CN218037651U

CN218037651U - High-speed camera with intelligent temperature control high-efficiency heat dissipation structure

Info

Publication number: CN218037651U
Application number: CN202122788062.1U
Authority: CN
Inventors: 唐晓世; 赵华; 卢小银; 沈沉; 雷传杰
Original assignee: Hefei Zhongke Junda Vision Technology Co ltd
Current assignee: Hefei Zhongke Junda Vision Technology Co ltd
Priority date: 2021-11-15
Filing date: 2021-11-15
Publication date: 2022-12-13
Anticipated expiration: 2031-11-15

Abstract

The utility model discloses a high-speed camera with high-efficient heat radiation structure of intelligence control by temperature change, include: the high-speed camera main part is provided with CMOS backup pad and chip backup pad in the inside of high-speed camera main part, the last fixed surface of CMOS backup pad and chip backup pad installs the integral type water-cooled tube, the integral type water-cooled tube is connected with the water pump that sets up at camera back shroud surface, the surface of camera back shroud is provided with the RS422 navigation plug who is connected with water pump and inside water-cooling system, the water pump passes through the water-cooled tube and is connected with the cold row of heat dissipation that sets up in its dead ahead, the fixed surface of the cold row of heat dissipation installs radiator fan, can realize the purpose of inside temperature intelligent control through inside water-cooling system simultaneously in with the heat dissipation to the environment heat sink in the cold row.

Description

High-speed camera with intelligent temperature control high-efficiency heat dissipation structure

Technical Field

The utility model relates to a high-speed camera technical field, concretely relates to high-speed camera with high-efficient heat radiation structure of intelligence control by temperature change.

Background

The high-speed camera is one of industrial cameras, generally refers to a digital industrial camera, which is generally installed on a machine production line to replace human eyes for measurement and judgment, converts a digital image shooting target into an image signal and transmits the image signal to a special image processing system.

However, the conventional heat dissipation methods of the high-speed camera at present mainly include air cooling and TEC heat dissipation, but with the doubling of the functions and power consumption of the newly developed FPGA chip, the conventional heat dissipation methods have gradually failed to satisfy the new structure and heat dissipation requirements:

1. the traditional water cooling has the risk of liquid leakage, and the whole circuit board fails under severe conditions;

2. because the water cooling system has more parts, the internal space of the cavity can be greatly increased when the water cooling system is placed inside the high-speed camera.

Therefore, the high-speed camera with the intelligent temperature-control efficient heat dissipation structure solves the problems.

SUMMERY OF THE UTILITY MODEL

To the problem that above-mentioned prior art exists, the utility model provides a high-speed camera with high-efficient heat radiation structure of intelligence control by temperature change can just can realize the water-cooling structure of control by temperature change feedback control to the quick heat dissipation of high-speed camera, can let the high-speed camera carry out high-efficient stable work under high power and complex environment.

In order to achieve the above object, the utility model discloses a pair of high-speed camera with high-efficient heat radiation structure of intelligence control by temperature change, include: the high-speed camera main body consists of an upper camera cover plate, a front camera cover plate, a left camera side plate, a bottom camera plate, a right camera side plate and a rear camera cover plate;

the camera comprises a high-speed camera body, and is characterized in that a CMOS supporting plate is arranged in the high-speed camera body, a CMOS chip is fixedly arranged at one end of the CMOS supporting plate, a chip supporting plate is arranged in the high-speed camera body on the right side of the CMOS supporting plate, integrated water-cooling pipes are arranged on the surfaces of the CMOS supporting plate and the chip supporting plate, a mainboard for controlling the camera to run is fixed on the surface of the chip supporting plate, the integrated water-cooling pipes are connected with a water pump arranged on the outer surface of a camera back cover plate, an RS422 aerial plug connected with the water pump and a water-cooling heat dissipation system arranged in the high-speed camera body is arranged on the outer surface of the camera back cover plate, the water pump is connected with a heat dissipation cold bar arranged in front of the water pump through the water-cooling pipes, and a heat dissipation fan is fixedly arranged on the surface of the heat dissipation cold bar.

As the further optimization of the scheme, the chip supporting plates are provided with two groups, the two groups of chip supporting plates are vertically distributed, the upper surfaces of the two groups of chip supporting plates are provided with integrated water cooling pipes, the integrated water cooling pipes on the two groups of chip supporting plates are mutually communicated to form a water cooling pipeline, the water outlet and the water inlet of the water cooling pipeline are respectively positioned at the same end of the two groups of chip supporting plates, a water cavity is arranged in the chip supporting plates, and a plurality of groups of water cavities are arranged in the chip supporting plates.

As a further optimization of the above scheme, the main boards are provided with two sets, namely a first main board and a second main board, and the first main board and the second main board are both fixedly mounted on the surface of the chip supporting board.

As a further optimization of the scheme, two groups of water-cooling pipe joints penetrating through the surface of the camera rear cover plate are arranged on the surface of the camera rear cover plate, and the two groups of water-cooling pipe joints are respectively connected with a water inlet and a water outlet of the integrated water-cooling pipe.

As a further optimization of the scheme, the CMOS supporting plate and the two groups of chip supporting plates form a structure in the shape of Contraband in the high-speed camera body.

As a further optimization of the above scheme, the surface of the heat dissipation cold row is of a saw-toothed structure, the saw-toothed structure is composed of a plurality of groups of heat dissipation fins, mounting holes penetrating through the front and rear surfaces of the heat dissipation fins are formed in the surfaces of the heat dissipation fins, two groups of fixed beams are arranged in the mounting holes in a crossed manner, the two groups of fixed beams and the heat dissipation fins are of an integrated structure, a rotating shaft is arranged at the crossed position of the fixed beams, and the fan blades are fixedly connected with the rotating shaft through bolts.

As a further optimization of the above scheme, the water pump, the heat dissipation cold bar and the heat dissipation fan are all externally arranged on the high-speed camera main body.

As a further optimization of the scheme, the side face of the integrated water-cooling tube is brazed on the side face of the CMOS supporting plate, and the integrated water-cooling tube is connected with the chip supporting plate through brazing.

As a further optimization of the above scheme, a cold drainage water channel pipeline is arranged inside the heat dissipation cold drainage, filter screens are arranged at water inlet and water outlet positions of the heat dissipation cold drainage, baffles are arranged at positions, close to the water inlet and the water outlet, of the cold drainage water channel pipeline, the heat dissipation cold drainage is located at the top of the heat dissipation cold drainage and is provided with a scale collection cavity communicated with the water inlet and the water outlet of the cold drainage water channel pipeline, and a plug is arranged at the top of the scale collection cavity.

The utility model discloses a high-speed camera with high-efficient heat radiation structure of intelligence control by temperature change possesses following beneficial effect:

1. the utility model discloses a high-speed camera with intelligent temperature control high-efficient heat radiation structure, the integral type water-cooling tube and the structure in the high-speed camera adopt integrative brazing type structure, improve area of contact and radiating effect, and the integral type water-cooling tube in the camera does not have the joint and does not have the weeping risk, has avoided the damage of camera that the weeping leads to;

2. the utility model discloses a high-speed camera with intelligent control by temperature change high-efficient heat radiation structure, with mechanisms such as fan, cold row and water pump that the water-cooling heat dissipation needs externally set up in the main part of high-speed camera, improve the high-speed camera main part internal integration degree, reduce its overall dimension, also avoid the weeping risk that the inside may appear simultaneously;

3. the utility model discloses a high-speed camera with intelligent temperature control high-efficient heat radiation structure, through reading the FPGA chip temperature that sets up in the camera, and feed back to the water pump and adjust the flow in the integral type water-cooling pipe, take away thermal change through the inside liquid of integral type water-cooling pipe under the different flow and adjust FPGA chip temperature and control at 65 +/-5 ℃ within range, realize intelligent temperature control purpose;

4. the utility model discloses a high-speed camera with high-efficient heat radiation structure of intelligence control by temperature change through the collection chamber that sets up the incrustation scale in the cold row of dispelling the heat, incrustation scale and discharge that produce in can the cold row of effectual collection heat dissipation, the heat radiating effect that has avoided leading to because of the incrustation scale blocks up the pipeline is worsened unusually.

There have been disclosed in detail certain embodiments of the invention with reference to the following description and drawings, and it is to be understood that the embodiments of the invention are not limited thereby, since the embodiments of the invention may include many variations, modifications, and equivalents within the spirit and scope of the appended claims.

Drawings

Fig. 1 is a schematic structural view of a water-cooling heat dissipation system of the present invention;

FIG. 2 is a schematic diagram of the internal structure of the high-speed camera according to the present invention;

FIG. 3 is a feedback flow chart of the water-cooling heat dissipation system of the present invention;

FIG. 4 is a sectional view of the internal structure of the chip support plate of the present invention;

FIG. 5 is a sectional view of the internal structure of the heat dissipation cold row of the present invention;

fig. 6 is an enlarged schematic view of the structure of the heat dissipation cold row surface cooling fin of the present invention.

In the figure: 1. an integrated water-cooled tube; 2. a chip support plate; 3. a CMOS support plate; 4. a CMOS chip; 5. a first main board; 6. a second main board; 7. an upper cover plate of the camera; 8. a camera front cover plate; 9. a camera left side panel; 10. a camera chassis; 11. a camera right side panel; 12. a camera back cover plate; 13. a high-speed camera body; 14. a water pump; 15. heat dissipation cold rows; 16. a heat radiation fan; 17. RS422 aerial plug; 18. a water-cooled pipe joint; 19. a water chamber; 20. filtering with a screen; 21. a baffle plate; 22. a cold drain conduit; 23. a scale collection chamber; 24 plug; 25. a heat sink; 26. mounting holes; 27. a fixed beam; 28. a rotating shaft; 29. a fan blade.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail through the drawings and the embodiments. It should be understood, however, that the description herein of specific embodiments is only intended to illustrate the invention and not to limit the scope of the invention.

It is noted that when an element is referred to as being "disposed on," or provided with "another element, it can be directly on, or intervening elements may also be present, when an element is referred to as being" connected, "or coupled to another element, it can be directly on, or coupled to, the other element, or intervening elements may also be present, and that" fixedly coupled "means fixedly coupled or coupled in any number of ways, not intended to be within the scope of the disclosure, and that the terms" vertical, "" horizontal, "" left, "" right, "and the like are used herein for illustrative purposes only and are not intended to be the only embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs, and the terms used herein in the specification are for the purpose of describing particular embodiments only and are not intended to limit the present invention, and the term "and/or" as used herein includes any and all combinations of one or more of the associated listed items;

referring to the attached drawings 1-3 of the specification, the utility model provides a technical scheme: a high-speed camera with intelligent temperature-control efficient heat dissipation structure comprises: a high-speed camera main body 13 composed of a camera upper cover plate 7, a camera front cover plate 8, a camera left side plate 9, a camera bottom plate 10, a camera right side plate 11 and a camera rear cover plate 12;

the camera comprises a high-speed camera body 13, a CMOS supporting plate 3 is arranged in the high-speed camera body 13, a CMOS chip 4 is fixedly installed at one end of the CMOS supporting plate 3, a chip supporting plate 2 is arranged on the right side of the CMOS supporting plate 3 and located in the high-speed camera body 13, integrated water-cooling pipes 1 are arranged on the surfaces of the CMOS supporting plate 3 and the chip supporting plate 2, a mainboard for controlling the camera to run is fixed on the surface of the chip supporting plate 2, the integrated water-cooling pipes 1 are connected with a water pump 14 arranged on the outer surface of a camera rear cover plate 12, an RS422 aerial plug 17 connected with the water pump 14 and a water-cooling heat dissipation system arranged in the high-speed camera body 13 is arranged on the outer surface of the camera rear cover plate 12, the water pump 14 is connected with a heat dissipation cold bar 15 arranged right in front of the water-cooling pipe, and a heat dissipation fan 16 is fixedly installed on the surface of the heat dissipation cold bar 15.

It should be noted that the camera upper cover plate 7, the camera front cover plate 8, the camera left side plate 9, the camera bottom plate 10, the camera right side plate 11 and the camera rear cover plate 12 jointly form a high-speed camera main body 13, all elements formed by a high-speed camera are fixed inside the high-speed camera main body 13, the CMOS support plate 3 is vertically placed between the camera upper cover plate 7 and the camera bottom plate 10, two ends of the CMOS support plate 3 are respectively clamped on the upper surface of the camera bottom plate 10 and the lower surface of the camera upper cover plate 7, the CMOS chip 4 is fixed on the surface of the CMOS support plate 3 by bolts, the integrated water cooling pipe 1 is coiled on the chip support plate 2 and the CMOS support plate 3 along a heat source in a brazing mode, heat emitted by the chip on the main plate can be rapidly and effectively taken away through good contact adhesion, the integrated water cooling pipe 1 is connected with the water pump 14 and takes out the heat after penetrating out of the camera rear cover plate 12, then is subjected to water path circulation through the heat dissipation cold discharge pipe 15, and the heat inside of the camera is rapidly led out to the environmental heat sink through the heat dissipation fan 16;

in the device, the water pump 14 can be used as the following types: the maximum length of a 111HJ small water pump is 40mm, the 111HJ small water pump is suitable for being used in an industrial camera, small water pumps of other models and the like can be used, and the 111HJ small water pump is common in the prior art and is not described in detail herein.

Meanwhile, internal wiring is led out through an RS422 aerial plug 17 arranged on the surface of the camera rear cover plate 12 and then connected to a control circuit of the water pump 14, the water pump 14 can control a water-cooling heat dissipation system of the high-speed camera by receiving the temperature of an FPGA chip of a mainboard and adjusting the flow, the system reads the real-time temperature of FPGA chip registers on the first mainboard 5 and the second mainboard 6, the real-time temperature is transmitted to a controller circuit board of the water pump 14 through the RS422 aerial plug 17, the feedback to the water pump 14 is controlled through PWM pulse width modulation, the flow of the water pump 14 is adjusted through the change of the rotating speed of an impeller, the flow of the water pump 14 can be adjusted within the range of 13.5-670ml/min, when the change of the heat dissipation capacity of the high-speed camera main body 13 is large under different working modes or external environments, the temperature of the FPGA chip can be adjusted and controlled within the range of 65 +/-5 ℃ through the difference of taking away of liquid in the water cooling pipes under different flows, and the purpose of intelligent temperature control inside the high-speed camera main body 13 is further achieved.

According to shown in fig. 2 and 4, chip supporting plate 2 is provided with two sets ofly, vertical distribution about two sets of chip supporting plate 2, and the upper surface of two sets of chip supporting plate 2 all is provided with integral type water-cooling tube 1, and integral type water-cooling tube 1 on two sets of chip supporting plate 2 communicates mutually and constitutes the water-cooling pipeline, and the delivery port and the water inlet of water-cooling pipeline are located the one end of two sets of chip supporting plate 2 respectively, and the inside of chip supporting plate 2 is provided with water cavity 19, and water cavity 19 is provided with a plurality of groups in the inside of chip supporting plate 2.

It should be explained that, the surface of two sets of chip backup pads 2 has all brazed integral type water-cooling tube 1, integral type water-cooling tube 1 constitutes 1 holistic of integral type water-cooling tube with two sets of chip backup pads 2, the setting of the delivery port of integral type water-cooling tube 1 and the water inlet is in the one end of two sets of chip backup pads 2, its water inlet and the flow direction of delivery port according to water pump 14 internal water, can exchange, the heat that the main plate gived off in the camera heats the liquid that is located 19 insides of water cavity earlier very first time, 19 inside liquid absorption heat in water cavity carries out temporary storage this moment, carry the heat to the external environment heat sink of camera through water-cooling pipeline again, the heat loss of mainboard has been avoided in the inside environment of camera, the temperature rising trend at inside all the other positions of camera has been slowed down.

In this embodiment, the mainboard is provided with two sets ofly, is first mainboard 5 and second mainboard 6 respectively, and the equal fixed mounting of first mainboard 5 and second mainboard 6 is on the surface of chip backup pad 2.

It should be noted that, the first mainboard 5 of two sets of mainboards and the inside at high-speed camera main part 13 is all installed to second mainboard 6, and first mainboard 5 passes through bolt fixed mounting on the surface of two sets of chip backup pads 2 with second mainboard 6, and then has good contact laminating can effectively take away the heat that the chip gived off fast.

In this embodiment, the surface of the camera back cover plate 12 is provided with two sets of water-cooling pipe joints 18 penetrating the surface thereof, and the two sets of water-cooling pipe joints 18 are respectively connected with the water inlet and the water outlet of the integrated water-cooling pipe 1.

It should be noted that two groups of water-cooled pipe joints 18 are arranged on the surface of the camera back cover plate 12, and are connected with the water inlet and the water outlet of the integrated water-cooled pipe 1, one is connected with the inlet of the internal water circulation entering the water pump 14, and the other is used as the outlet of the internal water circulation discharged from the water pump 14.

In this embodiment, the CMOS support plate 3 and the two sets of chip support plates 2 are combined in the high-speed camera body 13 to form a structure in the shape of "Contraband".

It should be noted that, the heat emitted from the main board in the camera is transferred to the structure of the shape Contraband formed by the CMOS supporting board 3 and the two sets of chip supporting boards 2, so that the heat is gathered in the internal cavity formed by Contraband, the heat is prevented from being rapidly emitted to the inside of the whole camera, and the heat can be rapidly transferred to the external environment heat sink through the water cooling pipeline.

According to fig. 2, the surface of the heat dissipation cold row 15 is a saw-toothed structure, the saw-toothed structure is composed of a plurality of groups of heat dissipation fins 25, mounting holes 26 penetrating through the front and rear surfaces of the heat dissipation fins 25 are formed in the surface of the heat dissipation fins 25, two groups of fixed beams 27 are arranged in the mounting holes 26 in a crossed manner, the two groups of fixed beams 27 and the heat dissipation fins 25 are of an integrated structure, a rotating shaft 28 is arranged at the crossed position of the fixed beams 27, and a fan blade 29 is fixedly connected with the rotating shaft 28 by using a bolt.

It should be noted that, the cold row is arranged to be a zigzag structure, so that the contact area between the cold row and the air is increased, the cooling speed of the internal water path of the cold row is accelerated, and the heat dissipation effect is improved.

In this embodiment, the water pump 14, the heat dissipation cold bar 15, and the heat dissipation fan 16 are all externally disposed on the high-speed camera body 13.

It should be noted that, the structure required for water-cooling heat dissipation is disposed outside the high-speed camera main body 13, so as to improve the internal integration level of the high-speed camera main body 13, reduce the external size thereof, and avoid the risk of liquid leakage possibly occurring inside the high-speed camera main body.

In the embodiment, the side surface of the integrated water-cooling tube 1 is brazed on the side surface of the CMOS support plate 3, and the integrated water-cooling tube 1 is connected with the chip support plate 2 through brazing.

It should be noted that the integrated water cooling tube 1 inside the high-speed camera and the structural member adopt an integrated brazing type structure, so that the contact area and the heat dissipation effect are improved, and the integrated water cooling tube 1 inside the camera is not connected and has no liquid leakage risk.

According to the illustration in fig. 5, a cold drainage water channel 22 is arranged inside the heat dissipation cold drainage 15, filter screens 20 are arranged at water inlets and water outlets of the heat dissipation cold drainage 15, baffle plates 21 are arranged in the cold drainage water channel 22 and close to the water inlets and the water outlets, a scale collection cavity 23 communicated with the water inlets and the water outlets of the cold drainage water channel 22 is arranged at the top of the heat dissipation cold drainage 15, and plugs 24 are arranged at the top of the scale collection cavity 23.

It should be noted that, in order to ensure that the heat dissipation cold drainage can dissipate heat in time, the cold drainage water pipeline 22 arranged in the heat dissipation cold drainage 15 is long, the hydraulic retention time of water entering the cold drainage is long, meanwhile, due to frequent heating and cooling, scale is easily generated in the heat dissipation cold drainage 15, the baffle 21 is arranged to intercept the scale preliminarily, meanwhile, the water inlet and outlet are provided with the filter screens 20 to prevent the scale from entering the water pump and adding the internal pipelines, when the scale is formed to cause the heat dissipation effect to be poor, the water pump 14 can be disassembled and then the water inlet and outlet can be installed upside down and the internal water flow speed is increased, water flow accelerates and reversely flows inside the heat dissipation cold drainage 15, the internal scale can be loosened under the reverse flushing effect, the collected scale located in the baffle 21 or the cold drainage water pipeline 22 is flushed to the scale collection cavity 23 for collection, the scale generated inside the scale collection cavity 23 can be taken out by opening the plug 24 after the heat dissipation cold drainage 15 is disassembled, the depth of the scale collection cavity 23 is lower edge of the scale collection cavity 23, and the scale can be deposited under the gravity effect, and the scale collection cavity 23 can not enter the cold drainage water flow once again.

The high-speed camera with the intelligent temperature-control efficient heat dissipation structure provided by the embodiment has the following working process: after the high-speed camera main body 13 runs, the first main board 5 and the second main board 6 inside can generate heat, the integrated water-cooling pipe 1 is wound on the chip supporting plate 2 and the CMOS supporting plate 3 along a heat source in a brazing mode, the heat emitted by the chip on the main board can be taken away quickly and effectively through good contact and attachment, the integrated water-cooling pipe 1 penetrates out of the camera rear cover plate 12 and then is connected with the water pump 14 to take the heat out, then water path circulation is carried out through the heat dissipation cold discharge 15, and the heat inside the camera is led out to the environmental heat sink quickly through the heat dissipation fan 16;

meanwhile, internal wiring is led out through an RS422 aerial plug 17 arranged on the surface of the camera rear cover plate 12 and then connected to a control circuit of the water pump 14, the water pump 14 can be enabled to control a water-cooling heat dissipation system of the high-speed camera by receiving the temperature of an FPGA chip of a mainboard and adjusting the flow, the system reads the real-time temperature of registers of the FPGA chip on the first mainboard 5 and the second mainboard 6, the real-time temperature is transmitted to a controller circuit board of the water pump 14 through the RS422 aerial plug 17, the feedback to the water pump 14 is controlled through PWM pulse width modulation, the flow of the water pump 14 is adjusted through the change of the impeller rotating speed, the flow of the water pump 14 can be adjusted within the range of 13.5-670ml/min, when the heat dissipation change of the high-speed camera body 13 is large under different working modes or external environments, the temperature control feedback system can be used, the temperature of the FPGA chip is adjusted and controlled within the range of 65 +/-5 ℃ through the difference of the liquid in the water cooling pipes under different flows, and further the purpose of intelligent temperature control inside the high-speed camera body 13 is achieved.

It should be understood, however, that the intention is not to limit the invention to the particular embodiments described, but to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Claims

1. A high-speed camera with intelligent temperature-control efficient heat dissipation structure comprises: a high-speed camera main body (13) which is composed of a camera upper cover plate (7), a camera front cover plate (8), a camera left side plate (9), a camera bottom plate (10), a camera right side plate (11) and a camera rear cover plate (12);

the method is characterized in that: be provided with CMOS backup pad (3) in the inside of high-speed camera main part (13), the one end fixed mounting of CMOS backup pad (3) has CMOS chip (4), the right-hand inside that is located high-speed camera main part (13) of CMOS backup pad (3) is provided with chip backup pad (2), the last fixed surface of CMOS backup pad (3) and chip backup pad (2) installs integral type water-cooling pipe (1), the fixed surface of chip backup pad (2) has the mainboard of control camera operation, integral type water-cooling pipe (1) is connected with water pump (14) that set up at camera back shroud (12) surface, the surface of camera back shroud (12) is provided with and inserts (17) with water pump (14) and set up the RS422 that the inside water-cooling heat dissipation system of high-speed camera main part (13) is connected, water pump (14) are connected with heat dissipation cold row (15) that set up in its dead ahead through the water-cooling pipe, the fixed surface of heat dissipation cold row (15) installs radiator fan (16).

2. The high-speed camera with intelligent temperature-control efficient heat dissipation structure of claim 1, wherein: chip backup pad (2) are provided with two sets ofly, vertical distribution about two sets of chip backup pad (2), and the upper surface of two sets of chip backup pad (2) all is provided with integral type water-cooling tube (1), and integral type water-cooling tube (1) on two sets of chip backup pad (2) communicate mutually and constitute the water-cooling pipeline, and the delivery port and the water inlet of water-cooling pipeline are located same one end of two sets of chip backup pad (2) respectively, the inside of chip backup pad (2) is provided with water cavity (19), water cavity (19) are provided with a plurality of groups in the inside of chip backup pad (2).

3. The high-speed camera with intelligent temperature-control efficient heat dissipation structure of claim 2, wherein: the mainboard is provided with two sets ofly, is first mainboard (5) and second mainboard (6) respectively, the equal fixed mounting in the surface of chip backup pad (2) of first mainboard (5) and second mainboard (6).

4. The high-speed camera with intelligent temperature-control efficient heat dissipation structure of claim 1, wherein: the surface of the camera rear cover plate (12) is provided with two groups of water-cooling pipe joints (18) penetrating through the surface of the camera rear cover plate, and the two groups of water-cooling pipe joints (18) are respectively connected with the water inlet and the water outlet of the integrated water-cooling pipe (1).

5. The high-speed camera with intelligent temperature-control efficient heat dissipation structure of claim 1, wherein: the CMOS supporting plate (3) and the two groups of chip supporting plates (2) form a structure in the shape of Contraband in the high-speed camera body (13).

6. The high-speed camera with intelligent temperature-control efficient heat dissipation structure of claim 1, wherein: the surface of heat dissipation cold row (15) is the structure of cockscomb structure, cockscomb structure comprises a plurality of groups fin (25), mounting hole (26) that run through its front and back surface are seted up on the surface of fin (25), the interior intersection of mounting hole (26) is provided with two sets of fixed beams (27), two sets of fixed beams (27) and fin (25) formula structure as an organic whole, fixed beam (27) intersection is provided with pivot (28), and pivot (28) are through bolt fixedly connected with fan blade (29).

7. The high-speed camera with intelligent temperature-control efficient heat dissipation structure of claim 1, wherein: the water pump (14), the heat dissipation cold row (15) and the heat dissipation fan (16) are all externally arranged on the high-speed camera main body (13).

8. The high-speed camera with intelligent temperature-control efficient heat dissipation structure of claim 1, wherein: the side surface of the integrated water-cooling tube (1) is brazed on the side surface of the CMOS supporting plate (3), and the integrated water-cooling tube (1) is connected with the chip supporting plate (2) through brazing.

9. The high-speed camera with intelligent temperature-control efficient heat dissipation structure of claim 6, wherein: the utility model discloses a water scale collection chamber, including heat dissipation cold row (15), just the cold row of just dispelling the heat (15) inlet and outlet position all is provided with filter screen (20), be close to inlet and outlet position and all be provided with baffle (21) in cold row water pipeline (22), heat dissipation cold row (15) are located its top and are provided with and connect the incrustation scale collection chamber (23) that cold row water pipeline (22) inlet and outlet all communicate, the top that the chamber (23) was collected to the incrustation scale is provided with end cap (24).