CN218003619U

CN218003619U - Flat plate type semiconductor device steady-state thermal resistance testing device

Info

Publication number: CN218003619U
Application number: CN202220282793.0U
Authority: CN
Inventors: 李杲宇; 张西刚
Original assignee: Shenzhen Shenhongsheng Electronic Co ltd
Current assignee: Shenzhen Shenhongsheng Electronic Co ltd
Priority date: 2022-02-12
Filing date: 2022-02-12
Publication date: 2022-12-09
Anticipated expiration: 2032-02-12

Abstract

The utility model provides a flat semiconductor device steady state thermal resistance testing arrangement, including cylinder, cold source end, first standard thermal resistance, second standard thermal resistance, hot source end, mounting bracket, measured device, buffering post, buffer spring, elastic pressing piece and pressure detection module, the cylinder is installed on the top of mounting bracket and its output drive is connected the cold source end, the bottom of cold source end is fixed with first standard thermal resistance, the bottom of mounting bracket is located the below of cold source end is fixed with the hot source end, the top of hot source end is fixed with second standard thermal resistance, the measured device has been placed at the top of second standard thermal resistance, and the top of second standard thermal resistance is close to both sides department and is fixed with pressure detection module, and the bottom of first standard thermal resistance is close to both sides department and is equipped with rather than inside sliding connection's buffering post, has cup jointed buffer spring on the buffering post, the bottom of buffering post is fixed with elastic pressing piece. The utility model discloses test method is simple, and the device under test is not fragile, repeatedly usable.

Description

Flat plate type semiconductor device steady-state thermal resistance testing device

Technical Field

The utility model relates to a semiconductor device test equipment technical field, very much be a flat semiconductor device steady state thermal resistance testing arrangement.

Background

The thermal resistance of the power semiconductor device is an important index of device performance parameters, and the thermal resistance is defined as the ratio of the temperature difference of two specified points to the dissipation power generating the temperature difference of the two points under the thermal balance condition. The thermal resistance reflects the heat dissipation capability of the device.

The conventional thermal resistance testing device is easy to cause damage to a tested piece in the thermal resistance measurement testing process, so a flat plate type semiconductor device steady-state thermal resistance testing device is urgently needed to be designed to solve the problems.

SUMMERY OF THE UTILITY MODEL

The utility model provides a utility model aims to provide a flat semiconductor device steady state thermal resistance testing arrangement, the device test method is simple, and the device under test is not fragile, repeatedly usable.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a steady-state thermal resistance testing device for a flat plate type semiconductor device comprises an air cylinder, a cold source end, a first standard thermal resistance, a second standard thermal resistance, a heat source end, a mounting frame, a tested device, a buffer column, a buffer spring, an elastic pressing sheet and a pressure detection module.

Preferably, the heat source end is an electrically heated constant temperature heat source made of a metal material.

Preferably, the cold source end is composed of a constant-temperature and constant-flow circulating water system.

Preferably, the first standard thermal resistance and the second standard thermal resistance are cylindrical metal standard thermal resistances.

Preferably, the first standard thermal resistance and the second standard thermal resistance are externally coated with heat insulation and preservation materials.

The utility model provides a flat semiconductor device steady state thermal resistance testing arrangement. The method has the following beneficial effects:

1. the utility model discloses device test method is simple, and the device under test is not fragile, repeatedly usable.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is an enlarged schematic structural view of fig. 1A of the present invention.

In the figure: the device comprises a cylinder 1, a cold source end 2, a first standard thermal resistor 3, a second standard thermal resistor 4, a hot source end 5, a mounting rack 6, a tested device 7, a buffer column 8, a buffer spring 9, an elastic pressing sheet 10 and a pressure detection module 11.

Detailed Description

The invention will be further described with reference to the accompanying drawings and specific embodiments:

in the description of the present invention, it should be noted that the terms "top", "bottom", "one side", "the other side", "front", "back", "middle part", "inside", "top", "bottom", etc. indicate the directions or positional relationships based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1-2, a device for testing steady-state thermal resistance of a flat plate type semiconductor device includes a cylinder 1, a cold source end 2, a first standard thermal resistance 3, a second standard thermal resistance 4, a hot source end 5, a mounting frame 6, a device under test 7, a buffer post 8, a buffer spring 9, an elastic pressing sheet 10 and a pressure detection module 11, and is characterized in that the cylinder 1 is mounted on the top end of the mounting frame 6, and the output end of the cylinder is in driving connection with the cold source end 2, the first standard thermal resistance 3 is fixed on the bottom of the cold source end 2, the hot source end 5 is fixed on the bottom of the mounting frame 6 below the cold source end 2, the second standard thermal resistance 4 is fixed on the top of the hot source end 5, the device under test 7 is placed on the top of the second standard thermal resistance 4, the pressure detection module 11 is fixed on the top of the second standard thermal resistance 4 near both sides, the buffer posts 8 slidably connected with the bottom of the first standard thermal resistance 3 are arranged near both sides, the buffer posts 8 are sleeved with the buffer spring 9, and the elastic pressing sheet 10 is fixed on the bottom of the buffer posts.

Specifically, the heat source end 5 is an electric heating constant temperature heat source made of a metal material.

Specifically, the cold source end 5 is composed of a constant-temperature and constant-current circulating water system.

Specifically, the first standard thermal resistance 3 and the second standard thermal resistance 4 are cylindrical metal standard thermal resistances.

Specifically, the first standard thermal resistance 3 and the second standard thermal resistance 4 are coated with heat insulation materials.

When the device is used, a heat flow channel for connecting the tested device 7 in series is established through the cold source end 2, the first standard heat resistance 3, the second standard heat resistance 4 and the heat source end 5, the heat flow power is obtained through the temperature difference of two ends of the first standard heat resistance 3 and the second standard heat resistance 4 in the test channel, the temperature difference of two ends of the tested device is tested, the heat resistance of the tested device 7 is calculated, the first standard heat resistance 3 is driven by the air cylinder to press down the tested device 7, the spring is compressed, and the elastic pressing sheet 10 presses the pressure detection module 11 to measure the pressure, so that the tested device 7 is not easy to damage in the measuring process.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The device for testing the steady-state thermal resistance of the flat plate type semiconductor device comprises an air cylinder (1), a cold source end (2), a first standard thermal resistance (3), a second standard thermal resistance (4), a thermal source end (5), a mounting rack (6), a tested device (7), a buffer column (8), a buffer spring (9), an elastic pressing sheet (10) and a pressure detection module (11), and is characterized in that the air cylinder (1) is mounted at the top end of the mounting rack (6) and is in drive connection with the cold source end (2) at the output end of the air cylinder, the first standard thermal resistance (3) is fixed at the bottom of the cold source end (2), the thermal source end (5) is fixed below the cold source end (2) at the bottom of the mounting rack (6), the second standard thermal resistance (4) is fixed at the top of the thermal source end (5), the tested device (7) is placed at the top of the second standard thermal resistance (4), the pressure detection module (11) is fixed at the top of the second standard thermal resistance (4) close to two sides, the buffer column (8) in sliding connection with the buffer column (8) is arranged at the bottom of the first standard thermal resistance (3), and the buffer column (8) is fixed at the bottom of the buffer column (8).

2. The device of claim 1 for testing the steady-state thermal resistance of a flat plate type semiconductor device, wherein: the heat source end (5) is an electric heating constant-temperature heat source made of metal materials.

3. The device of claim 1 for testing the steady-state thermal resistance of a flat plate type semiconductor device, wherein: the cold source end (2) is composed of a constant-temperature and constant-current circulating water system.

4. The device for testing the steady-state thermal resistance of the flat plate type semiconductor device according to claim 1, wherein: the first standard thermal resistance (3) and the second standard thermal resistance (4) are cylindrical metal standard thermal resistances.

5. The device for testing the steady-state thermal resistance of the flat plate type semiconductor device according to claim 1, wherein: and the first standard thermal resistance (3) and the second standard thermal resistance (4) are externally coated with heat insulation materials.