CN216911442U - Clip device for loading of insert machine - Google Patents
Clip device for loading of insert machine Download PDFInfo
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- CN216911442U CN216911442U CN202220214549.0U CN202220214549U CN216911442U CN 216911442 U CN216911442 U CN 216911442U CN 202220214549 U CN202220214549 U CN 202220214549U CN 216911442 U CN216911442 U CN 216911442U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
A clip device for loading a silicon wafer on a wafer inserting machine comprises a frame, a bottom plate and a support plate, wherein the frame is provided with a placing cavity for placing a silicon wafer, the bottom plate is fixedly arranged at the bottom of the placing cavity, and the support plate is arranged above the bottom plate and is movably arranged with the frame; the support plate is provided with an overflow hole, and the bottom plate is provided with a water trough communicated with the overflow hole; the overflow holes can enable the support plate to slow down the buoyancy of water flow gushing out from the water passing groove on the rising of the silicon wafers when the number of the silicon wafers in the placing cavity is gradually reduced, so that the phenomenon that the silicon wafers shake to impact the frame to cause cracking is reduced. According to the utility model, through the matching of the bottom plate and the support plate, the upward buoyancy of water impacting towards the silicon wafer can be improved, so that the support plate pushes the silicon wafer to rise, the distance between the silicon wafer and the slicing mechanism is shortened, and slicing is smoother. After the silicon wafer is inserted into the wafer by the device, the fragmentation rate of the silicon wafer is reduced by 1.5-2%; the capacity of each unit per shift is increased by about 2000 tablets, and the capacity of each unit can be improved by 3-4%.
Description
Technical Field
The utility model belongs to the technical field of cleaning inserting piece equipment, and particularly relates to an elastic clamp device for loading an inserting piece machine.
Background
After the silicon wafers are degummed, the silicon wafers are separated piece by piece on a wafer inserting machine and are inserted into a wafer basket, and in the wafer inserting process, the silicon wafers are stacked in a wafer clip placed in water. However, due to the fact that the structural design of the spring plate loading device is unreasonable, the silicon wafer is prone to being inclined, separation is discontinuous, manual intervention is needed to continuously discharge the silicon wafer, slicing time is long, and working hours are wasted seriously. Meanwhile, under the influence of water flow pressure, fragments are easy to appear especially when the last 20 silicon wafers are about, so that the quality and the yield of the silicon wafers are low.
SUMMERY OF THE UTILITY MODEL
The utility model provides a clip device for loading a silicon wafer, which solves the technical problems that the silicon wafer is not consistent in slicing and is easy to fragment due to the unreasonable structural design of the conventional clip loading device.
In order to solve at least one technical problem, the technical scheme adopted by the utility model is as follows:
a clip device for loading a silicon wafer on a wafer inserting machine comprises a frame, a bottom plate and a support plate, wherein the frame is provided with a placing cavity for placing a silicon wafer, the bottom plate is fixedly arranged at the bottom of the placing cavity, and the support plate is arranged above the bottom plate and is movably arranged with the frame;
the support plate is provided with an overflow hole, and the bottom plate is provided with a water trough communicated with the overflow hole;
the overflow holes can enable the support plate to slow down the buoyancy of water flow gushing out from the water passing groove on the rising of the silicon wafers when the number of the silicon wafers in the placing cavity is gradually reduced, so that the phenomenon that the silicon wafers shake to impact the frame to cause cracking is reduced.
Furthermore, the upper end surface of the bottom plate is of an inclined structure;
the position of the upper end surface of the bottom plate, which is close to one side of the silicon wafer outlet, is higher than the position of the upper end surface of the bottom plate, which is far away from one side of the silicon wafer outlet;
the inclination angle of the upper end surface of the bottom plate is 3-15 degrees.
Furthermore, the water passing groove is located on one side, close to the silicon wafer outlet, of the bottom plate, is arranged along the width direction of the bottom plate, and penetrates through the side wall, close to one side of the support plate, of the water passing groove.
Furthermore, the water passing groove is arranged in the thickness direction of the bottom plate, and is provided with a blind hole groove along the length direction of the bottom plate; at least one side of the support plate, which is close to the support plate, is provided with a first through hole communicated with the overflow hole.
Furthermore, a clearance hole is formed between the bottom plate and the base of the frame, and a second through hole communicated with the clearance hole is formed in one side, close to the base of the frame, of the water passing tank.
Furthermore, the overflow hole and the water trough are both in a long strip structure, and the width of the overflow hole is smaller than the depth of the water trough.
Furthermore, grooves with the same structure are arranged on the side, away from the silicon wafer outlet, of the bottom plate and the side, away from the silicon wafer outlet, of the support plate, and the grooves penetrate through the thickness of the bottom plate and the thickness of the support plate.
Furthermore, the back plate on the side, away from the silicon wafer outlet, of the frame is an inverted U-shaped frame, and an opening of the U-shaped frame is matched with the opening of the groove.
Furthermore, the water passing grooves are a plurality of square grooves which are arranged side by side along the width direction of the bottom plate, and the opening direction of each square groove faces one side of the base of the frame.
Furthermore, each square groove is provided with one overflow hole, and one side of each square groove, which is close to the support plate, is provided with a third through hole communicated with the overflow hole; the overflow hole is matched with the square groove structure.
Furthermore, a plurality of shallow grooves which are arranged opposite to the square grooves are also arranged on one side, close to the bottom plate, of the base of the frame.
Furthermore, the side of the bottom plate and the support plate, which is far away from the silicon wafer outlet, is resisted by the upright post arranged in the back plate of the frame, which is far away from the silicon wafer outlet.
Furthermore, ear holes which are penetrated by the two side plates of the frame are arranged on the two side surfaces of the support plate, and the inner width of each ear hole is larger than the thickness of the side plate.
Furthermore, two pins are arranged at one end, close to the bottom plate, of the outer side of the side plate, the pins are arranged along the width direction of the side plate in a separated mode, and the height of the pin close to one side of the silicon wafer outlet is lower than that of the pin far away from one side of the silicon wafer outlet.
Furthermore, the ear hole passes through from two the height between the pin, just one end of ear hole is located and is close to silicon chip export one side the top of pin, its other end is located and keeps away from silicon chip export one side the below of pin.
The cartridge clip device for loading the film inserting machine has good integral matching effect and simple installation, and does not need to change the original frame structure; through the matching of the bottom plate and the support plate, the upper buoyancy of water flow impact on the silicon wafer can be improved, the support plate pushes the silicon wafer to rise, the distance between the silicon wafer and the slicing mechanism is shortened, and slicing is smoother; manual auxiliary sheet discharging is also reduced, and the automation level of sheet inserting is improved. After the silicon wafer is inserted into the wafer by the device, the fragmentation rate of the silicon wafer is reduced by 1.5-2%; the capacity of each unit per shift is increased by about 2000 tablets, and the capacity of each unit can be improved by 3-4%.
Drawings
Fig. 1 is a schematic structural view of a clip device for loading a piece in a piece-inserting machine according to a first embodiment;
fig. 2 is a top view of the clip device of the first embodiment;
fig. 3 is a side view of the clip device of the first embodiment;
FIG. 4 is a side view of the base plate of the first embodiment;
FIG. 5 is a top view of the base plate of the first embodiment;
FIG. 6 is a top view of the plate of the first embodiment;
fig. 7 is a schematic structural view of a loading clip device of a second embodiment of the card inserter;
fig. 8 is a plan view of a clip device of the second embodiment;
fig. 9 is a side view of a clip device of the second embodiment;
FIG. 10 is a side view of the base plate of the second embodiment;
FIG. 11 is a plan view of the base plate of the second embodiment;
fig. 12 is a top view of the plate of the second embodiment.
In the figure:
100. cartridge clip device 10, frame 11, backplate
111. U-shaped frame 112, upright post 12 and side plate
121. First pin 122, second pin 13 and base
131. Clearance hole 132, shallow groove 20, bottom plate
21. A water trough 22, a first through hole 23 and a second through hole
24. Three through holes 30, support plate 31 and overflow hole
32. Recess 33, ear hole
Detailed Description
The utility model is described in detail below with reference to the figures and specific embodiments.
The first embodiment is as follows:
the embodiment provides a clip device 100 for loading a piece of a piece inserting machine, which comprises a frame 10 vertically arranged, a bottom plate 13 fixedly arranged on a base 13, and a support plate 30 arranged above the bottom plate 13 and movably hinged with two side plates 12, as shown in fig. 1-3; the frame 10 comprises a back plate 11, two side plates 12 and a base 13, the back plate 11, the two side plates 12 and the base 13 jointly form the frame 10 with an upper end surface and side wall surfaces opposite to the back plate 11 which are all of a square column structure arranged in an open manner, a placing cavity for placing a silicon wafer is formed inside the frame 10, the width of the placing cavity is slightly larger than the width of the silicon wafer, and the longitudinal length of the placing cavity is matched with the length of the silicon wafer; the silicon wafer is discharged from the empty side wall surface, leaves the cartridge device 100 and enters a wafer separating mechanism (not shown). An overflow hole 31 is arranged on the support plate 30, and a water through groove 21 communicated with the overflow hole 31 is arranged on the bottom plate 20; the overflow holes 31 can make the support plate 30 reduce the buoyancy of the water flow flowing out of the water passing groove 21 to the silicon wafer when the number of the silicon wafers in the placing cavity is gradually reduced, so that the cracking caused by the silicon wafer shaking and impacting the frame 10 is reduced.
Specifically, as shown in fig. 4, the upper end surface of the bottom plate 20 is of an inclined structure, and the position of the upper end surface of the bottom plate 20 close to the silicon wafer outlet is higher than the position of the upper end surface of the bottom plate far from the silicon wafer outlet, so that the inclination angle θ of the upper end surface of the bottom plate 20 is 3-15 °, which is more favorable for stacking the silicon wafers in the placing cavity, and slightly tilting the silicon wafers close to the outlet upwards, so as to protect the silicon wafers from flowing back out of the placing cavity; the sucking disc is also favorable for sucking the silicon wafer to separate the uppermost silicon wafer from the silicon wafer below the uppermost silicon wafer.
The minimum thickness of the bottom plate 20 is larger than that of the support plate 30, and the lower end face of the bottom plate 20 is arranged in a flush manner; and a clearance hole 131 is arranged between the bottom plate 20 and the base 13, at this time, the upper end surface of the base 13 contacting with the bottom plate 20 is an arc concave surface, so that the clearance hole 131 through which water flows is arranged between the bottom plate 20 and the base 13.
In the present embodiment, as shown in FIG. 1, the water passing grooves 21 are provided on the side of the bottom plate 20 close to the silicon wafer outlet and along the width direction of the bottom plate 20, and the water passing grooves 21 are provided in the thickness direction of the bottom plate 20, that is, the water passing grooves 21 are provided with a constant thickness from both the upper end surface and the lower end surface of the bottom plate 20.
Preferably, as shown in fig. 5, the water passing groove 21 is a blind hole groove formed along the length direction of the bottom plate 20, and a first through hole 22 and a second through hole 23 are respectively formed on both side surfaces thereof so as to communicate with the overflow hole 21 through the first through hole 22 and communicate with the clearance hole 131 through the second through hole 23. The first through hole 22 and the second through hole 23 can be a plurality of single small holes, or integrally arranged long holes,
as shown in fig. 6, the overflow hole 31 and the water passing groove 21 are both strip-shaped structures, the length of the overflow hole 31 is the same as the width of the water passing groove 21, and the width of the overflow hole 31 is smaller than the depth of the water passing groove 21; however, it is necessary to ensure that the overflow area of the first through hole 22 is smaller than the water injection area of the water trough 21, and the total volume of the water trough 21 is larger than the total volume of the overflow hole 21, so as to increase the water flow entering the water trough 21, but the water flow flowing out through the first through hole 22 is suddenly reduced, so that the flow velocity of the water flowing through the first through hole 22 is increased, further, the buoyancy of the water flowing to the support plate 30 is increased by increasing the flow velocity of the water flowing per unit area, so that the support force of the support plate 30 driving the silicon wafer to rise is larger, the approach distance between the silicon wafer and the inserting mechanism can be shortened when the support plate 30 drives the silicon wafer to rise and move, the silicon wafer is more convenient to separate, and the continuity of the silicon wafer discharging is improved. Meanwhile, a movable support plate 30 is arranged on the bottom plate 20, so that the silicon wafer can be supported indirectly through the support plate 30 by the direct buoyancy of water flow in the water through groove 20 and the cartridge clip device 100, the support plate 30 serves as a buffer to slow down the buoyancy of water flow gushing out from the water through groove 21 to the rise of the silicon wafer, the crack of the silicon wafer which is caused by the impact of the silicon wafer on the frame 10 due to the shaking is reduced, and the yield of the silicon wafer is improved.
Further, the bottom plate 30 is a resin plate, and grooves 32 with the same structure are arranged on the side of the bottom plate and the side of the support plate 20 away from the silicon wafer outlet, and the grooves 32 sequentially penetrate through the thickness of the bottom plate 20 and the thickness of the support plate 30; the width of the groove 32 is less than the length of the overflow aperture 31 and the length of the groove 32 is 1/3-1/2 of the length of the strip 30. With respect to the plate 30, the provision of the recess 32 reduces the weight of the plate 30, making it more prone to float. For the bottom plate 20, the arrangement of the groove 32 is more favorable for the thrust of water flow to the upward floating of the silicon chip, because the silicon chip is obliquely and inversely placed in the placing cavity, the gravity of the rear end of the silicon chip is greater than that of the front end of the silicon chip, and then the groove 32 in the rear end part is arranged by penetrating through the bottom plate 20 and the support plate 30, so that the buoyancy of the upward floating of the rear end of the silicon chip is favorably improved.
In the embodiment, the back plate 11 and the two side plates 12 in the frame 10 are independent and arranged with a gap, so as to improve the circulation of water flow and the overflow area of water flow; the back plate 11 is an inverted U-shaped frame 111, an opening of the U-shaped frame 111 is matched with an opening of the groove 32, that is, two vertical frames of the inverted U-shaped frame 111 are respectively in contact with the bottom plate 20 and the support plate 30 on two sides of the groove 32, so that the fixing stability of the bottom plate 20 is improved, meanwhile, the stability of placing the support plate 30 can be improved, and the support plate 30 is prevented from being misplaced and inclined in the placing cavity.
In order to improve the stability of the support plate 30 in placement, ear holes 33 penetrated by the side plates 12 are arranged on both sides of the support plate 30 in the width direction, and the inner width of the ear holes 33 is larger than the thickness of the side plates 12, so that the side plates 12 are prevented from moving by being clamped on the support plate 30.
Further, the height of the support plate 30 floating up and down in the placing cavity is increased, two pins, namely a pin I121 and a pin II 122, are arranged at one end of the outer side of the side plate 12 close to the bottom plate 20 and are respectively arranged along the width direction of the side plate 12, the pin I121 is arranged close to one side of a silicon wafer outlet, the pin II 122 is arranged close to one side of the groove 32, and the height of the small definition 121 is lower than that of the pin II 122. At this time, the ear hole 33 passes through the height gap between the height positions, and one end of the ear hole 33 is positioned above the first pin 121, and the other end thereof is positioned below the second pin 122, so as to keep the support plate 30 consistent with the inclination direction of the bottom plate 20 all the time.
Example two:
as shown in fig. 7-9, the clip device 100 of another structure is the most different from the first embodiment: the water passage grooves 21 and the overflow holes 31 are configured differently, so that the back plate 11 contacting the bottom plate 20 and the stay 30 is configured differently.
Specifically, as shown in fig. 8-9, the water passing grooves 21 on the bottom plate 20 are square grooves arranged side by side along the width direction of the bottom plate 20, and correspondingly, the shallow grooves 132 are arranged on the base 13 opposite to the square grooves, and the square grooves and the shallow grooves 132 are combined up and down to form the water passing grooves 21, that is, the base 13 and the bottom plate 20 are directly matched with each other to form one water passing groove 21 which is arranged in a mutual communication manner. And all set an overflow hole 31 above every square groove, overflow hole 31 is the same with the structure in square groove, also is the square hole. One side of the water trough 21 close to the support plate 30 is provided with a third through hole 24 communicated with the overflow hole 31; the through hole area of each through hole III 24 is not larger than the overflow area of the overflow hole 213 matched with the through hole III, and in the embodiment, the through hole area of each through hole III 24 is the same as the overflow area of the overflow hole 213 matched with the through hole III; and the total overflow area of the third through holes 24 is smaller than the total water injection area of the water trough 21, and the total volume of the water trough 21 is larger than the total volume of the overflow holes 21.
Preferably, in order to reduce the resistance of the water flow in the water through groove 21, the bottom and the end surface along the longitudinal depth of the bottom plate 20 are sloping surfaces, and the end surface is arranged obliquely upwards, that is, when the water flow impacts the end surface, the water flow can overflow upwards along the sloping surfaces towards the inside of the through hole three 24, which is more beneficial to improving the supporting buoyancy of the support plate 30.
In order to improve the impulsive force of the silicon wafer floating on the support plate 30, the overflow hole 31 is required to be arranged close to the middle position of the support plate 30 but close to one side of the silicon wafer outlet. Meanwhile, in order to improve that the support plate 30 can be stably placed on the bottom plate 20, a certain distance is reserved between the overflow hole 31 and the front side surface of the bottom plate 30; correspondingly, the upper end surface of the bottom plate 20 near the front side surface is an integrally connected plane for flatly supporting the support plate 30, so as to ensure the stability of the support plate 30.
In this embodiment, the support plate 30 and the bottom plate 20 are integrally arranged at one end close to the back plate 11, so that one side surfaces of the support plate 30 and the bottom plate 20 are relatively stable, the back plate 11 is used for blocking the inclination of the support plate 30 and the silicon wafer, meanwhile, in order to improve the fluidity of water flow, the back plate 11 is a frame body with a T-shaped structure, and the upright column 112 vertically arranged is located in the middle position of the width of the support plate 30; meanwhile, the back plate 11 with the T-shaped structure and the cross bars welded on the upper end faces of the upright posts 112 can be lapped on the side plates 12 on two sides so as to improve the fixing strength of the back plate 11. Of course, the base 13 of the two embodiments can be arranged interchangeably.
In both embodiments, an end surface of the base 13 near the through hole slot 21 may be protruded from the end of the bottom plate 20, as shown in fig. 2, and at this time, arc-shaped concave surfaces are further provided at both ends of the protruded portion of the base 13 in order to match with short posts in the water tank to fix the placement of the cartridge holder device 100. Or, the end surface of one side of the base 13 close to the through hole groove 21 is flush with the end of the bottom plate 20, and at this time, the whole base 13 is of a square structure and is clamped in the clamping groove in the water tank.
By adopting the cartridge clip device for loading the film of the film inserting machine, after the structure is optimized, the overall matching effect is good, the installation is simple, and the original frame structure does not need to be changed; through the matching of the bottom plate and the support plate, the upper buoyancy of water flow impact on the silicon wafer can be improved, the support plate pushes the silicon wafer to rise, the distance between the silicon wafer and the slicing mechanism is shortened, and slicing is smoother; manual auxiliary sheet discharging is also reduced, and the automation level of sheet inserting is improved. After the silicon wafer is inserted into the wafer by the device, the fragmentation rate of the silicon wafer is reduced by 1.5-2%; the capacity of each unit per shift is increased by about 2000 tablets, and the capacity of each unit can be improved by 3-4%.
The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (15)
1. The cartridge clip device for loading the silicon wafers on the wafer inserting machine is characterized by comprising a frame, a bottom plate and a support plate, wherein the frame is provided with a placing cavity for placing the silicon wafers, the bottom plate is fixedly arranged at the bottom of the placing cavity, and the support plate is arranged above the bottom plate and is movably arranged with the frame;
the support plate is provided with an overflow hole, and the bottom plate is provided with a water trough communicated with the overflow hole;
the overflow holes can enable the support plate to slow down the buoyancy of water flow gushing out from the water passing groove on the rising of the silicon wafers when the number of the silicon wafers in the placing cavity is gradually reduced, so that the phenomenon that the silicon wafers shake to impact the frame to cause cracking is reduced.
2. The clip device for loading a wafer into a wafer inserting machine according to claim 1, wherein the upper end surface of the bottom plate is of an inclined structure;
the position of the upper end surface of the bottom plate, close to one side of the silicon wafer outlet, is higher than the position of the upper end surface of the bottom plate, far away from one side of the silicon wafer outlet; the inclination angle of the upper end surface of the bottom plate is 3-15 degrees.
3. The wafer loading cartridge clip device of claim 1 or 2, wherein the water passage groove is located on the side of the bottom plate close to the silicon wafer outlet and is arranged along the width direction of the bottom plate, and penetrates through the side wall of the water passage groove close to the support plate; the total volume of the water through groove is larger than the total volume of the overflow hole.
4. The clip device for loading a wafer into a wafer inserting machine according to claim 3, wherein the water passage groove is provided in a blind hole groove provided in a thickness direction of the base plate and along a length direction of the base plate; at least one side of the support plate, which is close to the support plate, is provided with a first through hole communicated with the overflow hole.
5. The clip device for loading a wafer into a chip mounter according to claim 4, wherein a clearance hole is formed between the bottom plate and the base of the frame, and a second through hole communicated with the clearance hole is formed in one side of the water passing groove close to the base of the frame.
6. The clip device for loading a wafer into a wafer inserting machine according to claim 4 or 5, wherein the overflow hole and the water through groove are both in a strip shape, and the width of the overflow hole is smaller than the depth of the water through groove.
7. The clip device for loading silicon wafers of claim 6, wherein the bottom plate and the support plate are provided with grooves of the same structure on the sides away from the silicon wafer outlet, and the grooves are formed through the thicknesses of the bottom plate and the support plate.
8. The clip device of claim 7, wherein the back plate of the frame at a side away from the silicon wafer outlet is an inverted U-shaped frame, and the opening of the U-shaped frame is matched with the opening of the groove.
9. The clip device for loading tablets of claim 3, wherein said water passing grooves are a plurality of square grooves arranged side by side in the width direction of said base plate, and the opening direction of said square grooves is arranged toward the base side of said frame.
10. The clip device for loading a film into a card inserting machine as claimed in claim 9, wherein each of the square grooves is provided with one of the overflow holes, and one side of the square groove close to the support plate is provided with a third through hole communicated with the overflow hole; the overflow hole is matched with the square groove structure.
11. The clip device for loading wafers into a wafer inserting machine as claimed in claim 9 or 10, wherein a plurality of shallow grooves are formed on the base of the frame on the side close to the bottom plate and opposite to the square grooves.
12. The wafer loading cartridge clip apparatus of claim 11, wherein the base plate and the support plate are supported by posts in a back plate disposed on a side of the frame away from the silicon wafer outlet.
13. The clip device for loading a card inserter according to any of the claims 4 to 5, 7 to 8, 9 to 10 and 12, wherein the support plate is further provided with ear holes on both sides thereof, the ear holes being penetrated by both side plates of the frame, and the inner width of the ear holes is larger than the thickness of the side plates.
14. The clip device of claim 13, wherein two pins are disposed at an end of the outer side of the side plate adjacent to the bottom plate, the pins are spaced apart along the width of the side plate, and the height of the pin adjacent to the silicon wafer outlet is lower than the height of the pin away from the silicon wafer outlet.
15. The wafer loading cartridge clip apparatus of claim 14, wherein the ear hole extends through a height between two pins, and one end of the ear hole is located above the pin near the outlet side of the wafer, and the other end of the ear hole is located below the pin far from the outlet side of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220214549.0U CN216911442U (en) | 2022-01-26 | 2022-01-26 | Clip device for loading of insert machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220214549.0U CN216911442U (en) | 2022-01-26 | 2022-01-26 | Clip device for loading of insert machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216911442U true CN216911442U (en) | 2022-07-08 |
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ID=82264616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220214549.0U Active CN216911442U (en) | 2022-01-26 | 2022-01-26 | Clip device for loading of insert machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216911442U (en) |
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2022
- 2022-01-26 CN CN202220214549.0U patent/CN216911442U/en active Active
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