CN217881414U - Chip bonding pad base - Google Patents

Abstract

The application discloses a chip pad seat which is used for installing a chip, wherein the chip comprises a core body and a core body pin connected with the core body, and the chip pad seat comprises a pad seat body and a pad pin; the bonding pad base body is provided with a core body placing groove, the shape of the core body placing groove is matched with that of a chip, the core body placing groove comprises a first placing groove and a second placing groove, the second placing groove and core body pins are arranged in a one-to-one correspondence mode, the second placing groove is communicated with the first placing groove, one end of each bonding pad pin is arranged on the outer wall of the bonding pad base body, the other end of each bonding pad pin penetrates through the bonding pad base body to be arranged in the second placing groove, and the bonding pad pins and the second placing groove are arranged in a one-to-one correspondence mode; the core body is connected with the first placing groove in an embedded mode, the core pins are connected with the second placing groove in an embedded mode, and the second placing groove is connected with the pad pins; this application has realized need not to weld the chip on the mainboard repeatedly, reduces the time cost, also avoids damaging the mainboard, and then avoids the capability test result to receive the influence.

Description

Chip bonding pad base

Technical Field

The application relates to the technical field of circuit boards, in particular to a chip bonding pad seat.

Background

The electronic component is processed into a packaged chip through a packaging process, in the development process of the packaged chip, in order to require the reliability of the packaged chip, a performance test needs to be carried out on the packaged chip, in the performance test, the packaged chip needs to be repeatedly welded on a mainboard to obtain the performance and the stability of the packaged chip, so that the mainboard is damaged, and the performance test of the packaged chip is easily influenced; and the welding process and the disassembling process prolong the testing process of the packaged chip and increase the time cost.

SUMMERY OF THE UTILITY MODEL

The utility model provides a chip pad seat need not to weld the chip on the mainboard repeatedly, reduces the time cost, also avoids damaging the mainboard, and then avoids the capability test result to be influenced.

The above object of the present application is achieved by the following technical solutions:

the application provides a chip bonding pad for mounting a chip, wherein the chip comprises a core body and a core body pin connected with the core body, and the chip bonding pad comprises a bonding pad base body and a bonding pad pin; the pad seat body is provided with a core body placing groove, the shape of the core body placing groove is matched with that of the chip, the core body placing groove comprises a first placing groove and a second placing groove, the second placing groove and the core body pins are arranged in a one-to-one correspondence mode, the second placing groove is communicated with the first placing groove, one end of each pad pin is welded on the mainboard, the other end of each pad pin penetrates through the pad seat body to be arranged in the second placing groove, and the pad pins and the second placing grooves are arranged in a one-to-one correspondence mode; the core body is connected with the first placement groove in an embedded manner, the core pins are connected with the second placement groove in an embedded manner, and the second placement groove is connected with the pad pins.

According to an embodiment of the present application, the chip bonding pad base further includes a bonding pad cover body, the bonding pad cover body is rotatably connected to the bonding pad base body, and the bonding pad cover body is connected to the core body placing groove in an opening and closing manner; when the pad cover body and the core placing groove are in a closed state, the chip is clamped between the core placing groove and the pad cover body.

According to an embodiment of the application, the chip bonding pad base further comprises a top tightening piece, the top tightening piece is arranged on the wall surface of the bonding pad cover body, and the top tightening piece and the second placing groove are arranged in a one-to-one correspondence mode; when the pad cover body and the core body placing groove are in a closed state, the core body pins are clamped between the second placing groove and the tightening piece.

According to an embodiment of the application, be equipped with the blotter on the top tight member, top tight member passes through the blotter butt in the core pin.

According to an embodiment of the application, a first caulking groove is formed in the pad base body and located on the edge of the notch of the core body placing groove, a first insert is arranged on the pad cover body, and the first insert and the first caulking groove are arranged in a one-to-one correspondence manner; when the pad cover body and the core body placing groove are in a closed state, the first embedded piece is embedded and connected with the first embedding groove in an embedded mode.

According to an embodiment of the application, the pad base body is provided with an auxiliary groove, one groove wall of the auxiliary groove is communicated with the outer wall of the pad base body, and the pad cover body is connected with the auxiliary groove in an opening and closing manner; when the pad cover body and the core body placing groove are in a closed state, the pad cover body covers the notch of the auxiliary groove.

According to an embodiment of the present application, the auxiliary groove communicates with the first placing groove.

According to an embodiment of the present application, the die pad holder further includes an extension piece, and the extension piece is disposed on the side edge of the pad cover body adjacent to the auxiliary groove.

According to an embodiment of the present application, the pad cover is provided with a first cover, a second cover, a first shaft, and a second shaft; the first groove wall of the first placing groove and the second groove wall of the first placing groove are communicated with the second placing groove, and the first groove wall of the first placing groove and the second groove wall of the first placing groove are opposite to each other; the first rotating shaft penetrates through the second placing groove close to the first groove wall of the first placing groove, and the first cover body is rotatably connected to the first rotating shaft; the second rotating shaft penetrates through the second placing groove close to the second groove wall of the first placing groove, and the second cover body is rotatably connected to the second rotating shaft.

According to an embodiment of the present disclosure, a second caulking groove is formed on a first side of the first cover, a second insert is arranged on a first side of the second cover, a second side of the first cover is rotatably connected to the first rotating shaft, and a second side of the second cover is rotatably connected to the second rotating shaft; when the pad cover body and the core body placing groove are in a closed state, the second insert is connected with the second embedding groove in an embedded mode, and the first side edge of the first cover body is abutted to the first side edge of the second cover body.

Compared with the prior art, the chip bonding pad seat has the advantages that:

the chip pad holder is provided with: the bonding pad base body and the bonding pad pins;

the core body is connected with the mainboard through the pad pins, the core body is limited in position through the second placing grooves, the first placing grooves are used for limiting the position of the core body, the shape of the core body placing grooves is matched with the shape of the chip, the second placing grooves are communicated with the first placing grooves, the second placing grooves are in one-to-one correspondence with the core body pins, and the pad pins and the second placing grooves are in one-to-one correspondence to limit the position of the whole core body;

so, the die pad seat need not to weld the chip on the mainboard repeatedly, reduces the time of welding and dismantlement cost, reduces the time cost, has avoided the mainboard damage that the repeated welding of chip and mainboard leads to avoid the capability test result to be influenced.

Drawings

The present application will explain embodiments in conjunction with the accompanying drawings. The drawings in the present application are for illustration purposes only and for description of the embodiments. Other embodiments based on the described steps can be readily made by those skilled in the art from the following description without departing from the principles of the present application.

Fig. 1 is a schematic structural diagram of a die pad holder according to the present application;

FIG. 2 is a schematic view of the structure of another state of FIG. 1;

fig. 3 is an exploded view of the die pad holder of the present application.

Description of the main structure and symbols:

100. a die pad; 110. a pad base body; 111. a first caulking groove; 112. an auxiliary groove; 120. a pad pin; 130. a core body placing groove; 131. a first placing groove; 132. a second placing groove; 140. a pad cover body; 141. a first insert; 142. a first cover body; 143. a second cover body; 144. a first rotating shaft; 145. a second rotating shaft; 146. a second caulking groove; 147. a second insert; 150. a top tightening member; 151. a cushion pad; 160. an extension member; 200. a chip; 210. a core body; 220. a core pin; 300. a main board; 400. an auxiliary diaphragm.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures associated with the present application are shown in the drawings, not all of them. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first", "second", etc. in this application are used to distinguish between different objects and not to describe a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

Referring to fig. 1 to fig. 3, the present embodiment provides a die pad holder for mounting a die 200, the die 200 includes a core body 210 and a core lead 220 connected to the core body 210, the die pad holder 100 includes a pad holder body 110 and a pad lead 120; the pad seat body 110 is provided with a core placing groove 130, the shape of the core placing groove 130 is adapted to the shape of the chip 200, the core placing groove 130 includes a first placing groove 131 and a second placing groove 132, the second placing groove 132 is arranged in one-to-one correspondence with the core pins 220, the second placing groove 132 is communicated with the first placing groove 131, one end of each pad pin 120 is welded on the motherboard 300, the other end of each pad pin 120 penetrates through the pad seat body 110 to be arranged in the second placing groove 132, and the pad pins 120 are arranged in one-to-one correspondence with the second placing grooves 132; the core body 210 is fitted and connected to the first placement groove 131, the core pins 220 are fitted and connected to the second placement groove 132, and the second placement groove 132 is connected to the pad pins 120.

Further, the die pad 100 is a pad of the SOIC8 package, for example, the die 200 may be a FLASH-ROM of the SOIC package and a power MOS of the SOIC package.

In actual operation, the pad pins 120 are soldered to the motherboard 300, the chip 200 is placed in the core placement groove 130, the core pins 220 of the chip 200 are clamped in the corresponding second placement grooves 132, and the core body 210 of the chip 200 is clamped in the first placement groove 131; pushing the chip 200 to the bottom of the chip placement groove 130, so that the pad pins 120 in the second placement groove 132 are connected to the core pins 220, and the chip 200 is connected to the motherboard 300 by being embedded in the chip pad holder 100; the shape of the core placing groove 130 is adapted to the shape of the chip 200, the second placing groove 132 is communicated with the first placing groove 131, the second placing groove 132 and the core pins 220 are arranged in a one-to-one correspondence manner, so that the chip 200 and the pad seat body 110 are fixedly mounted, and the stable connection between the pad pins 120 and the core pins 220 is ensured.

When the performance of the chip 200 needs to be tested, an auxiliary membrane 400 is placed in the first placing groove 131, the chip 200 is placed in the core placing groove 130, the core pins 220 are connected with the pad pins 120 in the second placing groove 132, the core body 210 is placed in the first placing groove 131, the auxiliary membrane 400 is limited between the wall of the core body 210 and the wall of the first placing groove 131, after the performance test of the chip 200 is completed, the chip 200 can be detached from the core placing groove 130 by dragging the two ends of the auxiliary membrane 400, when the performance test of the chip 200 needs to be performed again, an auxiliary membrane 400 is placed in the first placing groove 131, the auxiliary membrane 400 is limited between the wall of the core body 210 and the wall of the first placing groove 131, and in the repeated performance test process of the chip 200 and the main board 300: subtracting the time for welding the chip 200 and the motherboard 300 and the time for unsoldering the chip 200 from the motherboard 300; therefore, repeated performance test of the chip 200 and damage to the mainboard 300 are avoided, performance test results are prevented from being affected, and time cost is reduced.

Referring to fig. 1 to fig. 3, according to an embodiment of the present disclosure, the die pad holder 100 further includes a pad cover 140, the pad cover 140 is rotatably connected to the pad holder 110, and the pad cover 140 is connected to the core placement groove 130 in an opening and closing manner; when the pad cover body 140 and the chip placement groove 130 are in the closed state, the chip 200 is clamped between the chip placement groove 130 and the pad cover body 140.

When the chip placement groove 130 and the chip placement groove 130 are in a closed state, the chip 200 is mounted and limited in the vertical direction by using the chip placement groove 130 and the chip placement groove 140, and the chip 200 is mounted and limited in the horizontal direction by combining the first placement groove 131 and the second placement groove 132; through the rotary connection of the pad cover 140 to the pad base 110, the pad cover 140 is connected to the core placement groove 130 in an opening and closing manner, so that the chip 200 can be mounted and limited in the vertical direction, and the chip 200 can be detachably connected to the core placement groove 130.

Referring to fig. 1 and fig. 3, according to an embodiment of the present disclosure, the die pad base 100 further includes a tightening member 150, the tightening member 150 is disposed on a wall surface of the pad cover 140, and the tightening member 150 and the second placing groove 132 are disposed in a one-to-one correspondence; when the pad cover 140 and the core placement groove 130 are in a closed state, the core pins 220 are clamped between the second placement groove 132 and the tightening member 150. The core pin 220 is abutted against the pad pin 120 in the vertical direction by the abutting member 150, and the connection stability of the core pin 220 and the pad pin 120 is improved.

Referring to fig. 1 and 3, according to an embodiment of the present application, a cushion 151 is disposed on the top member 150, and the top member 150 abuts against the core pin 220 through the cushion 151. By means of the cushion 151, wear of the core pins 220 by the abutment 150 is avoided.

Referring to fig. 1 and fig. 3, according to an embodiment of the present disclosure, the pad base 110 is provided with a first caulking groove 111, the first caulking groove 111 is located at a notch edge of the core placing groove 130, the pad cover 140 is provided with a first insert 141, and the first insert 141 and the first caulking groove 111 are arranged in a one-to-one correspondence; when the pad cover 140 and the core placement groove 130 are in a closed state, the first insert 141 is fitted and connected to the first fitting groove 111. Through the first insert 141 and the first caulking groove 111, the covering stability of the pad cover body 140 and the pad base body 110 is improved, so that the chip 200 is stably limited between the groove walls of the pad cover body 140 and the chip placing groove 130, the core pins 220 and the pad pins 120 are prevented from shaking in the vertical direction, and the connection stability of the core pins 220 and the pad pins 120 is improved.

Referring to fig. 1 to 3, according to an embodiment of the present disclosure, the pad body 110 has an auxiliary groove 112, a groove wall of the auxiliary groove 112 is communicated with an outer wall of the pad body 110, and the pad cover 140 is connected to the auxiliary groove 112 in an opening and closing manner; when the pad cover 140 and the core placement groove 130 are in a closed state, the pad cover 140 covers the notch of the auxiliary groove 112. When the pad cover 140 is fixedly connected to the pad base 110 and the pad cover 140 and the core placement groove 130 are in a closed state, the auxiliary groove 112 is utilized to restore the state of the fixed connection between the pad cover 140 and the pad base 110 to the state of the rotational connection between the pad cover 140 and the pad base 110.

Referring to fig. 1 and 3, according to an embodiment of the present application, the auxiliary slot 112 is in communication with the first placing slot 131. The auxiliary groove 112 is utilized to facilitate the heat dissipation of the chip 200; further, when the chip 200 is placed in the core body placement groove 130, the distance from the bottom of the auxiliary groove 112 to the bottom of the first placement groove 131 is H, and the distance from the top surface of the core body 210 to the bottom of the first placement groove 131 is H, specifically, H is less than or equal to 1/2 × H; the chip 200 is easily removed from the chip placement groove 130.

Referring to fig. 1 to 3, according to an embodiment of the present invention, the die pad holder 100 further includes an extension 160, and the extension 160 is disposed on a side of the pad cover 140 adjacent to the auxiliary groove 112. The opening and closing connection between the pad cover 140 and the pad base 110 is facilitated by the extension member 160.

Referring to fig. 3, according to an embodiment of the present disclosure, the pad cover 140 includes a first cover 142, a second cover 143, a first shaft 144, and a second shaft 145; the first groove wall of the first placing groove 131 and the second groove wall of the first placing groove 131 are both communicated with a second placing groove 132, and the first groove wall of the first placing groove 131 and the second groove wall of the first placing groove 131 are opposite to each other; the first rotating shaft 144 penetrates the second placing groove 132 close to the first groove wall of the first placing groove 131, and the first cover 142 is rotatably connected to the first rotating shaft 144; the second rotating shaft 145 penetrates the second receiving groove 132 adjacent to the second groove wall of the first receiving groove 131, and the second cover 143 is rotatably coupled to the second rotating shaft 145.

The first cover 142 is connected to the core body placing groove 130 in an opening and closing manner by the first rotating shaft 144, and then the second cover 143 is connected to the core body placing groove 130 in an opening and closing manner by the second rotating shaft 145, when the core body placing groove 130 needs to be shielded, the second side of the first cover 142 is rotated around the first rotating shaft 144, the second side of the second cover 143 is rotated around the second rotating shaft 145, the first cover 142 and the second cover 143 are moved relatively close to each other, and when the first side of the first cover 142 is abutted against the first side of the second cover 143, the first cover 142 and the second cover 143 are both shielded on the core body placing groove 130.

Further, the extension member 160 is provided on a side wall of the first cover 142 near the end of the first cover 142, and is also provided on a side wall of the second cover 143 near the end of the second cover 143, see fig. 2.

Referring to fig. 1 to 3, according to an embodiment of the present disclosure, a second caulking groove 146 is disposed on a first side of the first cover 142, a second insert 147 is disposed on a first side of the second cover 143, the second side of the first cover 142 is rotatably connected to the first rotating shaft 144, and the second side of the second cover 143 is rotatably connected to the second rotating shaft 145; when the pad cover 140 and the core placement groove 130 are in a closed state, the second insert 147 is fitted into and connected to the second insertion groove 146, and the first side of the first cover 142 abuts against the first side of the second cover 143. The second insert 147 and the second insertion groove 146 stabilize the contact between the first cover 142 and the second cover 143 in the horizontal direction.

The working principle of the chip pad base is as follows: soldering the pad pins 120 to the motherboard 300, placing the chip 200 in the chip placement grooves 130, so that each of the chip pins 220 of the chip 200 is clamped in the corresponding second placement groove 132, and so that the chip body 210 of the chip 200 is clamped in the first placement groove 131; pushing the chip 200 to the bottom of the chip placement groove 130, so that the pad pins 120 in the second placement groove 132 are connected to the core pins 220, and the chip 200 is connected to the motherboard 300 by being embedded in the chip pad holder 100; in combination with the shape of the core placing groove 130 adapted to the shape of the chip 200, the second placing groove 132 is communicated with the first placing groove 131, and the second placing groove 132 and the core pins 220 are arranged in one-to-one correspondence, so that the chip 200 and the pad base body 110 are fixedly mounted, and the stable connection between the pad pins 120 and the core pins 220 is ensured; when the performance of the chip 200 needs to be tested, an auxiliary membrane 400 is placed in the first placement groove 131, the chip 200 is then placed in the chip placement groove 130, the chip pins 220 are connected with the pad pins 120 in the second placement groove 132, the chip body 210 is placed in the first placement groove 131, the auxiliary membrane 400 is limited between the walls of the chip body 210 and the first placement groove 131, after the chip 200 completes the performance test, the chip 200 can be detached from the chip placement groove 130 by dragging the two ends of the auxiliary membrane 400, when the chip 200 needs to be tested again, an auxiliary membrane 400 is placed in the first placement groove 131, the auxiliary membrane 400 is limited between the walls of the chip body 210 and the first placement groove 131, and in the repeated performance test process of the chip 200 and the motherboard 300: subtracting the time for welding the chip 200 and the motherboard 300 and the time for unsoldering the chip 200 from the motherboard 300; therefore, repeated performance test of the chip 200 and damage to the mainboard 300 are avoided, performance test results are prevented from being affected, and time cost is reduced.

The above description is only for the purpose of illustrating the preferred embodiments of the present application and is not intended to limit the scope of the present application, which is defined by the appended claims and their equivalents, and all changes that can be made therein without departing from the spirit and scope of the invention.

Claims (10)

1. A chip pad seat is used for installing a chip, the chip comprises a core body and a core body pin connected with the core body, and the chip pad seat is characterized by comprising a pad seat body and a pad pin;

the pad seat body is provided with a core body placing groove, the shape of the core body placing groove is matched with that of the chip, the core body placing groove comprises a first placing groove and a second placing groove, the second placing groove and the core body pins are arranged in a one-to-one correspondence mode, the second placing groove is communicated with the first placing groove, one end of each pad pin is welded on the mainboard, the other end of each pad pin penetrates through the pad seat body to be arranged in the second placing groove, and the pad pins and the second placing grooves are arranged in a one-to-one correspondence mode;

the core body is connected with the first placement groove in an embedded manner, the core pins are connected with the second placement groove in an embedded manner, and the second placement groove is connected with the pad pins.

2. The die pad holder according to claim 1, further comprising a pad cover rotatably attached to the pad holder body, the pad cover being in open-close connection with the die-placement groove;

when the pad cover body and the core placing groove are in a closed state, the chip is clamped between the core placing groove and the pad cover body.

3. The die pad according to claim 2 further comprising a tightening member disposed on the wall of the pad cover, the tightening member corresponding to the second placement groove;

when the pad cover body and the core body placing groove are in a closed state, the core body pins are clamped between the second placing groove and the tightening piece.

4. The die pad holder according to claim 3, wherein the top member has a cushion pad thereon, and the top member abuts against the core pin through the cushion pad.

5. The die pad holder according to claim 2, wherein the pad holder body is provided with a first caulking groove which is located at a notch edge of the core placement groove, and the pad cover body is provided with a first insert which is arranged in one-to-one correspondence with the first caulking groove;

when the pad cover body and the core body placing groove are in a closed state, the first embedded piece is embedded and connected with the first embedding groove in an embedded mode.

6. The die pad holder according to claim 2, wherein the pad holder body is provided with an auxiliary groove, a groove wall of the auxiliary groove is communicated with an outer wall of the pad holder body, and the pad cover body is connected with the auxiliary groove in an opening and closing manner;

when the welding disc cover body and the core body placing groove are in a closed state, the welding disc cover body covers the notch of the auxiliary groove.

7. The die pad holder according to claim 6, wherein the auxiliary groove communicates with the first placing groove.

8. The die pad holder according to claim 6, further comprising an extension piece disposed on the side of the pad cover body adjacent to the auxiliary slot.

9. The die pad holder according to any one of claims 2 to 8, wherein the pad cover is provided with a first cover, a second cover, a first hinge, and a second hinge;

the first groove wall of the first placing groove and the second groove wall of the first placing groove are communicated with the second placing groove, and the first groove wall of the first placing groove and the second groove wall of the first placing groove are opposite to each other;

the first rotating shaft penetrates through the second placing groove close to the first groove wall of the first placing groove, and the first cover body is rotatably connected to the first rotating shaft;

the second rotating shaft penetrates through the second placing groove close to the second groove wall of the first placing groove, and the second cover body is rotatably connected to the second rotating shaft.

10. The die pad holder according to claim 9, wherein the first side of the first cover has a second caulking groove, the first side of the second cover has a second insert, the second side of the first cover is rotatably connected to the first hinge, and the second side of the second cover is rotatably connected to the second hinge;

when the pad cover body and the core body placing groove are in a closed state, the second insert is connected with the second embedding groove in an embedded mode, and the first side edge of the first cover body is abutted to the first side edge of the second cover body.

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