CN218004821U

CN218004821U - Semiconductor material oxidation treatment equipment with hot air supply mechanism

Info

Publication number: CN218004821U
Application number: CN202220810078.XU
Authority: CN
Inventors: 刘成龙
Original assignee: Zhejiang Yuqian Semiconductor Technology Co ltd
Current assignee: Zhejiang Yuqian Semiconductor Technology Co ltd
Priority date: 2022-04-09
Filing date: 2022-04-09
Publication date: 2022-12-09
Anticipated expiration: 2032-04-09

Abstract

The utility model discloses a semiconductor material oxidation treatment facility with send hot-blast mechanism, including the operation frame, the bottom of operation frame is close to left side department and pegs graft and has the bull stick, the spacing box of top fixedly connected with of bull stick, first spout, two have all been seted up near left and right sides department to the inner chamber bottom of spacing box the equal swing joint of first spout inner chamber has first slider, the bottom of operation frame is close to right side department fixedly connected with guard box, the inner chamber bottom fixedly connected with servo motor of guard box, servo motor's power output shaft top fixedly connected with lead screw, the top of lead screw runs through the inner chamber top of guard box and the top of operation frame and is close to right side department, through the mutually supporting between mechanisms such as second slider, lead screw, blower motor, transfer line, fan leaf, heating block, sheave, belt, can realize evenly blowing hot-blast effect to the semiconductor.

Description

Semiconductor material oxidation treatment equipment with hot air supply mechanism

Technical Field

The utility model relates to a semiconductor especially relates to a semiconductor material oxidation treatment facility with send hot-blast mechanism.

Background

The semiconductor is a substance with conductivity between an insulator and a conductor, and the conductivity of the semiconductor is easy to control and can be used as an element material for information processing. From the viewpoint of technological or economic development, semiconductors are very important, and the core units of many electronic products, such as computers, mobile phones, and digital recorders, process information by using the conductivity change of semiconductors, and semiconductor material oxidation processing equipment is processing equipment for performing oxidation processing on semiconductor materials.

The existing semiconductor material oxidation treatment equipment cannot uniformly blow hot air to the surface of the semiconductor material when in use, and cannot fix the semiconductor material.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims at providing a semiconductor material oxidation treatment device provided with a hot air supply mechanism.

The utility model discloses an one of the purpose adopts following technical scheme to realize:

the utility model provides a semiconductor material oxidation treatment equipment with send hot-blast mechanism, includes the operation frame, the bottom of operation frame is close to left side department and pegs graft and has had the bull stick, the spacing box of top fixedly connected with of bull stick, first spout has all been seted up near left and right sides department to the inner chamber bottom of spacing box, two the equal swing joint of first spout inner chamber has first slider, the bottom of operation frame is close to right side department fixedly connected with protection box, the inner chamber bottom fixedly connected with servo motor of protection box, servo motor's power take off spindle top fixedly connected with lead screw, the top of lead screw is run through the inner chamber top of protection box and the top of operation frame and is close to right side department, the second spout has been seted up on the right side of operation frame, second spout inner chamber swing joint has the second slider, the top of lead screw is run through the bottom of second slider, and peg graft and be close to right side department at the inner chamber top of operation frame, the inner chamber of second slider has seted up with lead screw assorted screw, the bottom of operation frame is close to left side department fixedly connected with two bracing pieces, two bracing pieces set up around for the bracing piece.

Further, two the equal fixedly connected with connecting rod in top of first slider, two the inner chamber top department of spacing box is all run through on the top of connecting rod to equal fixedly connected with splint.

Furthermore, the center of the top of the inner cavity of the limiting box is fixedly connected with a rotary cylinder, the bottom of the rotary cylinder is fixedly connected with a rotating shaft, and the bottom of the rotating shaft is fixedly connected with a disc.

Furthermore, the bottom of the disc is hinged to connecting rods close to the left side and the right side, and one ends, far away from the disc, of the two connecting rods are hinged to the tops of the adjacent first sliding blocks.

Furthermore, the left side fixedly connected with blast box of second slider, the equal fixedly connected with heating block of top and bottom department is close to on the left of the inner chamber of blast box.

Furthermore, a blowing motor is fixedly connected to the center of the right side of the inner cavity of the blowing box, a transmission rod is fixedly connected to the left end of a power output shaft of the blowing motor, and a fan blade is fixedly connected to the left end of the transmission rod.

Furthermore, grooved wheels are sleeved at the positions, close to the bottom ends, of the outer edges of the rotating rod and the lead screw, a belt is arranged between the two grooved wheels, and the two grooved wheels are in transmission connection through the belt.

Compared with the prior art, the beneficial effects of the utility model reside in that:

1. a semiconductor material oxidation treatment device provided with a hot air supply mechanism can realize the fixing effect on semiconductor materials through the mutual matching of a limiting box, a first slide block, a connecting rod, a clamping plate, a rotary cylinder, a rotating shaft, a disc, a connecting rod and other mechanisms;

2. the utility model provides a semiconductor material oxidation treatment equipment with send hot-blast mechanism, through the mutual cooperation between mechanisms such as second slider, lead screw, blast motor, transfer line, fan leaf, heating block, sheave, belt, can realize blowing hot-blast effect evenly to the semiconductor.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are specifically illustrated below, and the detailed description is given in conjunction with the accompanying drawings.

Drawings

FIG. 1 is a schematic structural diagram of the present embodiment;

FIG. 2 is a partial bottom view of the disk;

FIG. 3 is an enlarged view taken at A in FIG. 1;

fig. 4 is an enlarged view at B in fig. 1.

In the figure: 1. an operation frame; 2. a rotating rod; 3. a limiting box; 4. a first slider; 5. a connecting rod; 6. a splint; 7. a rotating cylinder; 8. a rotating shaft; 9. a disc; 10. a connecting rod; 11. a second slider; 12. a protection box; 13. a servo motor; 14. a screw rod; 15. a blower box; 16. a blower motor; 17. a transmission rod; 18. a fan blade; 19. a heating block; 20. a grooved wheel; 21. a belt; 22. a support rod.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that the embodiments or technical features described below can be arbitrarily combined to form a new embodiment without conflict.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for purposes of illustration only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1 to 4, a semiconductor material oxidation treatment device with a hot air supply mechanism comprises an operation frame 1, a rotating rod 2 is inserted at a position, close to the left side, of the bottom of the operation frame 1, a limiting box 3 is fixedly connected to the top end of the rotating rod 2, first sliding grooves are formed in positions, close to the left side and the right side, of the bottom of an inner cavity of the limiting box 3, first sliding blocks 4 are movably connected to inner cavities of the two first sliding grooves, a protecting box 12 is fixedly connected to the position, close to the right side, of the bottom of the operation frame 1, a servo motor 13 is fixedly connected to the bottom of the inner cavity of the protecting box 12, a lead screw 14 is fixedly connected to the top end of a power output shaft of the servo motor 13, the top end of the lead screw 14 penetrates through the top of the inner cavity of the protecting box 12 and the top of the operation frame 1, a second sliding groove is formed in the right side of the operation frame 1, a second sliding block 11 is movably connected to the inner cavity of the second sliding groove, the top end of the lead screw 14 penetrates through the bottom of the second sliding block 11 and is inserted and connected to the top of the inner cavity of the operation frame 1, threads matched with the inner cavity of the second sliding block 11, two supporting rods 22 are fixedly connected to the position, close to the left side of the bottom of the left side of the operation frame 1, and the front supporting rod 22 are arranged at the front side of the front supporting rod 22;

the top parts of the two first sliding blocks 4 are both fixedly connected with connecting rods 5, the top ends of the two connecting rods 5 penetrate through the top part of the inner cavity of the limiting box 3 and are both fixedly connected with clamping plates 6, the center of the top part of the inner cavity of the limiting box 3 is fixedly connected with a rotary cylinder 7, the bottom part of the rotary cylinder 7 is fixedly connected with a rotary shaft 8, the bottom end of the rotary shaft 8 is fixedly connected with a disc 9, the bottom part of the disc 9, close to the left side and the right side, is hinged with connecting rods 10, one end, far away from the disc 9, of each connecting rod 10 is hinged with the top part of the adjacent first sliding block 4, and therefore the fixing effect on a semiconductor is achieved;

a blowing box 15 is fixedly connected to the left side of the second sliding block 11, heating blocks 19 are fixedly connected to the left side of an inner cavity of the blowing box 15 close to the top and the bottom, a blowing motor 16 is fixedly connected to the center of the right side of the inner cavity of the blowing box 15, a transmission rod 17 is fixedly connected to the left end of a power output shaft of the blowing motor 16, and a fan blade 18 is fixedly connected to the left end of the transmission rod 17, so that a blowing effect is achieved;

the outer edges of the rotating rod 2 and the lead screw 14 close to the bottom end are respectively sleeved with a grooved pulley 20, a belt 21 is arranged between the two grooved pulleys 20, and the two grooved pulleys 20 are in transmission connection through the belt 21 to play a transmission role.

The working principle is as follows: the utility model discloses at first through place semiconductor material on spacing box 3, later start revolving cylinder 7, revolving cylinder 7 drives disc 9 through pivot 8 and rotates, disc 9 rotates and drives two first sliders 4 through two connecting rods 10 and remove to the center, two first sliders 4 move to the center and drive two splint 6 through connecting rod 5 and remove and carry out the fixed action to semiconductor material to the center, later start blower motor 16, blower motor 16 drives fan leaf 18 through transfer line 17 and rotates, cooperation heating block 19 blows hot-blast to it, later restart servo motor 13, servo motor 13 rotates and drives lead screw 14 and rotate, lead screw 14 rotates and drives second slider 11 through the screw thread and remove, second slider 11 removes and drives protection box 12 and removes, still drive action through sheave 20 and belt 21 when lead screw 14 changes drives bull stick 2 and rotates, bull stick 2 rotates and drives semiconductor material through spacing box 3 and rotates, make to blow it all with hot-blast.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art on the basis of the present invention are all within the protection scope of the present invention.

Claims

1. A semiconductor material oxidation treatment equipment provided with a hot air supply mechanism comprises an operation frame (1), and is characterized in that: the bottom of operation frame (1) is close to left side department and pegs graft and has bull stick (2), the top fixedly connected with spacing box (3) of bull stick (2), first spout has all been seted up near left and right sides department to the inner chamber bottom of spacing box (3), two the equal swing joint of first spout inner chamber has first slider (4), the bottom of operation frame (1) is close to right side department fixedly connected with guard box (12), the inner chamber bottom fixedly connected with servo motor (13) of guard box (12), the power take off spindle top fixedly connected with lead screw (14) of servo motor (13), the top of lead screw (14) runs through the inner chamber top of guard box (12) and the top of operation frame (1) is close to right side department, the second spout has been seted up on the right side of operation frame (1), second spout inner chamber swing joint has second slider (11), the top of lead screw (14) runs through the bottom of second slider (11), and pegs graft and the inner chamber top of operation frame (1) and is close to right side department, the inner chamber of second slider (11) has seted up with lead screw thread (14) assorted screw, the bracing piece (22) is close to two fixed support bars (22) of operation frame (1) and the front and back are connected with two.

2. The apparatus for oxidation treatment of semiconductor material provided with a mechanism for supplying hot air according to claim 1, wherein: two the equal fixedly connected with connecting rod (5) in top of first slider (4), two the inner chamber top department of spacing box (3) is all run through on the top of connecting rod (5) to equal fixedly connected with splint (6).

3. The oxidation treatment apparatus for semiconductor materials provided with a hot air supply mechanism according to claim 1, wherein: the inner chamber top center department fixed connection of spacing box (3) has revolving cylinder (7), the bottom fixedly connected with pivot (8) of revolving cylinder (7), the bottom fixedly connected with disc (9) of pivot (8).

4. The apparatus for oxidation treatment of semiconductor material provided with a mechanism for supplying hot air according to claim 3, wherein: the bottom of disc (9) is close to left and right sides department and all articulates there are connecting rod (10), two the one end that disc (9) were kept away from in connecting rod (10) all is articulated with the top department of adjacent first slider (4).

5. The apparatus for oxidation treatment of semiconductor material provided with a mechanism for supplying hot air according to claim 1, wherein: the left side fixedly connected with blast box (15) of second slider (11), the inner chamber left side of blast box (15) is close to top and the equal fixedly connected with heating block (19) of bottom department.

6. The oxidation processing apparatus for semiconductor materials provided with a hot air supply mechanism according to claim 5, wherein: the fan is characterized in that a blowing motor (16) is fixedly connected to the center of the right side of the inner cavity of the blowing box (15), a transmission rod (17) is fixedly connected to the left end of a power output shaft of the blowing motor (16), and a fan blade (18) is fixedly connected to the left end of the transmission rod (17).

7. The apparatus for oxidation treatment of semiconductor material provided with a mechanism for supplying hot air according to claim 1, wherein: the outer edges of the rotating rod (2) and the outer edges of the screw rod (14) close to the bottom end are respectively sleeved with a grooved wheel (20), a belt (21) is arranged between the two grooved wheels (20), and the two grooved wheels (20) are in transmission connection through the belt (21).