CN218004800U

CN218004800U - Silicon wafer magazine for silicon wafer paper separating and plate separating machine

Info

Publication number: CN218004800U
Application number: CN202221092755.5U
Authority: CN
Inventors: 陈春芙; 苏金财
Original assignee: Changzhou Kelongwei Intelligent Technology Co ltd
Current assignee: Changzhou Kelongwei Intelligent Technology Co ltd
Priority date: 2022-05-09
Filing date: 2022-05-09
Publication date: 2022-12-09
Anticipated expiration: 2032-05-09

Abstract

The utility model discloses a silicon chip separates paper and divides silicon chip magazine for board machine, including the magazine body of a square, set up one on the four sides box wall of magazine body respectively by the box wall on along extending to the scarce groove of fretwork of box bottom central authorities, the box wall inboard of magazine body is all pasted and is equipped with dog in the detachably, and the box wall outside bottom of magazine body is provided with the circular arc draw-in groove, and the box wall outside of magazine body is provided with perpendicular logical groove, and the outside bottom surface of magazine body is provided with spacing recess, and the one deck sponge has been laid to the inside bottom surface of magazine body. The utility model discloses an exterior structure can perfectly cooperate with the last unloading subassembly of the spacing subassembly of magazine and the magazine on the silicon chip separates paper board separator to the receipts material and the replacement of magazine are accomplished to high-efficient swiftly, and its inner structure can stack the silicon chip and form effective protection, and the silicon chip of 230 x 230 specifications that can be compatible the most to the inside size of design, and the silicon chip capacity can reach 120.

Description

Silicon wafer magazine for silicon wafer paper separating and plate separating machine

Technical Field

The utility model belongs to photovoltaic solar cell silicon chip automation equipment field relates to a silicon chip separates silicon chip magazine for paper board separator.

Background

After the silicon wafers are tested, sorting and material collection are needed, in the process, the sorted silicon wafers need to be stacked by using a material box, and the material collection is completed together with the material box after the silicon wafers are fully stacked. Under the original technical conditions, almost no protective measures are taken for silicon wafers during sorting, for example, in the Chinese utility model patent 'a silicon wafer sorting machine (publication No. CN 208157366U'), chinese invention patent application 'a silicon wafer intelligent sorting machine (publication No. CN 112676175A)', and Chinese utility model patent 'an automatic silicon wafer sorting device (publication No. CN 207401780U)', the silicon wafers are scratched on the surface of the tested silicon wafers inevitably, so that the silicon wafers have defects or damages, and the actual yield is reduced. And the material box conveying mechanism of the existing silicon wafer sorting machine is low in operation speed and needs workers to assist in sorting, so that the efficiency is low, labor is wasted, manual operation is prone to making mistakes, the production requirement is seriously affected, and the requirements for high efficiency and automation cannot be met. At present, the applicant is developing a silicon wafer separating paper plate separator which can cover separating paper on the surface of a silicon wafer before the silicon wafer is separated, and the silicon wafer separating paper plate separator has the function of automatic feeding and discharging of a silicon wafer material box, so that a silicon wafer material box which can be matched with the silicon wafer material box is needed.

SUMMERY OF THE UTILITY MODEL

In order to satisfy above-mentioned demand, the utility model provides a silicon chip separates paper and divides silicon chip magazine for trigger to cooperation silicon chip separates paper and divides trigger to carry out the sorting and the receipts material of silicon chip.

For solving the technical problem, realize above-mentioned technological effect, the utility model discloses a following technical scheme realizes:

the silicon wafer magazine for the silicon wafer partition paper board separator comprises a square magazine body, wherein hollow-out grooves extending from the upper edge of the box wall to the center of the box bottom are formed in the four box walls of the magazine body respectively, detachable inner stop blocks are attached to the inner sides of the box walls of the magazine body, an arc clamping groove used for being clamped by a magazine limiting block of the silicon wafer partition paper board separator is formed in the bottom of the outer side of the box wall of the magazine body, a vertical through groove used for enabling the magazine limiting block of the silicon wafer partition paper board separator to pass through is formed in the outer side of the box wall of the magazine body, a limiting groove used for being in limiting fit with a magazine lifting seat of the silicon wafer partition paper board separator is formed in the outer bottom of the magazine body, and a layer of sponge is laid on the inner bottom of the magazine body.

Furthermore, the upper plane of the box wall of the box body is flush with the upper plane of the inner stop block.

Furthermore, the inner stop block is attached to the inner side of the box wall of the material box body in an inserting mode.

Furthermore, a trapezoidal slot is formed in the inner side of the box wall of the material box body, a trapezoidal insertion block matched with the trapezoidal slot in shape is arranged on the outer side face of the inner stop block, and the inner stop block is fixed on the inner side face of the box wall of the material box body through the insertion fit of the trapezoidal insertion block and the trapezoidal slot.

Furthermore, inclined net-shaped reinforcing ribs are cast on the outer side surface and the outer bottom surface of the box wall of the box body in a pressure-equalizing manner.

Further, the thickness of the sponge is 3mm.

Further, all be provided with 2 on every box wall lateral surface of magazine body the groove is led to perpendicularly, and 2 the groove is led to perpendicularly and is located the left and right sides that corresponds the box wall lateral surface respectively, every box wall lateral surface bottom of magazine body all is provided with 4 the circular arc draw-in groove, and 4 the circular arc draw-in groove is located 2 that correspond the side respectively the left and right sides that leads to the groove perpendicularly.

Furthermore, the outer bottom surface of the material box body is provided with 4 limiting grooves, and the 4 limiting grooves are respectively positioned on four vertex angles of the central part of the material box body.

Furthermore, the external dimension of the magazine body is 264mm long, 264mm wide and 80mm high, the internal dimension of the magazine body is 238.6mm long, 238.6mm wide, the shallowest depth of the magazine body is 55mm, and the magazine body is maximally compatible with a 230 x 230 specification silicon chip.

Further, the inner size of the magazine body after the inner stopper is inserted is 208.6mm × 208.6mm, and the silicon wafer capacity of the magazine is 120 sheets when one silicon wafer is attached to one sheet of paper.

The utility model has the advantages that:

the utility model discloses a section is applicable to the silicon chip magazine of novel silicon chip partition paper board separator specially, and its outer structure can perfectly cooperate with the last unloading subassembly of the spacing subassembly of magazine and magazine on the silicon chip partition paper board separator to the material and the replacement of collecting of magazine are accomplished to high-efficient swiftly, and its inner structure can stack the silicon chip and form effective protection, and the inside size of design can be the silicon chip of the biggest compatible 230 x 230 specification, and the silicon chip capacity can reach 120.

The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings. The following examples and the accompanying drawings illustrate specific embodiments of the present invention.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention and do not constitute a limitation on the invention. In the drawings:

FIG. 1 is a top perspective view of the overall structure of the present invention;

FIG. 2 is a perspective view of the present invention after the inner stop block is removed;

fig. 3 is a bottom perspective view of the overall structure of the present invention.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments. The description set forth herein is intended to provide a further understanding of the invention and is to be construed as a part of this application and is provided by way of illustration of the exemplary embodiments and description and is not intended to limit the invention in any way.

Referring to fig. 1-3, the silicon wafer magazine for the silicon wafer paper separation plate separator comprises a square magazine body 1, wherein hollow-out grooves 2 extending from the upper edge of the box wall to the center of the box bottom are formed in the four box walls of the magazine body 1 respectively, detachable inner stop blocks 3 are attached to the inner sides of the box walls of the magazine body 1, arc clamping grooves 4 used for being clamped by magazine limiting blocks of the silicon wafer paper separation plate separator are formed in the bottom of the outer side of the box wall of the magazine body 1, vertical through grooves 5 used for allowing the magazine limiting blocks of the silicon wafer paper separation plate separator to pass through are formed in the outer side of the box wall of the magazine body 1, limiting grooves 6 used for being in limiting fit with a magazine lifting seat of the silicon wafer paper separation plate separator are formed in the outer bottom surface of the magazine body 1, and a layer of sponge 7 is laid on the inner bottom surface of the magazine body 1.

Further, the upper plane of the box wall of the box body 1 is flush with the upper plane of the inner stop block 3.

Furthermore, the inner stop block 3 is attached to the inner side of the box wall of the material box body 1 in an inserting mode.

Furthermore, a trapezoid slot is formed in the inner side of the box wall of the material box body 1, a trapezoid insertion block matched with the trapezoid slot in shape is arranged on the outer side face of the inner stop block 3, and the inner stop block 3 is fixed on the inner side face of the box wall of the material box body 1 through the insertion fit of the trapezoid insertion block and the trapezoid slot.

Furthermore, inclined net-shaped reinforcing ribs 8 are cast on the outer side surface and the outer bottom surface of the box wall of the box body 1 in a pressure-equalizing manner.

Further, the thickness of the sponge 7 is 3mm.

Further, all be provided with 2 on every box wall lateral surface of magazine body 1 lead to groove 5 perpendicularly, and 2 lead to groove 5 perpendicularly and be located the left and right sides that corresponds box wall lateral surface respectively, every box wall lateral surface bottom of magazine body 1 all is provided with 4 circular arc draw-in

groove

4, and 4 circular arc draw-in groove 4 is located 2 that corresponds the side respectively lead to the left and right sides of groove 5 perpendicularly.

On the outer side surface of the same box wall, 2 circular arc clamping grooves 4 on the left side of the 2 vertical through grooves 5 form a pair, and 2 circular arc clamping grooves 4 on the right side of the 2 vertical through grooves 5 form a pair.

Two pairs of arc clamping grooves 4 corresponding to the positions on the outer side surfaces of the two opposite box walls are used as one group, and the other two pairs of arc clamping grooves 4 corresponding to the positions on the outer side surfaces of the two opposite box walls are used as the other group.

When the material box is fixed on the silicon wafer paper separating and plate separating machine, material box limiting blocks of the silicon wafer paper separating and plate separating machine are only clamped with one group of the arc clamping grooves 4 on the left and right box walls of the current position of the material box; when the material box needs to be taken down from the silicon wafer paper separating and separating machine, the material box lifting seat of the silicon wafer paper separating and separating machine can ascend to contact with the four limiting grooves 6 and jack up the material box, the arc clamping grooves 4 are separated from the material box limiting blocks upwards, then the material box lifting seat can translate towards the vertical through grooves 5, so that the four vertical through grooves 5 are respectively aligned with the four material box limiting blocks downwards, finally, the material box lifting seat can drive the material box to move downwards, and the material box can be smoothly taken down from the silicon wafer paper separating and separating machine due to the fact that the vertical through grooves 5 can allow the material box limiting blocks to pass through, and therefore material collection after silicon wafer sorting is completed; the empty cartridge is replaced by a step opposite to the step in which the cartridge is removed.

Furthermore, the outer bottom surface of the material box body 1 is provided with 4 limiting grooves 6, and the 4 limiting grooves 6 are respectively positioned on four vertex angles of the central part of the material box body 1.

Furthermore, the external dimensions of the magazine body 1 are 264mm long by 264mm wide by 80mm high, the internal dimensions of the magazine body 1 are 238.6mm long by 238.6mm wide, the shallowest depth of the magazine body 1 is 55mm, and the magazine body is maximally compatible with a 230 x 230 specification silicon wafer.

Further, the inner size of the magazine body 1 after the inner stopper 3 is inserted is 208.6mm × 208.6mm, and the silicon wafer capacity of the magazine is 120 sheets when one sheet of silicon wafer is attached.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a silicon chip separates paper and divides silicon chip magazine for board machine which characterized in that: the silicon wafer partition board machine comprises a square material box body (1), hollow grooves (2) extending to the center of the bottom of the box from the upper edge of the box wall are formed in the four box walls of the material box body (1), detachable inner stop blocks (3) are attached to the inner sides of the box walls of the material box body (1), an arc clamping groove (4) clamped by a material box limiting block of a silicon wafer partition board machine is formed in the bottom of the outer side of the box wall of the material box body (1), a vertical through groove (5) for allowing the material box limiting block of the silicon wafer partition board machine to pass through is formed in the outer side of the box wall of the material box body (1), a limiting groove (6) used for being in limiting fit with a material box lifting seat of the silicon wafer partition board machine is formed in the outer bottom surface of the material box body (1), and a layer of sponge (7) is laid on the inner bottom surface of the material box body (1).

2. The silicon wafer box for the silicon wafer separating paper and board separating machine according to claim 1, wherein: the upper plane of the box wall of the box body (1) is flush with the upper plane of the inner stop block (3).

3. The silicon wafer box for the silicon wafer separating paper and board separating machine according to claim 1, wherein: the inner stop block (3) is attached to the inner side of the box wall of the material box body (1) in an inserting mode.

4. The silicon wafer box for the silicon wafer separating paper and board separating machine according to claim 3, wherein: the inner side of the box wall of the material box body (1) is provided with a trapezoidal slot, the outer side surface of the inner stop block (3) is provided with a trapezoidal insert block matched with the trapezoidal slot in shape, and the inner stop block (3) is fixed on the inner side surface of the box wall of the material box body (1) through the insertion and matching of the trapezoidal insert block and the trapezoidal slot.

5. The silicon wafer box for the silicon wafer separating paper and board separating machine according to claim 1, wherein: inclined net-shaped reinforcing ribs (8) are cast on the outer side surface and the outer bottom surface of the box wall of the box body (1) in a pressure-equalizing manner.

6. The silicon wafer box for the silicon wafer separating paper and board separating machine according to claim 1, wherein: the thickness of the sponge (7) is 3mm.

7. The silicon wafer box for the silicon wafer separating paper and board separating machine according to claim 1, wherein: all be provided with 2 on every box wall lateral surface of magazine body (1) lead to groove (5) perpendicularly, and 2 lead to groove (5) perpendicularly and be located the left and right sides that corresponds box wall lateral surface respectively, every box wall lateral surface bottom of magazine body (1) all is provided with 4 circular arc draw-in groove (4), and 4 circular arc draw-in groove (4) are located 2 of corresponding side respectively the left and right sides that leads to groove (5) perpendicularly.

8. The silicon wafer box for the silicon wafer separating paper and board separating machine according to claim 1, wherein: the outer bottom surface of the material box body (1) is provided with 4 limiting grooves (6), and the 4 limiting grooves (6) are respectively positioned on four vertex angles of the central part of the material box body (1).

9. The silicon wafer box for the silicon wafer separating paper and board separating machine according to claim 1, characterized in that: the external dimension of the magazine body (1) is 264mm long multiplied by 264mm wide multiplied by 80mm high, the internal dimension of the magazine body (1) is 238.6mm long multiplied by 238.6mm wide, and the shallowest depth of the magazine body (1) is 55mm.

10. The silicon wafer box for the silicon wafer separating paper and board separating machine according to claim 7, characterized in that: the inner size of the magazine body (1) after the inner stop block (3) is inserted is 208.6mm multiplied by 208.6mm.