CN217985786U

CN217985786U - Heat dissipation and air guide device and electronic equipment

Info

Publication number: CN217985786U
Application number: CN202221134876.1U
Authority: CN
Inventors: 柯佩君; 谢仲韦; 谢志升; 王文淳
Original assignee: Hongfujin Precision Industry Wuhan Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Wuhan Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2022-05-11
Filing date: 2022-05-11
Publication date: 2022-12-06
Anticipated expiration: 2032-05-11

Abstract

The application relates to the field of electronic equipment heat dissipation, and aims to solve the problem that the heat dissipation effect of an electronic element in electronic equipment is not good. The embodiment of the application provides a heat dissipation air ducting for in electronic equipment, be applied to electronic component for guide the distinguished and admirable electronic component that flows into electronic equipment, including shielding plate, fan and the wind cover that hides, hide the wind cover include the base plate and connect in on the base plate and relative interval set up's both sides board, the through-hole has on the base plate, the base plate with shielding plate and fan alternatively can dismantle the connection, in order to shield when being connected with the shielding plate the through-hole makes cold wind flow through between the board of flowing both sides electronic component, and when being connected with the fan with the through-hole makes cold wind follow relatively the through-hole reaches flow through between the board of both sides electronic component. The application also provides an electronic device. The temperature of different power electronic components can be effectively reduced, and the heat dissipation effect of the electronic equipment is improved.

Description

Heat dissipation and air guide device and electronic equipment

Technical Field

The present disclosure relates to electronic devices, and particularly to a heat dissipation and air guiding device and an electronic device including the same.

Background

With the continuous development of electronic technology, the heat dissipated by electronic components such as a motherboard, a video card, and a memory increases with the increase of power consumption, and if the heat cannot be effectively dissipated, the performance of the electronic components will be seriously affected.

In general, a heat dissipation device is disposed around an electronic component to guide heat generated by the electronic component to flow to the heat dissipation device, but when the performance requirement of the electronic component becomes high, the electronic component with higher power is replaced, and the originally configured heat dissipation device cannot meet the heat dissipation requirement of the electronic component with higher power.

SUMMERY OF THE UTILITY MODEL

In view of this, the present disclosure provides a heat dissipating and wind guiding device and an electronic apparatus including the heat dissipating and wind guiding device, so as to satisfy the heat dissipating requirements of electronic components with different powers.

The embodiment of the application provides a heat dissipation air ducting, is applied to in the electronic equipment for guide the electronic component of wind current flow direction in the electronic equipment, include:

a shielding plate;

a fan;

the air shielding cover comprises a base plate and two side plates which are connected to the base plate and are arranged oppositely at intervals, a through hole is formed in the base plate, the base plate is detachably connected with the shielding plate and the fan alternatively, so that the through hole is shielded when the base plate is connected with the shielding plate, cold air flows through the electronic element between the two side plates, and the fan is opposite to the through hole when the base plate is connected with the fan, so that the cold air flows through the electronic element between the through hole and the two side plates.

In one possible embodiment, the diameter of the through hole is not greater than the width of the shield plate or the fan.

In a possible implementation manner, the wind shielding cover further includes two positioning plates disposed on the base plate at intervals, and the two positioning plates are located at the edge of the through hole and are used for positioning the shielding plate and the fan.

In a possible implementation manner, two clamping portions are oppositely arranged on one side of each of the two positioning plates away from the base plate, and the two clamping portions are used for clamping the shielding plate and the fan.

In a possible embodiment, the two positioning plates and the two side plates are parallel to each other and perpendicular to the base plate.

In a possible embodiment, the wind shield further comprises a guide extending from one side of the base plate, and the guide is used for guiding the cold wind to flow between the two side plates.

In a possible embodiment, the substrate is provided with a plurality of engaging pieces at the edge of the through hole, the shielding plate and the fan are provided with a plurality of engaging holes, and the plurality of engaging pieces are used for being engaged with the plurality of engaging holes.

In a possible embodiment, the shielding plate is provided with a fixing member on a side opposite to the plurality of engaging holes, and the fixing member is used for being connected with the substrate.

The embodiment of the present application further provides an electronic device, which includes an electronic component and the heat dissipation and air guiding device described above, wherein the wind shielding cover is disposed on the electronic component, and the shielding plate and one of the fans shield the through hole.

In one possible embodiment, a system fan is provided within the electronic device, the system fan being located in front of the airflow passing through the electronic components.

Compared with the prior art, the radiating and air guiding device can be placed above the electronic element, the shielding plate and the fan can be selected alternatively to be detachably connected with the base, the through hole is shielded when the radiating and air guiding device is connected with the shielding plate, cold air can flow through the electronic element between the two side plates, the fan is opposite to the through hole when the radiating and air guiding device is connected with the fan, the cold air can flow through the electronic element between the through hole and the two side plates, and based on the radiating and air guiding device, the shielding plate or the fan can be selected alternatively according to the heating performance of the electronic element, air flows with different strengths can be guided to flow through the electronic element, and the radiating requirements of the electronic elements with different powers can be further met.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation and air guiding device provided in the present application.

Fig. 2 is a perspective view of the heat dissipation and air guiding device in fig. 1 in a first application state.

Fig. 3 is a perspective view of the heat dissipating and wind guiding device in fig. 1 in a second application state.

Fig. 4 is a schematic structural view of the heat dissipation and air guiding device shown in fig. 2 disposed in an electronic device.

Fig. 5 is a schematic structural view of the heat dissipation and air guiding device shown in fig. 3 disposed in an electronic device.

Description of the main elements

Electronic device 100

Heat dissipation and air guide device 10

Wind shielding cover 11

Substrate 111

Two side plates 112

Two positioning plates 113

Guide member 114

Through-hole 1111

Engaging member 1112

Shielding plate 12

Engaging

holes

121, 131

Fixing member 122

Fan 13

Electronic component 20

PCB board 30

Host heat dissipation system 40

System fan 41

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

The following description refers to the accompanying drawings to more fully describe the present disclosure. There is shown in the drawings exemplary embodiments of the present application. This application may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. Like reference numerals designate identical or similar components.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Further, as used herein, "comprises" and/or "comprising" and/or "having," integers, steps, operations, components, and/or components, but does not preclude the presence or addition of one or more other features, regions, integers, steps, operations, components, and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. Furthermore, unless otherwise explicitly defined herein, terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and this application and will not be interpreted in an idealized or overly formal sense.

The following description of exemplary embodiments refers to the accompanying drawings. It should be noted that the components depicted in the referenced drawings are not necessarily shown to scale; and the same or similar components will be given the same or similar reference numerals or similar terms.

Embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

As shown in fig. 1 to 3, an embodiment of the present invention provides a heat dissipating and wind guiding device 10, which is applied to an electronic apparatus 100 to improve heat dissipating efficiency of an electronic component 20 in the electronic apparatus 100, where the electronic apparatus 100 may be a personal computer, a server, or the like.

The electronic device 100 includes a PCB 30 and an electronic component 20, such as a memory, disposed on the PCB 30. The heat dissipation and air guiding device 10 includes a wind shielding cover 11, a shielding plate 12, and a fan 13. The shielding cover 11 includes a substrate 111 and two side plates 112 connected to the substrate 111 and disposed at an interval, the substrate 111 has a through hole 1111, the substrate 111 is detachably connected to the shielding plate 12 and the fan 13 alternatively, so as to shield the through hole 1111 when connected to the shielding plate 12 to allow the cold air to flow between the two side plates 112 through the electronic device 20, and when connected to the fan 13, the fan 13 is opposite to the through hole 1111 to allow the cold air to flow between the through hole 1111 and the two side plates 112 through the electronic device 20.

When the heat dissipating and wind guiding device 10 is applied to the electronic apparatus 100, the shielding plate 12 or the fan 13 can be selected to be connected to the substrate 111 according to the heat generating performance of the electronic component 20, so as to guide the air flows with different intensities to flow through the electronic component 20, thereby meeting the heat dissipating requirements of the electronic component 20 with different power consumptions.

Specifically, in some embodiments, the diameter of the through-hole 1111 is no greater than the width of the shield plate 12 or the fan 13. Preferably, the diameter of the through-hole 1111 is the same as the width of the shielding plate 12 or the fan 13.

In some embodiments, the heat dissipating and wind guiding device 10 further includes two positioning plates 113 disposed on the base plate 111 at intervals, and a guiding member 114 extending from one side of the base plate 111. The two positioning plates 113 are disposed at the edge of the through hole 1111, parallel to the two side plates 112 and perpendicular to the base plate 111, and are used for positioning the shielding plate 12 and the fan 13, two clamping portions 1131 are oppositely disposed at one side of the two positioning plates 113 away from the base plate 111, and the two clamping portions 1131 are used for clamping the shielding plate 12 and the fan 13. The guide member 114 is used to guide the cooling air to flow between the two side plates 112, thereby removing the heat generated by the electronic component 20.

In some embodiments, the substrate 111 is provided with a plurality of engaging members 1112 at the edge of the through hole 1111, and the plurality of engaging members 1112 may be shaped as a ball column. The shielding plate 12 and the fan 13 are respectively formed with a plurality of engaging

holes

121 and 131, and the shapes of the engaging

holes

121 and 131 are matched with the shapes of the engaging pieces 1112 for engaging the engaging

holes

121 and 131, so that the shielding plate 12 and the fan 13 can be placed in the substrate 111 more stably.

In some embodiments, the shielding plate 12 is provided with a fixing member 122 at a side opposite to the plurality of engaging holes 121 for connecting with the substrate 111.

Referring to fig. 4-5, the electronic device 100 provided by the present application is provided with a host heat dissipation system 40 therein, wherein the host heat dissipation system 40 includes a system fan 41, and the system fan 41 is disposed at one side of the electronic component 20 and in front of the airflow passing through the electronic component 20. The system fan 41 is configured to suck the hot air with the heat generated by the electronic components 20 into the system fan 41 and discharge the hot air out of the electronic apparatus 100 after the cool air flows through the electronic components 20 from between the two side plates 112.

As shown in fig. 4, when the electronic component 20 belongs to an electronic device with low power consumption, the shielding plate 12 is placed in the through hole 1111 of the wind shielding cover 11 to shield the through hole 1111, the wind shielding cover 11 is placed above the electronic component 20, and the cold wind flows through the electronic component 20 from between the two side plates 112, takes away the heat generated by the electronic component 20, and is then sucked to the system fan 41 and out of the electronic device 100.

As shown in fig. 5, when the electronic component 20 belongs to a large power consumption electronic device, the fan 13 is disposed in the through hole 1111 of the wind shield 11 so as to be opposite to the through hole 1111, the wind shield 11 is disposed above the electronic component 20, and cold wind flows through the electronic component 20 from between the through hole 1111 and the two side plates 112 at the same time, and is drawn to the system fan 41 and arranged outside the electronic device 100 by the system fan 41 after taking away heat generated by the electronic component 20.

Hereinbefore, specific embodiments of the present application are described with reference to the drawings. However, those skilled in the art will appreciate that various modifications and substitutions can be made to the specific embodiments of the present application without departing from the spirit and scope of the application. Such modifications and substitutions are intended to be within the scope of the present application.

Claims

1. A heat dissipation and air guide device is applied to electronic equipment and used for guiding air flow to electronic elements in the electronic equipment, and is characterized by comprising:

a shielding plate;

a fan;

the air shielding cover comprises a substrate and two side plates which are connected to the substrate and are oppositely arranged at intervals, a through hole is formed in the substrate, the substrate is alternatively detachably connected with the shielding plate and the fan, so that the through hole is shielded when the substrate is connected with the shielding plate, cold air flows through the electronic element between the two side plates, and the fan is opposite to the through hole when the substrate is connected with the fan, so that the cold air flows through the electronic element between the through hole and the two side plates.

2. The heat dissipating and wind guiding device according to claim 1, wherein the diameter of the through hole is not larger than the width of the shielding plate or the fan.

3. The heat dissipating and wind guiding device as claimed in claim 1, wherein the wind shielding cover further comprises two positioning plates spaced apart from each other on the base plate, the two positioning plates being located at the edge of the through hole for positioning the wind shielding plate and the fan.

4. The heat dissipating and wind guiding device as claimed in claim 3, wherein two retaining portions are disposed on opposite sides of the two positioning plates away from the substrate, and the two retaining portions are used for retaining the shielding plate and the fan.

5. A heat dissipating and wind guiding device as claimed in claim 4, wherein said two positioning plates and said two side plates are parallel to each other and perpendicular to said base plate.

6. The heat dissipating and wind guiding device as claimed in claim 1, wherein the wind shielding cover further comprises a guiding member extending from one side of the base plate, and the guiding member is used for guiding the cool wind to flow between the two side plates.

7. The heat dissipating and wind guiding device according to claim 1, wherein the substrate is provided with a plurality of engaging members at edges of the through hole, the shielding plate and the fan are provided with a plurality of engaging holes, and the plurality of engaging members are engaged with the plurality of engaging holes.

8. The heat dissipating wind guiding device according to claim 7, wherein the shielding plate is provided with a fixing member on a side opposite to the plurality of engaging holes, the fixing member being used for connecting to the substrate.

9. An electronic device comprising an electronic component, further comprising the heat dissipating and wind guiding apparatus as claimed in any one of claims 1 to 8, wherein the wind shielding cover is disposed on the electronic component, and one of the shielding plate and the fan shields the through hole.

10. The electronic device of claim 9, wherein a system fan is disposed within the electronic device, the system fan being positioned in front of an airflow passing through the electronic component.