CN218006829U

CN218006829U - Positioning mechanism and heat dissipation device of power tube

Info

Publication number: CN218006829U
Application number: CN202221434952.0U
Authority: CN
Inventors: 张涛; 陈脱颖
Original assignee: Xian Linchr New Energy Technology Co Ltd
Current assignee: Xian Linchr New Energy Technology Co Ltd
Priority date: 2022-06-09
Filing date: 2022-06-09
Publication date: 2022-12-09
Anticipated expiration: 2032-06-09

Abstract

The application provides a positioning mechanism and a heat dissipation device of a power tube, wherein the positioning mechanism is used for positioning and mounting a ceramic substrate and comprises a positioning frame, and the positioning frame is provided with a plurality of positioning spaces; the positioning space is matched with the ceramic substrate and used for accommodating the ceramic substrate. During the application, the ceramic substrate is installed in the position that the location space corresponds, location space and ceramic substrate phase-match, the side of locating rack butt ceramic substrate, there is the limiting displacement to the ceramic substrate, make the ceramic substrate be difficult to break away from former mounted position in the use, compared with the prior art, this application positioning mechanism can pinpoint the installation ceramic substrate, the reduction influences the radiating effect because of the mounted position is inaccurate, and have the limiting displacement to the ceramic substrate, prevent the problem that the ceramic substrate shifted because of vibrations in the use, the insulation and the heat transfer stability between ceramic substrate and the power pipe have been improved, and then insulating properties and radiating effect have been improved.

Description

Positioning mechanism and heat dissipation device of power tube

Technical Field

The application belongs to the technical field of power tube heat dissipation accessories, and particularly relates to a positioning mechanism and a heat dissipation device of a power tube.

Background

In the Field of electronics and electrics, high power transistors are commonly referred to as power transistors, which include, but are not limited to, IGBTs (Insulated Gate Bipolar Transistor), diodes, MOS transistors (Metal-Oxide-Semiconductor Field Effect transistors), and the like. The power tube can produce great heat in the course of working, and these heats need to be dissipated in time just can guarantee the continuous reliable operation of power tube.

At present, the heat dissipation of the power tube generally adopts the heat conduction adhesive tape or the ceramic substrate placed between the power tube and the radiator for insulation and heat transfer, but the heat dissipation coefficient of the heat conduction adhesive tape is low, so that the heat dissipation efficiency is low, and the heat dissipation effect is not ideal; the heat dissipation coefficient of the ceramic substrate is higher than that of the heat conduction adhesive tape, the heat dissipation effect is better than that of the heat conduction adhesive tape, but the ceramic substrate is unstable in installation and can shift, or the installation position is inaccurate in assembly, so that the positions of the ceramic substrate and the power tube do not correspond, the insulation and heat transfer between the power tube and the ceramic substrate are poor, and safety regulations and the heat dissipation effect are affected.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a positioning mechanism to ceramic substrate installation that exists among the solution prior art is unstable, leads to insulating and the not good technical problem of radiating effect.

The application also provides a heat abstractor of power tube, contains above-mentioned positioning mechanism, can stably install the ceramic substrate, improves the radiating effect.

In order to achieve the purpose, the technical scheme adopted by the application is as follows: the positioning mechanism is used for positioning and mounting the ceramic substrate and comprises a positioning frame, wherein a plurality of positioning spaces are formed in the positioning frame; the positioning space is matched with the ceramic substrate and used for accommodating the ceramic substrate.

Optionally, the positioning frame includes a plurality of positioning columns, two adjacent positioning columns are spaced apart from each other, and a positioning space is formed between two adjacent positioning columns.

Optionally, the positioning mechanism further includes a support, the support is connected with the positioning frame in a bending manner, the positioning frame extends along one side of the support, the support includes a first side, a second side and a third side that are connected in sequence, the first side and the third side are arranged oppositely, the plurality of positioning columns are distributed on the first side, the second side and the third side, and the plurality of positioning columns enclose the middle portion of the support into a containing space.

Optionally, one end of each positioning column is connected with the support, and an opening is formed between the other ends of two adjacent positioning columns at an interval.

Optionally, the positioning mechanism is provided with a positioning connection structure.

Optionally, the positioning connection structure is a post hole or a post projection.

A heat dissipation device for a power tube, comprising:

a heat sink including a support table;

a ceramic substrate; and

in the positioning mechanism according to any one of the above aspects, the support is connected to the support table, the inner side of the positioning frame abuts against the outer periphery of the support table, the support table forms an installation region corresponding to the region of the positioning space, and the ceramic substrate is installed in the installation region.

Optionally, the support table comprises a table body and a convex edge, the convex edge is connected with one end of the table body, the convex edge protrudes out of the outer surface of the table body, and a step is formed between the convex edge and the table body; the inner side of the positioning frame is abutted against the side surface of the table body, and the mounting area is positioned on the side surface of the table body; the end of the ceramic substrate far away from the positioning frame is abutted against the convex edge.

Optionally, the positioning mechanism is provided with a positioning connection structure, and the heat sink is provided with a heat dissipation connection structure used in cooperation with the positioning connection structure.

Optionally, the ceramic substrate has a quadrilateral structure, and the positioning space has the same shape structure as the ceramic substrate.

1. The utility model provides a positioning mechanism, can be applied to the heat abstractor of power tube, be used for fixing a position installation ceramic substrate, in application, the ceramic substrate is installed in the position that the location space corresponds, the location space matches with the ceramic substrate, then the ceramic substrate can be installed in the location space just, the side of locating rack butt ceramic substrate, restriction effect has to the ceramic substrate, make the ceramic substrate be difficult to break away from original mounted position in the use, compared with the prior art, this application positioning mechanism, can pinpoint the installation ceramic substrate, reduce and influence the radiating effect because of the mounted position is inaccurate, and have restriction effect to the ceramic substrate, prevent the problem that the ceramic substrate shifted because of vibrations in the use, the insulation and the heat transfer stability between ceramic substrate and the power tube have been improved, and then insulating properties and radiating effect have been improved;

2. the application provides a heat abstractor of power tube, accurate ceramic substrate installation area has been set for on the radiator, use with the positioning mechanism cooperation, the side of locating rack butt brace table, the brace table corresponds the location space and exposes in the installation area as ceramic substrate outside, confirm the position of installation area through the position of confirming the location space promptly, make the ceramic substrate can be accurate, install stably at preset position, adopt the ceramic substrate as the fin, the ceramic substrate has insulating nature and coefficient of heat dissipation height, the insulating effect and the radiating effect of power tube have been improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments or the prior art description will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings may be obtained according to these drawings without inventive labor.

Fig. 1 is a schematic structural diagram of a heat dissipation apparatus for a power tube according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of the heat dissipation device of the power tube in fig. 1 without the ceramic substrate;

fig. 3 is a schematic structural diagram of a heat sink in the heat dissipation device of the power tube in fig. 1;

fig. 4 is a first structural diagram of a positioning mechanism in the heat dissipation device of the power tube in fig. 1;

fig. 5 is a schematic application diagram of a heat dissipation device of the power tube of fig. 1;

fig. 6 is a schematic application diagram of the heat dissipation device of the power tube according to embodiment 1;

FIG. 7 is a schematic diagram of a positioning mechanism in the heat dissipation device of the power transistor of FIG. 6;

fig. 8 is a schematic structural view of a ceramic substrate in the heat dissipation device of the power tube of fig. 6.

Wherein, in the figures, the various reference numbers:

10. a heat sink for the power tube;

20. a heat sink; 21. a support table; 211. a table body; 212. a convex edge; 22. an installation area; 23. a substrate; 24. a heat dissipation connection structure;

30. a ceramic substrate;

40. a positioning mechanism; 41. a support; 42. a positioning frame; 421. a positioning column; 43. positioning a space; 44. positioning the connecting structure;

500. a power tube.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1 to fig. 6, a heat dissipation device 10 of a power tube according to an embodiment of the present disclosure will be described. The heat sink 10 of the power tube includes a heat sink 20, a ceramic substrate 30, and a positioning mechanism 40.

The heat sink 20 includes a support base 21. The positioning mechanism 40 comprises a positioning frame 42, and the positioning frame 42 is provided with a plurality of positioning spaces 43; the positioning space 43 is matched with the ceramic substrate 30, and the ceramic substrate 30 is disposed in the positioning space 43. The inner side of the positioning frame 42 abuts against the outer periphery of the support base 21, the support base 21 forms a mounting area 22 corresponding to the area of the positioning space 43, and the ceramic substrate 30 is mounted on the mounting area 22.

The inner side of the positioning frame 42 in the embodiment of the present application refers to a surface of the positioning frame 42 facing the central axis of the positioning mechanism 40.

The heat dissipation device 10 of the power tube provided by the embodiment of the application can be applied to a heat dissipation system of the power tube 500 in the field of vehicle-mounted power supplies, and the accurate ceramic substrate 30 installation region 22 is set on the heat sink 20 and is matched with the positioning mechanism 40 for use. After the positioning mechanism 40 is connected to the heat sink 20, the support table 21 is exposed to the outside as the mounting region 22 of the ceramic substrate 30 corresponding to the positioning space 43, that is, the position of the mounting region 22 is determined by determining the position of the positioning space 43.

The locating rack 42 is limited to the region of a fixed size with the corresponding location space 43 of brace table 21, as the region of installation ceramic substrate 30, the location space 43 and the ceramic substrate 30 phase-match of positioning mechanism 40, then the installation region 22 and the ceramic substrate 30 phase-match of brace table 21, location space 43 can be arranged in just to ceramic substrate 30, and install in the installation region 22 of brace table 21, the lateral wall of location space 43 is the week side of butt ceramic substrate 30 respectively, play the limiting action to ceramic substrate 30, make ceramic substrate 30 accurate, install stably at predetermineeing the position, and be difficult to break away from former mounted position in the use, the stable heat transfer between ceramic substrate 30 and power pipe 500 has been guaranteed.

Compared with the prior art, in the heat dissipation device 10 of the power tube provided by the embodiment of the application, the positioning mechanism 40 can accurately position and mount the ceramic substrate 30, so that the problem that the safety distance between the power tube 500 and the radiator 20 is insufficient due to improper placement of the ceramic substrate 30, so that the heat dissipation effect is poor, and dangerous accidents such as explosion, injury to people and the like can occur to the product is avoided; the positioning mechanism 40 limits the ceramic substrate 30, so that the problem of displacement of the ceramic substrate 30 due to vibration during use can be prevented, the insulation and heat transfer stability between the ceramic substrate 30 and the power tube 500 is improved, and the insulation performance and the heat dissipation effect are further improved.

In addition, the heat sink 10 of the power tube according to the embodiment of the present application uses the ceramic substrate 30 as a heat sink, and the ceramic substrate 30 has high insulation and heat dissipation coefficients, thereby improving the insulation effect and heat dissipation effect of the power tube 500.

In one embodiment of the present application, referring to fig. 3, the heat sink 20 includes a substrate 23, the supporting platform 21 is connected to the substrate 23, and the substrate 23 provides a mounting base for the supporting platform 21 and other components of the heat sink 20 and is used for connecting external devices.

In one embodiment, as shown in fig. 3, the supporting platform 21 includes a platform 211 and a flange 212, the flange 212 is connected to an end of the platform 211 away from the positioning frame 42, the flange 212 protrudes from an outer surface of the platform 211 to form a step with the platform 211; the inner side of the positioning frame 42 abuts against the side surface of the table body 211, and the mounting region 22 is located on the side surface of the table body 211. The flange 212 may be used to mount the ceramic substrate 30 in cooperation with the spacer 42.

Alternatively, the height H1 of the platform 211 relative to the rim 212 may be greater than or equal to the height H2 of the positioning frame 42. However, when the height H1 of the table body 211 is equal to the height H2 of the positioning frame 42, one end of the positioning frame 42 abuts against the flange 212, and at this time, there is a friction force between the positioning frame 42 and the flange 212, and in order to reduce the mode between the positioning frame 42 and the supporting table 21, generally, the height H1 of the table body 211 is selected to be greater than the height H2 of the positioning frame 42.

Optionally, the heat sink 20 is provided with a heat dissipating connection 24 for connecting the heat sink 20 with the positioning mechanism 40.

Alternatively, the heat dissipation connecting structure 24 is a post hole or a post protrusion.

In one embodiment, as shown in fig. 4, the positioning mechanism 40 further includes a support 41, the support 41 is connected with a positioning frame 42 in a bending manner, and the positioning frame 42 extends along one side of the support 41. The support 41 is connected to the top of the support platform 21, the positioning frame 42 abuts against the side surface of the support platform 21, and the positioning mechanism 40 is connected to the heat sink 20 stably through the connection of the support 41 and the positioning frame 42 with the support platform 21 in the horizontal and vertical directions.

It is understood that the bracket 41 and the positioning frame 42 can be integrally formed, which is beneficial to the structural design and production operation, and the connection is more secure.

In one embodiment, the positioning frame 42 and the bracket 41 are perpendicular to each other, so as to better support each other and facilitate assembly.

It is understood that the positioning frame 42 may be a continuous plate-like or block-like structure, and a through hole is formed on the plate-like or block-like structure as the positioning space 43; alternatively, the positioning frame 42 may be composed of a plurality of members, the positioning space 43 is formed by the intervals of the plurality of members, and the ceramic substrate 30 is interposed in the positioning space 43 between two adjacent members when the ceramic substrate 30 is assembled.

In an embodiment of the present application, referring to fig. 4 and fig. 5, the positioning frame 42 includes a plurality of positioning pillars 421, two adjacent positioning pillars 421 are spaced apart from each other, and a positioning space 43 is formed between two adjacent positioning pillars 421. The positioning frame 42 is composed of a plurality of positioning columns 421, so that the clinging degree of the positioning frame 42 abutting against the supporting table 21 can be adjusted more easily, the heat transfer rate between the positioning frame 42 and the supporting table 21 is improved, the position of the positioning space 43 can be designed conveniently, and materials are saved.

Optionally, the bracket 41 includes a first side, a second side, and a third side that are connected in sequence, and the first side and the third side are disposed oppositely, the plurality of positioning columns 421 are distributed on the first side, the second side, and the third side, and the plurality of positioning columns 421 enclose a middle portion of the bracket 41 into a receiving space. During assembly, the table body 211 is accommodated in the accommodating space, and the support 41 and the positioning frame 42 are sleeved on the periphery of the table body 211 to form multi-directional connection among the support 41, the positioning frame 42 and the table body 211, so that connection firmness is improved.

It will be understood that the positioning space 43 may be a closed-loop through hole structure, or may also be a through hole with an opening on the sidewall, and a part of the ceramic substrate 30 may extend out of the positioning space 43 through the opening to connect with other components.

It is understood that the ceramic substrate 30 may have a polygonal structure or a circular or oval structure or other shapes, and the positioning space 43 has the same shape structure as the ceramic substrate 30 to match the arrangement of the ceramic substrate 30 and to limit the ceramic substrate 30 in the positioning space 43.

In some preferred embodiments, the ceramic substrate 30 has a polygonal structure, and the positioning space 43 has a corresponding polygonal structure, so that the ceramic substrate 30 is restricted by the positioning frame 42 and cannot rotate if it is rotated clockwise or counterclockwise, thereby avoiding the problem of rotation loosening. For example, as shown in fig. 6, when the ceramic substrate 30 has a quadrilateral structure, the positioning space 43 has a matching quadrilateral structure, which effectively limits the possible rotation of the ceramic substrate 30 in the positioning space 43 and prevents the ceramic substrate 30 from rotating and loosening.

It will be appreciated that the positioning space 43 may be a closed loop type space or may be provided with an opening. The closed-loop space is that the side edge of the positioning space 43 is not provided with a notch, the peripheral sides of the ceramic substrates 30 are all abutted against the positioning frame 42, at this time, the contact area between the ceramic substrates 30 and the positioning frame 42 is the largest, and the positioning frame 42 limits the ceramic substrates 30 to the largest extent.

The positioning space 43 is provided with an opening, that is, the side edge of the positioning space 43 is provided with at least one opening, at least one side edge of the ceramic substrate 30 is abutted to the positioning frame 42 and limited by the positioning frame 42, and the positioning space 43 is provided with an opening which is beneficial to the diversified design of the connection structure or the assembly mode of the ceramic substrate 30 and other components. As long as the ceramic substrate 30 and the positioning space 43 can be installed in a matching manner, the ceramic substrate 30 can be limited.

In one embodiment of the present application, as shown in fig. 4, the positioning space 43 is provided with an opening, and the positioning space 43 is opened to face away from the bracket 41. When the positioning frame 42 includes a plurality of positioning posts 421, one end of each positioning post 421 is connected to the support 41, and an opening is formed between the other ends of two adjacent positioning posts 421. At this time, the height H1 of the table 211 is larger than the height H2 of the positioning frame 42. The positioning space 43 has an open design for convenient assembly, after the ceramic substrate 30 is mounted in the mounting region 22, three sides of the ceramic substrate 30 abut against the side walls of the positioning space 43, the side of the ceramic substrate 30 far away from the positioning frame 42 abuts against the convex edge 212, and the convex edge 212 supports the ceramic substrate 30.

Optionally, the positioning mechanism 40 is provided with a positioning connection 44 for use with the heat dissipating connection 24. In one embodiment, the positioning connection structure 44 is disposed on the support 41, and in this case, the heat dissipation connection structure 24 can be disposed on the support platform 21 for connecting the support 41 with the support platform 21, so as to connect the positioning mechanism 40 with the heat sink 20.

Alternatively, the positioning connection structure 44 is a post hole or a post projection. The positioning connection structure 44 is used in cooperation with the heat dissipation connection structure 24, and when the heat dissipation connection structure 24 is a column hole, the positioning connection structure 44 is a column-shaped protrusion matched with the column hole; when the heat dissipation connecting structure 24 is a cylindrical protrusion, the positioning connecting structure 44 is a matching cylindrical hole. The assembly and disassembly are convenient, and the positioning is accurate.

It is understood that the column hole may be a column hole with screw threads, and when in use, the column hole is fastened by screws or the like; the column hole can also be a column hole with a smooth wall.

In some embodiments, the central axis of the through hole or the pillar-shaped protrusion is parallel to the extending direction of the positioning pillar 421. The positioning connection structure 44 is disposed on a side of the support 41 close to the stage body 211, and the heat dissipation connection structure 24 is disposed on a side of the stage body 211 close to the support 41, and the position of the heat dissipation connection structure 24 corresponds to the position of the positioning connection structure 44. During assembly, the bracket 41 approaches the stage 211 along the extending direction of the pillar hole or the pillar protrusion until the bracket 41 abuts against the stage 211, and the positioning connection structure 44 is connected with the heat dissipation connection structure 24 in a matching manner, that is, the bracket 41 is connected with the stage 211.

Optionally, the bracket 41 has a plate-shaped structure, and the bracket 41 includes a limiting surface, and the limiting surface and the positioning column 421 are located on the same side of the bracket 41; the supporting platform 21 comprises a supporting surface, and after the support 41 is connected with the supporting platform 21, the limiting surface is tightly attached to the supporting surface. In some embodiments, a groove is formed in a side of the table body 211 facing the support 41, and the support 41 having a plate-like structure can cover the groove after being connected to the table body 211, so as to prevent foreign objects from falling into the groove and damaging components therein.

During assembly, the positioning frame 42 moves along the side surface of the support platform 21 in a direction close to the substrate 23 until the support 41 abuts against the support platform 21, the heat dissipation connecting structure 24 is connected with the positioning connecting structure 44 in a matching manner, the positioning frame 42 is sleeved on the periphery of the support platform 21, and the side surface of the support platform 21 corresponding to the positioning space 43 is used as the mounting area 22 of the ceramic substrate 30. Setting the surface of the ceramic substrate 30 close to the support platform 21 as the back surface, and setting the surface of the ceramic substrate 30 far away from the support platform 21 as the front surface; the side walls of the mounting area 22 and the positioning space 43 in the area are coated with heat-conducting adhesive, the back of the ceramic substrate 30 is adhered to the mounting area 22, at the moment, the three side edges of the ceramic substrate 30 are abutted to the side walls of the positioning space 43, the ceramic substrate 30 is far away from the side abutting boss of the support 41, the front of the ceramic substrate 30 is exposed outside and then is compressed, and when the heat-conducting adhesive is dried and solidified, the positioning and mounting of the ceramic substrate 30 are completed. When the power tube 500 is mounted, as shown in fig. 5, the front surface of the ceramic substrate 30 is coated with a heat conductive adhesive, and then the power tube 500 is adhered to the corresponding ceramic substrate 30.

The positioning mechanism 40 and the radiator 20 are matched to use the positioning and mounting ceramic substrate 30, the ceramic substrate 30 can be accurately mounted at the designed position, the implementation mode is simple, the operability is strong, the modular design of the whole vehicle-mounted product is realized, the assembly and the disassembly of each part have high independence, the assembly efficiency and the production efficiency of the product can be greatly improved, the reject ratio of the product is reduced, the positioning mechanism 40 can be recycled, and the economic benefit of the product is greatly contributed.

Example 1

As shown in fig. 6 to 8, the heat sink 10 of the power tube of the present embodiment includes a heat sink 20, a ceramic substrate 30, and a positioning mechanism 40.

The heat sink 20 includes a support base 21. The heat sink 20 includes a substrate 23, the supporting platform 21 is connected to the substrate 23, and the substrate 23 provides a mounting base for the supporting platform 21 and other components of the heat sink 20 and is used for connecting external devices.

The support table 21 comprises a table body 211 and a convex edge 212, the convex edge 212 is connected with one end of the table body 211 far away from the positioning frame 42, the convex edge 212 protrudes out of the outer surface of the table body 211, and a step is formed between the convex edge 212 and the table body 211; the inner side of the positioning frame 42 abuts against the side surface of the table body 211, and the mounting region 22 is located on the side surface of the table body 211. The flange 212 may be used to mount the ceramic substrate 30 in cooperation with the spacer 42.

The height H1 of the platform 211 relative to the rim 212 can be greater than or equal to the height H2 of the positioning frame 42. However, when the height H1 of the table body 211 is equal to the height H2 of the positioning frame 42, one end of the positioning frame 42 abuts against the flange 212, and at this time, there is a friction force between the positioning frame 42 and the flange 212, and in order to reduce the mode between the positioning frame 42 and the supporting table 21, generally, the height H1 of the table body 211 is selected to be greater than the height H2 of the positioning frame 42.

The heat sink 20 is provided with a heat dissipating connection 24 for connecting the heat sink 20 with the positioning mechanism 40.

The heat dissipation connecting structure 24 is a columnar protrusion.

The ceramic substrate 30 serves as a heat sink, and the ceramic substrate of this embodiment has a square shape.

The positioning mechanism 40 includes a bracket 41, a positioning frame 42 and a positioning connection structure 44, which are integrally formed, the bracket 41 is connected with the positioning frame 42 in a bending manner, the positioning frame 42 extends along one side of the bracket 41, and the positioning frame 42 is perpendicular to the bracket 41. The support 41 is connected to the top of the support platform 21, the inner side of the positioning frame 42 is abutted to the periphery of the support platform 21, and the positioning mechanism 40 is stably connected to the heat sink 20 through the connection of the support 41 and the positioning frame 42 with the support platform 21 in the horizontal and vertical directions.

The positioning frame 42 includes a plurality of positioning columns 421, one end of each positioning column 421 is connected with the support 41, two adjacent positioning columns 421 are arranged at intervals, a positioning space 43 is formed between two adjacent positioning columns 421, an opening is formed at an interval between the other ends of two adjacent positioning columns 421, that is, the positioning space 43 is provided with an opening, and the opening of the positioning space 43 faces away from the support 41.

The positioning space 43 has a square shape matching the ceramic substrate 30, and the ceramic substrate 30 is disposed in the positioning space. After the inner side of the positioning frame 42 abuts the outer periphery of the support base 21, the support base 21 forms the mounting area 22 corresponding to the area of the positioning space 43, and the ceramic substrate 30 is mounted on the mounting area 22.

Support 41 is platelike structure, including the first side, second side and the third side that connect gradually to first side and third side are relative setting, and a plurality of reference columns 421 distribute in first side, second side and third side, and a plurality of reference columns 421 enclose into accommodation space with support 41's middle part. During assembly, the table body 211 is accommodated in the accommodating space, and the support 41 and the positioning frame 42 are sleeved on the periphery of the table body 211 to form multi-directional connection among the support 41, the positioning frame 42 and the table body 211.

The bracket 41 comprises a limiting surface, and the limiting surface and the positioning column 421 are located on the same side of the bracket 41; the supporting platform 21 comprises a supporting surface, and after the support 41 is connected with the supporting platform 21, the limiting surface is tightly attached to the supporting surface. One side of the table body 211 facing the bracket 41 is provided with a groove, and the bracket 41 with a plate-shaped structure is connected with the table body 211 and then can cover the groove.

The positioning connection structure 44 is disposed on the bracket, the positioning connection structure 44 is a column hole with threads, and the positioning connection structure 44 is connected with the heat dissipation connection structure 24 by screws in a matching manner.

The height H1 of the table 211 is greater than the height H2 of the positioning frame 42.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A positioning mechanism is used for positioning and installing a ceramic substrate, and is characterized in that: the positioning mechanism comprises a positioning frame, and a plurality of positioning spaces are formed in the positioning frame; the positioning space is matched with the ceramic substrate, and the ceramic substrate is arranged in the positioning space.

2. The positioning mechanism of claim 1, wherein: the positioning frame comprises a plurality of positioning columns, two adjacent positioning columns are arranged at intervals, and the positioning space is formed between the two adjacent positioning columns.

3. The positioning mechanism of claim 2, wherein: positioning mechanism still includes the support, the support with the locating rack is buckled and is connected, the locating rack is followed one of them side of support extends, the support is including the first side, second side and the third side that connect gradually, and the first side with the third side is relative setting, and is a plurality of the reference column distribute in first side, second side and third side, and is a plurality of the reference column will the mid portion of support encloses into accommodation space.

4. The positioning mechanism of claim 3, wherein: one end of each positioning column is connected with the support, and openings are formed between the other ends of every two adjacent positioning columns at intervals.

5. The positioning mechanism of claim 1, wherein: the positioning mechanism is provided with a positioning connection structure.

6. The positioning mechanism of claim 5, wherein: the positioning connection structure is a column hole or a columnar bulge.

7. A heat abstractor of power tube which characterized in that: the method comprises the following steps:

a heat sink including a support table;

a ceramic substrate; and

the positioning mechanism according to any one of claims 1 to 6, wherein an inner side of the positioning frame abuts an outer periphery of the support base, the support base forms a mounting region corresponding to a region of the positioning space, and the ceramic substrate is mounted on the mounting region.

8. The heat sink of claim 7, wherein: the supporting platform comprises a platform body and a convex edge, the convex edge is connected with one end of the platform body, the convex edge protrudes out of the outer surface of the platform body, and a step is formed between the convex edge and the platform body; the inner side of the positioning frame is abutted against the side face of the table body, and the mounting area is positioned on the side face of the table body; one end of the ceramic substrate, far away from the positioning frame, is abutted against the convex edge.

9. The heat sink of claim 7, wherein: the positioning mechanism is provided with a positioning connection structure, and the radiator is provided with a heat dissipation connection structure matched with the positioning connection structure for use.

10. The heat dissipating device for a power transistor as set forth in claim 7, wherein: the ceramic substrate is of a quadrilateral structure, and the positioning space and the ceramic substrate are the same in shape and structure.