CN218041902U - Coiled three-layer soft baseplate structure - Google Patents
Coiled three-layer soft baseplate structure Download PDFInfo
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- CN218041902U CN218041902U CN202221970997.XU CN202221970997U CN218041902U CN 218041902 U CN218041902 U CN 218041902U CN 202221970997 U CN202221970997 U CN 202221970997U CN 218041902 U CN218041902 U CN 218041902U
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- insulating layer
- sided flexible
- layer
- lapping
- insulation layer
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Abstract
The utility model discloses a lapping three-layer flexible substrate structure, including the two-sided flexible line way board body of a plurality of, still be provided with the first insulation layer that can the lapping, the two-sided flexible line way board body of a plurality of discharges in proper order and the bottom surface all glues the top surface on the first insulation layer through the glue film, just the bottom surface on first insulation layer glues inherent second insulating layer. The utility model discloses a structure sets up rationally, but it is provided with the first insulation layer of lapping to the two-sided flexible line way board body of a plurality of discharges in proper order and glues firmly on the first insulation layer through the glue film, thereby can receive and release and transport the two-sided flexible line way board body lapping that can not the lapping through first insulation layer, is favorable to reducing transportation and use cost, and the suitability is strong and the practicality is good.
Description
Technical Field
The utility model belongs to the technical field of the flexible line way board, concretely relates to lapping three-layer soft base plate structure.
Background
Although a double-sided flexible circuit board can meet the use requirements of general situations, in the actual application process, because the double-sided flexible circuit board can only be processed into a sheet structure with the length of 1m or 0.5m, although the double-sided flexible circuit board can also realize bending, winding or folding operations, the double-sided flexible circuit board cannot be effectively rolled and stacked during processing, each double-sided flexible circuit board can only be rolled up independently, and the double-sided flexible circuit board is not beneficial to subsequent use and transportation operations, so that the technical problem to be solved by technical personnel in the technical field is to design a double-sided flexible circuit board which can be sequentially connected and rolled into a roll for use or transportation.
Disclosure of Invention
The utility model aims at providing a structure sets up rationally and is favorable to coiling a lapping three-layer soft base plate structure that the lapping was used.
Realize the technical scheme of the purpose of the utility model is a lapping three-layer flexible substrate structure, including the two-sided flexible line way board body of a plurality of, still be provided with the first insulation layer that can the lapping, the two-sided flexible line way board body of a plurality of is discharged in proper order and the bottom surface all glues the top surface at the first insulation layer through the glue film, just the bottom surface on first insulation layer glues inherent second insulation layer, the first insulation layer with be provided with the copper layer between the second insulation layer.
The thickness of the first insulating layer is 1-5mm, and the thickness of the second insulating layer is the same as that of the first insulating layer.
The width of the first insulating layer is the same as that of the double-sided flexible circuit board body.
The thickness of the copper layer is 1-3mm.
The utility model discloses has positive effect: the utility model discloses a structure sets up rationally, and it is provided with the first insulation layer that can the lapping to the two-sided flexible line way board body of a plurality of discharges in proper order and cements on the first insulation layer through the glue film, thereby can receive and release and transport the two-sided flexible line way board body lapping that can not the lapping through the first insulation layer, is favorable to reducing transportation and use cost, and the suitability is strong and the practicality is good.
Drawings
In order that the present invention may be more readily and clearly understood, the following detailed description of the present invention is provided in connection with the following specific embodiments, taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic structural diagram of the present invention.
Reference numerals: the double-sided flexible circuit board comprises a double-sided flexible circuit board body 1, a first insulating layer 2, an adhesive layer 3, a second insulating layer 4 and a copper layer 5.
Detailed Description
The technical scheme is further explained by combining the drawings in the specification, and the specific explanation is as follows:
referring to fig. 1, a roll three-layer flexible substrate structure includes a plurality of double-sided flexible circuit board bodies 1, in this embodiment, the double-sided flexible circuit board is a structure of the prior art, and therefore, the double-sided flexible circuit board is not described in detail, a first insulating layer 2 capable of being rolled is further provided, the plurality of double-sided flexible circuit board bodies are sequentially arranged, bottom surfaces of the double-sided flexible circuit board bodies are all adhered to top surfaces of the first insulating layer through adhesive layers 3, and a second insulating layer 4 is adhered to the bottom surface of the first insulating layer. In this embodiment, since the first insulating layer can be rolled, in an actual application process, the thickness of the first insulating layer is 1 to 5mm, and the thickness of the second insulating layer is the same as that of the first insulating layer. In order to effectively connect with the double-sided flexible circuit stacking body and ensure the connection attractiveness, the width of the first insulating layer is the same as that of the double-sided flexible circuit board body. And a copper layer 5 is provided between the first insulating layer and the second insulating layer thereof in order to ensure effective wiring.
The utility model discloses a structure sets up rationally, and it is provided with the first insulation layer that can the lapping to the two-sided flexible line way board body of a plurality of discharges in proper order and cements on the first insulation layer through the glue film, thereby can receive and release and transport the two-sided flexible line way board body lapping that can not the lapping through the first insulation layer, is favorable to reducing transportation and use cost, and the suitability is strong and the practicality is good.
The standard parts used in the present embodiment can be purchased directly from the market, and the non-standard structural parts described in the specification can also be obtained directly by processing according to the common general knowledge of the prior art without any doubt, and the connection mode of the parts adopts the conventional means matured in the prior art, and the machines, parts and equipment adopt the conventional models in the prior art, so that the detailed description is not given here.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. This need not be, nor should it be exhaustive of all embodiments. And such obvious changes and modifications which fall within the spirit of the invention are deemed to be covered by the present invention.
Claims (4)
1. The utility model provides a lapping three-layer soft substrate structure, includes the two-sided flexible line way board body of a plurality of, its characterized in that: the double-sided flexible circuit board is characterized by further comprising a first insulating layer capable of being rolled, a plurality of double-sided flexible circuit board bodies are sequentially arranged, the bottom surfaces of the double-sided flexible circuit board bodies are fixedly adhered to the top surface of the first insulating layer through adhesive layers, a second insulating layer is fixedly adhered to the bottom surface of the first insulating layer, and a copper layer is arranged between the first insulating layer and the second insulating layer.
2. A rolled three-layer flexible substrate structure according to claim 1, wherein: the thickness of the first insulating layer is 1-5mm, and the thickness of the second insulating layer is the same as that of the first insulating layer.
3. A rolled three-layer flexible substrate structure according to claim 2, wherein: the width of the first insulating layer is the same as that of the double-sided flexible circuit board body.
4. A rolled three-ply flexible substrate structure as claimed in claim 3, wherein: the thickness of the copper layer is 1-3mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221970997.XU CN218041902U (en) | 2022-07-28 | 2022-07-28 | Coiled three-layer soft baseplate structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221970997.XU CN218041902U (en) | 2022-07-28 | 2022-07-28 | Coiled three-layer soft baseplate structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN218041902U true CN218041902U (en) | 2022-12-13 |
Family
ID=84340403
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202221970997.XU Active CN218041902U (en) | 2022-07-28 | 2022-07-28 | Coiled three-layer soft baseplate structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN218041902U (en) |
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2022
- 2022-07-28 CN CN202221970997.XU patent/CN218041902U/en active Active
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