CN217849428U - Radio frequency chip, radio device and electronic equipment - Google Patents
Radio frequency chip, radio device and electronic equipment Download PDFInfo
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- CN217849428U CN217849428U CN202221767455.2U CN202221767455U CN217849428U CN 217849428 U CN217849428 U CN 217849428U CN 202221767455 U CN202221767455 U CN 202221767455U CN 217849428 U CN217849428 U CN 217849428U
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Abstract
The utility model relates to a semiconductor integrated chip field, in particular to radio frequency chip and radio device, electronic equipment, radio frequency chip includes: the radio frequency signal transmission path and the reference ground are arranged on two sides of the radio frequency signal transmission path, the radio frequency signal transmission path and the reference ground extend towards the same direction, the radio frequency signal transmission path and the reference ground are arranged on the same layer, and the radio frequency signal transmission path is used for transmitting radio frequency signals; the low-frequency signal transmission path and the radio-frequency signal transmission path are arranged in a staggered manner; a shielding structure located between the low frequency signal transmission path and the radio frequency signal transmission path, the shielding structure being coupled to a reference ground. The utility model discloses the territory design when being favorable to simplifying actual preparation radio frequency chip.
Description
Technical Field
The utility model relates to a semiconductor integrated chip field, in particular to radio frequency chip and radio device, electronic equipment.
Background
In a radio frequency chip, a passive device such as a transmission line or a coplanar waveguide is usually required to be integrated, wherein the coplanar waveguide generally includes a signal line and a ground line on both sides of the signal line, and the signal line can be used for transmitting a high-frequency signal such as a radio frequency signal. The coplanar waveguide is easy to manufacture, realize passivity and improve circuit density, so that the coplanar waveguide is widely applied to radio frequency chips.
However, at present, when the coplanar waveguide is used as a transmission line in a radio frequency chip, the layout design is complicated when the radio frequency chip is actually prepared.
SUMMERY OF THE UTILITY MODEL
The utility model provides a radio frequency chip and radio device, electronic equipment, the territory design when being favorable to simplifying actual preparation radio frequency chip at least.
The utility model provides a radio frequency chip, include: the radio frequency signal transmission path and the reference ground are positioned on two sides of the radio frequency signal transmission path, the radio frequency signal transmission path and the reference ground extend towards the same direction, the radio frequency signal transmission path and the reference ground are arranged on the same layer, and the radio frequency signal transmission path is used for transmitting radio frequency signals; the low-frequency signal transmission path and the radio-frequency signal transmission path are arranged in a staggered manner; a shielding structure located between the low frequency signal transmission path and the radio frequency signal transmission path, the shielding structure being coupled to a reference ground.
In some embodiments, the low frequency signal transmission path at least crosses the radio frequency signal transmission path in a direction pointing along the radio frequency signal transmission path towards a reference ground.
In some embodiments, the low frequency signal transmission path is used to transmit a direct current signal.
In some embodiments, the radio frequency signal transmission path comprises: 2 differential radio frequency signal transmission paths arranged at intervals are arranged on the same layer.
In some embodiments, further comprising at least one of: the differential amplifier is respectively electrically connected with one end of each of the two differential radio-frequency signal transmission paths, and is used for receiving the radio-frequency signals transmitted by the differential radio-frequency signal transmission paths and carrying out differential amplification processing on the radio-frequency signals; and the voltage transformation coupler is respectively connected with the other ends of the two differential radio frequency signal transmission paths, is also respectively electrically connected with the signal input end and the signal output end of the low-frequency signal transmission path, and is used for receiving the signals subjected to differential amplification processing by the differential amplifier.
In some embodiments, the shielding structure includes a middle region and side regions located at both sides of the middle region, a side surface of the shielding structure of the side regions is higher than a side surface of the shielding structure of the middle region in a direction toward the radio frequency signal transmission path, and a top surface of the shielding structure of the side regions is coupled to the reference ground.
In some embodiments, the shielding structure comprises: the shielding structure comprises a plurality of sub-shielding structures which are arranged at intervals along the extension direction of a radio frequency signal transmission path, and two ends of each sub-shielding structure are respectively coupled with a reference ground.
In some embodiments, the shielding structure is a continuous film layer, and the shielding structure further has a plurality of hollow structures.
In some embodiments, the low frequency signal transmission path comprises: the shielding structure is positioned in a space surrounded by the first transmission path and the second transmission path.
In some embodiments, the low frequency signal transmission path includes a low frequency signal transmission layer, the material of the low frequency signal transmission layer including a metal.
In some embodiments, the rf signal transmission path has a first meander structure disposed in a meander shape within a same layer, and the reference ground has a second meander structure disposed in a meander shape within a same layer.
In some embodiments, the low frequency signal transmission path comprises: the first transmission path and the second transmission path are positioned on different layers, the second transmission paths are positioned on two sides of the first transmission path and are positioned between the second transmission path and the radio frequency signal transmission path in a reference manner, and at least one second transmission path is provided with a third bending structure which is arranged in the same layer and is distributed along the second bending structure.
In some embodiments, the first transmission path is linear, and the shielding structure is located between the first transmission path and the radio frequency signal transmission path.
In some embodiments, shielding structures are disposed on two sides of the rf signal transmission path in a first direction, so as to dispose the low-frequency signal transmission path in a staggered manner on any side of the rf signal transmission path, where the first direction is a direction in which the rf signal transmission path points to the low-frequency signal transmission path.
In some embodiments, further comprising: and the signal transmitter is used for generating a radio frequency signal and transmitting the radio frequency signal to the transmitting antenna through the radio frequency signal transmission path.
In some embodiments, the signal transmitter comprises: the local oscillator circuit is electrically connected with the drive amplifying circuit through a radio frequency signal transmission path, and/or the signal transmitting end is electrically connected with the drive amplifying circuit through a radio frequency signal transmission path.
Correspondingly, the utility model also provides a radio device, include: the radio frequency chip and the antenna are arranged on the substrate, the radio frequency chip is electrically connected with the antenna, and the radio frequency signal is used for receiving the radio frequency signal from the antenna or transmitting the radio frequency signal to the antenna.
Correspondingly, the utility model also provides an electronic equipment, include: the above radio device, the radio device, is used for performing object detection or communication.
The utility model provides a technical scheme has following advantage at least:
in the technical scheme of the semiconductor packaging structure provided by the utility model, a radio frequency signal transmission path and reference grounds positioned at two sides of the radio frequency signal transmission path are arranged as transmission lines of coplanar waveguides; the low-frequency signal transmission path and the radio-frequency signal transmission path are arranged in a staggered mode, in addition, the shielding structure is arranged between the low-frequency signal transmission path and the radio-frequency signal transmission path and coupled with a reference ground, and due to the limiting effect of the shielding structure on an electric field, the low-frequency signal transmitted in the low-frequency signal transmission path cannot influence the electric field distribution of the coplanar waveguide. That is to say, because the shielding structure is arranged, when the layout of the radio frequency chip is carried out, a low-frequency signal transmission path does not need to be arranged to bypass the layout of the radio frequency signal transmission path, the complexity of the layout design can be reduced, and the space saving is facilitated. Meanwhile, due to the shielding effect of the shielding structure, the transmission performance of the coplanar waveguide can be kept unchanged.
Drawings
One or more embodiments are illustrated by corresponding figures in the drawings, which are not to be construed as limiting the embodiments, unless expressly stated otherwise, and the drawings are not to scale.
Fig. 1 is a schematic partial structure diagram of a first radio frequency chip according to an embodiment of the present invention;
fig. 2 is a schematic partial structure diagram of a second radio frequency chip according to an embodiment of the present invention;
fig. 3 is a schematic partial structure diagram of a third rf chip according to an embodiment of the present invention;
fig. 4 is a schematic top view of a partial structure of a third rf chip according to an embodiment of the present invention;
fig. 5 is a schematic partial structure diagram of a fourth rf chip according to an embodiment of the present invention;
fig. 6 is a schematic partial structure diagram of a fifth rf chip according to an embodiment of the present invention;
fig. 7 is a schematic top view of a partial structure of a sixth rf chip according to an embodiment of the present invention;
fig. 8 is a schematic top view of a partial structure of a seventh radio frequency chip according to an embodiment of the present invention;
fig. 9 is a schematic top view of a partial structure of an eighth radio frequency chip according to an embodiment of the present invention.
Detailed Description
As can be seen from the background art, at present, when the coplanar waveguide is used as a transmission line in a radio frequency chip, the layout design is complicated when the radio frequency chip is actually manufactured.
Analysis finds that one reason why layout design is complex when actually manufacturing a radio frequency chip is that the coplanar waveguide, as a form of a transmission line, is composed of a radio frequency signal transmission path for transmitting a signal and a pair of reference grounds at both sides of the radio frequency signal transmission path. Currently, in chip design, a low-frequency signal transmission path is required to transmit a low-frequency signal to each element in the rf chip. Wherein the frequency of the low-frequency signal is approximately in the range of 0Hz to MHz magnitude. For example, dc signals may need to be sent to the modules or systems to provide dc bias. Considering the complexity of layout design and the need to improve the integration level of the rf chip, it is usually necessary to arrange a low-frequency signal transmission path across the rf signal transmission path, however, the crossed low-frequency signal transmission path may affect the electromagnetic field distribution around the coplanar waveguide, thereby affecting the transmission performance of the coplanar waveguide. Therefore, in the actual layout design, only the low-frequency signal transmission path can be designed to bypass the radio-frequency signal transmission path, which undoubtedly increases the complexity of the layout design.
The utility model provides a well radio frequency chip sets up low frequency signal transmission path and the wrong layer setting of radio frequency signal transmission path, still sets up shielding structure and is located between low frequency signal transmission path and the radio frequency signal transmission path, and shielding structure and reference ground are coupled. Due to the limiting effect of the shielding structure on the electric field, the low-frequency signal transmitted in the low-frequency signal transmission path cannot influence the electric field distribution of the coplanar waveguide. That is to say, because the shielding structure is arranged, when the layout of the radio frequency chip is carried out, a low-frequency signal transmission path does not need to be arranged to bypass the layout of the radio frequency signal transmission path, the complexity of the layout design is reduced, and the space saving is facilitated.
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in the various embodiments of the invention, numerous technical details are set forth in order to provide a better understanding of the invention. However, the claimed invention can be practiced without these specific details and with various changes and modifications based on the following embodiments.
Fig. 1 is a schematic diagram of a partial structure of a radio frequency chip according to an embodiment of the present invention.
Referring to fig. 1, the radio frequency chip includes: the radio frequency signal transmission system comprises a radio frequency signal transmission path 101 and reference grounds 102 positioned at two sides of the radio frequency signal transmission path 101, wherein the radio frequency signal transmission path 101 and the reference grounds 102 extend towards the same direction, the radio frequency signal transmission path 101 and the reference grounds 102 are arranged on the same layer, and the radio frequency signal transmission path 101 is used for transmitting radio frequency signals; a low-frequency signal transmission path 103, wherein the low-frequency signal transmission path 103 and the radio-frequency signal transmission path 101 are arranged in a staggered manner; a shielding structure 104, the shielding structure 104 is located between the low frequency signal transmission path 103 and the radio frequency signal transmission path 101, and the shielding structure 104 is coupled to the reference ground 102.
The rf signal transmission path 101 and the reference ground 102 are disposed on the same geometric plane, and in some embodiments, the rf signal transmission path 101 and the reference ground 102 may be disposed on a surface of a dielectric substrate or a surface of a circuit board. The radio frequency signal transmission path 101 and the reference ground 102 provided on the same layer constitute a coplanar waveguide which can be used as a transmission line and transmits a radio frequency signal in the form of a millimeter wave.
The radio frequency signal transmission path 101 is used for transmitting a radio frequency signal, and the radio frequency signal has a high frequency, so that a strong radiation effect is provided, so that the radio frequency signal transmitted in the radio frequency signal transmission path 101 emits a long ray, when the low frequency signal transmission path 103 crosses the radio frequency signal transmission path 101, because the low frequency signal transmission path 103 and the radio frequency signal transmission path 101 are crossed with each other, electromagnetic waves radiated from the radio frequency signal transmission path 101 and electromagnetic waves radiated from the low frequency signal transmitted in the low frequency signal transmission path 103 interfere with each other, so that electromagnetic field distribution around the radio frequency signal transmission path 101 can be changed, and the signal transmission performance of the coplanar waveguide is affected. Based on this, the shielding structure 104 is disposed between the radio frequency signal transmission path 101 and the low frequency signal transmission path 103, and the shielding structure 104 plays a role of limiting an electromagnetic field, so that mutual interference between rays radiated from the radio frequency signal transmission path 101 and rays radiated from the low frequency signal transmission path 103 is not generated. In some embodiments, when the radio frequency signal transmission path 101 is located on a surface of a dielectric layer, the low frequency signal transmission path 103 may be located on a side of the dielectric layer away from the radio frequency signal transmission path 101, i.e., there may be a dielectric layer between the low frequency signal transmission path 103 and the radio frequency signal transmission path 101.
The reference ground 102 is used for connecting with the ground terminal, and the reference ground 102 can also play a role of shielding, because when the reference ground 102 is grounded, the charges can be discharged to the ground, and since no charges exist, no electric field is generated, and thus the reference ground 102 can play a role of shielding the electric field of the charges. Therefore, when the reference ground 102 is located at both sides of the radio frequency signal transmission path 101, an electromagnetic field formed at both sides of the radio frequency signal transmission path 101 can be shielded, so that both sides of the radio frequency signal transmission path 101 can be protected from an external signal. Based on this, the shielding structure 104 is disposed to be connected to the reference ground 102, and when the shielding structure 104 is connected to the reference ground 102, it may also be a part of the reference ground 102 to some extent, that is, the charges in the electromagnetic field may be transmitted to the reference ground 102 via the shielding structure 104, so as to be discharged to the ground, thereby playing a shielding role.
Referring to fig. 1, in some embodiments, low frequency signal transmission path 103 crosses at least radio frequency signal transmission path 101 in a direction pointing along radio frequency signal transmission path 101 towards reference ground 102. Specifically, the low-frequency signal transmission path 103 may cross the radio-frequency signal transmission path 101 and the reference ground 102, and the reference ground 102 exposes a surface of the radio-frequency signal transmission path 101, thereby facilitating leading out the low-frequency signal transmitted in the radio-frequency signal transmission path 101. In some embodiments, the low frequency signal transmission path 103 may cross the bottom side of the radio frequency signal transmission path 101. Referring to fig. 2, in other embodiments, the low frequency signal transmission path 103 may also cross the top surface side of the radio frequency signal transmission path 101. The utility model discloses do not restrict the specific position that low frequency signal transmission path 103 is located radio frequency signal transmission path 101, only need satisfy low frequency signal transmission path 103 and span radio frequency signal transmission path 101, and shielding structure 104 be located between low frequency signal transmission path 103 and the radio frequency signal transmission path 101 can.
In some embodiments, the low frequency signal transmission path 103 is used to transmit a direct current signal. That is, the low frequency signaling path 103 may be used as a dc line that may deliver current to other modules or systems in the rf chip to provide dc bias. Due to the arrangement of the shielding structure 104, even when the direct current line crosses the radio frequency signal transmission path 101, mutual interference between the direct current signal flowing through the direct current line and the radio frequency signal flowing through the radio frequency signal transmission path 101 cannot be generated based on the limiting effect of the shielding structure 104, so that the normal transmission performance of the coplanar waveguide is maintained, and the layout design is greatly simplified. And because the radio frequency signal transmission path 101 does not need to be bypassed, the space is saved, and the integration level of the radio frequency chip is improved.
In some embodiments, the low frequency signal transmission path comprises: the antenna comprises a first transmission path 11 and a second transmission path 12 which are positioned at different layers, wherein the second transmission path 12 is positioned at two sides of the first transmission path 11, the first transmission path 11 is electrically connected with the second transmission path 12, and a shielding structure 104 is positioned in a space enclosed by the first transmission path 11 and the second transmission path 12. Specifically, the first transmission path 11 and the second transmission path 12 respectively connect to two side regions of the first transmission path 11 opposite to each other along the second direction, the first transmission path 11 is located between the rf signal transmission path 101 and the shielding structure 104, the second transmission path 12 is located on two sides of the shielding structure 104, and the second direction is a direction in which the rf signal transmission path 101 points to the reference ground 102. It can be understood that, in consideration of the difficulty of the process for actually manufacturing the low-frequency signal transmission path 103, the low-frequency signal transmission path 103 is divided into a first transmission path 11 and a second transmission path 12, where the first transmission path 11 is disposed opposite to the radio-frequency signal transmission path 101, and the shielding structure 104 is located on a side of the first transmission path 11 facing the radio-frequency signal transmission path 101, so that the shielding structure 104 can shield the electromagnetic field of the first transmission path 11 and prevent the transmission layer from generating electrical interference. The second transmission path 12 is disposed at two sides of the shielding structure 104, that is, the second transmission path 12 and the first transmission path 11 are disposed at different layers, which is beneficial to simplifying the process difficulty of actually preparing the low-frequency signal transmission path 103. The second transmission path 12 is not directly opposite to the rf signal transmission path 101, so the second transmission path 12 does not interfere with the rf signal transmission path 101. In some embodiments, the second transmission path 12 on one side of the first transmission path 11 may be configured to be a positive electrode for dc transmission, the second transmission path 12 on the other side of the first transmission path 11 may be configured to be a negative electrode for dc transmission, and the first transmission path 11 and the second transmission path 12 are respectively connected to two positive and negative electrodes of other modules or systems for providing dc bias.
It should be noted that although the first transmission path 11 and the second transmission path 12 are disposed on different layers, both the first transmission path 11 and the second transmission path 12 function to transmit low-frequency signals, such as dc signals, and therefore, the materials of the first transmission path 11 and the second transmission path 12 may be set to be the same, so that the transmission capacities of the first transmission path 11 and the second transmission path 12 for the low-frequency signals are the same.
In other embodiments, the first transmission path 11 and the second transmission path 12 may be disposed on the same layer.
In some embodiments, the low frequency signal transmission path 103 includes a low frequency signal transmission layer, the material of which may include a metal, for example, which may be either copper or aluminum. Since metal has excellent conductivity, the material of the low-frequency signal transmission path 103 is made of metal, which can increase the transmission rate of the low-frequency signal transmission path 103 for low-frequency signals.
In some embodiments, the shielding structure 104 includes a middle region and side regions located at two sides of the middle region, a side surface of the shielding structure 104 of the side regions is higher than a side surface of the shielding structure 104 of the middle region in a direction toward the radio frequency signal transmission path 101, and a top surface of the shielding structure 104 of the side regions is coupled to the reference ground 102. That is to say, the middle region of the shielding structure 104 is recessed relative to the side region, and the rf signal transmission path 101 is opposite to the middle region of the shielding structure 104, which is equivalent to that the shielding structure 104 forms a structure similar to "wrapping" for the rf signal transmission path 101, so that the higher sides of the two sides of the shielding structure 104 can also shield the electric field around the rf signal transmission path 101, and further prevent the interference of the external signal to the rf signal transmission path 101. On the other hand, the top surface of the shielding structure 104 with the side edge region is coupled to the reference ground 102, so that the distance between the reference ground 102 and the bottom surface of the shielding structure 104 is relatively large, and thus, when the second transmission path 12 is located on both sides of the shielding structure 104, the problem of electrical interference caused by the contact between the reference ground 102 and the second transmission path 12 can be prevented, which is beneficial to improving the reliability of the rf chip.
Referring to fig. 1 and 2, in some embodiments, the shielding structure 104 includes: a plurality of sub-shielding structures are arranged at intervals along the extending direction of the rf signal transmission path 101, and two ends of each sub-shielding structure are respectively coupled to the reference ground 102, so that each sub-shielding structure can transmit the electromagnetic field to the reference ground 102, and then discharge the charges to the ground through the reference ground 102. That is, there is a gap between two adjacent sub-shielding structures, and this gap can be used for verifying the chip. Moreover, compared with the structure in which the shielding structure 104 is fully paved, the sub-shielding structure arranged at multiple intervals can save the material for forming the shielding structure 104, thereby being beneficial to saving the cost. It is understood that, in some embodiments, when a plurality of sub-shielding structures are disposed at intervals, the first transmission path 11 opposite to the radio frequency signal transmission path 101 may also be formed by a plurality of sub-transmission layers disposed at intervals, and each sub-transmission layer is opposite to a sub-shielding structure, so that the electromagnetic field around each sub-transmission layer can be limited by the corresponding sub-shielding structure.
Referring to fig. 3 and fig. 4, in other embodiments, the shielding structure 104 is a continuous film layer, and the shielding structure 104 further has a plurality of hollow structures 18. That is, the shielding structure 104 is an integral film layer, so that only one continuous film layer needs to be formed as the shielding structure 104 in the process step of actually preparing the shielding structure 104, which is beneficial to simplifying the process step of forming the shielding structure 104. The shielding structure 104 further has a plurality of hollow structures 18 therein, and the hollow structures 18 are configured for passing chip verification. The specific arrangement of the hollow structures 18 is not limited, and it is only necessary that each hollow structure 18 penetrates through the shielding structure 104.
It is understood that, whether the shielding structure 104 is a plurality of sub-shielding structures arranged at intervals or a continuous film layer, the shielding structure 104 in the side region is higher than the shielding structure 104 in the middle region.
In some embodiments, the material of the shielding structure 104 is metal, and the metal has a better charge transport capability, and when both ends of the shielding structure 104 are grounded, the metal can better transport the charge transport in the electric field to the reference ground 102, so as to realize the discharge of the charge, thereby playing a shielding role. In addition, metal has the advantage of low cost, and the cost of the whole radio frequency chip can be reduced by adopting metal as the shielding structure 104. Specifically, in some embodiments, the material of the shielding structure 104 may be any one of copper or aluminum.
Referring to fig. 5, in some embodiments, shielding structures are disposed on both sides of the rf signal transmission path 101 (see fig. 1) in a first direction, so as to dispose the low-frequency signal transmission path on either side of the rf signal transmission path 101 in a staggered manner, where the first direction is a direction in which the rf signal transmission path 101 points to the low-frequency signal transmission path 103. That is to say, the number of the shielding structures 104 and the number of the low frequency signal transmission paths 103 are 2,2, and the low frequency signal transmission paths 103 are respectively located at two opposite sides of the radio frequency signal transmission path 101, and 2 shielding structures 104 are respectively located between the low frequency signal transmission paths 103 and the radio frequency signal transmission path 101. Specifically, the 2 low-frequency signal transmission paths 103 may be referred to as a first low-frequency signal transmission path 103 and a second low-frequency signal transmission path 103, respectively, and the 2 shielding structures 104 may be referred to as a first shielding structure 104 and a second shielding structure 104, respectively. Wherein the first low-frequency signal transmission path 103 crosses the top surface of the radio-frequency signal transmission path 101, and the first shielding structure 104 is located between the first low-frequency signal transmission path 103 and the radio-frequency signal transmission path 101; the second low-frequency signal transmission path 103 crosses the bottom surface of the rf signal transmission path 101, and the second shielding structure 104 is located between the second rf signal transmission path 101 and the rf signal transmission path 101. That is to say, due to the arrangement of the shielding structure 104, the low-frequency signal transmission path 103 can simultaneously cross over two opposite sides of the radio-frequency signal transmission path 101, so that complexity of layout design can be further reduced, and the first low-frequency signal transmission path 103 and the second low-frequency signal transmission path 103 can both be used for transmitting direct current, which is beneficial to further saving space.
In some embodiments, the first low-frequency signal transmission path 103 and the second low-frequency signal transmission path 103 may also be electrically connected, that is, two low-frequency signal transmission paths 103 located on two opposite sides of the radio-frequency signal transmission path 101 are combined into one, so that the combined low-frequency signal transmission path 103 has a stronger conductive capability, and therefore, yajiang from the input end of the low-frequency signal transmission path 103 to the output end of the low-frequency signal transmission path 103 may be smaller, which is beneficial to improving the transmission performance of the low-frequency signal. Specifically, both ends of the first low-frequency signal transmission path 103 may be connected to both ends of the second low-frequency signal transmission path 103, respectively, so that the thickness of the connected low-frequency signal transmission path 103 is made larger, and therefore, a smaller resistance may be achieved.
Referring to fig. 6, in some embodiments, the radio frequency signal transmission path 101 includes: 2 differential radio frequency signal transmission paths 13 arranged at intervals, wherein the differential radio frequency signal transmission paths 13 are arranged in the same layer. When the rf signal flows through the two differential rf signal transmission paths 13, a pair of symmetric signals with equal magnitude and opposite polarity, i.e., differential signals, can be formed. Even though the differential signal may encounter an external interference signal during transmission, since the two differential rf signal transmission paths 13 are always together and the interference signal generally acts on the two differential rf signal transmission paths 13 at the same time, a common mode signal with equal magnitude is formed and is superimposed on the two differential rf signal transmission paths 13. And because the differential amplifier is only sensitive to the differential signal, when the differential amplifier detects the differential signal, the differential amplifier can inhibit the common-mode signal, so that the differentially transmitted signal has stronger anti-interference capability. Further, since the difference amplifier amplifies only the difference between the differential signals transmitted in the two differential radio frequency signal transmission paths 13, the performance of the differential amplifier is not affected even if the voltage biases supplied to the positive and negative electrodes of the differential amplifier are asymmetrical.
In some embodiments, the 2 rf signal transmission paths 101 are symmetrically arranged, that is, the distances from the 2 rf signal transmission paths 101 to the reference grounds 102 on both sides are equal. And the lengths of the 2 radio frequency signal transmission paths 101 are equal, so that the time delays of the differential signals can be the same, and the time sequence requirement can be met.
Referring to fig. 7, in some embodiments, further comprising: the differential amplifier 105 is electrically connected with one end of each of the two differential radio frequency signal transmission paths 13, and is used for receiving the radio frequency signals transmitted through the differential radio frequency signal transmission paths 13 and performing differential amplification processing on the radio frequency signals; the transformer coupler 106, the transformer coupler 106 is respectively connected to the other ends of the two differential rf signal transmission paths 13, the transformer coupler 106 is also respectively electrically connected to the signal input end and the signal output end of the low frequency signal transmission path 103, and the transformer coupler 106 is configured to receive the rf signal after being differentially amplified by the differential amplifier 105. Specifically, the differential amplifier 105 has two input terminals, which are electrically connected to the two differential rf signal transmission paths 13, respectively, to receive the difference value of the differential signals transmitted in the two differential rf signal transmission paths 13 and amplify the difference value of the differential signals. Specifically, the differential amplifier 105 gain-amplifies the differential signal by increasing the power of the differential signal to make the differential signal meet the demand. Meanwhile, compared with a transmission line, the area of the second transmission path 12 for transmitting the direct current is larger, so that the second transmission paths 12 on both sides are directly connected in a large area, and the potential difference on both sides of the differential radio frequency signal transmission path 13 is greatly reduced, so that the differential amplifier 105 has better symmetry, and the performance of the differential amplifier 105 is further improved.
The two input ends of the transformer coupler 106 are respectively connected to the two differential rf signal transmission paths 13, and are used for receiving the rf signals from the differential rf signal transmission paths 13, and the transformer coupler 106 is further electrically connected to the second transmission paths 12 located at two sides of the first transmission path 11. The two second transmission paths 12 are respectively used for providing positive and negative voltage biases for the transformer coupler 106. It is understood that the rf signal received by the transformer coupler 106 is a differential signal amplified by the differential amplifier 105, the differential signal differentially amplified by the differential amplifier 105 can be combined into a complete rf signal after passing through the transformer coupler 106, and then the transformer coupler 106 can transmit the complete rf signal to the antenna. It will be appreciated that the transformer coupler 106 may also be used to receive radio frequency signals from an antenna.
In some embodiments, the rf chip is a radar sensor chip, the rf chip further comprising: and the signal transmitter is used for generating a radio frequency signal and transmitting the radio frequency signal to the transmitting antenna through the radio frequency signal transmission path. Specifically, in some embodiments, the signal transmitter comprises: the local oscillator circuit is electrically connected with the driving amplification circuit through a radio frequency signal transmission path 101, and/or the signal transmitting end is electrically connected with the driving amplification circuit through the radio frequency signal transmission path 101. The local oscillation signal is used for generating a radio frequency signal, the radio frequency signal is transmitted to the driving amplifying circuit through the radio frequency signal transmission path 101 to be amplified so as to meet the power requirement of the signal receiver on the echo signal, and the signal transmitting end is used for receiving the radio frequency signal amplified by the driving amplifying circuit and sending the radio frequency signal to the antenna. The radio frequency signal is converted into electromagnetic wave through the antenna and radiated to the free space, and when the electromagnetic wave is reflected by an object, an echo signal is formed.
Referring to fig. 8, in some embodiments, the rf signal transmission path 101 has a first meander structure disposed in a meander shape in a same layer, and the reference ground 102 has a second meander structure disposed in a meander shape in a same layer. Specifically, the radio frequency signal transmission path 101 (refer to fig. 6) may include: a first straight portion 107 and at least one first bent portion 108, wherein the first bent portion 108 is connected to one end of the first straight portion 107, and the first bent portion 108 is bent toward the first straight portion 107; the reference ground 102 includes: at least one second bent portion 110 and a second straight portion 109, the second bent portion 110 is opposite to the first bent portion 108, and the second straight portion 109 is opposite to the first straight portion 107, that is, the layout direction of the reference ground 102 is the same as the layout direction of the rf signal transmission path 101. On the layout, the routing of the rf signal transmission path 101 and the routing of the reference ground 102 can be flexibly set by bending the rf signal transmission path 101 and the reference ground 102, thereby further simplifying the complexity of layout design. Specifically, in some embodiments, there may be two first bending portions 108 and two second bending portions 110, the two first bending portions 108 are respectively connected to one end of the first straight portion 107, and the two second bending portions 110 are respectively connected to one end of the second straight portion 109, that is, both ends of the rf signal transmission path 101 and the reference ground 102 are designed to be bent. In other embodiments, only one of the first bending portion 108 and the second bending portion 110 may be provided, that is, one end of the rf signal transmission path 101 and one end of the reference ground 102 are designed to be bent, and the other end of the rf signal transmission path 101 and the other end of the reference ground 102 still remain a straight structure. It can be understood that, no matter how many the first bending part 108 and the second bending part 110 are, the rf signal transmission path 101 and the reference ground 102 are always disposed opposite to each other, so that the reference ground 102 can shield both sides of the rf signal transmission path 101 from electromagnetic field, and prevent external signals from interfering with the rf signal transmission path 101. It should be noted that, the present invention does not limit the specific bending shape of the first bending portion 108 and the second bending portion 110, and the shapes of the first bending portion 108 and the second bending portion 110 can be set according to the requirement of the actual layout design.
In some embodiments, the low frequency signal transmission path 103 includes: the first transmission path 11 and the second transmission path 12 are located at different layers, the second transmission path 12 is located at two sides of the first transmission path 11, the reference ground 102 is located between the second transmission path 12 and the rf signal transmission path 101, and at least one of the second transmission paths 12 has a third bending structure disposed in the same layer and distributed along the second bending structure. Specifically, the at least one second transmission path 12 includes: the third straight portion 111 and at least one third bent portion 112, the third bent portion 112 is connected to one end of the third straight portion 111, the third bent portion 112 is bent with respect to the third straight portion 111, the first bent portion 108 and the second bent portion 110 are opposite to at least part of the third bent portion 112, and the first straight portion 107 and the second straight portion 109 are opposite to at least part of the third straight portion 111. When the low-frequency signal transmission path 103 is composed of the first transmission path 11 and the second transmission path 12, the second transmission path 12 located on both sides of the shielding structure 104 may be arranged to bend along with the bending of the radio-frequency signal transmission path 101 and the reference ground 102. This is because the second transmission path 12 is located on both sides of the shielding structure 104, not directly opposite to the radio frequency signal transmission path 101, and therefore the second transmission path 12 does not interfere with the radio frequency signal transmission path 101. Therefore, the routing of the second transmission path 12 can be flexibly set while the transmission performance of the coplanar waveguide is not affected, so that the layout design is more flexible. Specifically, when both ends of the rf signal transmission path 101 and the reference ground 102 have the bent structure, the second transmission path 12 may include two third bent portions 112, the two third bent portions 112 are respectively connected to one end of the third straight portion 111, and the first bent portion 108 and the second bent portion 110 are disposed opposite to the third bent portion 112, so that the routing trends of the rf signal transmission path 101, the reference ground 102 and the second transmission path 12 are the same. When one of the ends of the rf signal transmission path 101 and the reference ground 102 has a bent structure, the second transmission path 12 may include a third bent portion 112, so that the routing trends of the rf signal transmission path 101, the reference ground 102 and the second transmission path 12 are the same.
Referring to fig. 9, in other embodiments, the second transmission path 12 may also include only the third linear portion 111, that is, the second transmission path 12 has a linear structure, and the third linear portion 111 is opposite to the first linear portion 107 and the second linear portion 109.
In some embodiments, the first transmission path 11 is linear, and the shielding structure 104 is located between the first transmission path 11 and the rf signal transmission path 101. When the rf signal transmission path 101 has the first bending portion 108 and the first straight portion 107, the first transmission path 11 may not have a bending structure, so that the material of the first transmission path 11 may be saved. Based on this, the shielding structure 104 only needs to be located between the first transmission path 11 and the radio frequency signal transmission path 101, so that the shielding structure 101 can function to shield the electric field of the first transmission path 11. In this way, not only the material forming the first transmission path 11 but also the material of the shielding structure 104 opposite to the first transmission path 11 can be omitted. Moreover, since the bending structure of the first transmission path 11 is omitted, the process of forming the first transmission path 11 and the shielding structure 104 can be simplified. Furthermore, since the first transmission path 11 is electrically connected to the second transmission path 12, the low-frequency signal can still flow to the second transmission path 12 through the first transmission path 11, and therefore, the transmission performance of the low-frequency signal transmission path 103 is not affected.
It is understood that in other embodiments, the first transmission path 11 may also be provided with a fourth bending structure arranged along the third bending structure of the second transmission path 12. The utility model discloses do not prescribe a limit to the concrete position of shielding structure 104, only need satisfy shielding structure 104 be located between first transmission path 11 and the radio frequency signal transmission path 101 can.
In the radio frequency chip provided in the above embodiment, the shielding structure 104 is disposed between the radio frequency signal transmission path 101 and the low frequency signal transmission path 103, and the shielding structure 104 plays a role in limiting an electromagnetic field, so that mutual interference between rays radiated from the radio frequency signal transmission path 101 and rays radiated from the low frequency signal transmission path 103 is not generated. When the layout is carried out on the radio frequency chip, a low-frequency signal transmission path does not need to be arranged to bypass the layout of the radio frequency signal transmission path, the complexity of the layout design can be reduced, and the space saving is facilitated. Meanwhile, the transmission performance of the coplanar waveguide can be kept unchanged due to the shielding effect of the shielding structure.
Accordingly, an embodiment of the present invention further provides a radio device, including: the substrate, the antenna and the radio frequency chip provided by the embodiment, the radio frequency chip and the antenna are arranged on the substrate, the radio frequency chip is electrically connected with the antenna, and the radio frequency signal is used for receiving the radio frequency signal from the antenna or transmitting the radio frequency signal to the antenna. For example, the substrate is a dielectric substrate of a chip, the antenna may be a package antenna structure or an on-chip antenna structure, and the radio device may transmit and receive radio signals through the antenna, for example, transmit and receive millimeter wave signals through the antenna.
Accordingly, an embodiment of the present invention further provides an electronic device, including: the above embodiments provide a radio device for performing object detection or communication. In some embodiments, the radio may be disposed inside the electronic device body; in other embodiments, the radio may also be provided external to the electronic device.
In an alternative embodiment, the electronic device may be a component or a product applied to fields such as smart home, transportation, smart home, consumer electronics, monitoring, industrial automation, in-cabin inspection, and health care. For example, the electronic device may be an intelligent transportation device (such as an automobile, a bicycle, a motorcycle, a ship, a subway, a train, etc.), a security device (such as a camera), a liquid level/flow rate detection device, an intelligent wearable device (such as a bracelet, glasses, etc.), an intelligent household device (such as a sweeping robot, a door lock, a television, an air conditioner, an intelligent lamp, etc.), various communication devices (such as a mobile phone, a tablet computer, etc.), and the like, and a barrier gate, an intelligent traffic indicator lamp, an intelligent indicator board, various industrial mechanical arms (or robots), and the like, and may also be various instruments for detecting vital sign parameters and various devices carrying the instruments, such as an automobile cabin detection, an indoor personnel monitoring, an intelligent medical device, a consumer electronic device, and the like.
It will be understood by those skilled in the art that the foregoing embodiments are specific examples of the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in its practical application. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention is defined by the appended claims.
Claims (18)
1. A radio frequency chip, comprising:
the radio frequency signal transmission path and the reference ground are arranged on two sides of the radio frequency signal transmission path, the radio frequency signal transmission path and the reference ground extend towards the same direction, the radio frequency signal transmission path and the reference ground are arranged on the same layer, and the radio frequency signal transmission path is used for transmitting radio frequency signals;
a low-frequency signal transmission path, the low-frequency signal transmission path and the radio-frequency signal transmission path being arranged in layers;
a shielding structure located between the low frequency signal transmission path and the radio frequency signal transmission path, the shielding structure being coupled with the reference ground.
2. The radio frequency chip according to claim 1, wherein the low frequency signal transmission path crosses at least the radio frequency signal transmission path in a direction pointing to the reference ground along the radio frequency signal transmission path.
3. The RF chip of claim 1, wherein the low frequency signal transmission path is configured to transmit a DC signal.
4. The radio frequency chip of claim 1, wherein the radio frequency signal transmission path comprises: 2 differential radio frequency signal transmission paths which are arranged at intervals are arranged on the same layer.
5. The RF chip of claim 4, further comprising at least one of:
the differential amplifiers are respectively and electrically connected with one end of each of the two differential radio-frequency signal transmission paths, and are used for receiving the radio-frequency signals transmitted by the differential radio-frequency signal transmission paths and performing differential amplification processing on the radio-frequency signals;
the transformer couplers are respectively connected with the other ends of the two differential radio frequency signal transmission paths, are respectively electrically connected with the signal input end and the signal output end of the low-frequency signal transmission path, and are used for receiving signals subjected to differential amplification processing by the differential amplifier.
6. The RF chip of claim 1, wherein the shielding structure includes a middle region and side regions located at two sides of the middle region, a side surface of the shielding structure of the side regions is higher than a side surface of the shielding structure of the middle region in a direction toward the RF signal transmission path, and the top surfaces of the shielding structures of the side regions are coupled to the reference ground.
7. The RF chip of claim 1 or 5, wherein the shielding structure comprises: and the two ends of each sub-shielding structure are respectively coupled with the reference ground.
8. The RF chip according to claim 1 or 5, wherein the shielding structure is a continuous film layer and further has a plurality of hollowed-out structures.
9. The radio frequency chip according to claim 1, wherein the low frequency signal transmission path includes: the shielding structure comprises a first transmission path and a second transmission path which are positioned at different layers, wherein the second transmission path is positioned at two sides of the first transmission path, the first transmission path is electrically connected with the second transmission path, and the shielding structure is positioned in a space surrounded by the first transmission path and the second transmission path.
10. The radio frequency chip according to claim 1 or 9, wherein the low frequency signal transmission path includes: a low frequency signal transmission layer, the material of the low frequency signal transmission layer comprising a metal.
11. The RF chip of claim 1, wherein the RF signal transmission path has a first meander structure with a meander shape disposed in a same layer, and the reference ground has a second meander structure with a meander shape disposed in a same layer.
12. The rf chip of claim 11, wherein the low frequency signal transmission path comprises: the first transmission path and the second transmission path are located in different layers, the second transmission path is located on two sides of the first transmission path, the reference position is located between the second transmission path and the radio frequency signal transmission path, and at least one of the second transmission paths has a third bending structure which is arranged in the same layer and is distributed along the second bending structure.
13. The rf chip of claim 12, wherein the first transmission path is linear, and the shielding structure is located between the first transmission path and the rf signal transmission path.
14. The rf chip according to claim 1 or 3, wherein the shielding structures are disposed on both sides of the rf signal transmission path in a first direction, so as to dispose low-frequency signal transmission paths on either side of the rf signal transmission path in staggered layers, and the first direction is a direction in which the rf signal transmission path points to the low-frequency signal transmission path.
15. The radio frequency chip of claim 1, further comprising: and the signal transmitter is used for generating the radio-frequency signal and transmitting the radio-frequency signal to a transmitting antenna through the radio-frequency signal transmission path.
16. The radio frequency chip of claim 1, wherein the signal transmitter comprises: the local oscillator circuit is electrically connected with the drive amplifying circuit through the radio frequency signal transmission path, and/or the signal transmitting end is electrically connected with the drive amplifying circuit through the radio frequency signal transmission path.
17. A radio device, comprising: a substrate, an antenna, and the rf chip of any one of claims 1 to 16, wherein the rf chip and the antenna are disposed on the substrate, the rf chip is electrically connected to the antenna, and the rf signal is used to receive the rf signal from the antenna or transmit the rf signal to the antenna.
18. An electronic device, comprising: the radio device of claim 17, the radio device to perform object detection or communication.
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|---|---|---|---|
| CN202221767455.2U CN217849428U (en) | 2022-07-08 | 2022-07-08 | Radio frequency chip, radio device and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202221767455.2U CN217849428U (en) | 2022-07-08 | 2022-07-08 | Radio frequency chip, radio device and electronic equipment |
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| CN217849428U true CN217849428U (en) | 2022-11-18 |
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