CN218049440U - Chip welding table heating base - Google Patents
Chip welding table heating base Download PDFInfo
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- CN218049440U CN218049440U CN202221502185.2U CN202221502185U CN218049440U CN 218049440 U CN218049440 U CN 218049440U CN 202221502185 U CN202221502185 U CN 202221502185U CN 218049440 U CN218049440 U CN 218049440U
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Abstract
The utility model is suitable for a chip maintenance equipment technical field especially relates to a chip welding platform heating base, including base, chip rack, support side bearer and hot-blast rifle, and support the side bearer and connect in the side of base, the chip rack is installed on the surface of base, and the one end at the support side bearer is installed to the hot-blast rifle, chip welding platform heating base still includes: and the second mounting part is connected to the side surface of the base, and the surface of the second mounting part is provided with a moving assembly. The utility model discloses a set up clean subassembly, removal subassembly, vibration subassembly, second installed part, support piece and second support piece, can be convenient and automatic with the dust clean up on chip surface to avoid hot-blast rifle when blowing on the chip, the dust on chip surface floats everywhere and pollutes operational environment, thereby has improved this heating base's functionality.
Description
Technical Field
The utility model relates to a chip maintenance equipment technical field specifically is a chip soldering station heating base.
Background
The die pad heated mount is a specialized tool used to repair electrical components on a failed die.
When the chip is maintained through the chip welding table, the chip is usually placed on the chip placing frame firstly, and then the chip on the chip placing frame is heated through a hot air gun. However, many of the chips to be repaired are used for a long time, some dust is accumulated on the surface of the chip, and the hot air gun blows air to heat the chip, so that the dust is scattered randomly and floats into the air to pollute the working environment.
The problem of current heating base ubiquitous function singleness, and can not be before the heat-blast rifle bloies toward the chip, automatic and effectual even clearance of dust with the chip surface falls.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the utility model is to provide a chip soldering station heating base aims at solving following problem: the problem of current heating base ubiquitous function singleness, and can not be before the hot-blast rifle bloies toward the chip, automatic and effectual even clearance of dust with the chip surface falls.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the utility model provides a chip welding table heating base, includes base, chip rack, support side bearer and hot-blast rifle, and supports the side bearer and connect the side at the base, and the chip rack is installed on the surface of base, and the one end at the support side bearer is installed to the hot-blast rifle, chip welding table heating base still includes:
the second mounting piece is connected to the side surface of the base, and the surface of the second mounting piece is provided with a moving assembly;
the supporting piece is connected to the outer side of the moving assembly, the outer side of the supporting piece is sleeved with the second supporting piece, one end of the second supporting piece is provided with a groove, the supporting piece is arranged inside the groove, and the moving assembly is used for driving the supporting piece to move along the horizontal direction;
a cleaning component connected to the side surface of the second supporting component and used for cleaning dust on the surface of the chip placed on the chip placing frame; and
and the vibration assembly is arranged on the supporting piece and the second supporting piece and used for driving the second supporting piece to vibrate through mechanical transmission.
Further, the moving assembly includes:
the bearing seat is arranged on the surface of the second installation part, and a transmission part is connected inside the bearing seat;
the second driving piece is arranged on the outer side of the second mounting piece, and one end of the second driving piece is connected with one end of the transmission piece; and
the moving member cup joints in the outside of driving medium, and moving member sliding connection is in the side of base, and support piece connects in the outside of moving member.
Further, the cleaning assembly includes:
the first mounting part is connected to the side surface of the second supporting part in a sliding way; and
and the cleaning piece is arranged on the surface of the first mounting piece.
Further, the cleaning assembly further comprises: the extensible member is installed in second support piece's side, and the one end of extensible member is connected with the outside of first installed part, and the extensible member is used for driving first installed part and removes along vertical direction in second support piece's side.
Further, the vibration assembly includes:
the elastic piece is arranged in the groove, and one end of the supporting piece is connected with one end of the elastic piece;
a vibrating member coupled to a side of the second supporting member;
the first driving piece is arranged on the side surface of the supporting piece, and one end of the first driving piece is connected with the rotating piece; and
the knocking piece is sleeved on the outer side of the rotating piece.
Further, the outer diameter of the supporting piece is the same as the inner diameter of the groove, and the knocking piece is arranged below the vibrating piece.
The utility model provides a pair of chip welding platform heating base through setting up clean subassembly, removal subassembly, vibration subassembly, second installed part, support piece and second support piece, can be convenient and automatic with the dust clean up on chip surface to avoid hot-blast rifle when blowing on toward the chip, the dust on chip surface floats everywhere and pollutes operational environment, thereby has improved this heating base's functionality.
Drawings
Fig. 1 is a schematic structural diagram of a chip soldering station heating base.
Fig. 2 is an enlarged view of a chip bonding stage heating base at a.
Fig. 3 is a schematic side view of a partial structure of a bearing seat, a second mounting member, a second driving member, a moving member, and a supporting member in a heating base of a die pad.
Fig. 4 is a partial structural schematic diagram of a supporting member, a first driving member, a knocking member and a rotating member in a chip soldering station heating base.
In the figure: 1. a base; 2. placing a chip rack; 3. a support sideframe; 4. a hot air gun; 5. a first mounting member; 6. a cleaning member; 7. a moving member; 8. a transmission member; 9. a second mount; 10. a telescoping member; 11. a support member; 12. a first driving member; 13. a plexor member; 14. a rotating member; 15. a vibrating member; 16. a groove; 17. an elastic member; 18. a second support member; 19. a second driving member; 20. and a bearing seat.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following detailed description is provided for the specific embodiments of the present invention.
As shown in fig. 1-4, an embodiment of the utility model provides a chip welding table heating base, including base 1, chip rack 2, support side bearer 3 and hot-blast rifle 4, and support side bearer 3 and connect in the side of base 1, chip rack 2 installs on the surface of base 1, and hot-blast rifle 4 is installed in the one end of supporting side bearer 3, chip welding table heating base still includes:
the second mounting part 9 is connected to the side surface of the base 1, and the surface of the second mounting part 9 is provided with a moving component;
the supporting piece 11 is connected to the outer side of the moving assembly, a second supporting piece 18 is sleeved on the outer side of the supporting piece 11, a groove 16 is formed in one end of the second supporting piece 18, the supporting piece 11 is arranged inside the groove 16, and the moving assembly is used for driving the supporting piece 11 to move in the horizontal direction;
a cleaning assembly attached to a side of the second support member 18 for cleaning dust on the surface of the chip placed on the chip placing frame 2; and
and the vibration assembly is arranged on the support 11 and the second support 18 and is used for driving the second support 18 to vibrate through mechanical transmission.
In an embodiment of the utility model, second installed part 9 can be the installation lath, support piece 11 can be the connecting rod, second support piece 18 can be the support column, this application will be placed the dust on chip surface on chip rack 2 through clean subassembly and removal subassembly and clear up, the removal subassembly can be automatic drive clean subassembly in chip surface slow moving, thereby in order to the even sanitization of dust with the chip surface, the vibration subassembly is through the mode of strikeing second support piece 18 to drive the clean subassembly vibration of installation on second support piece 18 and the second support piece 18, so that the dust because of the adhesion of clean chip surface on the clean subassembly is shaken down, thereby can the continuation keep clean degree of clean subassembly.
As shown in fig. 1-3, in one embodiment of the present invention, the moving assembly comprises:
the bearing seat 20 is arranged on the surface of the second mounting part 9, and the transmission part 8 is connected inside the bearing seat 20;
a second driving member 19 installed at an outer side of the second installation member 9, and one end of the second driving member 19 is connected to one end of the transmission member 8; and
the moving part 7 is sleeved on the outer side of the transmission part 8, the moving part 7 is connected to the side face of the base 1 in a sliding mode, and the supporting part 11 is connected to the outer side of the moving part 7.
In this embodiment, the cleaning assembly includes:
a first mounting part 5 which is connected to the side of the second supporting part 18 in a sliding way; and
and the cleaning piece 6 is arranged on the surface of the first mounting piece 5.
In this embodiment, the cleaning assembly further comprises: and the telescopic piece 10 is installed on the side surface of the second support piece 18, one end of the telescopic piece 10 is connected with the outer side of the first installation piece 5, and the telescopic piece 10 is used for driving the first installation piece 5 to move along the vertical direction on the side surface of the second support piece 18.
In this embodiment, the second driving member 19 may be a forward and reverse rotation motor, the moving member 7 may be a threaded ring, and the preferred moving member 7 is slidably connected to the side surface of the base 1 through a sliding block and a sliding rail, the driving member 8 may be a lead screw, the telescopic member 10 may be an electric telescopic rod, the first mounting member 5 may be a mounting plate, the preferred first mounting member 5 is slidably connected to the side surface of the second supporting member 18 through the matching of the sliding block and the sliding rail, and the cleaning member 6 may be cleaning fluff;
after the chip is stably placed on the chip placing frame 2, the ash cleaning operation of the chip is firstly carried out, at the moment, the telescopic piece 10 is firstly opened according to the height of the chip to adjust the height of the first installation piece 5, the telescopic piece 10 drives the first installation piece 5 to slide on the side surface of the second support piece 18 along the vertical direction, so that the cleaning piece 6 on the first installation piece 5 can be fully in surface contact with the chip, then the second driving piece 19 is opened, the second driving piece 19 drives the transmission piece 8 to rotate through the bearing seat 20, the transmission piece 7 moves on the outer side of the transmission piece 8, the transmission piece 7 drives the support piece 11, the second support piece 18 and the first installation piece 5 horizontally move above the chip, and the cleaning piece 6 on the first installation piece 5 can clean dust on the surface of the chip.
As shown in fig. 1 and 4, in an embodiment of the present invention, the vibration assembly includes:
an elastic member 17 installed inside the groove 16, and one end of the support member 11 is connected with one end of the elastic member 17;
a vibrating member 15 coupled to a side of the second supporting member 18;
a first driving member 12 installed at a side of the supporting member 11, and one end of the first driving member 12 is connected with a rotating member 14; and
the knocking piece 13 is sleeved on the outer side of the rotating piece 14.
In the present embodiment, the outer diameter of the support member 11 is the same as the inner diameter of the groove 16, and the striking member 13 is disposed below the vibrating member 15.
In this embodiment, the elastic member 17 may be a spring or an elastic damping block, the first driving member 12 may be a driving motor, the striking member 13 may be a striking block, the rotating member 14 may be a rotating rod, and the vibrating member 15 may be a supporting block;
after the cleaning member 6 cleans the surface of the chip, a part of dust can be accumulated in the cleaning member 6, if the dust is not cleaned, the normal cleaning operation of the cleaning member can be affected, the user can open the first driving member 12, the first driving member 12 drives the rotating member 14 and the knocking member 13 to rotate, the knocking member 13 intermittently knocks the vibrating member 15, the vibrating member 15 drives the second supporting member 18 to vibrate through the elastic member 17, so that the first mounting member 5 on the second supporting member 18 also vibrates, and the dust on the cleaning member 6 is shaken down, it should be noted that before the cleaning member 6 and the first mounting member 5 are driven to vibrate through the vibrating member, the first mounting member 5 should be driven to move through the moving member and be not placed above the base 1 and the chip.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and any modifications, equivalents, improvements, etc. made within the spirit and principles of the present invention should be included within the scope of the present invention.
Claims (6)
1. The utility model provides a chip welding platform heating base, includes base, chip rack, support side bearer and hot-air gun, and supports the side bearer and connect the side at the base, and the chip rack is installed on the surface of base, and the one end at the support side bearer is installed to the hot-air gun, its characterized in that, chip welding platform heating base still includes:
the second mounting part is connected to the side surface of the base, and a moving assembly is arranged on the surface of the second mounting part;
the supporting piece is connected to the outer side of the moving assembly, a second supporting piece is sleeved on the outer side of the supporting piece in a sleeved mode, a groove is formed in one end of the second supporting piece, the supporting piece is arranged inside the groove, and the moving assembly is used for driving the supporting piece to move in the horizontal direction;
a cleaning component connected to the side surface of the second supporting component and used for cleaning dust on the surface of the chip placed on the chip placing frame; and
and the vibration assembly is arranged on the supporting piece and the second supporting piece and used for driving the second supporting piece to vibrate through mechanical transmission.
2. The chip bonding station heating base of claim 1, wherein the moving assembly comprises:
the bearing seat is arranged on the surface of the second installation part, and a transmission part is connected inside the bearing seat;
the second driving piece is arranged on the outer side of the second mounting piece, and one end of the second driving piece is connected with one end of the transmission piece; and
the moving member cup joints in the outside of driving medium, and moving member sliding connection is in the side of base, and support piece connects in the outside of moving member.
3. The die bonding station heating base of claim 1, wherein the cleaning assembly comprises:
the first mounting part is connected to the side surface of the second supporting part in a sliding manner; and
and the cleaning piece is arranged on the surface of the first mounting piece.
4. The chip bonding station heating base of claim 3, wherein the cleaning assembly further comprises: the extensible member is installed in second support piece's side, and the one end of extensible member is connected with the outside of first installed part, and the extensible member is used for driving first installed part and removes along vertical direction in second support piece's side.
5. The chip bonding station heating base of claim 1, wherein the vibration assembly comprises:
the elastic piece is arranged in the groove, and one end of the supporting piece is connected with one end of the elastic piece;
a vibrating member coupled to a side of the second supporting member;
the first driving piece is arranged on the side surface of the supporting piece, and one end of the first driving piece is connected with the rotating piece; and
the knocking piece is sleeved on the outer side of the rotating piece.
6. The chip bonding pad heating base according to claim 5, wherein the outer diameter of the supporting member is the same as the inner diameter of the groove, and the knocking member is disposed below the vibrating member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221502185.2U CN218049440U (en) | 2022-06-16 | 2022-06-16 | Chip welding table heating base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221502185.2U CN218049440U (en) | 2022-06-16 | 2022-06-16 | Chip welding table heating base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218049440U true CN218049440U (en) | 2022-12-16 |
Family
ID=84434543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221502185.2U Active CN218049440U (en) | 2022-06-16 | 2022-06-16 | Chip welding table heating base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218049440U (en) |
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2022
- 2022-06-16 CN CN202221502185.2U patent/CN218049440U/en active Active
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