding to the second opening area on the second base plate.
6. The quartz wafer coating tool of claim 5, wherein the positioning plate is provided with first magnetically permeable holes corresponding to the second magnet placing holes on the third bottom plate one to one, and the positioning plate is provided with slots corresponding to the first small holes on the third bottom plate one to one.
7. The quartz wafer coating tool of claim 6, wherein the cover plate is provided with second small holes corresponding to the slots on the positioning plate one to one.
8. The quartz wafer coating tool according to claim 7, wherein a first electrode plate is assembled between the combined bottom plate and the positioning plate, first electrodes corresponding to the slots on the positioning plate one to one and second magnetically permeable holes corresponding to the first magnetically permeable holes on the positioning plate one to one are arranged on the first electrode plate, a second electrode plate is assembled between the positioning plate and the cover plate, second electrodes corresponding to the slots on the positioning plate one to one and third magnetically permeable holes corresponding to the first magnetically permeable holes on the positioning plate one to one are arranged on the second electrode plate, the outer contours of the first electrode plate and the second electrode plate are consistent with the outer contour of the positioning plate in shape and size, two second substrates are arranged on the first electrode plate and the second electrode plate respectively, and a second positioning hole is arranged in the middle of the second substrate.
9. The quartz wafer coating tool according to any one of claims 1 to 8, wherein the combined bottom plate, the positioning plate and the cover plate have the same outer contour shape and size, the combined bottom plate, the positioning plate and the cover plate are respectively provided with two first substrates opposite to each other, and the combined bottom plate, the positioning plate and the cover plate are respectively provided with a first positioning hole at the corresponding position of the middle position of the substrates.
10. A coating device, characterized by comprising the quartz wafer coating tool according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222101012.6U CN218059183U (en) | 2022-08-10 | 2022-08-10 | Quartz wafer coating tool and coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222101012.6U CN218059183U (en) | 2022-08-10 | 2022-08-10 | Quartz wafer coating tool and coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218059183U true CN218059183U (en) | 2022-12-16 |
Family
ID=84403333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222101012.6U Active CN218059183U (en) | 2022-08-10 | 2022-08-10 | Quartz wafer coating tool and coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218059183U (en) |
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2022
- 2022-08-10 CN CN202222101012.6U patent/CN218059183U/en active Active
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