CN218006517U - Microphone of micro-electro-mechanical system - Google Patents
Microphone of micro-electro-mechanical system Download PDFInfo
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- CN218006517U CN218006517U CN202221691702.5U CN202221691702U CN218006517U CN 218006517 U CN218006517 U CN 218006517U CN 202221691702 U CN202221691702 U CN 202221691702U CN 218006517 U CN218006517 U CN 218006517U
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Abstract
The embodiment of the utility model provides a micro-electromechanical system microphone uses in the microphone field to there is the incompatible problem of phase place in the capacitanc micro-electromechanical system microphone of solving among the prior art different producers production. The method comprises the following steps: the first shell and the printed circuit board are combined to form a back cavity, and the first shell is provided with at least one first hole communicated with the back cavity. Through be equipped with at least one first hole of putting through with the back of the body chamber on first shell, can increase the volume of back of the body chamber, play the effect of adjusting the volume of back of the body chamber. The volume of back of the body chamber grow can make resonant frequency step down to can improve the low frequency and correspond, and then realize the effect of adjusting the phase place.
Description
Technical Field
The utility model relates to a microphone especially relates to a micro-electromechanical system microphone.
Background
With the continuous development of science and technology, the volume of electronic products such as mobile phones and notebooks is also continuously reduced, and the performance is higher and higher. The application of component microphones in electronic products such as mobile phones and notebooks is more and more extensive, especially, the development of micro-electromechanical system microphones is the most rapid, and the micro-electromechanical system microphones can gradually replace the traditional electret condenser microphones in the aspects of mobile communication, multimedia systems and the like due to the advantages of good performance, easy mass production and the like.
At present, a common mems microphone is a capacitive mems microphone, wherein capacitive mems microphones manufactured by different manufacturers have a problem of phase incompatibility.
In summary, how to solve the problem of phase incompatibility of the capacitive mems microphones manufactured by different manufacturers is a technical problem that needs to be solved urgently at present.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides a micro electro mechanical system microphone for there is the incompatible problem of phase place in the capacitive micro electro mechanical system microphone of solving among the prior art different producers production.
In a first aspect, an embodiment of the present invention provides a mems microphone, including: the first shell and the printed circuit board are combined to form a back cavity, and the first shell is provided with at least one first hole communicated with the back cavity.
The embodiment of the utility model provides an in, through be equipped with at least one on first shell with the first hole of back of the body chamber switch-on, can increase the volume in back of the body chamber, play the effect of adjusting back of the body chamber volume. The volume of back of the body chamber grow can make resonant frequency step-down to it is corresponding to can improve the low frequency, and then realize the effect of adjusting the phase place.
Optionally, a hole cover is covered above the first hole.
The embodiment of the utility model provides an in, the handhole door is the volume that is used for adjusting back of the body chamber to it is corresponding to reduce resonant frequency, improve the low frequency, and then plays the effect of adjustment phase place.
Optionally, the first housing is a metal housing.
The embodiment of the utility model provides an in, first shell is the metal material, through be equipped with at least one first hole on first shell, can adjust the volume in back of the body chamber to reduce resonant frequency, it is corresponding to improve the low frequency, and then plays the effect of adjustment phase place.
Optionally, the first housing is bonded to the printed circuit board by a conductive adhesive.
The embodiment of the utility model provides an in, bond first shell and printed circuit board through conducting resin, form the back of the body chamber, because be equipped with at least one first hole on the first shell, can adjust the volume in back of the body chamber to reduce resonant frequency, it is corresponding to improve the low frequency, and then plays the effect of adjustment phase place.
Optionally, the printed circuit board is provided with at least one second hole communicating with the outside.
The embodiment of the utility model provides an in, be equipped with at least one second hole with external intercommunication on the printed circuit board to can realize advancing the sound from the second hole.
Optionally, a microphone assembly is placed in the second bore.
The embodiment of the utility model provides an in, owing to enter the sound from the second hole, place the microphone subassembly downthehole at the second to can realize better radio reception.
Optionally, the printed circuit board is provided with at least one power Voltage (Vdd) terminal.
The embodiment of the utility model provides an in, be equipped with at least one mains voltage on printed circuit board, for micromotor system microphone power supply, be convenient for follow-up according to being equipped with at least one first hole on first shell, can adjust the volume in back of the body chamber to reduce resonant frequency, it is corresponding to improve the low frequency, and then realizes the effect of adjustment phase place.
Optionally, the mems microphone further includes: and the first chip is bonded with the printed circuit board through the conductive adhesive.
The embodiment of the utility model provides an in, bond first chip and printed circuit board through conducting resin, can realize encapsulating first chip in the back of the body chamber.
Optionally, the mems microphone further includes: and the second chip is bonded with the printed circuit board through the conductive adhesive.
The embodiment of the utility model provides an in, bond second chip and printed circuit board through the conducting resin, can realize encapsulating the second chip in the back of the body chamber.
Optionally, the mems microphone further includes: one end of the first metal wire is connected with the first chip, and the other end of the first metal wire is connected with the printed circuit board.
The embodiment of the utility model provides an in, connect first chip and printed circuit board through first metal wire, play electrically conductive effect, be convenient for follow-up according to being equipped with at least one first hole on first shell, can adjust the volume in back of the body chamber to reduce resonant frequency, it is corresponding to improve the low frequency, and then realizes the effect of adjustment phase place.
Optionally, the mems microphone further includes: and one end of the second metal wire is connected with the second chip, and the other end of the second metal wire is connected with the micro motor system module.
The embodiment of the utility model provides an in, connect second chip and printed circuit board through the second metal wire, play electrically conductive effect, be convenient for follow-up according to being equipped with at least one first hole on first shell, can adjust the volume in back of the body chamber to reduce resonant frequency, it is corresponding to improve the low frequency, and then realizes the effect of adjustment phase place.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic cross-sectional view of a condenser micro-motor system microphone according to an embodiment of the present invention;
fig. 2 is a side view of a mems microphone according to an embodiment of the present invention;
fig. 3 is a side view of another mems microphone according to an embodiment of the present invention;
fig. 4 is a side view of another mems microphone according to an embodiment of the present invention;
fig. 5 is a side view of another mems microphone according to an embodiment of the present invention;
fig. 6 is a side view of another mems microphone according to an embodiment of the present invention;
fig. 7 is a side view of another mems microphone according to an embodiment of the present invention;
fig. 8 is a cross-sectional view of a mems microphone according to an embodiment of the present invention;
fig. 9 is a schematic structural view of a hole cover and a first hole according to an embodiment of the present invention;
fig. 10a is a schematic structural diagram of a hole cover according to an embodiment of the present invention;
fig. 10b is a schematic structural diagram of another hole cover according to an embodiment of the present invention;
fig. 11 is a phase curve comparison diagram of an initial scheme, a scheme and a scheme two provided by the embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1, a schematic cross-sectional view of a microphone of a capacitive micro-motor system according to an embodiment of the present invention is shown. The principle of a capacitive mems microphone is described below. Specifically, the capacitive MEMS microphone comprises a MEMS chip and an ASIC chip, wherein the two chips are packaged in a cavity formed by combining a printed circuit board and a metal housing, and the MEMS chip mainly comprises a diaphragm and a back electrode. In the case of no electrical power, the membrane in the first chip is not charged. Under the condition of electrifying, voltage is applied to a Vdd end on a printed circuit board, then a pump voltage module of an ASIC chip provides stable direct current bias voltage for a condenser micro-electro-mechanical system microphone, so that a diaphragm in a first chip and a back pole in the condenser first chip form a parallel plate capacitor, when sound pressure starts to act, the diaphragm starts to vibrate under the action of sound pressure, so that the parallel plate capacitor generates tiny capacitance change, the ASCI chip is used for detecting the capacitance change of the MEMS chip and converting the capacitance change into an electric signal, and then the ASIC chip transmits the electric signal to a related processing device, such as a preamplifier or an audio input interface of matched equipment.
The phase parameter of the condenser micro-motor system microphone affects the performance of the condenser micro-motor system microphone. The factors influencing the phase parameters of the condenser type micro-motor system microphone include three factors, namely the diaphragm design of an MEMS chip, the back cavity volume of the condenser type micro-motor system microphone and the sizes of a front sound cavity and a sound inlet hole of the condenser type micro-motor system microphone. Because MEMS chips designed by different manufacturers are different and ASIC chip pages related to different manufacturers are different, the phases of the condenser micro-motor system microphones designed and produced by different manufacturers cannot be compatible. Therefore, when the electronic product needs to use 2 or more than 2 condenser micro-motor system microphones, if the condenser micro-motor system microphones are produced by different manufacturers, the problem of phase incompatibility can occur.
Fig. 2 is a side view of a mems microphone according to an embodiment of the present invention. The mems microphone 200 includes a first housing 201 and a printed circuit board 202, wherein the first housing and the printed circuit board are combined to form a back cavity, and the first housing is provided with at least one first hole 203 communicating with the back cavity. Through set up at least one first hole of putting through with the back chamber on first shell, can increase the volume of back chamber, play the effect of adjusting back chamber volume. The volume of back of the body chamber grow can make resonant frequency step down to can improve the low frequency and correspond, and then realize the effect of adjusting the phase place. Fig. 2 illustrates an example of the present invention in which a first hole communicating with the back cavity is formed in the first housing. The diameter of the first hole may be preset, or may be determined according to actual conditions, and is not limited herein. The first housing may be provided with one or more first holes communicating with the back cavity, see fig. 3-5 below.
Fig. 3 is a side view of another mems microphone according to an embodiment of the present invention. The mems microphone 300 includes a first housing 301 and a printed circuit board 302, wherein the first housing 301 and the printed circuit board 302 are combined to form a back cavity, and two first holes 303 and 304 are disposed on the first housing 301, wherein the diameters of 303 and 304 are the same.
As shown in fig. 4, a side view of another mems microphone according to an embodiment of the present invention is provided. The mems microphone 400 includes a first housing 401 and a printed circuit board 402, wherein the first housing 401 and the printed circuit board 402 are combined to form a back cavity, and three first holes 403, 404, and 405 are disposed on the first housing 401, wherein the diameters of the first holes 403, 404, and 405 are the same.
As shown in fig. 5, a side view of another mems microphone according to an embodiment of the present invention is provided. The mems microphone 500 includes a first housing 501 and a printed circuit board 502, wherein the first housing 501 and the printed circuit board 502 are combined to form a back cavity, and two first holes 503 and 504 are disposed on the first housing 501, wherein the diameters of 503 and 504 are different, and the diameter of 503 is larger than the diameter of 504.
As shown in fig. 6, a side view of another mems microphone according to an embodiment of the present invention is provided. The mems microphone 600 includes a first housing 601 and a printed circuit board 602, wherein the first housing 601 and the printed circuit board 602 are combined to form a back cavity, and three first holes 603, 604 and 605 are formed in the first housing 601, wherein the diameters of 603 and 604 are the same, but the diameters of 603, 604 and 605 are different, and wherein the diameter of 605 is larger than the diameters of 603 and 604.
Fig. 7 is a side view of another mems microphone according to an embodiment of the present invention. The mems microphone 700 includes a first housing 701 and a printed circuit board 702, wherein the first housing 701 and the printed circuit board 702 are combined to form a back cavity, and three first holes 703, 704, and 705 are formed in the first housing 701, wherein the diameters of the first holes 703, 704, and 705 are different, the diameter of the first hole 703 is the smallest, the diameter of the first hole 704 is larger than the diameter of the first hole 703, and the diameter of the first hole is smaller than the diameter of the first hole 705, and the diameter of the first hole 705 is the largest.
As shown in fig. 8, a cross-sectional view of a mems microphone according to an embodiment of the present invention is shown. The mems microphone 800 includes a first hole 801, a first housing 802, a first chip 803, a first metal wire 804, a printed circuit board 805, a second chip 806, a second metal wire 807, a second hole 808, a Vdd terminal 809, and a conductive paste 810.
The embodiment of the utility model provides an in, first shell 802 is metal casing, is equipped with at least one on the first shell 802 and carries the first hole 801 of chamber switch-on, bonds first shell 802 and printed circuit board 805 through conducting resin 810, then forms the back of the body chamber.
The embodiment of the utility model provides an in, every first hole is to having the handhole door, can see fig. 9, and the handhole door is used for covering on first hole to can realize increasing the volume in back of the body chamber, and then change resonant frequency, make to improve low frequency response, and then realize adjusting the effect of phase place.
In the embodiment of the present invention, because the sound entering mode of the mems microphone of the present invention is sound entering from the bottom, therefore, the second hole 808 which is provided with at least one and communicates with the outside is formed on the printed circuit board 805, so as to realize better radio reception.
The embodiment of the utility model provides an in, place the microphone subassembly downthehole at the second, be convenient for better radio reception. Wherein the microphone assembly is not shown in fig. 8.
In the embodiment of the present invention, at least one power voltage Vdd terminal 809 is disposed on the printed circuit board 805, so as to supply power to the microphone of the micro-motor system.
In the embodiment of the present invention, the first chip 803 is bonded to the printed circuit board 805 through the conductive adhesive 810, so that the first chip can be packaged in the back cavity.
In the embodiment of the present invention, the second chip 806 is bonded to the printed circuit board 805 through the conductive adhesive 810, so that the second chip can be packaged in the back cavity.
In the embodiment of the present invention, one end of the first metal wire 804 is used for connecting the first chip 803, and the other end of the first metal wire 804 is connected to the second chip 806. The first metal line 804 is electrically conductive and connects the first chip 803 and the second chip 806.
In the embodiment of the present invention, the second chip 806 is connected to one end of the second metal wire 807, and the printed circuit board 805 is connected to the other end of the second metal wire 807. The second metal line 807 conducts electricity, and connects the first chip 803 to the printed circuit board 805.
Fig. 10a is a schematic structural diagram of a hole cover according to an embodiment of the present invention. Fig. 10b is a schematic structural diagram of another hole cover according to an embodiment of the present invention. For example, if the first hole has a diameter of 0.5mm, there are now two hole covers, a first hole cover and a second hole cover, both of which can cover the first hole, wherein the first hole cover has a volume of A mm 3 The volume of the second hole cover is B mm 3 The second hole cover has a larger volume than the first hole cover because the second hole cover has a larger height than the first hole cover. The initial scheme is as follows: when the first housing is not provided with the first hole, the volume of the back cavity is 1.41mm 3 The MEMS microphone corresponds to a signal-to-noise ratio of 62. The first scheme is as follows: when the first hole cover is covered on the first hole of the first shell, the volume of the back cavity is 3.48mm 3 The corresponding signal-to-noise ratio of the MEMS microphone is 63.1. The second scheme is as follows: when the second hole cover is covered on the first hole of the first shell, the volume of the back cavity is 8.42mm 3 The signal-to-noise ratio for the MEMS microphone is 63.3. From the above data, it can be seen that the signal-to-noise ratio is significantly improved by increasing the volume of the back cavity.
As shown in fig. 11, a phase curve comparison diagram of an initial scheme, a scheme and a scheme two is provided for the embodiment of the present invention. It can be seen that the increase of the back cavity volume can adjust the phase of the low frequency, and the increase of the back cavity volume can greatly improve the signal-to-noise ratio, but when the back cavity is increased to a certain volume, the phase can not change more obviously.
The MEMS microphone comprises a first chip and a second chip, wherein the two chips are packaged in a cavity formed by combining a printed circuit board and a metal shell, and the first chip mainly comprises a diaphragm and a back electrode. The working principle of the micro-motor system microphone is that under the condition of no power supply, the diaphragm in the second chip is not electrified. Under the condition of electrifying, voltage is applied to a Vdd terminal on the printed circuit board, then a pump voltage module of the second chip provides stable direct current bias voltage for the capacitive micro-electro-mechanical system microphone, so that the diaphragm in the first chip and a back pole in the capacitive first chip form a parallel plate capacitor, when sound pressure starts to act, the diaphragm starts to vibrate under the action of sound pressure, so that the parallel plate capacitor generates tiny capacitance change, the second chip is used for detecting the capacitance change of the first chip and converting the capacitance change into an electric signal, and then the second chip transmits the electric signal to a related processing device, such as a preamplifier or an audio input interface of matched equipment. However, when the electronic product needs to use two or more than two micro-electromechanical system microphones produced by different manufacturers, at least one first hole communicated with the back cavity needs to be formed in the first shell of the micro-electromechanical system microphone, wherein the first hole is used for increasing the volume of the back cavity, so that the resonance frequency can be reduced, the low frequency is improved, and the phase effect is achieved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (11)
1. A mems microphone, comprising: the first shell and the printed circuit board are combined to form a back cavity, and the first shell is provided with at least one first hole communicated with the back cavity.
2. The microphone of claim 1, wherein the first hole is covered with a hole cover.
3. The microphone of claim 1, wherein the first housing is a metal housing.
4. The microphone of claim 1, wherein the first housing is bonded to the printed circuit board by a conductive adhesive.
5. The microphone of claim 1, wherein the printed circuit board is provided with at least one second hole communicating with the outside.
6. The microphone of claim 5 wherein a microphone assembly is disposed within the second bore.
7. The microphone of claim 1, wherein the printed circuit board is provided with at least one supply voltage Vdd terminal.
8. The microphone of claim 4, wherein the microelectromechanical systems microphone further comprises: and the first chip is bonded with the printed circuit board through the conductive adhesive.
9. The microphone of claim 4, wherein the microelectromechanical systems microphone further comprises: and the second chip is bonded with the printed circuit board through the conductive adhesive.
10. The microphone of claim 9, wherein the microelectromechanical systems microphone further comprises: one end of the first metal wire is connected with the first chip, and the other end of the first metal wire is connected with the second chip.
11. The microphone of claim 9, wherein the microelectromechanical systems microphone further comprises: and one end of the second metal wire is connected with the second chip, and the other end of the second metal wire is connected with the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221691702.5U CN218006517U (en) | 2022-06-30 | 2022-06-30 | Microphone of micro-electro-mechanical system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221691702.5U CN218006517U (en) | 2022-06-30 | 2022-06-30 | Microphone of micro-electro-mechanical system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218006517U true CN218006517U (en) | 2022-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221691702.5U Active CN218006517U (en) | 2022-06-30 | 2022-06-30 | Microphone of micro-electro-mechanical system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218006517U (en) |
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- 2022-06-30 CN CN202221691702.5U patent/CN218006517U/en active Active
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