CN217967739U

CN217967739U - Silicon wafer cutting device

Info

Publication number: CN217967739U
Application number: CN202221851626.XU
Authority: CN
Inventors: 吴友洲; 戚晓峰
Original assignee: Jiangsu Debi New Material Technology Co ltd
Current assignee: Jiangsu Debi New Material Technology Co ltd
Priority date: 2022-07-19
Filing date: 2022-07-19
Publication date: 2022-12-06
Anticipated expiration: 2032-07-19

Abstract

The utility model discloses a silicon chip cutting device, the test platform comprises a support, the constant head tank has been seted up to the frame upside, and the upper bracket is installed to frame one end upside, and upper bracket upside mid-mounting has the cylinder, and the top board is installed to the cylinder downside, and the locating plate is installed to the top board downside, and the one-to-one setting about locating plate and the constant head tank, and cutting blade is installed through the transmission shaft to frame one end, and transmission shaft one end is connected with first motor through the gear train transmission, and the constant head tank is inside to be provided with the delivery sheet through the lead screw slip, the utility model discloses a constant head tank that is equipped with, top board and locating plate, the silicon rod level that will treat cutting is placed the card and is established in the constant head tank, and cylinder drive top board and locating plate move down and compress tightly the silicon rod location in the constant head tank, and the positional stability is high, is favorable to improving the cutting precision, then cuts the silicon chip through the rotation of first motor drive cutting blade, stores in the silicon chip falls into the storage fill, and cutting efficiency is higher, and convenient operation is swift.

Description

Silicon wafer cutting device

Technical Field

The utility model relates to a silicon chip processing dress technical field specifically is a silicon chip cutting device.

Background

In the process of producing and preparing the silicon wafer, a bearing device is generally required to bear the silicon wafer so as to meet the requirements of cleaning and texturing in the process of producing the solar silicon wafer. The flower basket is a common bearing device for the solar silicon wafer, the silicon wafer is specifically inserted between two adjacent clamping teeth on the flower basket, so that the position of the silicon wafer is fixed, and the solar silicon wafer is prevented from being displaced, floating and stuck in the cleaning and texturing process.

The silicon wafer cutting device with the application number of CN202022684445.X in the prior art has poor silicon rod positioning stability, so that the cutting precision is influenced, and a plurality of silicon rods are not convenient to cut simultaneously, so that the cutting efficiency is low.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a silicon chip cutting device to it is poor to solve silicon rod positioning stability among the prior art, thereby influences the precision of cutting, is not convenient for cut many silicon rods simultaneously moreover and handles, makes the problem that the cutting efficiency is low.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a silicon chip cutting device, includes the frame, the constant head tank has been seted up to the frame upside, the upper bracket is installed to frame one end upside, upper bracket upside mid-mounting has the cylinder, the top board is installed to the cylinder downside, the locating plate is installed to the top board downside, and locating plate and constant head tank one-to-one setting from top to bottom, cutting blade is installed through the transmission shaft to frame one end, transmission shaft one end is connected with first motor through the gear train transmission, the constant head tank is inside to be provided with the delivery sheet through the lead screw slip.

Furthermore, the constant head tank sets to the arc wall, and locating plate and constant head tank correspondence are provided with the multiunit from top to bottom, the PLC switch board is installed in the upper bracket outside.

Further, a protective cover is installed on the outer side of one end of the machine base, and a storage hopper is installed on one side of the protective cover.

Furthermore, the lead screw comprises a lead screw arranged at the top in the base, a slide seat is arranged on the lead screw in a threaded sliding manner, the lower end of the feeding plate is fixedly connected with the slide seat, the lower end of the slide seat is arranged in a sliding manner with the sliding hole at the bottom in the positioning groove, and a second motor is connected to one end of the lead screw in a transmission manner.

Furthermore, the inner wall of the upper support is provided with a sliding groove, and two ends of the upper pressure plate are arranged in the sliding groove in a sliding mode through sliding blocks.

Furthermore, the gear train is including setting up the driven gear in transmission shaft one end, first motor one end transmission is connected with the driving gear, and driven gear and driving gear meshing connection.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a constant head tank, top board and the locating plate that is equipped with on the frame will treat the silicon rod level of cutting and place the card and establish in the constant head tank, and cylinder drive top board and locating plate move down and compress tightly the silicon rod and fix a position in the constant head tank, and positional stability is high, is favorable to improving the cutting precision, then cuts the silicon chip through the rotation of first motor drive cutting blade, and the silicon chip stores in falling into the storage fill, and cutting efficiency is higher, and convenient operation is swift.

2. The utility model discloses and set the arc wall to through the constant head tank, and locating plate and constant head tank correspondence from top to bottom are provided with the multiunit for positioning stability is high, can cut many silicon rods simultaneously moreover and handle, is favorable to improving the efficiency of silicon chip processing.

3. The utility model discloses and the constant head tank is inside to be provided with the delivery sheet through the lead screw slip, the lead screw is including setting up the lead screw at top in the frame, screw thread slidable mounting has the slide on the lead screw, delivery sheet lower extreme and slide and fixed connection, and the slide sliding setting of bottom in slide lower extreme and the constant head tank, lead screw one end transmission is connected with the second motor, make through motor drive lead screw rotation regulation, thereby can adjust the delivery sheet horizontal migration and carry out the material loading cutting and handle, adjust convenient and fast, the regulation precision is high, be favorable to improving sliced homogeneity.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a front view of the overall structure of the present invention;

fig. 2 is a right side view of the upper bracket structure of the present invention;

fig. 3 is a schematic view of the connection structure between the cutting blade and the first motor according to the present invention.

In the figure: 1. a machine base; 2. positioning a groove; 3. an upper bracket; 4. a slider; 5. a cylinder; 6. a screw rod; 7. a slide base; 8. a feeding plate; 9. a slide hole; 10. a second motor; 11. a drive shaft; 12. a cutting blade; 13. a driving gear; 14. a driven gear; 15. a first motor; 16. a protective cover; 17. a storage hopper; 18. an upper pressure plate; 19. positioning a plate; 20. a PLC control cabinet; 21. a chute.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1, fig. 2, fig. 3, in the embodiment of the present invention, a silicon wafer cutting device, which comprises a base 1, a positioning groove 2 has been seted up on the upper side of the base 1, an upper bracket 3 is installed to the upside of the base 1 one end, a cylinder 5 is installed at the upside middle part of the upper bracket 3, a top board 18 is installed to the downside of the cylinder 5, a positioning board 19 is installed to the downside of the top board 18, and a positioning board 19 and a positioning groove 2 are in one-to-one correspondence setting from top to bottom, the cylinder 5 drives the top board 18 and the positioning board 19 to move down to compress and position a silicon rod in the positioning groove 2, the positioning stability is high, which is beneficial for improving the cutting precision, a cutting blade 12 is installed through a transmission shaft 11 at one end of the base 1, the transmission shaft 11 one end is connected with a first motor 15 through a gear set transmission, cut the silicon wafer through the rotation of the first motor 15 driving the cutting blade 12, the silicon wafer falls into a storage hopper 17 to be stored, the cutting efficiency is high, the operation is convenient and fast, a feeding board 8 is provided through the screw sliding inside of the positioning groove 2, which can be adjusted horizontally, the feeding board, the horizontal pushing and the silicon rod cutting processing is convenient and the adjustment, the adjustment is convenient and fast, the adjustment is beneficial for improving the uniformity of the silicon rod.

Preferably, the arc wall is set to the constant head tank 2, and locating plate 19 and constant head tank 2 correspond from top to bottom and are provided with the multiunit for positional stability is high, can cut many silicon rods simultaneously moreover and handle, is favorable to improving the efficiency of silicon chip processing, and PLC switch board 20 is installed in the 3 outsides of upper bracket.

Preferably, a protective cover 16 is installed on the outer side of one end of the machine base 1, so that the lower part of the cutting blade 12 can be conveniently covered and protected, and a storage hopper 17 is installed on one side of the protective cover 16 and used for storing the cut silicon wafers.

Preferably, the lead screw is including setting up the lead screw 6 at top in frame 1, screw thread slidable mounting has slide 7 on the

lead screw

6, 8 lower extremes of delivery sheet and slide 7 and fixed connection, and slide 7 lower extreme and the slide opening 9 of bottom slide 2 in the constant head tank slide set up, 6 one end transmissions of lead screw are connected with second motor 10, make through 6 rotation regulation of second motor 10 drive lead screw, thereby can adjust 8 horizontal migration of delivery sheet, carry out horizontal propelling movement material loading cutting to the silicon rod and handle, adjust convenient and fast, the regulation precision is high, be favorable to improving sliced homogeneity.

Preferably, the inner wall of the upper bracket 3 is provided with a sliding groove 21, and two ends of the upper pressure plate 18 are arranged in the sliding groove 21 in a sliding manner through the sliding block 4, so that the upper pressure plate 18 is guided and treated when being lifted and adjusted, and the positioning stability of the positioning plate 19 is improved.

Preferably, the gear set comprises a driven gear 14 arranged at one end of the transmission shaft 11, one end of the first motor 15 is in transmission connection with a driving gear 13, and the driven gear 14 is in meshing connection with the driving gear 13 so as to drive the cutting blade 12 to rotate for cutting a silicon wafer.

The utility model discloses a theory of operation and use flow: the silicon rod to be cut is horizontally placed and clamped in the positioning groove 2 through the positioning groove 2, the upper pressing plate 19 and the positioning plate 18 which are arranged on the base 1, the air cylinder 5 drives the upper pressing plate 18 and the positioning plate 19 to move downwards to press and position the silicon rod in the positioning groove 2, the positioning stability is high, the cutting accuracy is improved, then the first motor 15 drives the cutting blade 12 to rotate to cut the silicon slice, the silicon slice falls into the storage hopper 17 to be stored, the cutting efficiency is high, and the operation is convenient and fast; and set the arc wall to through constant head tank 2, and locating plate 19 and constant head tank 2 are provided with the multiunit from top to bottom to the correspondence for positioning stability is high, can cut the processing to many silicon rods simultaneously moreover, is favorable to improving the efficiency of silicon chip processing.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a silicon chip cutting device, includes frame (1), its characterized in that: constant head tank (2) have been seted up to frame (1) upside, upper bracket (3) are installed to frame (1) one end upside, upper bracket (3) upside mid-mounting has cylinder (5), top board (18) are installed to cylinder (5) downside, locating plate (19) are installed to top board (18) downside, and locating plate (19) and constant head tank (2) one-to-one setting from top to bottom, cutting blade (12) are installed through transmission shaft (11) to frame (1) one end, transmission shaft (11) one end is connected with first motor (15) through the gear train transmission, constant head tank (2) inside is provided with delivery sheet (8) through the lead screw slip.

2. The silicon wafer dicing apparatus according to claim 1, wherein: the positioning groove (2) is arranged to be an arc-shaped groove, and a plurality of groups of positioning plates (19) and the positioning groove (2) are correspondingly arranged up and down.

3. The silicon wafer dicing apparatus according to claim 1, wherein: a protective cover (16) is installed on the outer side of one end of the machine base (1), and a storage hopper (17) is installed on one side of the protective cover (16).

4. The silicon wafer dicing apparatus according to claim 1, wherein: the lead screw is including setting up lead screw (6) at top in frame (1), screw thread slidable mounting has slide (7) on lead screw (6), feed plate (8) lower extreme and slide (7) and fixed connection, and slide (7) lower extreme and constant head tank (2) interior bottom slide hole (9) slide the setting, and lead screw (6) one end transmission is connected with second motor (10).

5. The silicon wafer dicing apparatus according to claim 1, wherein: the inner wall of the upper support (3) is provided with a sliding groove (21), and two ends of the upper pressure plate (18) are arranged in the sliding groove (21) in a sliding mode through the sliding block (4).

6. The silicon wafer dicing apparatus according to claim 1, wherein: the gear train is including setting up driven gear (14) in transmission shaft (11) one end, first motor (15) one end transmission is connected with driving gear (13), and driven gear (14) and driving gear (13) meshing connection.