CN217868129U - Wireless intelligent sensor chip architecture based on system-in-package - Google Patents
Wireless intelligent sensor chip architecture based on system-in-package Download PDFInfo
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- CN217868129U CN217868129U CN202221854114.9U CN202221854114U CN217868129U CN 217868129 U CN217868129 U CN 217868129U CN 202221854114 U CN202221854114 U CN 202221854114U CN 217868129 U CN217868129 U CN 217868129U
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Abstract
The utility model discloses a wireless intelligent sensor chip framework based on system level packaging, including MEMS sensor chip, MCU chip, energy management chip and wireless communication chip, MEMS sensor chip, MCU chip, energy management chip and wireless communication chip are installed on the SIP base plate through the packaging piece, have realized the wireless intelligent sensor chip of high integration level; MEMS sensor chip and MCU chip electricity are connected, MCU chip and wireless communication chip electricity are connected, the energy management chip respectively with MEMS sensor chip, MCU chip and wireless communication chip electricity are connected, the MEMS sensor is responsible for gathering the physical quantity signal, the signal is sent for the MCU chip after conditioning, send away with wireless transmission mode through the wireless communication chip simultaneously. The utility model has the advantages of compact structure, short development period, high reliability, high integration level, etc.; the solar energy radio frequency power supply system has three power supply modes of radio frequency power supply, solar energy power supply and lithium battery power supply, and can be suitable for various application scenes.
Description
Technical Field
The utility model relates to a sensor chip framework, in particular to wireless intelligent sensor chip framework based on system level packaging.
Background
With the rapid development of the technology of the internet of things and the technology of the MEMS sensor, the MEMS sensor is developing towards intellectualization, wireless miniaturization and miniaturization. The traditional MEMS sensor chip has single and centralized structural functions, is only responsible for signal acquisition and processing, and is only used for integrating a wireless communication chip, a microcontroller MCU chip and a MEMS sensor chip based on a Printed Circuit Board (PCB) if an intelligent sensor for realizing networking based on a wireless communication mode is required to be realized, so that the area of the PCB is difficult to reduce, and the processing cost of the PCB is difficult to control; secondly, the reliability of the whole machine highly depends on the experience level of hardware design and development of designers, and the development period is difficult to control. In addition, with the popularization and application of the MEMS sensor, the traditional energy management mode (power supply mode) no longer adapts to its diversified application requirements and application scenarios.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: the utility model provides a wireless intelligent sensor chip architecture based on system in package for solve traditional micro-electromechanical system MEMS sensor chip architecture function singleness, it is bulky, the unreliable scheduling problem of power supply.
The technical scheme is as follows: a wireless intelligent sensor chip architecture based on system-in-package comprises an MEMS sensor chip, an MCU chip, an energy management chip and a wireless communication chip, wherein the MEMS sensor chip, the MCU chip, the energy management chip and the wireless communication chip are arranged on an SIP substrate through a package; the MEMS sensor chip is electrically connected with the MCU chip, and the MCU chip is electrically connected with the wireless communication chip; the energy management chip is electrically connected with the MEMS sensor chip, the MCU chip and the wireless communication chip respectively;
a signal transmitting/receiving antenna pin, a radio frequency energy receiving antenna pin, a solar energy input pin and a battery charging and discharging pin are arranged on one side of the SIP substrate; the signal transmitting/receiving antenna pin is connected with the wireless communication chip; the radio frequency energy receiving antenna pin is connected with an energy management chip, the solar energy input pin is connected with the energy management chip, and the battery charging and discharging pin is connected with the energy management chip.
Furthermore, the energy management chip comprises a magnetoelectric conversion module, a solar power supply combing module, a power supply channel selection module and a voltage stabilizing module; the solar energy power supply combing module is electrically connected with the power supply channel selection module, and the power supply channel selection module is electrically connected with the voltage stabilization module;
the energy management chip is also provided with a radio frequency energy receiving port, a solar power supply input port, a battery charging and discharging port, a power supply voltage output port and a power supply ground port; the radio frequency energy receiving port is connected with the magnetoelectric conversion module, the solar power supply input port is connected with the solar power supply combing module, the battery charging and discharging port is connected with the power supply channel selection module, and the power supply voltage output port and the power supply ground port are respectively connected with the voltage stabilizing module;
the radio frequency energy receiving antenna pin is electrically connected with the radio frequency energy receiving port; the solar input pin is electrically connected with the solar power supply input port; the battery charging and discharging pin is electrically connected with the battery charging and discharging port; the MEMS sensor chip, the MCU chip and the wireless communication chip are respectively and electrically connected with the power supply voltage output port.
Furthermore, a UART debugging pin is arranged on the SIP substrate; and the UART debugging pin is connected with the MCU chip.
Furthermore, an SWD debugging pin is arranged on the SIP substrate; the SWD debugging pin is respectively connected with the MCU chip and the wireless communication chip.
Preferably, the MCU chip and the MEMS sensor chip are connected in a bidirectional communication mode through a Serial Peripheral Interface (SPI).
Preferably, the MCU chip and the wireless communication chip are connected in a bidirectional communication mode through a Serial Peripheral Interface (SPI).
Compared with the prior art, the utility model has the advantages of as follows:
1. based on an advanced system-in-package process, the wireless communication chip, the microcontroller MCU chip, the MEMS sensor chip and the energy management chip are packaged on the SIP substrate, only a plurality of connectors are required to be placed on the printed circuit board PCB, peripheral components are basically not required, the development difficulty of products is greatly reduced, and the development period is shortened.
2. The formed SIP chip has a compact structure and high integration level, and can effectively reduce the area of the PCB and reduce the processing cost of the PCB; and the core devices are all integrated in the SIP chip, so that the reliability is high.
3. The radio frequency power supply or solar power supply can be selected according to actual conditions, and under special conditions such as night and interference, the lithium battery can be used for supplying power, so that the solar energy power supply system is applicable to different application scenes.
4. The user can utilize the UART serial port to develop or debug the SIP chip, and can also carry out program downloading and simulation debugging on the MCU chip and the wireless communication chip through the SWD. The SIP chip provides a whole set of solution for wireless intelligent sensor products, and avoids the user from spending time in device type selection and chip verification.
Drawings
FIG. 1 is a schematic diagram of a system-in-package based wireless smart sensor chip architecture;
FIG. 2 is a block schematic diagram of an energy management chip;
FIG. 3 is a flow chart of a test for a wireless smart sensor chip;
fig. 4 is a typical application of a wireless smart sensor chip based on system-in-package.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only used to illustrate the technical solutions of the present invention more clearly, and therefore are only used as examples, and the protection scope of the present invention is not limited thereby.
As shown in fig. 1, a system-in-package based wireless smart sensor chip architecture includes a MEMS sensor chip, an MCU chip, an energy management chip, and a wireless communication chip.
The MEMS sensor chip is electrically connected with the MCU chip, and the MCU chip is electrically connected with the wireless communication chip.
The energy management chip is electrically connected with the MEMS sensor chip, the MCU chip and the wireless communication chip respectively; specifically, a first signal output end of the energy management chip is connected with a signal input end of the MEMS sensor chip, a second signal output end of the energy management chip is connected with a signal input end of the MCU chip, and a third signal output end of the energy management chip is connected with a signal input end of the wireless communication chip, so that power supply to the MEMS sensor chip, the MCU chip and the wireless communication chip is achieved.
The chips are arranged and mounted on the SIP substrate in a matrix mode through a package to form a system-in-package SIP chip.
And a signal transmitting/receiving antenna pin, a radio frequency energy receiving antenna pin, a solar energy input pin and a battery charging and discharging pin are also arranged on one side of the SIP substrate.
The signal transmitting/receiving antenna pin is connected with the wireless communication chip and used for transmitting data sampled by the MEMS sensor or receiving data of remote equipment. Specifically, the signal transmitting/receiving antenna pin establishes two-way communication with the remote device via the antenna. On the one hand, after the data sampled by the MEMS sensor is transmitted to the MCU chip, the data can be transmitted to the remote equipment through the wireless communication chip, the signal transmitting/receiving antenna pin and the antenna. Meanwhile, data sent by the remote equipment can be transmitted to the MCU chip through the antenna, the signal transmitting/receiving antenna pin and the wireless communication chip.
The pin of the radio frequency energy receiving antenna is connected with the energy management chip. The radio frequency energy receiving antenna pin receives radio frequency energy in the space through the antenna, the radio frequency energy and the energy management chip form a radio frequency power supply management module, and the energy management chip outputs electric energy to the MEMS sensor chip, the MCU chip and the wireless communication chip.
The solar energy input pin is connected with the energy management chip, and the solar energy input pin and the energy management chip form a solar energy power supply management module together. The solar energy input pin is used for being connected with the solar panel, solar energy is converted into electric energy, and the MEMS sensor chip, the MCU chip and the wireless communication chip are powered through the energy management chip.
The battery charging and discharging pin is connected with the energy management chip and used for being connected with a lithium battery. The radio frequency power supply and the solar power supply can supply power to the MEMS sensor chip, the MCU chip and the wireless communication chip, and meanwhile, the lithium battery can be charged through the energy management chip.
The structure enables the radio frequency power supply and the solar power supply to complement each other, and when the chip is applied to occasions without solar illumination or with weak solar illumination, the radio frequency power supply supplies power to the SIP chip; when the chip is applied to the occasion with enough sunlight, the solar power supply can be completely used for supplying power, and a user can switch two power supply modes according to the actual situation. On the other hand, no matter a radio frequency power supply or a solar power supply is adopted, the electric energy stored in the lithium battery can ensure the normal power supply of the SIP chip system. For example, when the signal of the radio frequency power supply is interfered, the energy stored in the lithium battery can be used for supplying power, so that the system is prevented from being powered off.
Preferably, one side of the SIP substrate is further provided with a universal asynchronous receiver/transmitter UART debugging pin (hereinafter referred to as UART debugging pin), and the UART debugging pin is connected with the MCU chip. The UART debugging pin is used for serial port debugging, and a user can conveniently develop or debug an SIP chip by using a UART serial port.
Furthermore, an SWD debugging pin is arranged on the SIP substrate. The SWD debugging pin is respectively connected with the MCU chip and the wireless communication chip. The SWD pin is used for program downloading and simulation debugging of the MCU chip and the wireless communication chip. The MCU chip and the wireless communication chip share the SWD debugging pin, and the connection of the SWD debugging pin, the wireless communication chip and the MCU chip is switched by sending different commands.
Further preferably, the MCU chip adopts a serial peripheral interface SPI, an MEMS sensor chip and a wireless communication chip to realize bidirectional passing connection.
As shown in fig. 2, the energy management chip includes a magnetoelectric conversion module, a solar power combing module, a power supply channel selection module, and a voltage stabilization module. The functions of the modules are as follows:
a magnetoelectric conversion module: the antenna is mainly responsible for converting magnetic energy received by the antenna into electric energy and supplying the electric energy to the power supply channel selection module.
The solar power supply carding module: the solar panel temperature monitoring device is mainly responsible for buffering and smoothing the electric energy converted by the solar panel, monitoring the temperature and the voltage of the solar panel, and disconnecting the solar panel from the solar panel at the first time if the temperature of the solar panel is too high or damaged.
A power supply channel selection module: the method is used for managing charging and power supply. The energy source for the energy management chip to supply power to the rear stage comprises three types of solar energy, a radio frequency antenna and a lithium battery. In this embodiment, if the power supply channel selection module detects that the lithium cell electric quantity is less than a certain proportion, for example 80%, then charge for the lithium cell through solar panel or radio frequency antenna to guarantee that the lithium cell possesses long-time stable energy storage. If the lithium battery is detected to be full, namely the electric quantity is 100%, at the moment, if solar voltage or radio frequency voltage exists, the solar voltage or the radio frequency voltage is preferentially selected to be transmitted to the voltage stabilizing module. Of course, the specific charging threshold and the power supply priority may be adjusted by the user according to the actual application scenario, and are not limited herein.
A voltage stabilizing module: is primarily responsible for stabilizing the output voltage through VCC _ OUT at a fixed value.
Specifically, the signal output end of the magnetoelectric conversion module is connected with the first signal input end of the power supply channel selection module, the signal output end of the solar power supply combing module is connected with the second signal input end of the power supply channel selection module, and the signal output end of the power supply channel selection module is connected with the signal input end of the voltage stabilization module.
The energy management chip is also provided with a radio frequency energy receiving port, a solar power supply input port, a battery charging and discharging port, a power supply voltage output port (VCC _ OUT) and a power supply ground port (GND). The function of each port is as follows:
radio frequency energy receiving port: for receiving the radio frequency energy coupled from the antenna.
Solar power input port: the solar panel is used for receiving the electric energy transmitted by the solar panel.
A battery charging and discharging port: the energy management chip is used for connecting a lithium battery, the lithium battery is used for supplying power to the energy management chip, and the energy management chip is used for charging the lithium battery.
VCC _ OUT: and the port is used for outputting power supply voltage and supplying power to a rear-stage chip power supply.
GND: and a power ground port of the whole SIP chip.
Specifically, the radio frequency energy receiving port is connected with a signal input end of the magnetoelectric conversion module, the solar power supply input port is connected with a signal input end of the solar power supply combing module, the battery charging and discharging port is electrically connected with the power supply channel selection module, the first signal output end of the voltage stabilizing module is connected with the VCC _ OUT port, and the second signal output end of the voltage stabilizing module is connected with the GND port.
When the energy management chip and other chips are packaged together, the radio frequency energy receiving antenna pin is electrically connected with the radio frequency energy receiving port, the solar energy input pin is electrically connected with the solar power supply input port, the battery charging and discharging pin is electrically connected with the battery charging and discharging port, and the VCC _ OUT port is electrically connected with the power supply ports of the MEMS sensor chip, the MCU chip and the wireless communication chip respectively.
Fig. 3 shows a testing process for the wireless intelligent sensor chip, which includes the following steps:
s1: testing the power supply function of the radio frequency energy;
s2: testing the power supply function of the lithium battery;
s3: testing the charging function of the solar panel for the lithium battery;
s4: downloading a program to a wireless communication chip through an SWD interface and entering a Debug mode;
s5: testing the sampling function of the MEMS sensor;
s6: testing the functions of the wireless communication chip;
s7: downloading a program to the MCU chip through the SWD interface and entering a Debug mode;
s8: and testing the basic function of the MCU chip and controlling the wireless communication chip to perform the data transceiving function by the MCU chip.
Fig. 4 shows a typical application of the wireless intelligent sensor chip.
When the sunlight is insufficient, the solar energy is supplied by 220V commercial power, namely radio frequency. At the moment, high-frequency electromagnetic waves are radiated to the space through the radio frequency energy transmitter, and the input voltage of the radio frequency energy transmitter adopts commercial power 220V alternating current (L-live wire, N-zero wire). The radio frequency energy receiving antenna pin of the wireless intelligent sensor chip is connected with the antenna, the radio frequency energy in the space is captured through the antenna, and at the moment, the energy source can be independently provided for the whole chip system without a solar panel and a lithium battery.
Under the applied scene that does not have the 220V commercial power, can rely on solar panel and lithium cell to provide the energy source for entire system, can directly supply power for the chip through solar panel daytime, then supply power through the lithium cell night, maintain operating condition. The signal transmitting or receiving antenna pin is connected with the antenna, the MEMS sensor is responsible for acquiring physical quantity signals, the physical quantity signals are conditioned and then sent to the MCU chip for quality control and local storage, and meanwhile, data are sent out in a wireless transmission mode through the wireless communication chip. In this embodiment, the user can implement local debugging of the wireless intelligent sensor by converting UART to USB.
It should be noted that the utility model discloses the framework composition of the wireless intelligent sensor chip of request protection, and the relation of connection between each chip; the signal of telecommunication process of MEMS sensor chip, MCU chip, energy management chip that relates only is used for explaining the utility model discloses an operating principle, these signal of telecommunication process are independent of the utility model discloses a computer software product, nevertheless can by the utility model discloses executed.
Claims (6)
1. The utility model provides a wireless intelligent sensor chip architecture based on system in package which characterized in that: the system comprises an MEMS sensor chip, an MCU chip, an energy management chip and a wireless communication chip, wherein the MEMS sensor chip, the MCU chip, the energy management chip and the wireless communication chip are arranged on an SIP substrate through a packaging piece; the MEMS sensor chip is electrically connected with the MCU chip, and the MCU chip is electrically connected with the wireless communication chip; the energy management chip is electrically connected with the MEMS sensor chip, the MCU chip and the wireless communication chip respectively;
a signal transmitting/receiving antenna pin, a radio frequency energy receiving antenna pin, a solar energy input pin and a battery charging and discharging pin are arranged on one side of the SIP substrate; the signal transmitting/receiving antenna pin is connected with a wireless communication chip; the radio frequency energy receiving antenna pin is connected with an energy management chip, the solar energy input pin is connected with the energy management chip, and the battery charging and discharging pin is connected with the energy management chip.
2. The wireless smart sensor chip architecture of claim 1, wherein: the energy management chip comprises a magnetoelectric conversion module, a solar power supply combing module, a power supply channel selection module and a voltage stabilization module; the solar energy power supply combing module is electrically connected with the power supply channel selection module, and the power supply channel selection module is electrically connected with the voltage stabilization module;
the energy management chip is also provided with a radio frequency energy receiving port, a solar power supply input port, a battery charging and discharging port, a power supply voltage output port and a power supply ground port; the radio frequency energy receiving port is connected with the magnetoelectric conversion module, the solar power supply input port is connected with the solar power supply combing module, the battery charging and discharging port is connected with the power supply channel selection module, and the power supply voltage output port and the power supply ground port are respectively connected with the voltage stabilizing module;
the radio frequency energy receiving antenna pin is electrically connected with the radio frequency energy receiving port; the solar input pin is electrically connected with the solar power supply input port; the battery charging and discharging pin is electrically connected with the battery charging and discharging port; the MEMS sensor chip, the MCU chip and the wireless communication chip are respectively and electrically connected with the power supply voltage output port.
3. The wireless smart sensor chip architecture of claim 1, wherein: a UART debugging pin is arranged on the SIP substrate; and the UART debugging pin is connected with the MCU chip.
4. The wireless smart sensor chip architecture of claim 1, wherein: an SWD debugging pin is arranged on the SIP substrate; and the SWD debugging pin is respectively connected with the MCU chip and the wireless communication chip.
5. The wireless smart sensor chip architecture of claim 1, wherein: and the MCU chip and the MEMS sensor chip are connected in a bidirectional communication manner by adopting a Serial Peripheral Interface (SPI).
6. The wireless smart sensor chip architecture of claim 1, wherein: and the MCU chip and the wireless communication chip are connected in a bidirectional communication manner by adopting a Serial Peripheral Interface (SPI).
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2024183594A1 (en) * | 2023-03-06 | 2024-09-12 | 杭州阿里云飞天信息技术有限公司 | System-in-package detection chip, information detection method and electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2024183594A1 (en) * | 2023-03-06 | 2024-09-12 | 杭州阿里云飞天信息技术有限公司 | System-in-package detection chip, information detection method and electronic device |
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