CN217903088U - Wafer support switching mechanism and semiconductor process equipment - Google Patents

Abstract

The utility model provides a wafer supports switching mechanism for semiconductor process equipment, include: the first support structure comprises a first support bottom plate and at least three first support seats, and the at least three first support seats are suitable for supporting the wafer; the second supporting structure comprises a second supporting bottom plate and at least three second supporting seats, the at least three second supporting seats are suitable for supporting the wafer, the second supporting bottom plate is arranged below the first supporting bottom plate of the first supporting structure, and the first supporting bottom plate is provided with a through hole; the lifting structure is connected with the second support structure and is suitable for driving the second support structure to enable the second support bottom plate of the second support structure to move between the first position and the second position. The utility model provides a wafer supports switching mechanism all has the stress point in the both sides of wafer and centre, and is more steady when bearing the wafer.

Description

Wafer support switching mechanism and semiconductor process equipment

Technical Field

The utility model relates to a semiconductor manufacturing field specifically, relates to a wafer supports switching mechanism and semiconductor process equipment.

Background

A Wafer Transfer System (WTS) is an important component of a tank Wafer cleaning apparatus, and performs automatic Transfer of wafers from a loading area to a processing area. The wafer transmission system can move the wafer to be cleaned from the storage box to the cleaning device, and can also move the cleaned wafer from the cleaning device to the storage box. That is, the wafer transfer apparatus transfers both the unwashed wafer and the cleaned wafer, which may cause the cleaned wafer to be contaminated.

In order to avoid the occurrence of contamination, the prior art has provided two bearing structures to respectively bear the uncleaned wafer and the cleaned wafer, but the existing bearing structures are all in two-point contact and have a narrow bearing distance, which is not stable enough to bear the wafer and is easy to generate shaking.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least, provide a wafer support switching mechanism and semiconductor process equipment, this wafer support switching mechanism all has the stress point in the both sides of wafer and centre, and is more steady when bearing the weight of the wafer.

To achieve one of the objectives of the present invention, there is provided a wafer support switching mechanism for semiconductor processing equipment, comprising: the wafer support device comprises a first support structure, a second support structure and a third support structure, wherein the first support structure comprises a first support bottom plate and at least three first support seats, and the at least three first support seats are suitable for supporting a wafer; the second supporting structure comprises a second supporting bottom plate and at least three second supporting seats, the at least three second supporting seats are suitable for supporting wafers, the second supporting bottom plate is arranged below the first supporting bottom plate of the first supporting structure, the second supporting bottom plate can move between a first position far away from the first supporting bottom plate and a second position close to the first supporting bottom plate, and through holes matched with the shapes and the positions of the second supporting seats of the second supporting structure are formed in the first supporting bottom plate; and the lifting structure is connected with the second supporting structure and is suitable for driving the second supporting structure to enable the second supporting bottom plate of the second supporting structure to move between the first position and the second position, when the second supporting bottom plate is positioned at the first position, the upper end face of the second supporting seat is lower than the lower edge of the wafer supported by the first supporting seat, and when the second supporting bottom plate is positioned at the second position, the upper end face of the first supporting seat is lower than the lower edge of the wafer supported by the second supporting seat.

Optionally, at least three first supporting seats are arranged in parallel at intervals along the extending direction of the first supporting bottom plate, and the extending direction of the through hole is parallel to the extending direction of the first supporting seat; or at least three second supporting seats are arranged in parallel at intervals along the extending direction of the second supporting bottom plate.

Optionally, the quantity of first supporting seat is the odd number, sets up in the middle first supporting seat sets up on the extension line of the vertical central line of wafer, set up in both sides first supporting seat is in the middle for setting up first supporting seat is the setting of symmetry formula, just the perforating hole is located to set up in the middle the both sides of first supporting seat just are the setting of symmetry formula.

Optionally, a plurality of first tooth space structures are configured on the surface of each first supporting seat facing the wafer, each first tooth space structure is arranged at intervals, and each first tooth space structure is suitable for being clamped on the lower edge of the wafer.

Optionally, the number of the second supporting seats is an even number, the number of the through holes is equal to the number of the second supporting seats, and each of the second supporting seats is adapted to pass through the corresponding through hole.

Optionally, a plurality of second tooth groove structures are formed on the surface of each second support seat facing the wafer, each second tooth groove structure is arranged at intervals, and each second tooth groove structure is suitable for clamping the lower edge of the wafer.

Optionally, the lifting structure includes a cylinder body disposed below the second support base plate and a cylinder telescopic rod disposed in the cylinder body, wherein the cylinder telescopic rod is connected to the lower end surface of the second support base plate.

Optionally, the wafer support switching mechanism further comprises:

a body case having an opening formed at an upper end thereof and an accommodating chamber formed inside thereof; the first supporting structure, the second supporting structure and the lifting structure are all arranged in the machine body shell.

Optionally, the wafer support switching mechanism further includes an annular transition connection plate disposed below the second support base plate; the containing cavity is provided with vertical slide rails and slide blocks arranged on the vertical slide rails, the slide blocks are connected with the annular transition connecting plate, the second supporting bottom plate is driven to move synchronously through the movement of the lifting structure, the annular transition connecting plate is driven to move through the movement of the second supporting bottom plate, and the slide blocks are driven to move along the extending direction of the vertical slide rails through the movement of the annular transition connecting plate.

According to a second aspect of the present application, there is also provided a semiconductor processing apparatus, comprising the wafer support switching mechanism described above.

The utility model discloses following beneficial effect has:

the utility model provides a wafer supports switching mechanism is through addding at least three first supporting seat in first bearing structure, also add at least three second supporting seat on second bearing structure equally, the wafer is before treating the washing, need use first bearing structure to treat abluent wafer and support and fix, promptly, this treat abluent wafer and support and fix through the first supporting seat in this first bearing structure, at least three first supporting seat, the support stress point of treating abluent wafer has increased to a certain extent, ensure to treat abluent wafer more firm, do not rock. The lifting structure is suitable for driving the second supporting structure to enable the second supporting bottom plate of the second supporting structure to move between the first position and the second position, when the second supporting bottom plate is located at the first position, the upper end face of the second supporting seat is lower than the lower edge of the wafer supported by the first supporting seat, and when the second supporting bottom plate is located at the second position, the upper end face of the first supporting seat is lower than the lower edge of the wafer supported by the second supporting seat. It can be seen that, this application owing to add at least three first supporting seat on first bearing structure, like this, when supporting and fixing the wafer of treating the washing, stability can be better, and simultaneously, at least three second supporting seat has also been add on second bearing structure, and like this, when supporting and fixing the wafer after the washing, the stress point of this wafer is many, and it is firm to bear in mechanics, both sides and centre all have the stress point, it is more steady when bearing the wafer, be difficult for causing rocking of wafer, prevented the fish tail to the wafer effectively.

Drawings

Fig. 1 is a schematic diagram illustrating an overall structure of a wafer support switching mechanism for use in a semiconductor processing apparatus according to an embodiment of the present application;

fig. 2 is a schematic view of an overall structure of a wafer support switching mechanism for semiconductor processing equipment, which is mounted in a machine body housing according to an embodiment of the present application;

fig. 3 is a schematic front view of an overall structure of a wafer support switching mechanism for semiconductor processing equipment housed in a body housing according to an embodiment of the present application;

FIG. 4 is a schematic view of the overall structure of the first support structure of FIG. 2;

FIG. 5 is a schematic view of the second support structure of FIG. 2;

FIG. 6 is a schematic view of a front connection structure of the first support structure, the second support structure and the lifting structure in FIG. 1;

FIG. 7 is a schematic view of the first support structure of FIG. 1 supporting a wafer to be cleaned;

fig. 8 is a schematic structural view of the second support structure in fig. 1 supporting a cleaned wafer.

Detailed Description

In order to make those skilled in the art better understand the technical solution of the present invention, the following describes the temperature control device and the reaction chamber using the same in detail with reference to the attached drawings.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

Fig. 1-8 illustrate a wafer support switching mechanism for semiconductor processing equipment provided herein.

As shown in fig. 1 and 4, the wafer support switching mechanism is schematically shown to include a first support structure 2, a second support structure 3, and a lifting structure 4.

The first support structure 2 comprises a first support base 21 and at least three first support seats 22, at least three first support seats 22 being adapted to support a wafer 200.

The second support structure 3 comprises a second support base plate 31 and at least three second support seats 32, at least three second support seats 32 are adapted to support the wafer 200, the second support base plate 31 is disposed below the first support base plate 21 of the first support structure 2, the second support base plate 31 is capable of moving between a first position away from the first support base plate 21 and a second position close to the first support base plate 21, and the first support base plate 21 has a through hole 21a adapted to the shape and position of the second support seat 32 of the second support structure 3.

As shown in fig. 8, the lifting structure 4 is connected to the second support structure 3 and adapted to drive the second support structure 3 to move the second support base 31 of the second support structure 3 between the first position and the second position, when the second support base 31 is at the first position, the upper end surface of the second support base 32 is lower than the lower edge of the wafer 200 supported by the first support base 22, as shown in fig. 7; when the second support base 31 is at the second position, the upper end surface of the first support base 22 is lower than the lower edge of the wafer 200 supported by the second support base 32. Specifically, the present application adds at least three first supporting seats 22 to the first supporting structure 2, and also adds at least three second supporting seats 32 to the second supporting structure 3.

In the present application, the first supporting structure 2 is adapted to support and fix a first type of wafer, and the second supporting structure 3 is adapted to support and fix a second type of wafer, so as to avoid mixing the first type of wafer and the second type of wafer. More specifically, the first type of wafer may be, for example, a wafer to be cleaned and the second type of wafer may be, for example, a cleaned wafer, such that the wafer to be cleaned and the cleaned wafer are placed on different support structures to avoid contamination of the cleaned wafer by the wafer to be cleaned. Specifically, before the wafer 200 is to be cleaned, the first supporting structure 2 needs to be used to support and fix the wafer 200 to be cleaned, that is, the wafer 200 to be cleaned is supported and fixed by the first supporting seat 22 in the first supporting structure 2, and the supporting stress points of the wafer 200 to be cleaned are increased to a certain extent by the at least three first supporting seats 22, so as to ensure that the wafer 200 to be cleaned is more stable and does not shake. The lifting structure 4 is adapted to drive the second supporting structure 3 to move the second supporting base plate 31 of the second supporting structure 3 between the first position and the second position, when the second supporting base plate 31 is at the first position, the upper end surface of the second supporting seat 32 is lower than the lower edge of the wafer 200 supported by the first supporting seat 22, and when the second supporting base plate 31 is at the second position, the upper end surface of the first supporting seat 22 is lower than the lower edge of the wafer 200 supported by the second supporting seat 32, and in addition, since at least three second supporting seats 32 are also provided on the third supporting structure 3 of the present application, when supporting the cleaned wafer 200, the wafer 200 can be supported more stably, and the wafer 200 is prevented from shaking. It can be seen that, in the present application, at least three first supporting seats 22 are additionally provided on the first supporting structure 2, so that when supporting and fixing the wafer 200 to be cleaned, the stability is better, and at least three second supporting seats 32 are additionally provided on the second supporting structure 3, so that when supporting and fixing the cleaned wafer 200, the wafer 200 has a plurality of stress points, and is stable in mechanical bearing, and both sides and the middle of the wafer 200 have stress points, so that the wafer 200 is more stable when bearing the wafer 200, the wafer 200 is not easy to shake, and scratches on the wafer 200 are effectively prevented.

As shown in fig. 2 to 4, in an alternative embodiment of the present application, the at least three first supporting seats 22 are disposed in parallel along the extending direction of the first supporting base plate 21, and the extending direction of the through hole 21a is parallel to the extending direction of the first supporting seat 22. Specifically, the at least three first supporting seats 22 may be selected to be three, wherein the first supporting seats 22 are respectively disposed in the middle and the first supporting seats 22 are disposed at two sides of the first supporting seat 22 and are symmetrically disposed, so that a three-point support for the wafer 200 to be cleaned is formed, and the support is more stable.

In an alternative embodiment of the present application, at least three second supporting seats 32 are arranged at intervals along the extending direction of the second supporting bottom plate 31. In this way, a three-point support can be formed for the wafer 200, so that the positioning of the wafer 200 is more stable.

As shown in fig. 1, 3 and 4, the number of the first supporting seats 22 is odd, and 3 first supporting seats 22 are exemplarily shown in fig. 4, and those skilled in the art will understand that it is possible to provide more odd-numbered first supporting seats. The first supporting seat 22 disposed in the middle is disposed on an extension line of the vertical center line of the wafer 200, the first supporting seats 22 disposed on both sides are disposed symmetrically with respect to the first supporting seat 22 disposed in the middle, and the through holes 21a are disposed on both sides of the first supporting seat 22 disposed in the middle and disposed symmetrically. Specifically, through making this first supporting seat 22 that sets up in the middle set up on the extension line of the vertical center line of this wafer 200, this first supporting seat 22 that is located both sides is the symmetrical formula setting to form three firm strong point, in order to treat abluent wafer 200 and carry out better support, avoid adjacent waiting to take place the contact between the abluent wafer 200, avoid cross contamination, simultaneously, also avoided adjacent waiting to abluent wafer 200 to take place the condition of fish tail because of the contact in the in-process of contact.

In addition, the number of the first supporting seats 21 is odd, so that the wafer 200 can be well supported, and the adjacent wafers 200 to be cleaned are prevented from contacting and cross contamination.

It should be noted that the wafer support switching mechanism further includes a machine body housing 1, and the first support structure 2 of the present application is disposed on the machine body housing 1, that is, the first support structure 2 is fixedly disposed.

The second supporting structure 3 can be freely lifted and lowered under the driving action of the lifting structure 4.

In a specific embodiment of the present application, the first supporting seat 22 may be a first vertical fixed supporting plate, wherein the size of the middle first vertical fixed supporting plate is smaller than the sizes of the first vertical fixed supporting plates on both sides, and a connecting line between the upper end surface of the first vertical fixed supporting plate disposed on the left side, the upper end surface of the first vertical fixed supporting plate disposed in the middle, and the upper end surface of the first vertical fixed supporting plate disposed on the right side is an arc line which is matched with the lower edge arc line of the wafer 200 to be cleaned.

Each of the first vertical fixing support plates may be fixedly disposed on the upper end surface of the first support base plate 21 by means of screws or bolts.

As shown in fig. 2 to 3 and fig. 5, 6 and 7, in an alternative embodiment of the present application, a plurality of first spline structures 5 are configured on a surface of each first supporting seat 22 facing the wafer 200, each first spline structure 5 is disposed at intervals, and each first spline structure 5 is adapted to clamp a lower edge of the wafer 200. It should be noted that the bottom wall of the first spline structure 5 has a contour adapted to the lower edge of the wafer 200, so that the bottom wall of the first spline structure 5 can be prevented from scratching the surface of the wafer 200 due to the corner.

The first tooth space structures 5 are arranged at intervals along the extending direction of the first supporting base 22, and the first tooth space structures 5 arranged on the first supporting bases 22 on the two sides are arranged opposite to the first tooth space structures 5 on the opposite sides so as to be suitable for clamping the corresponding wafer 200. The "extending direction of the first supporting seat 22" refers to a direction facing inward in a vertical plane of the drawing in fig. 2.

In an alternative embodiment of the present application, as shown in fig. 7, the profile line of each first gullet structure 5 is adapted to the arc shape of the lower edge of the wafer 200. Specifically, the tooth profile line of each first tooth space structure 5 is adapted to the arc shape of the lower edge of the wafer 200, so that the lower edge of the wafer 200 can be ensured to be in a good state, and the surface of the wafer 200 is prevented from being scratched by the angular tooth space structure.

As shown in fig. 1, 2, 4 and 5, in an alternative embodiment of the present application, the number of the second supporting seats 32 is an even number, and 4 second supporting seats 32 are exemplarily shown in fig. 5, and it should be understood by those skilled in the art that it is possible to provide more second supporting seats with even numbers. The number of the through holes 21a is equal to the number of the second supporting seats 32, and each of the second supporting seats 32 is adapted to pass through the corresponding through hole 21a. Specifically, the number of the second supports 32 is the same as the number of the through holes 21a disposed on the first support base plate 21, when the second support structure 3 is lifted to fix and support the cleaned wafer 200, the second supports 32 are continuously lifted and pass through the corresponding through holes 21a, and after passing through the corresponding through holes 21a, the height of the upper end surface of each second support 32 is higher than that of the upper end surface of each first support 22, so as to be suitable for supporting and fixing the cleaned wafer 200. At this time, the second supporting structure 3 of the present application forms four-point support for the cleaned wafer 200, so that there are more stress points on the wafer 200, that is, there are stress points on both sides and in the middle, so that the wafer 200 is more stable when being loaded, and is not easy to shake.

Each of the second supporting seats 32 is vertically disposed with the second supporting bottom plate 31, and each of the second supporting seats 32 can be fastened with the second supporting bottom plate 31 by screws or rivets to form a whole.

As shown in fig. 3, 5 and 8, in an alternative embodiment of the present application, a plurality of second slot structures 6 are formed on a surface of each second support seat 32 facing the wafer 200, each second slot structure 6 is disposed at intervals, and each second slot structure 6 is adapted to be engaged with a lower edge of the wafer 200. The bottom wall profile of the second tooth groove structure 6 is matched with the lower edge of the wafer 200, so that the bottom wall of the second tooth groove structure 6 can be prevented from scratching the surface of the wafer 200 due to the existence of corners.

In an alternative embodiment of the present application, as shown in fig. 3 and 8, the tooth line of each second tooth groove structure 6 is adapted to the arc shape of the lower edge of the wafer 200. The tooth-shaped line of each second tooth groove structure 6 is matched with the arc of the lower edge of the wafer 200, so that the lower edge of the wafer 200 can be ensured to be in a good state, and the surface of the wafer 200 is prevented from being scratched by the angular tooth groove structure.

As shown in fig. 3 and 6, in one embodiment of the present application, the maximum distance between the first supporting seats 22 disposed at both ends of the first supporting base plate 21 is L, and L is equal to or greater than 240 mm and equal to or less than 250 mm. The first support seat 22 is called a fixed large tooth structure.

The distance between the second support seats 32 (large longitudinal dimension) provided at both ends of the second support base plate 31 is M, which is greater than or equal to 200 mm and less than or equal to 220 mm. The second supporting seats 32 provided at both ends of the second supporting base plate 31 are called as a moving large tooth structure.

The distance between two second support seats 32 (with small longitudinal dimension) disposed in the middle area of the second support base plate 31 is N, where N is greater than or equal to 50 mm and less than or equal to 100 mm. Two second supporting seats 32 arranged in the middle area of the second supporting bottom plate 31 are called as a movable small tooth structure, the movable small tooth structure is arranged, the contact of middle point positions is realized, the supporting force of the middle point positions is exerted on the wafer 200, meanwhile, the supporting force at two ends is matched, the supporting point positions of the wafer 200 are increased, the wafer 200 can be more stable, and meanwhile, the wafer 200 cannot easily shake, the distance between the adjacent wafers 200 is very close, the second supporting seats 32 are additionally arranged on the second supporting bottom plate 31, the stress points of the wafer 200 are increased, the wafer 200 is more stable in stress supporting when being borne, therefore, the contact between the adjacent wafers 200 is avoided, and the mutual scratch is avoided.

In an alternative embodiment of the present application, the second support seat 32 may be a second vertical fixed support plate.

As shown in fig. 1, 3, 4 and 8, in an alternative embodiment of the present application, the lifting structure 4 includes a cylinder body 41 disposed in the accommodating chamber 12 and a cylinder extension rod 42 disposed in the cylinder body 41, wherein the cylinder extension rod 42 is connected to the lower end surface of the second supporting base plate 31. After the wafer 200 is cleaned, the cylinder extension rod 42 in the lifting structure 4 is lifted to drive the second supporting bottom plate 31 to move towards the direction close to the first supporting bottom plate 21, so that after the second supporting seats 32 respectively pass through the corresponding through holes 21a, and after the upper end surfaces of the first supporting seats 22 are lower than the lower edge of the wafer 200 supported by the second supporting seats 32, the cylinder extension rod 42 stops moving upwards and keeps the current position unchanged, so as to be suitable for supporting and fixing the cleaned wafer 200.

As shown in fig. 2 and 3, in an alternative embodiment of the present application, the wafer support switching mechanism further includes:

the body case 1 is configured with an opening 11 at an upper end of the body case 1, and a receiving cavity 12 is configured inside the body case 1.

The first supporting structure 2, the second supporting structure 3 and the lifting structure 4 are all disposed in the machine housing 1. Wherein, the first supporting bottom plate 21 is disposed at the position of the opening 11 and fixed on the side wall of the machine body shell 1.

As shown in fig. 2 and 3, in an alternative embodiment of the present application, the wafer support switching mechanism further includes an annular transition connection plate 7 disposed below the second support base plate 31.

Be equipped with vertical slide rail 8 and set up slider 9 on this vertical slide rail 8 respectively on the inside wall that should hold the chamber 12 and be located this engine body shell 1's both sides, wherein, this slider 9 is connected with this annular transition connecting plate 7, through the motion of this lifter structure 4, drive this second supporting baseplate 31 and carry out synchronous motion, through the motion of this second supporting baseplate 31, drive the motion of this annular transition connecting plate 7, through the motion of this annular transition connecting plate 7, drive this slider 9 and move along vertical slide rail 8's extending direction. The "extending direction of the vertical slide rail 8" refers to the extending direction along the height direction of the vertical slide rail 8 when the vertical slide rail 8 is vertically arranged.

It should be noted that, by additionally arranging the annular transition connecting plate 7, the vertical slide rail 8 and the slide block 9, through cooperation of the three, the second supporting bottom plate 31 can be ensured to stably lift, and meanwhile, the second supporting structure 3 is also ensured to stably lift, so that the situation that contact scratches occur between adjacent wafers 200 is avoided.

According to a second aspect of the present application, there is also provided a semiconductor processing apparatus comprising the wafer support switching mechanism of the above embodiments.

It should be noted that the semiconductor processing equipment may be a cleaning machine.

To sum up, this application is through addding at least three first supporting seat 22 in first bearing structure 2, also add at least three second supporting seat 32 on second bearing structure 3 equally, wafer 200 is before treating the washing, need use first bearing structure 2 to treat abluent wafer 200 and support and fix, promptly, this treat abluent wafer 200 and support and fix through first supporting seat 22 in this first bearing structure 2, at least three first supporting seat 22, the support stress point of treating abluent wafer 200 has been increased to a certain extent, it is more firm to ensure to treat abluent wafer 200, do not rock. The lifting structure 4 is adapted to drive the second supporting structure 3 to move the second supporting base plate 31 of the second supporting structure 3 between the first position and the second position, when the second supporting base plate 31 is at the first position, the upper end surface of the second supporting seat 32 is lower than the lower edge of the wafer 200 supported by the first supporting seat 22, and when the second supporting base plate 31 is at the second position, the upper end surface of the first supporting seat 22 is lower than the lower edge of the wafer 200 supported by the second supporting seat 32, and in addition, since at least three second supporting seats 32 are also provided on the third supporting structure 3 of the present application, when supporting the cleaned wafer 200, the wafer 200 can be supported more stably, and the wafer 200 is prevented from shaking. It can be seen that, in the present application, since the at least three first supporting seats 22 are additionally provided on the first supporting structure 2, when supporting and fixing the wafer 200 to be cleaned, the stability is better, and meanwhile, the at least three second supporting seats 32 are additionally provided on the second supporting structure 3, so that when supporting and fixing the cleaned wafer 200, the wafer 200 has a plurality of stress points, and is stable in mechanical bearing, and both sides and the middle have stress points, so that when bearing the wafer 200, the wafer 200 is more stable, the wafer 200 is not easily shaken, and scratches on the wafer 200 are effectively prevented.

It is to be understood that the above embodiments are merely exemplary embodiments that have been employed to illustrate the principles of the present invention, and that the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims (10)

1. A wafer support switching mechanism for semiconductor processing equipment, comprising:

the wafer support device comprises a first support structure, a second support structure and a third support structure, wherein the first support structure comprises a first support bottom plate and at least three first support seats, and the at least three first support seats are suitable for supporting a wafer;

the second supporting structure comprises a second supporting bottom plate and at least three second supporting seats, the at least three second supporting seats are suitable for supporting wafers, the second supporting bottom plate is arranged below the first supporting bottom plate of the first supporting structure, the second supporting bottom plate can move between a first position far away from the first supporting bottom plate and a second position close to the first supporting bottom plate, and through holes matched with the shapes and the positions of the second supporting seats of the second supporting structure are formed in the first supporting bottom plate;

and the lifting structure is connected with the second supporting structure and is suitable for driving the second supporting structure to enable the second supporting bottom plate of the second supporting structure to move between the first position and the second position, when the second supporting bottom plate is positioned at the first position, the upper end face of the second supporting seat is lower than the lower edge of the wafer supported by the first supporting seat, and when the second supporting bottom plate is positioned at the second position, the upper end face of the first supporting seat is lower than the lower edge of the wafer supported by the second supporting seat.

2. The wafer support switching mechanism of claim 1, wherein at least three of the first supporting bases are arranged in parallel at intervals along an extending direction of the first supporting base plate, and the extending direction of the through holes is parallel to the extending direction of the first supporting bases; or

At least three second supporting seats are arranged in parallel at intervals along the extending direction of the second supporting bottom plate.

3. The wafer support switching mechanism for semiconductor processing equipment according to claim 2, wherein the number of the first supporting seats is odd, the first supporting seat disposed in the middle is disposed on an extension line of a vertical center line of the wafer, the first supporting seats disposed on both sides are symmetrically disposed with respect to the first supporting seat disposed in the middle, and the through holes are located on both sides of the first supporting seat disposed in the middle and symmetrically disposed.

4. The wafer support switching mechanism for semiconductor processing equipment as claimed in claim 2, wherein a plurality of first spline structures are formed on a surface of each first supporting seat facing the wafer, each first spline structure is arranged at intervals, and each first spline structure is adapted to clamp a lower edge of the wafer.

5. The wafer support switching mechanism of claim 2, wherein the number of the second supports is an even number, the number of the through holes is equal to the number of the second supports, and each of the second supports is adapted to pass through the corresponding through hole.

6. The wafer support switching mechanism of claim 5, wherein a plurality of second slot structures are formed on a surface of each second support base facing the wafer, each second slot structure being spaced apart from each other, each second slot structure being adapted to engage a lower edge of the wafer.

7. The wafer support switching mechanism for semiconductor processing equipment as claimed in claim 1, wherein the lifting structure comprises a cylinder body disposed below the second support base plate and a cylinder extension rod disposed in the cylinder body, wherein the cylinder extension rod is connected to a lower end surface of the second support base plate.

8. The wafer support switching mechanism for semiconductor processing equipment as recited in any one of claims 1 to 7, further comprising:

a body case having an opening formed at an upper end thereof and an accommodating chamber formed inside thereof;

the first supporting structure, the second supporting structure and the lifting structure are all arranged in the machine body shell.

9. The wafer support switching mechanism for semiconductor processing equipment of claim 8, further comprising an annular transition connection plate disposed below the second support floor;

the containing cavity is provided with vertical slide rails and slide blocks arranged on the vertical slide rails, the slide blocks are connected with the annular transition connecting plate, the second supporting bottom plate is driven to move synchronously through the movement of the lifting structure, the annular transition connecting plate is driven to move through the movement of the second supporting bottom plate, and the slide blocks are driven to move along the extending direction of the vertical slide rails through the movement of the annular transition connecting plate.

10. A semiconductor processing apparatus comprising the wafer support switching mechanism of any of claims 1 to 9.

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