CN218011621U - Air inlet treatment system of semiconductor production equipment - Google Patents
Air inlet treatment system of semiconductor production equipment Download PDFInfo
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- CN218011621U CN218011621U CN202221786054.1U CN202221786054U CN218011621U CN 218011621 U CN218011621 U CN 218011621U CN 202221786054 U CN202221786054 U CN 202221786054U CN 218011621 U CN218011621 U CN 218011621U
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- condensing
- condensing tank
- pipe
- air
- waste gas
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Abstract
The utility model relates to a semiconductor device technical field, concretely relates to semiconductor production facility processing system that admits air, including filter equipment and condensing equipment, condensing equipment includes the air duct, the condensing tank, the feed liquor pipe, the drain pipe, first intake pipe and flowing back valve door, filter equipment is used for filtering waste gas, organic coolant liquid adds the condensation chamber from the feed liquor pipe, discharge from the drain pipe, make condensing tank temperature reduce, waste gas gets into the condensing tank from first intake pipe, harmful gas that the melting point is high turns into liquid under microthermal influence, with the dust in the waste gas together in the deposit of condensing tank bottom portion, remaining waste gas passes through the air duct and gets into filter equipment, condensing equipment has reduced dust and waste gas composition in the waste gas, avoid semiconductor waste gas's treatment facility to block up and corrode, the treatment facility that has solved semiconductor waste gas needs often to wash the maintenance, the problem of cost is improved.
Description
Technical Field
The utility model relates to a semiconductor equipment technical field especially relates to a semiconductor production equipment processing system that admits air.
Background
Chemical vapor deposition processes are widely used in the semiconductor chip manufacturing industry, but the reaction source used in the chemical vapor deposition process and the residual gas after the reaction may have flammable, explosive and toxic hazards, and the residual gas contains a large amount of dust, so it is important to perform harmless treatment on the exhaust gas generated in the chemical vapor deposition process to prevent environmental pollution.
Prior art (CN 215391484U) discloses a semiconductor waste gas treatment device, including shell and filtration, the surface of shell is provided with filtration, filtration includes the long slab, the long slab welds with the surface of shell mutually, the inside of long slab rotates and is inserted and is equipped with the rocker, the fixed surface of rocker is connected with the gear, the surface meshing of gear has the rack, the spout has been seted up on the surface of rack, the surperficial sliding connection of spout has the slide bar, the skin weld of slide bar has the clamping bar, the surface threaded connection of clamping bar has first screw, the surface rotation of first screw is connected with the square, the inside of shell is inserted and is equipped with the carbon box, the skin weld of long slab has the supporting shoe, the surface of supporting shoe is inserted and is equipped with the bolt, the supporting shoe has two, the bolt runs through two supporting shoes simultaneously. The utility model discloses, can make things convenient for quick change the carbon box.
The semiconductor waste gas has complex components and large discharge amount, and the waste gas contains a large amount of dust, so the equipment is easy to block and corrode, frequent cleaning and maintenance are needed, and the cost is increased.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor production facility processing system that admits air, the treatment facility that aims at solving semiconductor waste gas needs often to wash the maintenance, has improved the problem of cost.
In order to achieve the purpose, the utility model provides an air inlet treatment system of semiconductor production equipment, which comprises a filtering device and a condensing device, wherein the condensing device is fixedly connected with the filtering device and is positioned on one side of the filtering device;
condensing equipment includes air duct, condensing tank, feed liquor pipe, drain pipe, first intake pipe and flowing back valve, the air duct with filter equipment intercommunication, and be located filter equipment one side, the condensing tank with air duct fixed connection, and be located the air duct is kept away from filter equipment one side, the condensing tank is provided with the condensation chamber, the condensation chamber is located inside the condensing tank, the feed liquor pipe with the condensing tank intercommunication, and be located condensing tank one side, the drain pipe with the condensing tank intercommunication, and be located the condensing tank is close to feed liquor pipe one side, first intake pipe with the condensing tank intercommunication, and be located the condensing tank top, flowing back valve with the condensing tank intercommunication, and be located the condensing tank is close to feed liquor pipe one side.
The filter device comprises an air blower, a second air inlet pipe, a filter box and an air outlet pipe, the air blower is fixedly connected with the air guide pipe and is positioned at the position where the air guide pipe is far away from one side of the condensing tank, the second air inlet pipe is communicated with the air blower and is positioned at the position where the air blower is far away from one side of the air guide pipe, the filter box is fixedly connected with the second air inlet pipe and is positioned at the position where the second air inlet pipe is far away from one side of the air blower, and the air outlet pipe is communicated with the filter box and is positioned at the position where the filter box is far away from one side of the second air inlet pipe.
The condensing device further comprises a plurality of cooling plates, and the cooling plates are fixedly connected with the condensing tank respectively and are located inside the condensing tank.
The condensing device further comprises an observation window, and the observation window is fixedly connected with the condensing tank and is positioned on one side of the condensing tank.
The cooling tank is provided with a protection sleeve, and the protection sleeve is located on the outer side of the cooling tank.
The utility model discloses a semiconductor production equipment processing system that admits air, filter equipment is used for filtering waste gas, prevents harmful gas polluted environment, and the manual work passes through organic coolant liquid the feed liquor pipe is added in the condensation chamber, through the drain pipe is discharged organic coolant liquid, forms a circulation, makes condensation tank temperature reduces, and waste gas passes through first intake pipe gets into in the condensation tank, gas molecule and dust particle activity in the waste gas reduce under microthermal influence, and the harmful gas that the melting point is high turns into liquid, takes a large amount of dust in the waste gas to be in condensation tank bottom deposit has reduced dust and waste gas composition in the waste gas, and remaining waste gas passes through the air duct gets into filter equipment is middle and filtration, passes through after the filter work is accomplished the flowing back valve will the waste liquid and the dust discharge of condensation tank bottom, through condensing equipment has reduced dust and waste gas composition in the waste gas, avoids the processing equipment of semiconductor waste gas to block up and corrode, has reduced the washing maintenance frequency of the processing equipment of semiconductor waste gas, has solved the processing equipment of semiconductor waste gas and has needed frequent washing maintenance, has improved the problem of cost.
Drawings
In order to more clearly illustrate the embodiments or prior art solutions in the present application, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of an air inlet processing system of semiconductor production equipment provided by the present invention.
Fig. 2 is a longitudinal sectional view of the condensation assembly of the air inlet treatment system of the semiconductor production equipment along the direction of the air duct.
Fig. 3 is a front view of an inlet processing system of a semiconductor manufacturing apparatus according to the present invention.
1-filtering device, 2-condensing device, 3-blower, 4-second air inlet pipe, 5-filtering box, 6-air outlet pipe, 7-air guide pipe, 8-condensing tank, 9-liquid inlet pipe, 10-liquid outlet pipe, 11-first air inlet pipe, 12-liquid discharge valve, 13-cooling plate, 14-observation window, 15-protective cover and 16-condensing cavity.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention. In addition, in the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1 to 3, the present invention provides an inlet gas treatment system for semiconductor manufacturing equipment, including a filtering device 1 and a condensing device 2, wherein the condensing device 2 is fixedly connected to the filtering device 1 and located at one side of the filtering device 1;
In this embodiment, filter equipment 1 is used for filtering waste gas, prevents harmful gas pollution environment, and the manual work passes through organic coolant liquid in the feed liquor pipe 9 adds in the condensation chamber 16, through drain pipe 10 discharges organic coolant liquid, forms a circulation, makes condensation jar 8 temperature reduces, and waste gas passes through first intake pipe 11 gets into in the condensation jar 8, gas molecules and dust particle activity in the waste gas reduce under microthermal influence, and the harmful gas that the melting point is high turns into liquid, takes a large amount of dust in the waste gas to be in condensation jar 8 bottom deposit has reduced dust and waste gas composition in the waste gas, and remaining waste gas passes through air duct 7 gets into filter equipment 1 is middle-line filtration, and the back is accomplished in the filter work passes through leakage fluid dram 12 will the waste liquid and the dust discharge of condensation jar 8 bottom, through condensing equipment 2 has reduced dust and the waste gas composition in the waste gas, avoids semiconductor waste gas's treatment facility to block up and corrode, has reduced semiconductor waste gas's treatment facility's washing maintenance frequency, has solved semiconductor waste gas's treatment facility and need wash the maintenance, has improved the problem that the cost often.
Further, filter equipment 1 includes air-blower 3, second intake pipe 4, rose box 5 and outlet duct 6, air-blower 3 with air duct 7 fixed connection, and be located air duct 7 is kept away from condensation jar 8 one side, second intake pipe 4 with air-blower 3 intercommunication, and be located air-blower 3 is kept away from air duct 7 one side, rose box 5 with second intake pipe 4 fixed connection, and be located second intake pipe 4 is kept away from air-blower 3 one side, outlet duct 6 with rose box 5 intercommunication, and be located rose box 5 is kept away from second intake pipe 4 one side.
In this embodiment, the blower 3 sucks the residual waste gas after condensation treatment into the filter box 5 from the second air inlet pipe 4, and filters the residual waste gas through the filter box 5 to adsorb and filter the residual harmful gas and the trace dust so as to prevent the residual harmful gas and the trace dust from polluting the environment, and then discharges the residual harmless gas from the air outlet pipe 6.
Further, the condensing device 2 further comprises a plurality of cooling plates 13, and the plurality of cooling plates 13 are respectively and fixedly connected with the condensing tank 8 and are all positioned inside the condensing tank 8; the condensing device 2 further comprises an observation window 14, and the observation window 14 is fixedly connected with the condensing tank 8 and is positioned on one side of the condensing tank 8; the condensation tank 8 is provided with a protecting sleeve 15, and the protecting sleeve 15 is positioned outside the condensation tank 8.
In this embodiment, cooling plate 13 is the metal sheet that copper or copper alloy made, has good heat conductivility, cooling plate 13 and waste gas large tracts of land contact are arrived the heat transfer in the waste gas on the condensation jar 8, further strengthen condensing equipment 2's condensation effect prevents that waste gas from not condensing and get into completely filter equipment 1, observation window 14 makes things convenient for artifical the inside condition of condensation jar 8 is observed, in time discharges the clearance to waste liquid and dust, lag 15 will the cold air of condensation jar 8 is isolated, prevents to freeze and hinders the manual work.
While the present invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the invention.
Claims (5)
1. A semiconductor production equipment inlet gas treatment system comprises a filtering device and a condensing device, wherein the condensing device is fixedly connected with the filtering device and is positioned at one side of the filtering device,
condensing equipment includes air duct, condensing tank, feed liquor pipe, drain pipe, first intake pipe and flowing back valve, the air duct with filter equipment intercommunication, and be located filter equipment one side, the condensing tank with air duct fixed connection, and be located the air duct is kept away from filter equipment one side, the condensing tank is provided with the condensation chamber, the condensation chamber is located inside the condensing tank, the feed liquor pipe with the condensing tank intercommunication, and be located condensing tank one side, the drain pipe with the condensing tank intercommunication, and be located the condensing tank is close to feed liquor pipe one side, first intake pipe with the condensing tank intercommunication, and be located the condensing tank top, flowing back valve with the condensing tank intercommunication, and be located the condensing tank is close to feed liquor pipe one side.
2. The semiconductor manufacturing facility gas inlet treatment system of claim 1,
the filter device comprises an air blower, a second air inlet pipe, a filter box and an air outlet pipe, the air blower is fixedly connected with the air guide pipe and is located at the position where the air guide pipe is far away from one side of the condensing tank, the second air inlet pipe is communicated with the air blower and is located at the position where the air guide pipe is far away from one side of the air guide pipe, the filter box is fixedly connected with the second air inlet pipe and is located at the position where the second air inlet pipe is far away from one side of the air blower, and the air outlet pipe is communicated with the filter box and is located at the position where the filter box is far away from one side of the second air inlet pipe.
3. The semiconductor manufacturing facility inlet gas treatment system of claim 1,
the condensing device further comprises a plurality of cooling plates, and the cooling plates are fixedly connected with the condensing tank respectively and are located inside the condensing tank.
4. The semiconductor manufacturing facility gas inlet treatment system of claim 1,
the condensing device further comprises an observation window, and the observation window is fixedly connected with the condensing tank and is positioned on one side of the condensing tank.
5. The semiconductor manufacturing facility gas inlet treatment system of claim 1,
the condensing tank is provided with a protecting sleeve, and the protecting sleeve is located on the outer side of the condensing tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221786054.1U CN218011621U (en) | 2022-07-12 | 2022-07-12 | Air inlet treatment system of semiconductor production equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221786054.1U CN218011621U (en) | 2022-07-12 | 2022-07-12 | Air inlet treatment system of semiconductor production equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218011621U true CN218011621U (en) | 2022-12-13 |
Family
ID=84383428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221786054.1U Active CN218011621U (en) | 2022-07-12 | 2022-07-12 | Air inlet treatment system of semiconductor production equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218011621U (en) |
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2022
- 2022-07-12 CN CN202221786054.1U patent/CN218011621U/en active Active
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