CN217868130U - Micro-fluidic chip preparation tool - Google Patents
Micro-fluidic chip preparation tool Download PDFInfo
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- CN217868130U CN217868130U CN202221888166.8U CN202221888166U CN217868130U CN 217868130 U CN217868130 U CN 217868130U CN 202221888166 U CN202221888166 U CN 202221888166U CN 217868130 U CN217868130 U CN 217868130U
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Abstract
The utility model discloses a micro-fluidic chip preparation tool for laminating micro-fluidic chip's glass apron and chip bottom plate, micro-fluidic chip preparation tool includes: the glass cover plate is positioned in the light through hole and is arranged on the light through cushion block, and the upper surface of the glass cover plate protrudes out of the upper surface of the support plate; the chip base plate is arranged on the bearing plate and is partially positioned in the clearance groove; the elastic support assembly is connected with the support plate and the bearing plate, and enables the bearing plate to move towards the support plate through compression or to be far away from the support plate through extension; and the pressure applying assembly is arranged on one side of the bearing plate, which deviates from the supporting plate. The problems of difficulty in alignment and low production efficiency in manual manufacturing of the microfluidic chip in the prior art are solved.
Description
Technical Field
The utility model relates to a micro-fluidic chip preparation equipment field especially relates to a micro-fluidic chip preparation tool.
Background
The microfluidic technology is a technology for accurately controlling and controlling micro-scale fluid, and can integrate basic operation units such as sample preparation, reaction, separation, detection and the like in a biochemical analysis process on a micron-scale chip to automatically complete the whole analysis process. The microfluidic technology has the advantages of less sample consumption, high detection speed, simple and convenient operation, multifunctional integration, small volume, convenience for carrying and the like, and has great application potential in the fields of biology, chemistry, medicine and the like.
The micro-fluidic chip comprises a glass cover plate and a chip bottom plate (aluminum bottom plate), wherein the glass cover plate and the chip bottom plate are bonded to form the micro-fluidic chip, and a plurality of liquid storage tanks are formed between the glass cover plate and the chip bottom plate. In the existing microfluidic chip, the chip bottom plate is fixed, the glass cover plate is manually covered on the chip bottom plate, and then ultraviolet light is used for curing, so that the existing microfluidic chip is not easy to align during manual manufacturing, has high requirement on proficiency of workers and is slow in production efficiency, and therefore, the existing microfluidic chip is inconvenient.
Accordingly, the prior art is yet to be improved and developed.
SUMMERY OF THE UTILITY MODEL
In view of the not enough of above-mentioned prior art, the utility model aims to provide a micro-fluidic chip preparation tool is difficult for adjusting well when having solved among the prior art manual preparation micro-fluidic chip, the slow problem of production efficiency.
The technical scheme of the utility model as follows:
the utility model provides a micro-fluidic chip preparation tool for laminating micro-fluidic chip's glass apron and chip bottom plate, wherein, micro-fluidic chip preparation tool includes:
the glass cover plate is positioned in the light through hole and is placed on the light through cushion block, and the upper surface of the glass cover plate protrudes out of the upper surface of the support plate;
the chip base plate is arranged on the bearing plate and is partially positioned in the clearance groove;
the elastic support component is connected with the support plate and the bearing plate, and enables the bearing plate to move towards the support plate through compression or enables the bearing plate to be far away from the support plate through extension;
and the pressure applying assembly is arranged on one side of the bearing plate, which is deviated from the supporting plate.
Furthermore, a plurality of limiting bosses are arranged on the inner wall of the light through hole, and are distributed on the inner walls of four sides of the light through hole;
the glass cover plate is embedded between the limiting bosses.
Furthermore, a limiting sinking groove is formed in the bearing plate and is arranged on the edges of two opposite sides of the empty avoiding groove, and the limiting sinking groove is used for limiting the chip bottom plate.
Furthermore, a through area is arranged in the limiting sinking groove, a limiting bulge is arranged on the supporting plate, and the limiting bulge protrudes out of the bottom surface of the limiting sinking groove;
the chip bottom plate is arranged in the limiting sinking groove and sleeved on the limiting protruding part through a hook hole in the chip bottom plate.
Furthermore, two through areas are arranged and are respectively arranged on the limiting sinking grooves at the two ends;
the two limiting protruding parts are arranged and are respectively located in the through areas on the two sides.
Furthermore, a threaded hole is formed in the supporting plate;
the elastic support assembly includes: one end of the guide screw penetrates through the bearing plate and is connected in the threaded hole;
and the elastic piece is arranged between the bearing plate and the supporting plate.
Furthermore, a sinking groove is formed in the supporting plate, and the bearing plate is located in the sinking groove and moves up and down.
Furthermore, the micro-fluidic chip manufacturing jig further comprises a base, wherein a through step bottom hole is formed in the base, a light guide block is arranged in the step bottom hole, and the light transmission cushion block is arranged on the light guide block.
Further, the pressing assembly comprises a lower pressing plate, and the lower pressing plate is positioned on one side of the bearing plate, which is far away from the supporting plate;
the lower pressing plate faces the edge of one side of the bearing plate, limiting guide blocks are symmetrically arranged on four sides of the lower pressing plate respectively, inclined planes are arranged on the lower portion of the inner side of each limiting guide block, and the inclined planes are opposite to each other and form a splayed opening.
Further, the subassembly of exerting pressure still includes the balancing weight, the balancing weight sets up one side that the pressure board dorsad the loading board down.
The beneficial effect of this scheme: the utility model provides a pair of micro-fluidic chip preparation tool sets up logical unthreaded hole in the backup pad, sets up the printing opacity cushion in leading to the unthreaded hole, places micro-fluidic chip's glass apron on the printing opacity cushion to carry on spacingly through leading to the unthreaded hole to glass apron, make glass apron at leading to the downthehole unmovable of unthreaded hole, just the upper surface protrusion of glass apron in the upper surface of backup pad. The loading board is suspended above the supporting plate through the elastic supporting assembly, the chip bottom plate is placed on the loading board and located above the glass cover plate, the loading board is pressed through the pressing assembly, the loading board compresses the elastic supporting assembly, the loading board moves towards the supporting plate, the chip bottom plate moves towards the glass cover plate, and due to the fact that the empty avoiding groove is formed in the loading board, the chip bottom plate pressed downwards covers the glass cover plate. And then light is guided through the light-transmitting cushion block, so that UV light can be emitted onto the glass cover plate, glue between the glass cover plate and the chip bottom plate is solidified, the glass cover plate and the chip bottom plate are connected together to form the micro-fluidic chip, the pressing assembly is moved away after the micro-fluidic chip is manufactured, the bearing plate moves towards the direction far away from the bearing plate under the action of the elastic supporting assembly, the manufactured micro-fluidic chip is driven to move out of the light-transmitting hole, and the micro-fluidic chip is taken out greatly conveniently. The assembly of the micro-fluidic chip is realized through the jig, compared with manual operation, the precision of the method is high, the direct alignment of the glass cover plate and the chip bottom plate is realized, and the production efficiency is high.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of a micro-fluidic chip manufacturing jig of the present invention;
fig. 2 is an exploded view of the main structure of an embodiment of the fixture for manufacturing a microfluidic chip according to the present invention;
fig. 3 is a schematic structural diagram of a main structure of an embodiment of the micro-fluidic chip manufacturing jig of the present invention;
fig. 4 is an exploded view of another view angle of the main structure of an embodiment of the micro-fluidic chip manufacturing jig of the present invention;
fig. 5 is an exploded view of an embodiment of a fixture for manufacturing a microfluidic chip according to the present invention;
fig. 6 is a schematic structural diagram of a pressing assembly according to an embodiment of the present invention.
The reference numbers in the figures: 10. a glass cover plate; 20. a chip chassis; 21. a hook hole; 100. a support plate; 110. a light-transmitting hole; 111. a limiting boss; 120. a light-transmitting cushion block; 130. sinking the tank; 140. a limiting bulge; 150. a guide bar; 200. a carrier plate; 210. an empty avoiding groove; 220. limiting the sink groove; 221. a through-region; 300. an elastic support member; 310. a guide screw; 320. an elastic member; 400. a pressure application assembly; 410. a lower pressing plate; 411. a limiting guide block; 412. pressing the boss; 420. a counterweight block; 500. a base; 510. a step bottom hole; 520. and a light guide block.
Detailed Description
The utility model provides a micro-fluidic chip preparation tool and micro-fluidic chip preparation tool, for making the utility model discloses a purpose, technical scheme and effect are clearer, clear and definite, and it is right that the following refers to the drawing and the embodiment is lifted the utility model discloses further detailed description. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly connected to the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It should be further noted that the same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if there are the terms "upper", "lower", "left", "right", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of the description, but not for indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and should not be construed as limitations of the present patent, and specific meanings of the above terms can be understood according to specific situations by those of ordinary skill in the art.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
As shown in fig. 2, the utility model provides a micro-fluidic chip makes tool for laminating micro-fluidic chip's glass apron 10 and chip bottom plate 20, the embodiment is as follows:
as shown in fig. 1, 2 and 3, a fixture for manufacturing a microfluidic chip includes: a support plate 100, a carrier plate 200, a resilient support assembly 300, and a pressure applying assembly 400. For convenience of structural description, taking the outline of the support plate 100 on the horizontal plane as a rectangle as an example, the direction of the long side of the rectangular support plate 100 is the length direction, the direction of the short side is the width direction, and the vertical direction is the up-down direction. The supporting plate 100 is provided with a light through hole 110, the light through hole 110 penetrates through the supporting plate 100 along the up-down direction, a light transmitting cushion block 120 is arranged in the light through hole 110, the glass cover plate 10 is located in the light through hole 110 and is placed on the light transmitting cushion block 120, the glass cover plate 10 is limited through the light through hole 110, and the glass cover plate 10 is located in the light through hole 110 and does not move. The upper surface of the glass cover plate 10 protrudes from the upper surface of the support plate 100. The carrier plate 200 is located above the supporting plate 100, a through clearance groove 210 is formed on the carrier plate 200, the clearance groove 210 is located above the light transmitting hole 110, and the die pad 20 is located on the carrier plate 200 and partially located in the clearance groove 210. The elastic support member 300 connects the support plate 100 and the loading plate 200, and the elastic support member 300 is disposed in a vertical direction and can support the loading plate 200 by an elastic force. The elastic support assembly 300 moves the loading plate 200 toward the support plate 100 by compression or moves the loading plate 200 away from the support plate 100 by extension. The pressing assembly 400 is disposed at one side (upper side) of the carrier plate 200 facing away from the support plate 100, and is used to press the carrier plate 200 such that the carrier plate 200 can move toward the support plate 100.
As shown in fig. 2 and 3, in the above-mentioned fixture for manufacturing a microfluidic chip, a light-passing hole 110 is formed in a support plate 100, a light-passing pad 120 is disposed in the light-passing hole 110, a glass cover plate 10 of the microfluidic chip is placed on the light-passing pad 120, and the glass cover plate 10 is limited by the light-passing hole 110, so that the glass cover plate 10 does not move in the light-passing hole 110, and the upper surface of the glass cover plate 10 protrudes out of the upper surface of the support plate 100. The carrier plate 200 is suspended above the support plate 100 by the elastic support assembly 300, the bottom chip plate 20 is placed on the carrier plate 200 and above the glass cover plate 10, the carrier plate 200 is pressed by the pressing assembly 400, the carrier plate 200 compresses the elastic support assembly 300, and the carrier plate 200 moves toward the support plate 100, so that the bottom chip plate 20 moves toward the glass cover plate 10, and since the carrier plate 200 is provided with the clearance groove 210, the pressed bottom chip plate 20 covers the glass cover plate 10. And then, light is guided by the light-transmitting cushion block 120, so that UV light can be emitted onto the glass cover plate 10, and the glue between the glass cover plate 10 and the chip base plate 20 is cured, so that the glass cover plate 10 and the chip base plate 20 are connected together to form the microfluidic chip, after the microfluidic chip is manufactured, the pressing assembly 400 is moved away, the bearing plate 200 moves towards the direction far away from the support plate 100 under the action of the elastic support assembly 300, so that the manufactured microfluidic chip is driven to move out of the light-transmitting hole 110, and the microfluidic chip is taken out conveniently. The assembly of the micro-fluidic chip is realized through the jig, compared with manual operation, the precision of the method is high, the direct alignment of the glass cover plate 10 and the chip bottom plate 20 is realized, and the production efficiency is high.
As shown in fig. 2 and fig. 5, in the specific structure of this embodiment, the fixture for manufacturing a microfluidic chip further includes a base 500, the base 500 is placed on a table, and the base 500 is configured as a rectangle matching with the supporting plate 100. The base 500 is provided with a through step bottom hole 510, and the step bottom hole 510 is through in the up-down direction, so that the UV lamp can irradiate conveniently. A step position is arranged in the step bottom hole 510, a light guide block 520 is arranged in the step bottom hole 510, the light guide block 520 is embedded in the step bottom hole 510 in a clamping mode and is arranged on the step position, and the light guide block 520 plays a role in light transmission and support. After the supporting plate 100 is connected to the base 500, the light-transmitting cushion block 120 is disposed on the light-guiding block 520, and the light-transmitting cushion block 120 is supported by the light-guiding block 520 so as not to fall out of the light-transmitting hole 110, and the supporting plate 100 is supported by the base 500.
As shown in fig. 3 and 4, in order to limit the glass cover plate 10, a plurality of limiting bosses 111 are disposed on the inner wall of the light-passing hole 110, the limiting bosses 111 and the supporting plate 100 are integrally formed, the light-passing hole 110 is rectangular, and the limiting bosses 111 are disposed on the inner walls of four sides of the light-passing hole 110 in the length direction and the width direction. Specifically, 2 limiting bosses 111 are arranged in the length direction, and 1 limiting boss is arranged in the width direction; the glass cover plate 10 is embedded between the limit bosses 111. Therefore, the glass cover plate 10 is limited in the length direction and the width direction, and the glass cover plate 10 is limited between the limiting bosses 111 on the two sides and is not easy to move.
As shown in fig. 2 and 4, after the carrier 200 is moved down, the chip bottom plate 20 is contacted with the glass cover plate 10. The supporting plate 100 is provided with a sinking groove 130, the light hole 110 is located at the middle position of the sinking groove 130, and the sinking groove 130 is larger than the bearing plate 200, so that the bearing plate 200 can move up and down in the sinking groove 130. Thus, when the carrier plate 200 is pressed down, the carrier plate 200 can be lowered into the sunken groove 130, so that the chip base plate 20 placed on the carrier plate 200 can be more conveniently abutted against the glass cover plate 10 positioned in the light passing hole 110.
Four threaded holes are formed in the support plate 100, and the four threaded holes are located at four corners of the sunken groove 130 respectively. The corresponding elastic support members 300 are provided with four, by supporting the loading plate 200 at four corners, so that the stability of the loading plate 200 is enhanced.
As shown in fig. 2 and 3, the elastic support assembly 300 includes: a guide screw 310, and an elastic member 320. One end of the guide screw 310 penetrates the bearing plate 200 in the up-down direction and is connected in the screw hole; the elastic member 320 is disposed between the loading plate 200 and the support plate 100. The elastic member 320 in this embodiment is a spring, the spring is sleeved in the guide screw 310, and one end of the spring abuts against the lower surface of the bearing plate 200, and the other end abuts against the support plate 100. In addition, in order to facilitate the installation of the spring, a counter bore is formed in the position of the threaded hole, so that the spring is arranged in the counter bore, the installation of the spring is facilitated, and the pressing stroke of the bearing plate 200 can be reduced. The lower surface of the carrier plate 200 is attached to the bottom of the sinking groove 130, which is more favorable for the chip bottom plate 20 and the glass cover plate 10 to abut against.
As shown in fig. 3 and 4, the carrier plate 200 is provided with a limiting sinking groove 220, the limiting sinking groove 220 is adapted to the contour of the chip bottom plate 20, the limiting sinking groove 220 is disposed on two opposite side edges of the clearance groove 210, and the limiting sinking groove 220 is used for limiting the chip bottom plate 20. In the specific structure, since the length of the chip bottom plate 20 in the length direction is greater than the length of the clearance groove 210, the limit sink grooves 220 are arranged at two opposite edges (short edges) of the clearance groove 210 in the length direction, and the limit sink grooves 220 extend towards the length direction, and the limit sink grooves 220 are connected with the clearance groove 210 and located at two ends of the clearance groove in the length direction. Placing the chip bottom plate 20 in the limiting sinking groove 220 can limit the chip bottom plate 20 and prevent the chip bottom plate 20 from moving.
As shown in fig. 3 and 4, a through region 221 is disposed in the limiting sinking groove 220, the through region 221 penetrates through the limiting sinking groove 220 in the vertical direction and is communicated with the clearance groove 210, the supporting plate 100 is provided with a limiting protrusion 140, and the limiting protrusion 140 protrudes from the bottom surface of the limiting sinking groove 220. Usually, hook holes 21 are formed at both ends of the chip bottom plate 20 in the length direction, and the hook holes 21 are through holes; the chip base plate 20 is disposed in the position-limiting sinking groove 220 and sleeved on the position-limiting protrusion 140 through the hook hole 21 on the chip base plate 20. This allows for further restraint of the die pad 20. Spacing bellying 140 sets up in backup pad 100, and the relative position of spacing bellying 140 and glass apron 10 is fixed so, and spacing bellying 140 of rethread is spacing to chip bottom plate 20 to make chip bottom plate 20 and glass apron 10's relative position be fixed, the position just is difficult for appearing the deviation after the lid closes, carries out effective control to the precision, has improved the yields in the production process.
The number of the through areas 221 in this embodiment is two, the two through areas 221 are respectively disposed on the limiting sinking grooves 220 at the two ends, the number of the limiting protrusions 140 is two, and the two limiting protrusions 140 are respectively located in the through areas 221 at the two sides. The chip tray 20 can be better limited by providing the two limiting protrusions 140 in the longitudinal direction of the support plate 100.
As shown in fig. 5 and 6, the pressing assembly 400 in the present embodiment includes a lower pressing plate 410, and the lower pressing plate 410 is located on one side (upper side) of the loading plate 200 facing away from the supporting plate 100; the edge of holding down plate 410 towards loading board 200 one side is provided with spacing guide block 411, and spacing guide block 411 symmetry respectively sets up on holding down plate 410's four sides, and the inboard lower part of spacing guide block 411 is provided with the inclined plane, and relative inclined plane forms "eight" font opening. The lower pressing plate 410 can be pressed down to the correct position of the edge of the supporting plate 100 through the limiting guide block 411, so that the lower pressing plate 410 is not easy to deviate from the microfluidic chip. And a lower pressing boss 412 is arranged on the bottom surface of the lower pressing plate 410, and the outer contour of the lower pressing boss 412 is matched with that of the microfluidic chip. In the pressing process, the pressing boss 412 contacts the chip base plate 20 of the microfluidic chip first, so that the chip base plate 20 is pressed on the glass cover plate 10 directly under force.
As shown in fig. 5 and 6, the upper pressing plate has a certain pressing effect, and the upper pressing plate can mainly align with the position of the microfluidic chip and perform pre-pressing. In order to enhance the pressing effect, the pressing assembly 400 of the present embodiment further includes a weight block 420, and the weight block 420 is disposed on a side of the lower pressing plate 410 away from the loading plate 200. By placing the weight 420 on the upper platen, the pressure is increased, and the microfluidic chip has a better bonding effect.
As shown in fig. 2 and 4, the upper platen and the weight plate are not easily attached to each other. The guide rods 150 are arranged at two ends of the supporting plate 100 in the length direction, the guide rods 150 are arranged in the vertical direction, through holes are formed in the corresponding positions of the upper pressing plate and the counterweight plate, and when the upper pressing plate and the counterweight plate are placed, correct alignment can be achieved only by sleeving the guide rods 150 through the through holes.
It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (10)
1. The utility model provides a micro-fluidic chip preparation tool for laminating micro-fluidic chip's glass apron and chip bottom plate, its characterized in that, micro-fluidic chip preparation tool includes:
the glass cover plate is positioned in the light through hole and placed on the light transmitting cushion block, and the upper surface of the glass cover plate protrudes out of the upper surface of the support plate;
the chip base plate is arranged on the bearing plate and is partially positioned in the clearance groove;
the elastic support component is connected with the support plate and the bearing plate, and enables the bearing plate to move towards the support plate through compression or enables the bearing plate to be far away from the support plate through extension;
and the pressure applying assembly is arranged on one side of the bearing plate, which is deviated from the supporting plate.
2. The jig for manufacturing a microfluidic chip according to claim 1, wherein a plurality of limiting bosses are arranged on the inner wall of the light through hole, and the plurality of limiting bosses are distributed on the inner walls of the four sides of the light through hole;
the glass cover plate is embedded between the limiting bosses.
3. A fixture for manufacturing microfluidic chips according to claim 2, wherein the supporting plate is provided with limiting sinking grooves, the limiting sinking grooves are disposed on two opposite edges of the avoiding groove, and the limiting sinking grooves are used for limiting the chip bottom plate.
4. The jig for manufacturing a microfluidic chip according to claim 3, wherein a through region is disposed in the limiting sinking groove, and the supporting plate is provided with a limiting protrusion protruding from a bottom surface of the limiting sinking groove;
the chip bottom plate is arranged in the limiting sinking groove and is sleeved on the limiting protruding portion through a hook hole in the chip bottom plate.
5. The jig for manufacturing the microfluidic chip according to claim 4, wherein two through areas are provided, and the two through areas are respectively arranged on the limiting sunken grooves at two ends;
the two limiting protruding parts are arranged and are respectively located in the through areas on the two sides.
6. The jig for manufacturing a microfluidic chip according to claim 1, wherein the supporting plate is provided with a threaded hole;
the elastic support assembly includes: one end of the guide screw penetrates through the bearing plate and is connected in the threaded hole;
the elastic piece is arranged between the bearing plate and the supporting plate.
7. The jig for manufacturing a microfluidic chip according to claim 1, wherein the supporting plate is provided with a sink groove, and the supporting plate is located in the sink groove and moves up and down.
8. The jig for manufacturing a microfluidic chip according to claim 1, further comprising a base, wherein the base is provided with a through step bottom hole, a light guide block is arranged in the step bottom hole, and the light transmission cushion block is arranged on the light guide block.
9. The fixture for manufacturing a microfluidic chip according to claim 1, wherein the pressing assembly comprises a lower pressing plate, and the lower pressing plate is located on one side of the bearing plate, which is away from the supporting plate;
the lower pressing plate faces the edge of one side of the bearing plate and is provided with limiting guide blocks, the limiting guide blocks are symmetrically arranged on four sides of the lower pressing plate respectively, the lower portion of the inner side of each limiting guide block is provided with an inclined plane, and the inclined planes are opposite to each other and form an opening shaped like a Chinese character 'ba'.
10. The apparatus of claim 9, wherein the pressure applying assembly further comprises a weight block disposed on a side of the lower pressing plate opposite to the loading plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221888166.8U CN217868130U (en) | 2022-07-21 | 2022-07-21 | Micro-fluidic chip preparation tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221888166.8U CN217868130U (en) | 2022-07-21 | 2022-07-21 | Micro-fluidic chip preparation tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217868130U true CN217868130U (en) | 2022-11-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221888166.8U Active CN217868130U (en) | 2022-07-21 | 2022-07-21 | Micro-fluidic chip preparation tool |
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| Country | Link |
|---|---|
| CN (1) | CN217868130U (en) |
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2022
- 2022-07-21 CN CN202221888166.8U patent/CN217868130U/en active Active
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