CN217991222U - Hot air heating circulating device for hot air reflow soldering furnace body - Google Patents
Hot air heating circulating device for hot air reflow soldering furnace body Download PDFInfo
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- CN217991222U CN217991222U CN202221515870.9U CN202221515870U CN217991222U CN 217991222 U CN217991222 U CN 217991222U CN 202221515870 U CN202221515870 U CN 202221515870U CN 217991222 U CN217991222 U CN 217991222U
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Abstract
The utility model relates to a reflow soldering field, concretely relates to heated air circulation device for hot-blast reflow soldering furnace body, including the fan motor, the impeller, the fan shell, the fan inner shell, a heater, the heating pipe, hot-blast water conservancy diversion pipeline and hot-blast backward flow case, the top at the fan shell is installed to the fan motor, the motor of the fixed fan motor of impeller is epaxial, the heater is installed in the fan shell, the heating pipe is being fixed in the fan inner shell, heater connection heating pipe, the air outlet has been seted up to the bottom at the fan inner shell, the entrance point intercommunication of hot-blast water conservancy diversion pipeline is in air outlet department, be equipped with the ventilation hole to each single heating channel on hot-blast water conservancy diversion pipeline, tail end at hot-blast water conservancy diversion pipeline is communicating hot-blast water conservancy diversion pipeline's wherein one end, the other end is communicating hot-blast backward flow case. The plurality of hot air pipelines are communicated to the plurality of heating areas, only one motor is assembled, the whole reflow soldering furnace can be heated, hot air can be recycled, and the purpose of energy conservation is achieved.
Description
Technical Field
The utility model relates to a reflow soldering field, concretely relates to hot air heating circulating device for hot air reflow soldering furnace body.
Background
Reflow soldering is a soldering process in which the solder terminals or pins of surface mount components are mechanically and electrically connected to the pads of the printed circuit board by re-melting the solder paste which is pre-distributed to the pads of the printed circuit board. Reflow soldering is used to solder the components to the PCB board, and reflow soldering is used to surface mount the components. Reflow soldering is to rely on the action of hot air flow on soldering points, and colloidal flux performs physical reaction under certain high-temperature air flow to achieve SMD soldering; therefore, the reflow soldering is called because the gas circularly flows in the soldering machine to generate high temperature so as to achieve the purpose of soldering.
As shown in fig. 1, the overall structure of the reflow oven is mainly divided into five main parts, namely a heating zone 1, a cooling zone 2, an in-oven gas circulation device, an exhaust gas discharge device 3 and a PCB conveying device 4.
The structure of each heating zone in the furnace body is the same. The upper heating zone and the lower heating zone are respectively provided with a motor which drives an impeller to rotate at a high speed to generate the blowing force of air or nitrogen. The gas is heated by a heating wire or other materials, blown out from the porous plate and is sprayed on the PCB. The motor speed of some reflow furnaces is programmable and adjustable, such as RoHS-848, which can be 1000 to 2800RPM, while some furnaces are fixed when leaving the factory, such as BTU furnaces, which are fixed at high speed of about 3000RPM. The faster the motor speed, the greater the wind power and the greater the heat exchange capacity. By measuring the wind pressure of the blown gas, whether the motor operates normally can be monitored. Due to the volatilization of the flux in the solder paste during the reflow process, the flux may condense on the impeller, reducing the efficiency of the wind, resulting in a reduction of the temperature reflow curve. It is therefore necessary to regularly check and clean the impeller.
The temperature control system and the temperature control of each heating area of the hot air reflow welding machine are vertical closed-loop control systems. The temperature controller maintains the temperature at the set point through PID control. Thermocouple wires adopted by the temperature sensor are arranged below the porous plate and used for sensing the temperature of the airflow.
According to the cooling area structure scheme, after the PCB is subjected to reflow soldering, the PCB must be immediately cooled, and a good soldering effect can be achieved. Thus, a cooling zone follows the reflow oven. The cooling zone is constructed as a water-circulating heat exchanger. And after the cooling fan blows hot air to the circulating water heat exchanger, the cooled air is blown to the PCB. The heat in the heat exchanger is taken away by the circulating water, and the circulating water flows back to the heat exchanger after being cooled.
The hot air reflow soldering furnace transfers heat energy through the laminar motion of hot air, the air in the furnace is continuously heated and circulated by using the heater and the fan, and a workpiece to be soldered is heated by the hot gas in the furnace, so that the soldering is realized.
As shown in fig. 1, a motor, an impeller and a heating pipe are designed in each heating zone for hot air circulation, which results in a huge device, and multiple motors are easy to load when working together, which also results in energy saving, resource waste and increased device cost.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model aims to provide a hot air heating circulating device for hot-blast reflow soldering furnace body communicates to a plurality of zones of heating through a plurality of hot-blast pipes, only assembles a motor and can be in order to whole reflow soldering stove internal heating to hot-blast recovery forms a circulation, reaches energy-conserving purpose.
In order to realize the purpose, the technical scheme of the utility model is as follows:
a hot-blast heating circulating device for hot-blast reflow soldering furnace body, hot-blast reflow soldering furnace body includes the reflow soldering furnace body, be equipped with the zone of heating in the reflow soldering furnace body, conveyer belt and cooling space, go up the zone of heating and the cooling space sets up the top at the conveyer belt side by side, the low reaches end of conveyer belt is arranged in to the cooling space, the upper reaches end of conveyer belt is arranged in to the zone of heating, it comprises one and more than one single heating way to go up the zone of heating, utilize the baffle to separate between the adjacent single heating way of going up, the wind gap that single heating was said is facing to the conveyer belt direction.
The hot air heating circulation device comprises a fan motor, an impeller, a fan outer shell, a fan inner shell, a heater, a heating pipe, a hot air diversion pipeline, a hot air backflow pipeline and a hot air backflow box, wherein the fan outer shell covers the fan inner shell, the fan motor is installed at the top of the fan outer shell, a motor shaft of the fan motor penetrates through the fan outer shell to penetrate into the fan inner shell, the impeller is fixed in the fan inner shell and connected to the motor shaft of the fan motor, the heating pipe is fixed in the fan outer shell of the heater, the heater is connected with the heating pipe, an air outlet is formed in the bottom of the fan inner shell, the inlet end of the hot air diversion pipeline is communicated with the air outlet, the hot air diversion pipeline penetrates from a first single heating channel of an upper heating zone to a last single heating channel of a downstream position, and a ventilation hole facing each single heating channel is formed in the hot air diversion pipeline.
The tail end of the hot air diversion pipeline is communicated with one end of a hot air return pipeline, the hot air return tank is arranged beside the fan inner shell, a communication pipeline is arranged between the hot air return tank and the fan inner shell, and the other end of the hot air return pipeline is communicated with the hot air return tank.
The heated air circulation heating device with the design improves the technology that all heating zones need one heater in the prior art, is designed to use one fan motor and one heater in all heating zones, utilizes the hot air diversion pipeline to transmit hot air into each heating zone, and can ensure that the temperature of each heating zone is equivalent through continuous heating, reduce the use of parts, reduce the equipment cost and also reduce the equipment weight. The hot air reflux pipeline is used for collecting hot air, the hot air is guided to the upstream end of the hot air guide pipeline, the heating pipe and the impeller are used for reheating, the heat energy is recycled, the energy consumption of the equipment is reduced, and the purpose of saving energy is achieved.
Preferably, a cooling air port is arranged on the hot air return pipeline between the last single heating channel at the most downstream end of the upper heating zone and the cooling zone, and a shunting hot air pipe is arranged between the cooling air port and the cooling zone. The structure of the cooling zone is a heat exchanger with water circulation. And after the cooling fan blows hot air to the circulating water heat exchanger, the cooled air is blown to the PCB. It is necessary to divert the hot air to the cooling zone.
Preferably, an exhaust fan is arranged in the hot air return pipeline. Heated air circulation arrives last cooling space position, and utilization air exhauster that can be quick comes with hot-blast extraction to through hot-blast backflow pipeline transmission backheat wind backflow box, hot-blast backflow box gives the fan inner shell with the temperature transmission again, along with the rotation of impeller, through reheating again, gets into hot-blast water conservancy diversion pipeline, forms a cyclic utilization hot-blast closed loop passageway, reduces the loss of heat degree, the maximize utilizes heat energy, reduces the energy consumption.
Preferably, an accelerating heat conduction fan is arranged in the hot air diversion pipeline. The flow of hot air flow is accelerated, so that the temperature at each position in the hot air diversion pipeline is quickly balanced.
Preferably, a temperature sensor is installed at a vent hole facing each single heating passage, and the temperature sensor is electrically connected to a speed switch of the fan motor and a temperature control switch of the heater through a relay. The temperature of each heating area is detected at any time through the temperature of the induction air flow, the temperature required to be heated by the heater can be flexibly adjusted according to the temperature setting, and the required temperature for heating and welding the PCB can be flexibly controlled.
Preferably, the heating tube is formed in a ring shape around the outer circumference of the impeller. The impeller can be quick go out quick, the even blow of the heat degree on the heating pipe like this for hot-blast quick be full of hot-blast diversion pipeline, make everywhere in the hot-blast diversion pipeline reach temperature stability, even fast, last heat retaining be PCB board carry out the heat degree conveying on the conveyer belt.
Drawings
FIG. 1 is a schematic view of a prior art;
FIG. 2 is a schematic front view of a hot air heating circulation device;
fig. 3 is a schematic view of the structure of the utility model in the use state.
Detailed Description
In order to make the technical means, creation characteristics, achievement purpose and efficacy of the utility model easy to understand and understand, the utility model is further explained by combining with the specific embodiments.
The hot air heating circulating device for the hot air reflow soldering furnace body shown in the figures 2 and 3 comprises a reflow soldering furnace body, wherein an upper heating area, a conveyor belt and a cooling area are arranged in the reflow soldering furnace body, the upper heating area and the cooling area are arranged above the conveyor belt side by side, the downstream end of the conveyor belt is arranged in the cooling area, the upstream end of the conveyor belt is arranged in the upper heating area, the upper heating area consists of one or more than one single heating channel, the adjacent upper single heating channels are separated by a baffle, and the air opening of the single heating channel faces to the direction of the conveyor belt.
The hot air heating circulation device comprises a fan motor 5, an impeller 6, a fan outer shell 7, a fan inner shell 8, a heater 9, a heating pipe 10, a hot air diversion pipeline 11, a hot air return pipeline 12 and a hot air return tank 13, wherein the fan outer shell 7 covers the fan inner shell 8, the fan motor 5 is arranged at the top of the fan outer shell 7, a motor shaft of the fan motor 5 penetrates through the fan outer shell 7 to enter the fan inner shell 8, the impeller 6 is fixed in the fan inner shell 8 and connected to the motor shaft of the fan motor 5,
the heater 9 is arranged in the fan outer shell 7, the heating pipe 10 is fixed in the fan inner shell 8, the heater 9 is connected with the heating pipe 10, and the heating pipe 10 is looped into a ring shape and surrounds the periphery of the impeller 6. Thus, after the heating tube 10 is heated, the impeller 6 rotates rapidly to rapidly transfer the hot air around the heating tube 10. The air outlet 80 has been seted up in the bottom of fan inner shell 8, the entrance point intercommunication of hot-blast water conservancy diversion pipeline 11 is in air outlet 80 department, hot-blast water conservancy diversion pipeline 11 alternates to the last single heating channel of most low reaches department from the first single heating channel of the last zone of heating, be equipped with the ventilation hole to each single heating channel on hot-blast water conservancy diversion pipeline 11, impeller 6 is quick with hot-blast transmission to hot-blast water conservancy diversion pipeline 11 in, hot-blast in being full of hot-blast water conservancy diversion pipeline 11 will go out from the ventilation hole, spread the heat to the conveyer belt 4 that goes out, colloidal solder flux melts under high temperature fast, just so the PCB board at the conveyer belt can weld with the device, for accelerating hot-blast quick a plurality of single heating channels that are full of, be equipped with heat conduction fan 14 in hot-blast water conservancy diversion pipeline 11, accelerate the air flow and reach the purpose that the heat distributes fast, just can be with the heat transmission of source to every zone of heating through hot-blast water conservancy diversion pipeline 11, for reducing the loss of temperature in the diffusion process, can set up the one deck heat preservation in hot-blast water conservancy diversion pipeline 11 outside.
In addition, in order to save energy, a pipeline for recycling hot air and reheating is also designed in the present example, namely: the tail end of the hot air diversion pipeline 12 is communicated with one end of the hot air return pipeline 12, the hot air return tank 13 is installed beside the fan inner shell 8, a communication pipeline is arranged between the hot air return tank and the fan inner shell, the other end of the hot air return pipeline 12 is communicated with the hot air return tank 13, an exhaust fan 15 is arranged in the hot air return pipeline 12, hot air which is circulated is pumped back for reuse, and the function of accelerating air flow in the hot air diversion pipeline 11 is achieved.
In order to introduce the surplus heat into the cooling area 2 and convert the heat energy into cold air through the heat exchanger, the PCB is cooled in the cooling area 2, a cooling air port is arranged on a hot air return pipeline 12 between the last single heating channel at the most downstream end of the upper heating area 1 and the cooling area 2, and a shunting hot air pipe 16 is arranged between the cooling air port and the cooling area.
In this case, in order to ensure the stability of the temperatures of the plural heating zones, a temperature sensor is installed at the vent hole facing each single heating lane, and the temperature sensor is electrically connected to the speed switch of the fan motor 5 and the temperature control switch of the heater 9 through a relay. A plurality of heating temperatures are designed, and the heating temperature and the speed of rotation of the impeller 6 can be controlled by a program.
As shown in figure 3, heating zones 1 are arranged on the upper side and the lower side of a conveying belt 4 in the reflow soldering furnace body, when the design is applied, only a group of hot air heating circulating devices are required to be arranged above and below the conveying belt 4 respectively, and the heating is simultaneously carried out to melt glue from the upper direction and the lower direction of a PCB so as to weld the PCB and devices.
It is right above that the utility model provides a heated air heating circulating device for hot air reflow soldering furnace body has carried out the detailed introduction. The description of the specific embodiments is only intended to assist in understanding the method of the present invention and its core idea, and it should be noted that, for a person skilled in the art, several modifications and improvements can be made to the present invention without departing from the principle of the present invention, and these modifications and improvements also fall within the scope of the claims of the present invention.
Claims (6)
1. A hot air heating circulating device for a hot air reflow soldering furnace body comprises a reflow soldering furnace body, wherein an upper heating area, a conveyor belt and a cooling area are arranged in the reflow soldering furnace body, the upper heating area and the cooling area are arranged above the conveyor belt side by side, the cooling area is arranged at the downstream end of the conveyor belt, the upper heating area is arranged at the upstream end of the conveyor belt, the upper heating area consists of one or more than one single heating channel, the adjacent upper single heating channels are separated by a baffle, and the air ports of the single heating channels face the direction of the conveyor belt,
the method is characterized in that: the hot air heating circulation device comprises a fan motor, an impeller, a fan outer shell, a fan inner shell, a heater, a heating pipe, a hot air diversion pipeline, a hot air return pipeline and a hot air return box, wherein the fan outer shell is covered on the fan inner shell, the fan motor is arranged at the top of the fan outer shell, a motor shaft of the fan motor penetrates through the fan outer shell to extend into the fan inner shell, the impeller is fixed in the fan inner shell and connected to the motor shaft of the fan motor,
the heater is arranged in the outer shell of the fan, the heating pipe is fixed in the inner shell of the fan, the heater is connected with the heating pipe,
an air outlet is arranged at the bottom of the inner shell of the fan, the inlet end of the hot air diversion pipeline is communicated with the air outlet, the hot air diversion pipeline is inserted from the first single heating channel of the upper heating area to the last single heating channel at the most downstream, a vent hole opposite to each single heating channel is arranged on the hot air diversion pipeline,
the tail end of the hot air diversion pipeline is communicated with one end of a hot air return pipeline, the hot air return tank is arranged beside the fan inner shell, a communication pipeline is arranged between the hot air return tank and the fan inner shell, and the other end of the hot air return pipeline is communicated with the hot air return tank.
2. The hot air heating circulation device for the hot air reflow soldering furnace body according to claim 1, characterized in that: a cooling air port is arranged on a hot air return pipeline between the last single heating channel at the most downstream end of the upper heating zone and the cooling zone, and a shunting hot air pipe is arranged between the cooling air port and the cooling zone.
3. The hot air heating circulation device for the hot air reflow soldering furnace body according to claim 1, characterized in that: an exhaust fan is arranged in the hot air return pipeline.
4. The hot air heating circulation device for the hot air reflow soldering furnace body according to claim 1, characterized in that: an accelerating heat conduction fan is arranged in the hot air diversion pipeline.
5. The hot air heating circulation device for the hot air reflow soldering furnace body according to claim 1, characterized in that: a temperature sensor is installed at a vent hole facing each single heating passage, and the temperature sensor is electrically connected to a speed switch of the fan motor and a temperature control switch of the heater through a relay.
6. The hot air heating circulation device for the hot air reflow soldering furnace body according to claim 1, characterized in that: the heating pipe is coiled into a ring shape and surrounds the periphery of the impeller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221515870.9U CN217991222U (en) | 2022-06-17 | 2022-06-17 | Hot air heating circulating device for hot air reflow soldering furnace body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221515870.9U CN217991222U (en) | 2022-06-17 | 2022-06-17 | Hot air heating circulating device for hot air reflow soldering furnace body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217991222U true CN217991222U (en) | 2022-12-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221515870.9U Active CN217991222U (en) | 2022-06-17 | 2022-06-17 | Hot air heating circulating device for hot air reflow soldering furnace body |
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| Country | Link |
|---|---|
| CN (1) | CN217991222U (en) |
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2022
- 2022-06-17 CN CN202221515870.9U patent/CN217991222U/en active Active
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