CN217983292U

CN217983292U - Film expanding table suitable for die bonder

Info

Publication number: CN217983292U
Application number: CN202222025920.1U
Authority: CN
Inventors: 王永良; 高云; 姜敏
Original assignee: Heyuan Maxtor Electronic Technology Co ltd
Current assignee: Heyuan Maxtor Electronic Technology Co ltd
Priority date: 2022-08-03
Filing date: 2022-08-03
Publication date: 2022-12-06
Anticipated expiration: 2032-08-03

Abstract

The utility model discloses an expand piece platform suitable for solid brilliant machine, including the equipment principal, the equipment principal includes: the base is arranged on the outer fixing surface of the die bonder; the rotary feeding mechanism is used for rotationally feeding wafers, and is arranged on the left side of the top end of the base; the auxiliary mechanism is used for assisting the rotary feeding mechanism to fix the wafer and is arranged on the right side of the top end of the base; through setting up the rotation feed mechanism, the rotary type feed structure makes the material loading and the operation of taking out to the wafer all go on beyond the operation point, and simulation pipelined's processing agency, the material loading of wafer and take out and all do not cause the influence to the extension subassembly, can effectively improve equipment to the extension efficiency of wafer, effectively strengthen the practicality of device, make things convenient for the user to use.

Description

Film expanding table suitable for die bonder

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a wafer expanding table suitable for a wafer fixing machine.

Background

The die bonder is mainly used for lead frame pressing plates of various gold wire ultrasonic welding devices, various suction nozzles, ejector pins, dispensing heads, ceramic nozzles, through needles, motors, carbon brushes, encoders, transmission belts, various spare parts of automation equipment, instruments and the like of various chip mounting devices, and can mount wafers, but the wafers are closely arranged together in an original state.

The wafer expanding equipment of the existing wafer fixing machine is too simple in structure, in the using process, a user needs to manually place a wafer to the operation point of the wafer expanding equipment, after the wafer expanding is finished, the wafer is manually taken out, the wafer expanding equipment is always in a standby state in the process of placing and taking out the wafer, the wafer expanding efficiency is seriously influenced, and the practicability of the device is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an expand piece platform suitable for solid brilliant machine to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above purpose, the utility model provides the following technical scheme: the utility model provides an expand piece platform suitable for solid crystal machine, includes the equipment main part, the equipment main part includes:

the base is arranged on the outer fixing surface of the die bonder;

the rotary feeding mechanism is used for rotationally feeding the wafer and is arranged on the left side of the top end of the base;

the auxiliary mechanism is used for assisting the rotary feeding mechanism to fix the wafer and is arranged on the right side of the top end of the base; and

and the expansion assembly is used for expanding the wafer and is arranged in the middle of the top end of the base.

Further, it includes electronic revolving stage to rotate feed mechanism, electronic revolving stage sets up in the top left side of base, electronic revolving stage's top is provided with the operation panel, be provided with the perforation on the operation panel, the perforation runs through the upper and lower both ends of operation panel, the top right side of operation panel is provided with signal receiver.

Further, the output end of the electric rotary table is upwards provided with a rotating frame, the rotating frame comprises a rotating shaft, the rotating shaft penetrates through the operating platform and extends to the upper side of the operating platform, and a plurality of groups of extending frames are uniformly arranged on the outer side of the rotating shaft along the circumference.

Furthermore, the one end that the pivot was kept away from to the extension frame is provided with puts the frame, put the frame including putting the ring, put ring fixed connection in the one end that the pivot was kept away from to the extension frame, the internal diameter of putting the ring is less than the diameter of blue membrane on the wafer, the top of putting the ring is provided with the contact ring, the outside of putting the ring is provided with signal transmitter, signal transmitter and signal receiver adaptation each other.

Furthermore, the contact ring is made of polyurethane, and is fixedly connected to the top end of the placing ring through hot melting and gluing.

Further, the complementary unit includes the decline driving piece, the decline driving piece includes the decline jar, the decline jar sets up in the top right side of base, the output of decline jar upwards is provided with the decline pole, the top of decline pole is provided with the extension rod left, the left end of extension rod is provided with the compressing tightly piece, the compressing tightly piece includes the clamp ring of fixed connection in the extension rod left end, the clamp ring corresponds with putting the ring each other, the bottom of clamp ring is provided with compresses tightly the pad.

Furthermore, the material of compressing pad is polyurethane, compressing pad hot melt veneer fixed connection is in the bottom of clamp ring.

Further, the extension subassembly is including rising the driving piece, the driving piece that rises includes the jar that rises, jar fixed connection in the top intermediate position of base rises, the output of jar that rises upwards is provided with the push rod that rises, the top of push rod that rises is provided with the extension piece, the extension piece includes fixed connection in the extension piece on the push rod top that rises, the diameter of extension piece equals with the internal diameter of putting the ring, the top outside of extension piece is provided with the arc edge.

Compared with the prior art, this practical beneficial effect is:

by arranging the equipment main body, when in use, a user places a wafer needing to be subjected to wafer expansion operation on the contact ring on the placing ring, the electric turntable drives the rotating frame to rotate to drive the wafer to move to the position below the auxiliary mechanism, the signal transmitter and the signal receiver are mutually connected to send signals, the auxiliary mechanism operates, the descending cylinder drives the descending rod to move downwards to drive the pressing piece to move downwards, the pressing pad at the bottom end of the pressing ring is matched with the contact ring to fix the outer side of a blue film on the wafer, then the expansion assembly operates, the ascending cylinder drives the ascending push rod to move upwards, the expansion piece moves upwards along with the ascending cylinder, the expansion block penetrates through the placing ring, the top end of the expansion block is contacted with the bottom end of the blue film, and in the continuous moving process, as the outer side of the expansion block is provided with an arc edge, the blue membrane is by jack-up, and the wafer of its top is expanded, realizes the quick extension effect to the wafer, and complementary unit and extension subassembly reset afterwards, and electric turntable lasts the operation, and a set of wafer of treating the extension removes to the operation station down, and the wafer after the user will expand takes out to change new wafer can, the utility model discloses a set up and rotate feed mechanism, rotary type material loading structure makes the material loading and the operation of taking out to the wafer all go on beyond the operation point, and simulation pipelined's processing agency, the material loading of wafer and take out and all not cause the influence to the extension subassembly, can effectively improve the extension efficiency of equipment to the wafer, effectively strengthen the practicality of device, make things convenient for the user to use.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following descriptions are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

FIG. 1 is a schematic view of the overall appearance structure of the present invention;

fig. 2 is a schematic structural view of the rotary feeding mechanism of the present invention;

FIG. 3 is a schematic view of the structure of the expansion module of the present invention;

fig. 4 is a schematic structural diagram of the auxiliary mechanism of the present invention.

In the figure: 1. an apparatus main body; 2. a base; 3. rotating the feeding mechanism; 31. an electric turntable; 32. an operation table; 321. perforating; 33. a rotating frame; 331. a rotating shaft; 332. an extension frame; 34. placing frames; 341. placing a ring; 342. a contact ring; 343. a signal emitter; 35. a signal receiver; 4. an expansion component; 41. a lifting drive; 411. a lift cylinder; 412. lifting the push rod; 42. an extension member; 421. an extension block; 4211. a circular arc edge; 5. an auxiliary mechanism; 51. a drop drive; 511. a lowering cylinder; 512. a lowering rod; 513. an extension rod; 52. a compression member; 521. a compression ring; 522. and pressing the pad.

Detailed Description

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by persons skilled in the art based on the embodiments in the present application without any creative work belong to the protection scope of the present application.

Referring to fig. 1-4, the present invention provides a technical solution for a film expanding table of a die bonder: a wafer expanding table suitable for a die bonder comprises an equipment main body 1, wherein the equipment main body 1 comprises:

the base 2 is arranged on the outer fixing surface of the die bonder;

the wafer feeding device comprises a rotary feeding mechanism 3 for rotationally feeding wafers, wherein the rotary feeding mechanism 3 is arranged on the left side of the top end of a base 2, the rotary feeding mechanism 3 comprises an electric rotary table 31, the electric rotary table 31 is arranged on the left side of the top end of the base 2, an operation table 32 is arranged on the top end of the electric rotary table 31, through holes 321 are formed in the operation table 32, the through holes 321 penetrate through the upper end and the lower end of the operation table 32, a signal receiver 35 is arranged on the right side of the top end of the operation table 32, a rotary frame 33 is upwards arranged at the output end of the electric rotary table 31, the rotary frame 33 comprises a rotary shaft 331, the rotary shaft 331 penetrates through the operation table 32 and extends to the upper side of the operation table, a plurality of groups of extension frames 332 are uniformly arranged on the outer side of the rotary shaft 331 along the circumference, a placing frame 34 is arranged at one end, far away from the rotary shaft 331, the placing frame 34 comprises a placing ring 341, the placing ring 341 is fixedly connected to one end, the inner diameter of the placing ring 341 is smaller than the diameter of a blue film on a wafer, a contact ring 342 is arranged at the top end of the placing ring 341, a signal emitter 343 is arranged on the outer side of the placing ring 341, the contact ring 343, the contact ring 341, the contact ring 342, the contact ring 343 is matched with the signal receiver 35, the wafer 341, the wafer 342, the wafer 342, and the wafer is placed on the wafer 342, and is placed on the wafer 342;

the auxiliary mechanism 5 is used for assisting the rotary feeding mechanism 3 to fix the wafer, the auxiliary mechanism 5 is arranged on the right side of the top end of the base 2, the auxiliary mechanism 5 comprises a descending driving piece 51, the descending driving piece 51 comprises a descending cylinder 511, the descending cylinder 511 is arranged on the right side of the top end of the base 2, the output end of the descending cylinder 511 is upwards provided with a descending rod 512, the top end of the descending rod 512 is leftwards provided with an extending rod 513, the left end of the extending rod 513 is provided with a pressing piece 52, the pressing piece 52 comprises a pressing ring 521 fixedly connected to the left end of the extending rod 513, the pressing ring 521 corresponds to the placing ring 341, the bottom end of the pressing ring 521 is provided with a pressing pad 522, the pressing pad 522 is made of polyurethane, the pressing pad 522 is fixedly connected to the bottom end of the pressing ring 521 in a hot melting manner, after signals are mutually communicated between the signal transmitter 343 and the signal receiver 35, the auxiliary mechanism 5 operates, the descending cylinder 511 drives the descending rod 512 to downwards move to drive the pressing piece 52 to downwards, the pressing pad 522 to downwards move, the pressing pad 522 at the outside of the blue film on the wafer is fixed by matching with the contact ring 342, the contact ring, the soft polyurethane material, the polyurethane material can effectively protect the blue film 342 in the process of the wafer, and can effectively protect the blue film 342, and can be damaged blue film in the process; and

the expanding assembly 4 is used for expanding the wafer, the expanding assembly 4 is arranged at the middle position of the top end of the base 2, the expanding assembly 4 comprises an ascending driving member 41, the ascending driving member 41 comprises an ascending cylinder 411, the ascending cylinder 411 is fixedly connected to the middle position of the top end of the base 2, an ascending push rod 412 is arranged at the output end of the ascending cylinder 411 in an upward mode, an expanding member 42 is arranged at the top end of the ascending push rod 412, the expanding member 42 comprises an expanding block 421 fixedly connected to the top end of the ascending push rod 412, the diameter of the expanding block 421 is equal to the inner diameter of the placing ring 341, an arc edge 4211 is arranged on the outer side of the top end of the expanding block 421, when the expanding assembly is used, the ascending push rod 412 is driven to move upwards by the ascending cylinder 411, the expanding member 42 moves upwards along with the expanding block 421, the top end of the expanding block passes through the placing ring 341 and is in contact with the bottom end of the blue film, and in the continuous moving process, the blue film is jacked up due to the fact that the arc edge 4211 is arranged on the outer side of the expanding block 421, the wafer is expanded, and the rapid expanding effect on the wafer is achieved.

The utility model is provided with the equipment main body 1, when in use, a user places a wafer needing to be subjected to wafer expansion operation on the contact ring 342 on the placing ring 341, the electric turntable 31 drives the rotating frame 33 to rotate to drive the wafer to move to the lower part of the auxiliary mechanism 5, the signal transmitter 343 and the signal receiver 35 are mutually communicated with each other to make signals, the auxiliary mechanism 5 operates, the descending cylinder 511 drives the descending rod 512 to move downwards to drive the pressing piece 52 to move downwards, the pressing pad 522 at the bottom end of the pressing ring 521 is matched with the contact ring 342 to fix the outer side of a blue film on the wafer, then the expansion component 4 operates, the ascending cylinder 411 drives the ascending push rod 412 to move upwards, the expansion piece 42 moves upwards along with the ascending, the expansion block 421 passes through the placing ring 341, the top end of the expansion block is contacted with the bottom end of the blue film, and in the continuous moving process, because the outside of extension piece 421 is provided with circular arc limit 4211, the blue membrane is by jack-up, the wafer of its top is expanded, realizes the quick extension effect to the wafer, and complementary unit 5 and extension subassembly 4 reset afterwards, and electric turntable 31 continues the operation, and the wafer that a set of pending extension was expanded down removes to the operation station, and the wafer after the user of service will expand takes out, and it can to change new wafer, the utility model discloses a set up and rotate feed mechanism 3, rotary type feed structure makes the material loading and the operation of taking out to the wafer all go on beyond the operation point, and the processing agency of simulation assembly line formula, the material loading of wafer and take out and all do not cause the influence to extension subassembly 4, can effectively improve equipment to the extension efficiency of wafer, effectively strengthen the practicality of device, make things convenient for the user to use.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an expand piece platform suitable for solid crystal machine, includes equipment main part (1), its characterized in that: the apparatus main body (1) includes:

the base (2), the said base (2) is set up on the external fixed surface of the die bonder;

the rotary feeding mechanism (3) is used for rotationally feeding wafers, and the rotary feeding mechanism (3) is arranged on the left side of the top end of the base (2);

the auxiliary mechanism (5) is used for assisting the rotary feeding mechanism (3) to fix the wafer, and the auxiliary mechanism (5) is arranged on the right side of the top end of the base (2); and

the expansion assembly (4) is used for expanding the wafer, and the expansion assembly (4) is arranged in the middle of the top end of the base (2).

2. The wafer expanding table suitable for the die bonder as claimed in claim 1, wherein: rotate feed mechanism (3) including electronic revolving stage (31), electronic revolving stage (31) set up in the top left side of base (2), the top of electronic revolving stage (31) is provided with operation panel (32), be provided with on operation panel (32) and perforate (321), perforate (321) run through the upper and lower both ends of operation panel (32), the top right side of operation panel (32) is provided with signal receiver (35).

3. The wafer expanding table suitable for the die bonder as claimed in claim 2, wherein: the output end of the electric turntable (31) is upwards provided with a rotating frame (33), the rotating frame (33) comprises a rotating shaft (331), the rotating shaft (331) penetrates through the operating platform (32) and extends to the upper side of the operating platform, and a plurality of groups of extending frames (332) are uniformly arranged on the outer side of the rotating shaft (331) along the circumference.

4. The wafer expanding table suitable for the die bonder as claimed in claim 3, wherein: one end of the extension frame (332), which is far away from the rotating shaft (331), is provided with a placing frame (34), the placing frame (34) comprises a placing ring (341), the placing ring (341) is fixedly connected to one end of the extension frame (332), which is far away from the rotating shaft (331), the inner diameter of the placing ring (341) is smaller than the diameter of a blue film on a wafer, the top end of the placing ring (341) is provided with a contact ring (342), the outer side of the placing ring (341) is provided with a signal emitter (343), and the signal emitter (343) is matched with the signal receiver (35) mutually.

5. The wafer expanding table suitable for the die bonder as claimed in claim 4, wherein: the contact ring (342) is made of polyurethane, and the contact ring (342) is fixedly connected to the top end of the placing ring (341) through hot melting and gluing.

6. The wafer expanding table suitable for the die bonder as claimed in claim 5, wherein: auxiliary mechanism (5) are including descending driving piece (51), descending driving piece (51) are including descending cylinder (511), descending cylinder (511) set up in the top right side of base (2), the output of descending cylinder (511) upwards is provided with descending pole (512), the top of descending pole (512) is provided with extension rod (513) left, the left end of extension rod (513) is provided with compressing component (52), compressing component (52) are including clamp ring (521) of fixed connection in extension rod (513) left end, clamp ring (521) and putting ring (341) correspond each other, the bottom of clamp ring (521) is provided with compresses tightly pad (522).

7. The wafer expanding table suitable for the die bonder as claimed in claim 6, wherein: the material of compress tightly pad (522) is polyurethane, compress tightly pad (522) hot melt veneer fixed connection in the bottom of clamp ring (521).

8. The wafer expanding table suitable for the die bonder as claimed in claim 7, wherein: expansion subassembly (4) are including rising driving piece (41), rising driving piece (41) are including rising jar (411), rise jar (411) fixed connection in the top intermediate position of base (2), the output of rising jar (411) upwards is provided with ascending push rod (412), the top of ascending push rod (412) is provided with extension piece (42), extension piece (42) are including fixed connection in the extension piece (421) on ascending push rod (412) top, the diameter of extension piece (421) equals with the internal diameter of putting ring (341), the top outside of extension piece (421) is provided with arc limit (4211).