CN217966611U

CN217966611U - Metal bond diamond grinding wheel with symmetrically distributed chip grooves

Info

Publication number: CN217966611U
Application number: CN202123334274.9U
Authority: CN
Inventors: 洪文锋; 丘秀敏; 周学文; 赖春涛; 滕延超; 蓝可文
Original assignee: Foshan Nanhai New Way Technologoy Co ltd
Current assignee: Foshan Nanhai New Way Technologoy Co ltd
Priority date: 2021-12-28
Filing date: 2021-12-28
Publication date: 2022-12-06
Anticipated expiration: 2031-12-28

Abstract

The utility model discloses a metallic bond diamond grinding wheel that has chip groove symmetric distribution, including iron base member and working layer, seted up the centre bore in the middle of the iron base member, and centre bore outside a week equidistance has seted up a plurality of fixed orifices, the working layer is installed at iron base member openly, and the working layer comprises abrasive particles, metallic bond powder and lubricated pore-forming material, the chip groove has been seted up to the working layer terminal surface simultaneously, this metallic bond diamond grinding wheel that has chip groove symmetric distribution compares specification edging emery wheel commonly used, its working layer cross-section width increases to 16mm, the increase of width can improve the grinding volume, working layer surface symmetric distribution has 36 chip grooves designs simultaneously, reduce the jam of the last grinding face of emery wheel, the radiating effect of emery wheel has been strengthened, the sharpness and the grinding efficiency of emery wheel in the use have been guaranteed, the chip groove is symmetric distribution, the staff need not to select the direction of rotation when the installation, easy to assemble.

Description

Metal bond diamond grinding wheel with symmetrically distributed chip grooves

Technical Field

The utility model relates to a diamond grinding wheel technical field specifically is a metal bond diamond grinding wheel that has chip groove symmetric distribution.

Background

The diamond grinding wheel is a special-effect tool for grinding high-hardness and brittle materials such as hard alloy, glass, ceramic, precious stone and the like. In recent years, with the rapid development of high-speed grinding and ultra-precision grinding technologies, higher requirements are put on grinding wheels, the ceramic resin bond grinding wheels cannot meet production requirements, and the metal bond grinding wheels are widely applied to production due to the remarkable characteristics of high bonding strength, good formability, long service life and the like. When the wall tiles and the floor tiles are edged, the wall tiles and the floor tiles are firstly coarsely ground through the metal bond diamond edging wheel and then finely edged through the resin bond diamond edging wheel, so that the ceramic tiles reach the standard size.

The existing metal bonding agent edge grinding wheel is generally 250mm in outer diameter, 10mm in cross section width and free of chip grooves on end faces. The design of the chip grooves is also available in products, but the chip grooves are not symmetrically distributed and need to be installed according to the rotation direction of the chip grooves during installation. Along with the line speed of a user production line and the continuous improvement of the hardness of a ceramic tile, the metal bond edge grinding wheel is required to have good sharpness and large grinding amount, and meanwhile, the service life of the metal bond edge grinding wheel is ensured. In the in-service use, often be difficult to reach above customer's requirement with the metal bonding agent edging wheel, consequently use convenient inadequately, to above-mentioned problem, need improve current equipment.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a metal bond diamond grinding wheel that has chip groove symmetric distribution to the chip groove that sets up is not symmetric distribution on the metal bond edging wheel that proposes in solving above-mentioned background art, will install according to chip groove direction of rotation when the installation, makes the installation effectiveness low, and metal bond edging wheel sharpness is low, works as big grinding load, can influence the problem of the life of metal bond edging wheel.

In order to achieve the above purpose, the utility model provides a following technical scheme: a metal bond diamond grinding wheel with symmetrically distributed chip grooves comprises an iron matrix and a working layer,

a central hole is formed in the middle of the iron base body, and a plurality of fixing holes are formed in the periphery of the outer side of the central hole at equal intervals;

the working layer is arranged on the front surface of the iron matrix, and the end surface of the working layer is provided with a chip removal groove.

Preferably, the outer diameter of the working layer is 250mm, and the cross section width of the working layer is 16mm;

by adopting the technical scheme, the grinding amount can be improved by increasing the section width of the working layer.

Preferably, the number of the chip discharge grooves is 36, and the chip discharge grooves are symmetrically distributed;

by adopting the technical scheme, chips can be conveniently removed, the blockage of the grinding surface on the grinding wheel is reduced, and the heat dissipation effect of the grinding wheel is enhanced.

Compared with the prior art, the beneficial effects of the utility model are that: the metal bond diamond grinding wheel with the chip grooves which are symmetrically distributed,

(1) Compare specification edging emery wheel commonly used, its working layer cross-sectional width increases to 16mm, and the increase of width can improve the grinding volume, and working layer surface symmetric distribution has 36 chip groove designs simultaneously, reduces the jam of the last grinding face of emery wheel, has strengthened the radiating effect of emery wheel, has guaranteed sharpness and grinding efficiency of emery wheel in the use, and the chip groove is symmetric distribution, and staff need not to select the direction of rotation when the installation, easy to assemble.

(2) The durability of the grinding wheel is ensured by enhancing the holding force of the abrasive particles to the prealloyed powder, and meanwhile, the auxiliary abrasive is used to partially replace expensive diamond abrasive, so that the cost of the grinding wheel is reduced. Through in-service use, compare with the metal bond emery wheel of specification commonly used, this device has that cooling effect is good, the chip removal is effectual, last sharpness, grinding efficiency is high, the good characteristics of wearing resistance.

Drawings

FIG. 1 is a schematic view of the structure of the present invention;

FIG. 2 is a schematic side view of the cross-sectional structure of the present invention;

fig. 3 is a schematic view of the rear view structure of the present invention.

In the figure: 1. the iron base body 2, the center hole 3, the fixing hole 4, the working layer 5 and the chip groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: a metal bond diamond grinding wheel with symmetrically distributed chip grooves is characterized in that a center hole 2 is formed in the middle of an iron base body 1, a plurality of fixing holes 3 are formed in the periphery of the outer side of the center hole 2 at equal intervals, and the whole grinding wheel is conveniently installed and fixed through the fixing holes 3, as shown in figures 1 and 3.

According to the figure 1 and figure 2, the working layer 4 is arranged on the front surface of the iron matrix 1, and the working layer 4 is composed of abrasive particles, metal bond powder and lubricating pore-forming materials, wherein the abrasive particles comprise diamond particles and auxiliary abrasive, the auxiliary abrasive comprises one or more of silicon carbide, boron carbide, white corundum and brown corundum, the particle size of the auxiliary abrasive is smaller than or close to that of the diamond abrasive particles, meanwhile, the diamond abrasive particles account for 3-5% of the mass ratio of the working layer, the auxiliary abrasive particles account for 3-5% of the volume ratio of the working layer, the auxiliary abrasive is used to effectively reduce the production cost of the grinding wheel, the metal bond powder comprises one or more of copper powder, tin powder, iron powder, nickel powder and pre-alloyed powder, and the metal bond powder accounts for 90-95% of the mass ratio of the working layer, the wear resistance is improved, the service life of the grinding wheel is prolonged, the lubricating pore-forming material comprises one or more of graphite particles and molybdenum disulfide, the lubricating pore-forming material accounts for 2-6% of the mass ratio of the working layer, the high temperature resistance of the grinding wheel during edge grinding is improved, the outer diameter of the working layer 4 is 250mm, the cross section width of the working layer 4 is 16mm, meanwhile, the chip discharge grooves 5 are formed in the end face of the working layer 4, the number of the chip discharge grooves 5 is 36, the chip discharge grooves 5 are symmetrically distributed, the phenomenon that scraps fly in disorder during the working of the grinding wheel to influence the working of the grinding wheel is avoided, the blockage of the grinding face on the grinding wheel is effectively reduced, the heat dissipation effect of the grinding wheel is enhanced, and the sharpness and the grinding efficiency of the grinding wheel in the using process are ensured.

Those not described in detail in this specification are well within the skill of the art.

The terms "central," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like refer to orientations or positional relationships illustrated in the drawings, and are used merely to simplify the description of the present disclosure, rather than to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the scope of the present disclosure.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a have metallic bond diamond grinding wheel of chip groove symmetric distribution, includes iron substrate (1) and working layer (4), its characterized in that:

a center hole (2) is formed in the middle of the iron base body (1), and a plurality of fixing holes (3) are formed in the periphery of the outer side of the center hole (2) at equal intervals;

the working layer (4) is arranged on the front surface of the iron base body (1), and the chip discharge groove (5) is formed in the end face of the working layer (4).

2. A metal bond diamond grinding wheel with symmetrically distributed flutes as defined in claim 1, wherein: the outer diameter of the working layer (4) is 250mm, and the cross section width of the working layer (4) is 16mm.

3. A metal bond diamond grinding wheel with symmetrically distributed flutes as defined in claim 1, wherein: the number of the chip grooves (5) is 36, and the chip grooves (5) are symmetrically distributed.