CN217989880U

CN217989880U - Dispensing jig for SMT device

Info

Publication number: CN217989880U
Application number: CN202220944740.0U
Authority: CN
Inventors: 赵红波; 徐志华; 黄熙; 黄财生; 罗剑; 潘文波; 余茂林
Original assignee: Zhuhai Xinli Electronic Technology Co ltd
Current assignee: Zhuhai Xinli Electronic Technology Co ltd
Priority date: 2022-04-22
Filing date: 2022-04-22
Publication date: 2022-12-09
Anticipated expiration: 2032-04-22

Abstract

The utility model relates to a FPC board field especially relates to glue dispensing jig of SMT device, include the base and take the support plate, be provided with the pilot pin on the base, take the support plate on correspond the pilot pin and seted up the locating hole, and take and be provided with the magnet layer on the outside terminal surface of support plate, and placed the FPC board on the magnet layer, FPC board upper cover is equipped with the cover plate, and the cover plate passes through magnetic adsorption with the magnet layer and fixes. The utility model discloses in, through installing the FPC board on taking the support plate, then will take the support plate to install on the base, through taking the magnet layer in the support plate outside to cover plate magnetic adsorption for the whole fixing that keeps leveling of FPC has realized that the whole version of FPCSMT product is glued in succession, has improved production efficiency, has made things convenient for the inspection of gluing the process, and has reduced manufacturing cost, has promoted product competitiveness.

Description

Dispensing jig for SMT device

Technical Field

The utility model relates to a FPC board technical field especially relates to adhesive deposite tool of SMT device.

Background

The dispensing process is mainly used for reinforcing and sealing electronic product components in electronic products, and protecting the electronic products from water/dust and the like, so that the service life and the performance reliability of the electronic products can be well improved. The circuit board sensitive to some electronic equipment and some electronic components are effectively protected for a long time, and the waterproof, dustproof and anticorrosion effects are achieved; the glue is cured to form flexible glue, so that the anti-vibration impact and deformation capacity is better, and the protection capacity of the SMT device is improved.

In the prior art, the SMT device is formed into a single piece, and then the dispensing process is carried out, so that the production efficiency is low, the product needs to be turned over/adjusted to directly inspect a dispensing area, and the height and the like meet the quality requirements, so that the dispensing efficiency is low.

Disclosure of Invention

The utility model aims at solving the defects existing in the prior art and providing a glue dispensing jig for SMT devices.

In order to realize the purpose, the utility model adopts the following technical scheme:

the glue dispensing jig for the SMT device comprises a base and a carrying plate, wherein a positioning needle is arranged on the base, a positioning hole is formed in the carrying plate and corresponds to the positioning needle, a magnet layer is arranged on the outer end face of the carrying plate, an FPC board is placed on the magnet layer, a cover plate is arranged on the FPC board, and the cover plate and the magnet layer are fixed through magnetic adsorption.

Preferably, the four corners of the base are provided with mounting pins, and mounting holes are formed in the support plate corresponding to the mounting pins.

Preferably, the number of the positioning needles and the positioning holes is six, and the diameters of the positioning needles and the positioning holes are 2mm.

Preferably, the cover plate is a stainless steel plate, and the thickness of the cover plate is 0.1mm.

The utility model has the advantages that:

the utility model discloses in, through installing the FPC board on taking the support plate, then will take the support plate to install on the base, through the magnet layer of taking the support plate outside to cover plate magnetic adsorption for FPC is whole to keep leveling and fixing, thereby has realized that FPC SMT product full edition is glued in succession, has improved production efficiency, has made things convenient for the inspection of gluing the process, and has reduced manufacturing cost, has promoted product competitiveness.

Drawings

Fig. 1 is a schematic structural view of a dispensing jig for an SMT device according to the present invention;

fig. 2 is a schematic structural view of a base of the dispensing jig for the SMT device according to the present invention;

fig. 3 is a schematic view of an inner side end face structure of a carrying plate of a dispensing jig for SMT devices of the present invention;

fig. 4 is the utility model provides a point of SMT device glues tool's the board of taking outside terminal surface structure schematic diagram.

In the figure: the magnetic field sensor comprises a base 10, mounting pins 11, positioning pins 12, a mounting plate 20, mounting holes 21, positioning holes 22, a magnet layer 23 and a cover plate 30.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

Referring to fig. 1-4, the dispensing jig for the smt device includes a base 10 and a carrying plate 20, a positioning pin 12 is disposed on the base 10, a positioning hole 22 is disposed on the carrying plate 20 corresponding to the positioning pin 12, so that the base 10 and the carrying plate 20 can be aligned, installed and positioned conveniently, wherein the number of the positioning pins 12 and the positioning holes 22 is six, and the diameters of the positioning pins 12 and the positioning holes 22 are 2mm.

The magnet layer 23 is arranged on the end face of the outer side of the carrying plate 20, the FPC board is arranged on the magnet layer 23, the cover sheet 30 is covered on the FPC board, the cover sheet 30 and the magnet layer 23 are fixed through magnetic adsorption, the cover sheet 30 is a stainless steel sheet, and the thickness of the cover sheet 30 is 0.1mm.

In addition, the mounting pins 11 are disposed at four corners of the base 10, and the mounting plate 20 is provided with mounting holes 21 corresponding to the mounting pins 11, so that the mounting plate 20 can be conveniently mounted.

In this embodiment, when dispensing the SMT device on the FPC board, the FPC board is mounted on the mounting board 20, the mounting board 20 is mounted on the base 10 through the positioning hole 22 and the mounting hole 21, and the stainless cover 30 covers the FPC board, so that the cover 30 keeps the whole FPC flat and fixed under the action of the magnet layer 23 on the outer end surface of the mounting board 20, thereby achieving continuous dispensing.

The utility model discloses in, through installing the FPC board on taking support plate 20, then will take support plate 20 to install on base 10, through taking the magnet layer 23 in the support plate 20 outside to cover plate 30 magnetic adsorption for whole keeping leveling of FPC fixes, thereby realized that the whole version of FPC SMT product is glued in succession, improved production efficiency, made things convenient for the inspection of gluing process, and reduced manufacturing cost, promoted product competitiveness.

The above, only be the embodiment of the preferred of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, which are designed to be replaced or changed equally, all should be covered within the protection scope of the present invention.

Claims

The dispensing jig for the SMT device comprises a base (10) and a carrying plate (20), and is characterized in that positioning pins (12) are arranged on the base (10), positioning holes (22) are formed in the carrying plate (20) corresponding to the positioning pins (12), a magnet layer (23) is arranged on the outer end face of the carrying plate (20), an FPC board is placed on the magnet layer (23), a cover plate (30) is arranged on the FPC board in a covering mode, and the cover plate (30) is fixed with the magnet layer (23) through magnetic adsorption.
2. An SMT device dispensing jig according to claim 1, wherein mounting pins (11) are disposed at four corners of the base (10), and mounting holes (21) are formed in the mounting plate (20) corresponding to the mounting pins (11).
3. An SMT device dispensing jig according to claim 1, wherein the number of the positioning pins (12) and positioning holes (22) is six, and the diameters of the positioning pins (12) and the positioning holes (22) are each 2mm.
4. An SMT device dispensing jig according to claim 1, wherein the cover sheet (30) is a stainless steel sheet, and the thickness of the cover sheet (30) is 0.1mm.