CN217902742U

CN217902742U - Transparent conductive film and touch screen

Info

Publication number: CN217902742U
Application number: CN202221251656.7U
Authority: CN
Inventors: 李培良; 朴成珉; 杜同强
Original assignee: Anhui Jingzhuo Optical Display Technology Co Ltd
Current assignee: Anhui Jingzhuo Optical Display Technology Co Ltd
Priority date: 2022-05-23
Filing date: 2022-05-23
Publication date: 2022-11-25
Anticipated expiration: 2032-05-23

Abstract

The utility model provides a transparent conductive film, including the substrate, still including ITO layer and the metal level that forms in the substrate both sides respectively, still be formed with adjustment IM layer between ITO layer and the substrate, one side that the substrate is formed with the metal level still is formed with the BM layer that is located the metal level upper surface, and the substrate upper and lower surface all is formed with the hard coat, and adjustment IM layer forms in hard coat and deviates from substrate one side, and the ITO layer is formed in adjustment IM layer and deviates from hard coat one side, the metal level is formed on the surface that hard coat deviates from substrate one side. The utility model discloses a transparent conducting film utilizes the ITO layer to combine the mode in substrate both sides with the metal level to be favorable to reducing the cycle of metal net, effectively reduces the risk of mole interference line that the metal net caused, optimizes the display effect, promotes the product and uses the experience, combines to adjust the setting on IM layer and BM layer simultaneously, can further promote the visual effect of product; in addition, the touch effect of the product can be improved by utilizing the characteristic that the metal layer has low sheet resistance.

Description

Transparent conductive film and touch screen

Technical Field

The utility model relates to a touch-control technical field, concretely relates to transparent conductive film and touch screen.

Background

The touch part of a large-size touch display product in the industry at present adopts a double-layer metal grid or double-layer ITO (indium tin oxide) layer structure, the scheme needs to use an upper layer of metal grid or a lower layer of metal grid or two layers of ITO layer which are matched with a display screen at the same time, after the upper layer of metal grid and the lower layer of metal grid are combined, the grid displayed by a finished product is smaller, the density is higher, the transmittance is lower, and meanwhile, the display effect of the finished product is poor and the visibility is poor due to the fact that the two layers of metal grids are easy to generate moire interference; the ITO layer has the characteristic of high impedance, so that the touch effect of a finished product is reduced, and the use experience of the product is poor.

SUMMERY OF THE UTILITY MODEL

For solving the technical problem, the utility model discloses a ITO layer combines the cycle that is favorable to reducing the metal grid in the mode of substrate both sides with the metal level, effectively reduces the risk of mole interference line that the metal grid caused, optimizes the display effect, promotes the product and uses experience, and concrete technical scheme is as follows:

a transparent conductive film comprises a substrate, an ITO layer and a metal layer which are respectively formed on two sides of the substrate, wherein an adjustment IM layer is further formed between the ITO layer and the substrate, and a BM layer located on the upper surface of the metal layer is further formed on one side of the substrate where the metal layer is formed.

Preferably, the hard coating is formed on both the upper surface and the lower surface of the substrate, the adjusting IM layer is formed on the side of the hard coating, which faces away from the substrate, the ITO layer is formed on the side of the adjusting IM layer, which faces away from the hard coating, and the metal layer is formed on the surface of the hard coating, which faces away from the substrate.

Preferably, when the ITO layer is formed on the upper surface side of the substrate and the metal layer is formed on the lower surface side of the substrate, the BM layer is formed between the hard coat layer and the metal layer.

Preferably, when the ITO layer is formed on one side of the lower surface of the substrate and the metal layer is formed on one side of the upper surface of the substrate, the BM layer is formed on one side of the metal layer away from the hard coating layer.

Preferably, the adjustment IM layer and the BM layer are each at least one layer.

Preferably, the adjusting IM layer is MgF film or Al ₂ O ₃ Film, siO ₂ One of a film, an SiO film or an OC film; the BM layer is a black matrix layer made of copper oxide including copper oxide, copper nickel oxide and copper nitride.

Preferably, the ITO layer further comprises a second metal layer formed on the side of the ITO layer opposite to the adjusting IM layer.

Preferably, the material of the metal layer and the second metal layer is copper or silver.

Preferably, the material of the substrate is PET or COP.

A touch screen comprises the transparent conductive film.

According to the technical solution provided by the utility model, the utility model discloses following beneficial effect has: the utility model discloses a ITO layer combines the cycle that the mode in substrate both sides is favorable to reducing the metal grid with the metal level, effectively reduce the risk of mole interference line that the metal grid caused, optimize the display effect, promote the product and use experience, combine the setting on adjustment IM layer and BM layer simultaneously, can further promote the visual effect of product, in addition, the mode that one deck ITO layer conducting layer and one deck metal grid combine, with the characteristic that utilizes metal grid layer square resistance to hang down, reach the impedance value that reduces the conducting film of former two-layer ITO conducting layer, with the touch-control effect who improves the product.

Drawings

Fig. 1 is a schematic view of an embodiment of a transparent conductive film provided by the present invention;

fig. 2 is a schematic view of another embodiment of a transparent conductive film provided by the present invention;

fig. 3 is a flowchart illustrating the removal of the second metal layer on the transparent conductive film according to the embodiment of fig. 1.

In the figure: 10. a substrate; 20. an ITO layer; 30. a metal layer; 40. adjusting an IM layer; 50. a BM layer; 60. a hard coating layer; 70. a second metal layer.

Detailed Description

The present invention will be described in detail with reference to the drawings and specific embodiments, wherein prior to describing the technical aspects of the embodiments of the present invention in detail, the terms and the like are explained, and in the present specification, the components with the same names or the same reference numbers represent the similar or the same structures and are only used for illustrative purposes.

The specific names, english acronyms and corresponding chinese translations used in this application are as follows:

IM is the abbreviation of index match, chinese means: the refractive indices are matched.

ITO is short for Indium Tin Oxides, and Chinese refers to: indium tin oxide.

BM is short for black Mask, and Chinese refers to: and (5) black frames.

OC is short for Over Coating, and Chinese is: a cover layer; the following are specified in the touch screen: negative photoresist insulating photoresist.

Referring to fig. 1, a transparent conductive film, including a substrate 10, the substrate having a thickness of 50-100 μm, further including an ITO layer 20 and a metal layer 30 formed on two sides of the substrate, respectively, the ITO layer having a thickness of 15-25 nm, the metal layer having a thickness of 250-500 nm, and a sheet resistance of 0.5-1 ohm, wherein an adjustment IM layer 40 is further formed between the ITO layer and the substrate, the adjustment IM layer having a thickness of 50-100 nm, and a sheet resistance of 70-150 ohm, i.e., the ITO layer and the metal layer are formed on two sides of the substrate 10, and a BM layer located on an upper surface of the metal layer is further formed on one side of the substrate 10 where the metal layer 30 is formed, the BM layer having a thickness of 40-50 nm, and being a black insulating material, and mainly used for isolating color mixing in appearance, and having a light shielding function to shield the metal layer, so that a visual effect of the conductive film is better, in the utility model, the ITO layer and the metal layer are combined with the metal layer to reduce a period of the metal mesh, effectively reduce a molar interference of the metal mesh, optimize a moire effect of the conductive film, and further improve a touch control effect of the ITO layer, and improve a touch control product.

In the present invention, the formation method of each film layer on the substrate can adopt coating, sputtering, evaporation, and the like, and the specific formation method depends on the material.

As the preferred technical scheme of the utility model, the upper and lower surface of substrate 10 all is formed with hard coat 60, and hard coat's thickness is 0.2 ~ 2 μm, and hard coat 60's effect is on the one hand the protection substrate surface prevents the scratch in the processing procedure, and on the other hand increases substrate surface flatness, increases the adhesive force and the coating surface smoothness of back processing procedure, so, after being formed with hard coat at substrate 10 upper and lower surface, adjustment IM layer 40 be formed with in hard coat and deviate from substrate one side, ITO layer 20 is formed with in adjustment IM layer 40 and deviates from hard coat one side, and metal level 30 at this moment is formed with in the surface that hard coat 60 deviates from substrate one side.

Further, the utility model provides a two upper and lower surfaces of substrate are arranged in to ITO layer 20 and metal level 30 branch, specifically divide into the ITO layer and set up at the substrate upper surface and the metal level setting at the substrate lower surface and the ITO layer sets up at the substrate lower surface and the metal level sets up at the substrate upper surface two kinds of circumstances, work as ITO layer 20 form in substrate 10 upper surface one side, when metal level 30 is formed at substrate 10 lower surface one side, the lower surface laminating of adjustment IM layer 40 at this moment is at the hardcoat upper surface, the ITO layer laminating is at adjustment IM layer 40 upper surface, the metal level 30 laminating is at the upper surface of ITO layer 20, BM layer 50 is formed between hardcoat 60 and metal level 30, the upper surface on BM layer and the lower surface laminating of hardcoat promptly, the lower surface and the metal level upper surface laminating on BM layer.

Referring to fig. 2, when the ITO layer 20 is formed on one side of the lower surface of the substrate 10 and the metal layer 30 is formed on one side of the upper surface of the substrate 10, the BM layer 50 is formed on one side of the metal layer 30 away from the hard coating layer 60, the upper surface of the adjustment IM layer 20 is attached to the lower surface of the hard coating layer 60, the upper surface of the ITO layer is attached to the lower surface of the adjustment IM layer, the lower surface of the metal layer is attached to the upper surface of the hard coating layer, and the lower surface of the BM layer is attached to the upper surface of the metal layer.

The utility model discloses in, adjustment IM layer 40 and BM layer 50 all set up to at least one deck, and adjustment IM layer and BM layer can set one deck, two-layer, three-layer promptly and the quantity on adjustment IM layer and BM layer can be the same, also can be different, promptly when the adjustment IM layer is the one deck, the BM layer can be one deck, two-layer, three-layer.

As the preferable technical proposal of the utility model, the adjusting IM layer 40 is MgF film, al ₂ O ₃ Film, siO ₂ One of the film, siO film or OC film, i.e., the adjustment IM layer, may be MgF or Al ₂ O ₃ 、SiO ₂ It should be noted that, when the IM layer is adjusted to have a multilayer structure, the IM layer may be adjusted by one or more of the above-mentioned films, that is, different films may be used in combination, and in other embodiments, the IM layer may also be adjusted by films made of other materials to adjust the refractive index of the whole conductive film, so that the conductive film has a better visual effect.

Further, the BM layer 50 is a black matrix layer made of an oxide of copper, and may be one of copper oxide, copper nickel oxide or copper nitride, and may be formed by sputtering technology, and the specific formation method is the prior art, and is not described herein any more, and the BM layer is a black insulating material, and has the effects of isolating RGB to avoid color mixing and shading, and may shield the metal layer, thereby improving the visual effect of the conductive film, and enhancing the product use experience.

As the preferred technical scheme of the utility model, still including forming the second metal level 70 that deviates from adjustment IM layer 40 one side on ITO layer 20, the thickness of second metal level is 250 ~ 500nm, the sheet resistance is 0.5 ~ 1ohm, no matter be that the ITO level is located the upper surface of substrate or be located the lower surface of substrate promptly, it all is formed with the foretell second metal level 70 of one deck to deviate from substrate one side on the ITO layer, the lower surface laminating on the ITO layer of this second metal level, second metal level 70 uses as marginal lead wire layer, can form the lead wire layer that is used for being connected with external drive circuit on its surface in specific use, because can lead to the impedance of whole conducting film too big when outwards leading to through the ITO layer, consequently, set up this second metal level, can avoid above-mentioned problem to take place.

Further, the material of the metal layer 30 and the second metal layer 70 is copper or silver, preferably, the metal layer and the second metal layer are made of copper, of course, the metal layer and the second metal layer are not limited to copper or silver, and in other embodiments, metals made of other materials may also be used.

Further, the material of the substrate 10 is PET or COP, that is, the substrate may be a PET substrate, a COP substrate, or a glass substrate, and the specific user may select the substrate according to actual needs.

Referring to fig. 3, the following describes the step of removing the second metal layer on the upper side of the ITO layer to realize transparentization, taking the ITO layer 20 disposed on the upper surface of the substrate 10 and the metal layer 30 disposed on the lower surface of the substrate as an example: (1) simultaneously forming a UV adhesive layer on the surfaces of the upper layer and the lower layer; (2) Exposing the formed upper and lower UV adhesive layers to form a preset grid pattern, and developing to display the preset grid pattern; (3) Etching and protecting the area in the range of the grid pattern, and etching the conductive film formed in the step (2) by adopting an etching process to eliminate the part of the conductive film outside the range of the grid pattern so as to obtain a metal grid; (4) And forming a second UV adhesive layer on the upper layer of the conductive film, exposing the formed second UV adhesive layer to form a preset second grid pattern, developing to display the preset second grid pattern, etching and protecting the area in the range of the second grid pattern, and etching the upper layer of the conductive film by adopting an etching process to erode the part of the conductive film, which is positioned outside the range of the second grid pattern, so as to form the preset grid pattern on the second metal layer on the upper layer of the conductive film, thereby realizing transparentization.

The utility model also provides a touch screen, including foretell transparent conductive film, utilize above-mentioned transparent conductive film ITO layer and metal level to combine the cycle that is favorable to reducing the metal grid in the mode of substrate both sides, effectively reduce the risk of mole interference line that the metal grid caused, optimize the display effect, combine the setting on adjustment IM layer and BM layer simultaneously, can further promote the visual effect of product, in addition, utilize the metal level to have the touch-control effect of the low characteristics of square resistance in order to improve the product, promote the product and use experience.

The above-mentioned embodiments are only to describe the preferred embodiments of the present invention, but not to limit the scope of the present invention, and various modifications and improvements made by those skilled in the art without departing from the design spirit of the present invention should fall into the protection scope defined by the claims of the present invention.

Claims

1. The transparent conductive film comprises a substrate (10), and is characterized by further comprising an ITO layer (20) and a metal layer (30) which are respectively formed on two sides of the substrate, wherein an adjusting IM layer (40) is further formed between the ITO layer and the substrate, and a BM layer (50) located on the upper surface of the metal layer is further formed on one side, where the metal layer (30) is formed, of the substrate (10).

2. The transparent conductive film according to claim 1, wherein the hard coating layer (60) is formed on each of the upper and lower surfaces of the substrate (10), the adjustment IM layer (40) is formed on the side of the hard coating layer facing away from the substrate, the ITO layer (20) is formed on the side of the adjustment IM layer (40) facing away from the hard coating layer, and the metal layer (30) is formed on the surface of the hard coating layer (60) facing away from the substrate.

3. The transparent conductive film according to claim 2, wherein when the ITO layer (20) is formed on the upper surface side of the substrate (10) and the metal layer (30) is formed on the lower surface side of the substrate (10), the BM layer (50) is formed between the hard coat layer (60) and the metal layer (30).

4. The transparent conductive film according to claim 2, wherein when the ITO layer (20) is formed on the lower surface side of the substrate (10) and the metal layer (30) is formed on the upper surface side of the substrate (10), the BM layer (50) is formed on the side of the metal layer (30) facing away from the hard coat layer (60).

5. The transparent conductive film according to claim 2, wherein the adjustment IM layer (40) and the BM layer (50) are each at least one layer.

6. The transparent conductive film according to claim 5, wherein the adjustment IM layer (40) is a MgF film, al ₂ O ₃ Film, siO ₂ One of a film, an SiO film or an OC film; the BM layer (50) is a black matrix layer made of copper oxide including copper oxide, copper nickel oxide and copper nitride.

7. The transparent conductive film according to claim 6, further comprising a second metal layer (70) formed on a side of the ITO layer (20) facing away from the modifying IM layer (40).

8. The transparent conductive film according to claim 7, wherein the material of the metal layer (30) and the second metal layer (70) is copper or silver.

9. The transparent conductive film according to claim 7, wherein the substrate (10) is made of PET or COP.

10. A touch panel comprising the transparent conductive film according to any one of claims 1 to 9.