CN217915210U

CN217915210U - Assembling tool for semiconductor equipment

Info

Publication number: CN217915210U
Application number: CN202221925871.0U
Authority: CN
Inventors: 尹宁
Original assignee: Jiangsu Tianxin Micro Semiconductor Equipment Co ltd
Current assignee: Jiangsu Tianxin Micro Semiconductor Equipment Co ltd
Priority date: 2022-07-25
Filing date: 2022-07-25
Publication date: 2022-11-29
Anticipated expiration: 2032-07-25

Abstract

The utility model provides an assembly fixture for semiconductor equipment, semiconductor equipment includes the cavity and is located the supporter of cavity side, include: the arm comprises a first arm, a second arm and a third arm, wherein the first arm, the second arm and the third arm are sequentially connected in a rotating mode to execute rotating action, and the first arm, the second arm and the third arm are plate-shaped bodies; wherein the first arm is connected with the support body; the first arm, the second arm, and the third arm each include a plurality of holes penetrating through the plate-like body, and in any plate-like body, the area of the holes occupies 55% or more of the area of the plate-like body. The utility model discloses an assembly fixture can be convenient dismantlement or the subassembly of installation semiconductor.

Description

Assembling tool for semiconductor equipment

Technical Field

The utility model relates to a semiconductor equipment technical field, in particular to assembly fixture for semiconductor equipment.

Background

As shown in fig. 1, a semiconductor apparatus generally includes a process chamber for performing a process on a wafer, such as etching, thin film deposition, etc., and since the process of these processes requires process gas to be introduced into the process chamber, there are many complicated gas pipelines 300 around the process chamber, and in order to precisely control the flow rate of the process gas in the gas pipelines 300, many flow control devices 400, such as flow meters and valves, are connected to the gas pipelines 300, but these flow control devices 400 are heavy, such as valves weighing about 20kg, and thus are difficult to handle and fix manually during installation.

Therefore, for the above reasons, there is an urgent need for a tool that can assist the worker in detachment or installation.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an assembly fixture for semiconductor equipment for supplementary manual work when the subassembly of installation or dismantlement semiconductor equipment, convenient operation.

In order to realize the above purpose, the utility model discloses a following technical scheme realizes:

the utility model provides an assembly fixture for semiconductor equipment, semiconductor equipment includes the cavity and is located the supporter of cavity side, its characterized in that includes:

the arm comprises a first arm, a second arm and a third arm, wherein the first arm, the second arm and the third arm are sequentially connected in a rotating mode to execute rotating action, and the first arm, the second arm and the third arm are plate-shaped bodies;

wherein the first arm is connected with the support body;

the first arm, the second arm, and the third arm each include a plurality of holes penetrating through the plate-like body, and in any plate-like body, the area of the holes occupies 55% or more of the area of the plate-like body.

Furthermore, the first arm is a fixed arm, and the second arm and the third arm are movable arms.

Further, the holes are circular holes or square holes.

Furthermore, one surface of the second arm facing the first arm is provided with a containing groove for containing the third arm when in the containing position.

Further, one surface of the first arm facing the second arm is provided with a containing groove for containing the third arm when in the containing position.

Further, the plate-shaped body is 5-15mm thick, the width of the plate-shaped body is 18-30cm, and the length of the first arm is 25-40cm.

Furthermore, one end of the first arm is connected with the supporting body, the other end of the first arm is connected with one end of the second arm, the other end of the second arm is connected with one end of the third arm, and the rotating connection is executed through the rotating device.

Further, the turning motion is performed in a horizontal direction.

Further, the first arm is connected to the support body by a first connecting device, and the first connecting device includes a moving component for sliding and locking the arm on the support body.

Furthermore, the arm further comprises a fourth arm, one end of the fourth arm is rotatably connected with the other end of the third arm, and the fourth arm is detachably connected with the component of the semiconductor device through a second connecting device.

Further, the third arm length is less than the second arm length.

Compared with the prior art, the utility model has the advantages of as follows:

the assembly tool of the utility model can conveniently disassemble or assemble the semiconductor component, and the arm is a plate-shaped body, thus being thin, occupying no space and being not beneficial to supporting heavy objects; the holes can effectively reduce the weight of the plate-shaped body, and meanwhile, a frame supporting body is formed between every two holes, so that the structure is enhanced.

Drawings

In order to illustrate the technical solution of the present invention more clearly, the drawings needed for the description will be briefly introduced below, and it is obvious that the drawings in the following description are an embodiment of the present invention, and for those skilled in the art, other drawings can be obtained without creative effort according to the drawings:

FIG. 1 is a schematic structural diagram of a semiconductor device according to the present invention;

fig. 2 is a schematic structural view of the assembly fixture of the present invention at the storage position;

fig. 3 is a schematic structural view of the assembly tool of the present invention in use.

Detailed Description

The embodiments of the present invention will be described in detail with reference to the accompanying drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the drawings are in a very simplified form and are not to precise scale, and are provided for convenience and clarity in order to assist in describing embodiments of the present invention. To make the objects, features and advantages of the present invention more comprehensible, please refer to the accompanying drawings. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limitation of the implementation of the present invention, so that the present invention does not have the essential significance in the technology, and any modification of the structure, change of the ratio relationship or adjustment of the size should still fall within the scope of the technical content disclosed in the present invention without affecting the function and the achievable purpose of the present invention.

Fig. 1 is the structural schematic diagram of the middle semiconductor device of the present invention, referring to fig. 1, the semiconductor device includes a cavity 100, a support 200, a gas pipeline 300, a flow control device 400 and an assembly fixture 500, the support is located at the cavity side, the cavity can be a process cavity (PM), such as etching, a thin film deposition cavity, a Load Lock cavity (Load Lock) or a transmission cavity (TM), and these cavities all need to be filled with gas, such as process gas, carrier gas or cleaning gas, through the flow control device 300, and the flow of these gases is precisely controlled, because the flow control device 400 has a large weight, the assembly fixture 500 can effectively facilitate the disassembly or assembly of the flow control device 300.

Fig. 2-3 are schematic structural views of the assembly fixture 500 of the present invention. Referring to fig. 2-3, it can be seen that assembly tooling 500 includes:

the arm comprises a first arm 501, a second arm 503 and a third arm 505, wherein the first arm 501, the second arm 503 and the third arm 505 are sequentially connected in a rotating manner to execute rotating action, and particularly, the first arm, the second arm and the third arm are plate-shaped bodies; wherein the first arm 501 is connected with the support body 200;

the first, second, and third arms each include a plurality of holes 5033 that extend through the plate-like body, wherein the area of the holes in any plate-like body is greater than 55% of the area of the plate-like body, and optionally, the holes are circular holes or square holes. The plate-shaped body can be very thin, does not occupy space and is not beneficial to supporting heavy objects; the holes can effectively reduce the weight of the plate-like body, and the frame supports 5035 are formed between the holes, which is beneficial to the structural enhancement.

Further, the first arm 501 is a fixed arm, and the second arm 503 and the third arm 505 are movable arms; one end of the first arm is connected to the support body 200, the other end of the first arm is connected to one end of the second arm, the other end of the second arm is connected to one end of the third arm, and the rotational connection is performed by a rotating device. The rotating device is a hinge, a hinge and the like in the prior art.

The rotation of the second arm 503 and the third arm 505 is performed in a horizontal direction, so that the components (such as the flow control device 400) of the semiconductor device can be installed in any horizontal position, and since the horizontal installation positions of different components are different, the rotation adjustment positions of the second arm 503 and the third arm 505 can be adjusted according to the positions of different components, as shown in fig. 2. In order to better accommodate the components of different installation heights, the first arm is connected with the supporting body through a first connecting device, the first connecting device comprises a moving component, the moving component is used for enabling the arm to slide and lock on the supporting body, the moving component is a track, a screw rod and the like in the prior art, and is not limited in particular, and the plurality of arms can slide up and down along the supporting body 200 through the moving component and can be locked at a certain height.

Optionally, the arm further comprises a fourth arm 507, one end of the fourth arm 507 is rotatably connected to the other end of the third arm 505, the fourth arm is detachably connected to a component (such as the flow control device 400) of the semiconductor device through a second connecting device, and fig. 1 shows a state where the component is mounted on the fourth arm 507, and then the component is mounted on the gas pipeline 300; the arrangement of the fourth arm is beneficial to facilitating the rotation of the assembly.

The assembly fixture has two states: a use state and a storage state. Fig. 3 shows a storage state of the assembly tool at the storage position. Further, the side of the second arm facing the first arm is provided with a receiving groove 5031 for receiving the third arm in the storage position, and/or the side of the first arm facing the second arm is provided with a receiving groove 5031 for receiving the third arm in the storage position.

Optionally, the plate-shaped body is 5-15mm thick, the plate-shaped body is 18-30cm wide, and the first arm is 25-50cm long. Third arm length L is less than second arm length, conveniently accomodates the third arm in the second arm.

The using method comprises the following steps: firstly, the assembly tool 500 is moved on the support body 200 to adjust the height of proper assembly, the multiple arms are opened from the storage positions, the assembly is installed on the fourth arm, the second arm, the third arm and the fourth arm are adjusted to rotate, the assembly is moved to the installation position, then the assembly is installed on the semiconductor equipment, after the installation is finished, the assembly is detached from the fourth arm, and then the multiple arms are rotated to the storage positions.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising a," "8230," "8230," or "comprising" does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

While the present invention has been described in detail with reference to the preferred embodiments thereof, it should be understood that the above description should not be taken as limiting the present invention. Numerous modifications and alterations to the present invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be limited only by the attached claims.

Claims

1. The utility model provides an assembly fixture for semiconductor equipment, semiconductor equipment includes the cavity and is located the supporter of cavity side, its characterized in that includes:

wherein the first arm is connected with the support body;

2. The assembly tooling of claim 1 wherein the first arm is a fixed arm and the second and third arms are moveable arms.

3. The assembly tooling of claim 1, wherein the holes are circular holes or square holes.

4. The assembly tool of claim 2, wherein a face of the second arm facing the first arm is provided with a receiving slot for receiving the third arm in the receiving position.

5. The assembly tool of claim 2, wherein a face of the first arm facing the second arm is provided with a receiving slot for receiving the third arm in the receiving position.

6. The assembly tooling of claim 1, wherein the plate-like body is 5-15mm thick, the plate-like body is 18-30cm wide, and the first arm is 25-40cm long.

7. The assembly fixture of claim 2, wherein one end of the first arm is connected to the support body, the other end of the first arm is connected to one end of the second arm, the other end of the second arm is connected to one end of the third arm, and the rotational connection is performed by a rotating device.

8. The assembly tooling of claim 3 wherein the rotational action is performed in a horizontal direction.

9. The assembly fixture of claim 2, wherein the first arm is coupled to the support body by a first coupling device, the first coupling device including a moving assembly for sliding and locking the arm on the support body.

10. The assembly fixture of claim 7, wherein the arms further comprise a fourth arm, one end of the fourth arm is rotatably connected with the other end of the third arm, and the fourth arm is detachably connected with the component of the semiconductor device through a second connecting device.

11. The assembly tooling of claim 6 wherein the third arm length is less than the second arm length.