CN217871590U - HDF composite board - Google Patents
HDF composite board Download PDFInfo
- Publication number
- CN217871590U CN217871590U CN202221620259.2U CN202221620259U CN217871590U CN 217871590 U CN217871590 U CN 217871590U CN 202221620259 U CN202221620259 U CN 202221620259U CN 217871590 U CN217871590 U CN 217871590U
- Authority
- CN
- China
- Prior art keywords
- layer
- solid wood
- balance
- composite board
- hdf
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The embodiment of the application discloses HDF composite board, including the substrate layer, decorate the top layer, the substrate layer decorate to cover between the top layer and have first balanced layer, just the substrate layer decorate the top layer and pass through first balanced layer adhesive bonding, the back of substrate layer covers there is the balanced layer of second, wherein, it includes the solid wood layer at least to decorate the top layer. The HDF composite board has relatively good stability and waterproofness.
Description
Technical Field
The utility model relates to a technical field of wooden board specifically is a HDF composite board.
Background
The high-density fiberboard is a board prepared by applying thermosetting resin on wood fiber serving as a raw material and pressing the wood fiber under the conditions of heating and pressing. The high-density fiberboard has relatively high density, fine and smooth texture, good density and texture uniformity at each part inside, good dimensional stability and good surface decoration property, thus being an ideal wood material. However, the high-density fiberboard is single in color and not decorative, and is only suitable for being used as a basic structure. In the prior art, a decorative layer is often attached to a high-density fiberboard to decorate the high-density fiberboard.
In chinese patent database, patent No. CN2592765Y entitled "composite floor with solid wood surface layer" discloses a technical solution of attaching a decorative solid wood layer on the surface of a high-density fiberboard to improve the added value of the high-density fiberboard, and attaching a waterproof and moisture-proof balance bottom layer on the back to balance the tension of the solid wood layer and prevent deformation.
SUMMERY OF THE UTILITY MODEL
The solid wood layer attached to the high-density fiberboard can generate stress on the high-density fiberboard, so that the cooled composite board is warped in one direction. To solve this problem, the prior art is to apply a balance paper on the back of the high-density fiberboard to balance the tensile action of the paper on the high-density fiberboard and counteract the stress generated by the solid wood layer, which is a routine choice and technical understanding of those skilled in the art.
However, the above-mentioned technical solutions are not ideal for preventing the composite board from being warped in one direction.
After the creative research of the inventor, the influence of applying the decorative surface layer (the solid wood layer or the solid wood layer coated with paint) on the surface of the high-density fiberboard is not only the stress generated by the decorative surface layer on the high-density fiberboard, but also the influence of the adhesive penetrating into the surface of the high-density fiberboard in the applying operation. Specifically, the solid wood layer or the solid wood layer coated with paint is bonded and connected with the high-density fiberboard through a thermosetting adhesive, the adhesive permeates into the surface of the high-density fiberboard under the action of high temperature and pressure, and the permeated adhesive can affect the surface density of the high-density fiberboard, so that the density of the surface layer of the high-density fiberboard is uneven in the thickness direction. The stability of the high-density fiberboard effected by the application of the decorative cover layer is thus influenced by the tensile stress of the decorative cover layer itself in combination with the adhesive penetrating into the surface of the high-density fiberboard.
In the same way, the gluing mechanism of the balance paper is that under the action of high temperature and pressure, the flowing adhesive in the balance paper overflows and permeates into the surface of the high-density fiber board, and the balance paper and the high-density fiber board are bonded and connected after being cured. Therefore, the effect of the application of the balance paper on the high-density fiberboard is generated by the original tensile force of the balance paper and the adhesive which penetrates into the back surface of the high-density fiberboard.
Therefore, the prior art designs a three-layer structure by considering only the stress of the solid wood layer on the surface and the balanced paper on the back, and the stability (avoiding warpage) is not ideal.
The utility model aims to solve the technical problem that not enough to prior art provides a HDF composite board, at least one in it can effectively solve above-mentioned problem.
In order to achieve the above object, an embodiment of the utility model provides a HDF composite board, including the substrate layer, decorate the top layer, the substrate layer decorate to cover between the top layer and have first balanced layer, just the substrate layer decorate the top layer and pass through first balanced layer adhesive bonding, the back of substrate layer covers and has the second balanced layer, wherein, it includes the solid wood layer at least to decorate the top layer. Preferably, the decorative surface layer further comprises a paint layer coated on the solid wood layer.
Preferably, the first balance layer and the second balance layer are balance paper impregnated with a melamine formaldehyde resin adhesive.
Preferably, the thickness of the base material layer is 2.0mm to 30mm.
Preferably, the thickness of the solid wood layer is 0.1mm to 10mm.
Preferably, the back surface of the base material layer is covered with a decorative back layer, and the base material layer and the decorative back layer are connected through the second balance layer in an adhesive mode.
Preferably, the decorative backing layer includes at least a back solid wood layer.
Preferably, the decorative backing layer further comprises a back paint layer applied to the back solid wood layer.
Preferably, the thickness of the back solid wood layer is 0.1mm to 10mm.
To sum up, the embodiment of the utility model provides an adopt above-mentioned structure, have following advantage:
1. a first balance layer is arranged between the decorative surface layer and the base material layer and is used as a bonding material of the decorative surface layer and the base material layer, and part of the flowing adhesive overflowing under the action of high temperature and pressure of the first balance layer overflows into the decorative surface layer and part of the flowing adhesive overflows into the surface of the base material layer. The second balance layer is only used for bonding and connecting the second balance layer with the base material layer, and the flowing adhesive overflowing from the second balance layer under the action of high temperature and pressure completely overflows into the back surface of the base material layer. Therefore, decorate the tensile stress that top layer, first balanced layer produced on the surface of substrate layer, combine first balanced layer to overflow into the relatively less adhesive on substrate layer surface, with the tensile stress that second balanced layer produced at the back of substrate layer, combine the relative more adhesive in the substrate layer back that second balanced layer overflows into, can offset each other to, the HDF composite board of this application technical scheme has better stability.
2. With the balanced paper that impregnates the melamine formaldehyde resin adhesive as first balanced layer, first balanced layer forms melamine formaldehyde resin adhesive coating on the surface of substrate layer after the pressure is pasted, because the melamine formaldehyde resin adhesive has better hydrophobicity relatively, heat resistance, so first balanced layer can be used to provide waterproof, the humidity resistance on high density fiberboard surface simultaneously, makes the HDF composite board of this application technical scheme have better waterproof, humidity resistance.
3. In the same way, the second balance layer can be used for providing the waterproof and moisture-proof performances of the back surface of the high-density fiberboard, so that the HDF composite board has better waterproof and moisture-proof performances. In the technical scheme of simultaneously having the first balance layer and the second balance layer, the double-sided waterproof and moistureproof performance of the HDF can be improved.
For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description and accompanying drawings, which are provided for reference and illustration purposes only and are not intended to limit the present invention.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 shows a schematic structural view of an HDF composite board according to example 1 of the present application.
Fig. 2 shows a schematic structural view of an HDF composite board according to example 2 of the present application.
Fig. 3 shows a schematic structural view of an HDF composite board according to example 4 of the present application.
Fig. 4 shows a schematic structural view of an HDF composite board according to example 5 of the present application.
The figures of the above drawings are numbered: 1. substrate layer, 2, decoration top layer, 3, first balanced layer, 4, second balanced layer, 5, the decorative backing layer, 21, the solid wood layer, 22, the paint layer, 51, the back solid wood layer, 52, the back paint layer.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making creative efforts shall fall within the protection scope of the present application.
Example 1
Referring to fig. 1, the HDF composite board includes a substrate layer 1, a decorative surface layer 2, a first balance layer 3, and a second balance layer 4. First balanced layer 3 sets up between substrate layer 1, decoration top layer 2, and substrate layer 1, decorate top layer 2 and pass through first balanced layer 3 adhesive bonding. The second balance layer 4 is coated on the back surface of the base material layer 1, and is bonded to the base material layer 1 by itself. In the embodiment, the substrate layer 1 is a high-density fiberboard with a nominal thickness of 16mm and has a moisture content of 8% to 10%, and the decorative surface layer 2 includes a solid wood layer 21 (a oak continuous rotary cut veneer) with a thickness of 0.8mm and has a moisture content of 14% to 16%.
By the structure, a part of the flowing adhesive overflowing from the first balance layer 3 under the action of high temperature and pressure overflows into the solid wood layer 21, and a part of the flowing adhesive overflows into the surface of the substrate layer 1. The second balance layer 4 is only used for bonding and connecting the second balance layer 4 with the substrate layer 1, and the flowing adhesive overflowing from the second balance layer 4 under the action of high temperature and pressure completely overflows into the back of the substrate layer 1. Therefore, the tensile stress generated on the surface of the base material layer 1 by the solid wood layer 21 and the first balance layer 3, relatively less adhesive overflowing into the surface of the base material layer 1 by combining the first balance layer 3, and the tensile stress generated on the back surface of the base material layer 1 by the second balance layer 4 and relatively more adhesive overflowing into the back surface of the base material layer 1 by combining the second balance layer 4 can be mutually offset, so that the HDF composite board of the embodiment has better stability. Meanwhile, the balance paper impregnated with the melamine formaldehyde resin adhesive is used as the first balance layer 3 and the second balance layer 4, the melamine formaldehyde resin adhesive coating can be formed on the surface and the back surface of the substrate layer 1 by the first balance layer 3 and the second balance layer 4 after pressing and pasting, and the melamine formaldehyde resin adhesive has relatively good hydrophobicity and heat resistance, so that the first balance layer 3 and the second balance layer 4 can also provide the waterproof and moisture-proof performances of the surface and the back surface of the substrate layer 1, and the HDF composite board of the embodiment has better waterproof and moisture-proof performances.
Specifically, the first balance layer 3 and the second balance layer 4 are balance paper impregnated with a melamine formaldehyde resin adhesive (or optionally with a modifier added). The gram weight and the gluing amount of the first balance layer 3 and the second balance layer 4 are the same, for example, 150 g/square meter and 180% gluing amount.
Example 2
Example 2 is different from example 1 in that, referring to fig. 2, the decorative surface layer 2 includes a solid wood layer 21 (oak continuous peeled veneer) having a thickness of 0.1mm to 0.6mm, and a paint layer 22 coated on the solid wood layer 21, wherein the water content of the solid wood layer 21 is 14% to 16%, and the paint layer 22 is a single-painting wood wax oil coating. In the present embodiment, the solid wood layer 21 has relatively good toughness due to its relatively small thickness, and can dry, shrink, wet, and expand in synchronization with the substrate layer 1 after being attached to the substrate layer 1. Therefore, in the case where the thickness of the decorative skin 2 is relatively small, the decorative skin 2 hardly exhibits a stress action on the base material layer 1. In this case, the grammage of the first balance layer 3 is 1.2 to 1.7 times that of the second balance layer 4, and the amount of sizing of the first balance layer 3 is 1.1 to 1.3 times that of the second balance layer 4. Therefore, on the premise of ensuring the adhesive performance, after the adhesive part in the first balance layer 3 penetrates into the solid wood layer 21, the amount of the molten adhesive penetrating into the surface of the substrate layer 1 can be approximately equal to the amount of the molten adhesive penetrating into the back of the substrate layer 1 by the second balance groove 4, so that the densities of the surface and the back of the substrate layer 1 are approximately equal.
For example, the thickness of the solid wood layer 21 in this embodiment is 0.1mm, the base paper grammage of the first balance layer 3 is 180 g/square meter and the sizing amount is 210%, the base paper grammage of the second balance layer 4 is 140 g/square meter and the sizing amount is 190%, that is, the grammage of the first balance layer 3 is 1.3 times that of the second balance layer 4, and the sizing amount of the first balance layer 3 is 1.1 times that of the second balance layer 4.
Those skilled in the art will appreciate that the larger the thickness of the solid wood layer 21 in the interval of 0.1mm to 0.6mm, the larger the grammage and the glue amount of the first balancing layer should be compared with the grammage and the glue amount of the second balancing layer. For example, when the solid wood layer 21 has a thickness of 0.5mm, the first balance layer 3 has a body paper grammage of 200 g/square meter and a glue application amount of 240%, the second balance layer 4 has a body paper grammage of 130 g/square meter and a glue application amount of 180%, that is, the grammage of the first balance layer 3 is 1.6 times that of the second balance layer 4, and the glue application amount of the first balance layer 3 is 1.3 times that of the second balance layer 4.
Example 3
For example, the thickness of the solid wood layer 21 in this embodiment is 0.7mm, the base paper grammage of the first balance layer 3 is 135 g/square meter and the sizing amount is 170%, the base paper grammage of the second balance layer 4 is 170 g/square meter and the sizing amount is 190%, that is, the grammage of the first balance layer 3 is 0.8 times of that of the second balance layer 4, and the sizing amount of the first balance layer 3 is 0.9 times of that of the second balance layer 4.
As will be appreciated by those skilled in the art, the larger the thickness of the solid wood layer 21 in the range of 0.7mm to 2.0mm, the smaller the grammage and the glue application amount of the first balance layer should be compared with the grammage and the glue application amount of the second balance layer, so that the second balance layer 4 can penetrate more molten glue into the substrate layer 1 than the first balance layer 3. For example, when the solid wood layer 21 has a thickness of 2.0mm, the first balance layer 3 has a body paper gram weight of 145 g/square meter and a glue application amount of 200%, the second balance layer 4 has a body paper gram weight of 240 g/square meter and a glue application amount of 250%, that is, the first balance layer 3 has a gram weight 0.6 times that of the second balance layer 4, and the first balance layer 3 has a glue application amount 0.8 times that of the second balance layer 4.
Example 4
Example 4 differs from example 1 in that, as shown in fig. 3, a decorative back layer 5 is attached to the back surface of a base material layer 1, and the base material layer 1 and the decorative back layer 5 are adhesively bonded to each other through a second balance layer 4. The decorative surface layer 2 comprises a solid wood layer 21 (oak continuous rotary-cut veneer) with the thickness of 3.0mm and a paint layer 22 coated on the solid wood layer 21, the water content of the solid wood layer 21 is 14-16%, and the paint layer 22 is 8-12 UV paints. The back decorative layer 5 includes a back solid wood layer 51 having a thickness of 2.0mm, and the moisture content of the back solid wood layer is 14% to 16%.
Example 5
Example 5 differs from example 4 in that, referring to fig. 4, the back decorative layer 5 further includes a paint layer 22 applied on the solid wood layer 21, and the back paint layer 52 is 3 UV paint.
The warpage of the plate blanks of the HDF composite boards of examples 1 to 5 was performed according to GB/T18102-2000, and the experimental results are shown in table 1. The control group 1 is of a three-layer structure comprising a solid wood layer, a base material layer and a balance layer, the solid wood layer and the base material layer are bonded through a urea-formaldehyde resin adhesive, and the grammage of raw paper of the balance layer is 160 g/square meter and the gluing amount is 180%; the control group 2 is a four-layer structure comprising a paint layer, a solid wood layer, a base material layer and a balance layer, the solid wood layer and the base material layer are bonded through a urea-formaldehyde resin adhesive, and the gram weight of the base paper of the balance layer is 160 g/square meter and the gluing amount is 180%; the contrast group 3 is a five-layer structure comprising a paint layer, a solid wood layer, a base material layer, a solid wood layer and a paint layer, wherein the solid wood layer and the base material layer are bonded through a urea-formaldehyde resin adhesive.
In the waterproof performance experiment, the water absorption thickness expansion rate is measured by taking test pieces of each embodiment and a control group with the specification of 10cm multiplied by 10cm, sealing edges of plastic belts at the four sides, and soaking in clear water at 20 ℃ for 24 hours; the moisture absorption thickness expansion rate was measured by taking the test pieces of each example and the control group having a standard of 10cm × 10cm, sealing the edges of the peripheral side plastic tapes, and then balancing the test pieces in an environment of 30 ℃/92% RH for 72 hours. The results are shown in Table 2.
TABLE 1 Mat warping (length direction) of HDF composite boards of examples 1-5
| Item | Ratio of average sizing amount | Average degree of warp/%) | Direction of warp deformation |
| Example 1 | 1:1 | 0.11 | Concave |
| Example 2 | (1.3～1.7):1 | 0.10 | Concave part |
| Example 3 | (0.6～0.8):1 | 0.10 | Concave |
| Example 4 | 1:1 | 0.08 | |
| Control group | |||
| 1 | / | 0.16 | Convex |
| Control group | |||
| 2 | / | 0.20 | Convex |
| Control group | |||
| 3 | / | 0.14 | Convex part |
TABLE 2 waterproof Properties of the HDF composite boards of examples 1 to 5
| Item | Water content% | Water absorption thickness swelling ratio/%) | Hygroscopic thickness swell ratio/%) |
| Example 1 | 12～14 | 6.1 | 1.3 |
| Example 2 | 12～14 | 6.8 | 0.8 |
| Example 3 | 12～14 | 6.6 | 1.1 |
| Example 4 | 12～14 | 5.1 | 1.0 |
| |
10～14 | 12.3 | 4.1 |
| |
10～14 | 10.8 | 4.2 |
| |
10～14 | 16.7 | 3.8 |
The foregoing description is for the purpose of illustration and is not for the purpose of limitation. Many embodiments and many applications other than the examples provided would be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of subject matter that is disclosed herein is not intended to forego the subject matter and should not be construed as an admission that the applicant does not consider such subject matter to be part of the disclosed subject matter.
Claims (9)
1. The utility model provides a HDF composite board, includes the substrate layer, decorates the top layer, its characterized in that, the substrate layer decorate to cover between the top layer and have first balanced layer, just the substrate layer decorate the top layer and pass through first balanced layer adhesive bonding, the back of substrate layer covers has the balanced layer of second, wherein, it includes the solid wood layer at least to decorate the top layer.
2. The HDF composite board according to claim 1, wherein the decorative surface layer further comprises a paint layer applied over the solid wood layer.
3. The HDF composite board according to claim 1, wherein the first balancing layer and the second balancing layer are each balancing paper impregnated with a melamine formaldehyde resin adhesive.
4. The HDF composite board according to claim 1, wherein the thickness of the solid wood layer is 0.1mm to 10mm.
5. The HDF composite panel according to claim 1, wherein the back surface of the substrate layer is covered with a decorative back layer, and the substrate layer and the decorative back layer are adhesively connected by the second balance layer.
6. The HDF composite board of claim 5, wherein the decorative backing layer includes a back solid wood layer.
7. The HDF composite board according to claim 6, wherein the thickness of the back solid wood layer is 0.1mm to 10mm.
8. The HDF composite board of claim 6, wherein the decorative backing layer further comprises a back paint layer applied to the back solid wood layer.
9. The HDF composite board according to claim 1, wherein the thickness of the substrate layer is 2.0mm to 30mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221620259.2U CN217871590U (en) | 2022-06-27 | 2022-06-27 | HDF composite board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221620259.2U CN217871590U (en) | 2022-06-27 | 2022-06-27 | HDF composite board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217871590U true CN217871590U (en) | 2022-11-22 |
Family
ID=84096902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221620259.2U Active CN217871590U (en) | 2022-06-27 | 2022-06-27 | HDF composite board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217871590U (en) |
-
2022
- 2022-06-27 CN CN202221620259.2U patent/CN217871590U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES2459293T3 (en) | Procedure for manufacturing a laminated decoration panel | |
| KR100716404B1 (en) | Wood flooring laminated with high pressure veneer and impregnated low weight printing paper | |
| US3189514A (en) | Composite board | |
| JP3903401B2 (en) | Decorative plate manufacturing method | |
| CN217871590U (en) | HDF composite board | |
| CN207794530U (en) | A kind of solid wood composite cork floor | |
| CN210999168U (en) | Impregnated bond paper facing core-board for core board | |
| CN115059261A (en) | HDF composite board | |
| CN106193523A (en) | A kind of anti-deformation solid wood composite board and processing method thereof | |
| CN216766597U (en) | Flame-retardant polypropylene decorative film veneer artificial board | |
| CN213413180U (en) | Decorative plate with excellent waterproof performance | |
| JP3305075B2 (en) | Manufacturing method of composite board | |
| CN210018531U (en) | Stable log composite board and panel furniture | |
| CN211762236U (en) | Impregnated paper veneer wood composite floor | |
| KR100189372B1 (en) | A melamine sheet of laminated plywood type floorboard for the korean under-floor heating system | |
| CN216446416U (en) | Decorative board with melamine impregnated paper pressed on solid wood veneer | |
| CN110450236A (en) | A kind of particieboard with wear-resisting waterproof performance | |
| CN101980866B (en) | Damp-proof membrane, anti-warping wooden board, and veneer | |
| CN210500697U (en) | Veneer shaving board | |
| CN219749103U (en) | Ultrathin fiber board base decorative structure | |
| CN220150771U (en) | Solid wood composite wood floor capable of being applied to floor heating | |
| CN204869121U (en) | Novel structure ecological plate | |
| CN220615136U (en) | Fast-growing wood veneer | |
| CN207122046U (en) | A kind of building element | |
| CN215149954U (en) | Wood skin UV lacquer painting ecological plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |