CN217847944U - High-density lead frame - Google Patents
High-density lead frame Download PDFInfo
- Publication number
- CN217847944U CN217847944U CN202221957544.3U CN202221957544U CN217847944U CN 217847944 U CN217847944 U CN 217847944U CN 202221957544 U CN202221957544 U CN 202221957544U CN 217847944 U CN217847944 U CN 217847944U
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- China
- Prior art keywords
- pin frame
- water storage
- storage shell
- lead frame
- frame
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Abstract
The utility model discloses a pin frame of high density relates to pin frame technical field. This high-density pin frame, including pin frame, water storage shell and buffer gear, the cavity has been opened to the pin frame front side, fixed mounting has heat absorption silica gel in the cavity, the rear side inner wall fixed mounting of heat absorption silica gel has the heat dissipation water tank, the equal fixed mounting in top and the bottom of pin frame has the installation piece, the mounting hole has been seted up on the installation piece, the water storage shell sets up in pin frame's front side, the front side of water storage shell is provided with miniature pump, buffer gear's quantity is four groups and all sets up in one side of pin frame, buffer gear has the buffering effect when making the pin frame installation. This high density's lead frame, the convenient pin frame with the water-cooling mode carries out the cooling process, has avoided the higher condition of installing the chip on the lead frame with the temperature conduction of lead frame self heat, and has good buffering effect when the pin frame is installed.
Description
Technical Field
The utility model relates to a pin frame technical field, in particular to pin frame.
Background
The lead frame belongs to one of electronic components, and the heat dissipation effect of the lead frame of the existing part is poor, which easily causes the chip mounted on the lead frame to generate high temperature, and the lead frame is generally mounted by using screws, but once the lead frame is mounted too tightly, the lead frame is easily crushed, so that the improvement treatment is urgently needed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to solve one of the technical problem that exists among the prior art at least, provide a high density's pin frame, can solve the relatively poor and installation problem that leads to pin frame to be crushed easily when tension.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-density pin frame, including pin frame, water storage shell and buffer gear, the cavity has been opened to the pin frame front side, fixed mounting has heat absorption silica gel in the cavity, the rear side inner wall fixed mounting of heat absorption silica gel has heat dissipation water tank, the equal fixed mounting in top and bottom of pin frame has the installation piece, the mounting hole has been seted up on the installation piece, the water storage shell sets up in pin frame's front side, the front side of water storage shell is provided with miniature pump, buffer gear's quantity is four groups and all sets up in one side of pin frame, buffer gear has the buffering effect when making the pin frame installation.
Preferably, the number of the mounting pieces is four and the mounting pieces are arranged in a rectangular shape, and a rubber gasket is fixedly mounted on the other side of each mounting piece.
Preferably, the outer walls of the two sides of the water storage shell are fixedly provided with two groups of sheet-shaped plates, screws are arranged on the sheet-shaped plates, and the screws penetrate through the sheet-shaped plates and are in threaded connection with the pin frame, so that the water storage shell can be conveniently detached.
Preferably, the input end of the micro water pump is fixedly connected with a suction pipe, one end of the suction pipe extends into the water storage shell, the output end of the micro water pump is fixedly connected with a water outlet pipe, one end of the water outlet pipe penetrates through the water storage shell and extends into the heat dissipation water tank, and a return pipe is fixedly arranged between the heat dissipation water tank and the water storage shell.
Preferably, the front side fixed mounting of water storage shell has the protection casing, and the front side of water storage shell is opened and is equipped with in leading the temperature vent and its inner wall fixed mounting has the heat dissipation aluminum sheet, conveniently derives the inside heat of water storage shell.
Preferably, the miniature pump is located the inside of protection casing, and the front side of protection casing is provided with the apron, is provided with the screw on the apron, and the screw passes the apron and with protection casing threaded connection for conveniently maintain the miniature pump after dismantling the apron.
Preferably, buffer gear is including fixed block, nest block, soft cushion, slide and spring, and fixed block fixed mounting has seted up notch and cavity in one side of pin frame, the opposite side of nest block, and slide slidable mounting is in the cavity, the fixed block pass the notch and with slide fixed connection, spring fixed mounting is between slide and cavity, soft cushion fixed mounting is in one side of nest block.
Compared with the prior art, the beneficial effects of the utility model are that:
this high density's pin frame, setting through the heat absorption silica gel, be convenient for adsorb the heat of itself on the pin frame, and then be convenient for follow-up cooling treatment with it, through the heat dissipation water tank, the water storage shell, micro-water pump and heat dissipation aluminum sheet's cooperation is used, conveniently carry out the heat dissipation treatment with heat absorption silica gel and pin frame with water-cooled mode, avoided pin frame heat itself higher with the temperature conduction to the condition of installing the chip on pin frame, and then the effectual practicality that improves this pin frame, through the fixed block, the cover stock, the cushion, the cooperation of slide and spring is used, good buffering effect has when making pin frame install, it leads to its condition of being crushed to have reduced the too tight pin frame installation, and then the effectual use reliability who strengthens this pin frame.
Drawings
The invention will be further described with reference to the following figures and examples:
fig. 1 is a cross-sectional view of the present invention;
FIG. 2 is an enlarged view of part A of the present invention;
FIG. 3 is a schematic view of the micro water pump according to the present invention;
fig. 4 is a partial front view of the present invention.
Reference numerals are as follows: 1. a lead frame; 2. heat absorbing silica gel; 3. a heat radiation water tank; 4. mounting a sheet; 5. a buffer mechanism; 51. a fixed block; 52. sleeving blocks; 53. a soft rubber cushion; 54. a slide plate; 55. a spring; 6. a water storage shell; 7. a micro water pump; 8. radiating aluminum sheets; 9. a shield.
Detailed Description
This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a high-density pin frame, including pin frame 1, water storage shell 6 and buffer gear 5, the cavity has been opened to pin frame 1 front side, fixed mounting has heat absorption silica gel 2 in the cavity, the rear side inner wall fixed mounting of heat absorption silica gel 2 has heat radiation water tank 3, the equal fixed mounting in top and the bottom of pin frame 1 has installation piece 4, the mounting hole has been seted up on the installation piece 4, water storage shell 6 sets up in pin frame 1's front side, water storage shell 6's front side is provided with micro water pump 7, buffer gear 5's quantity is four groups and all sets up in one side of pin frame 1, buffer gear 5 has the buffering effect when making pin frame 1 install.
The mounting pieces 4 are arranged in four groups and are rectangular, the other side of the mounting piece 4 is fixedly provided with a rubber gasket, the outer walls of two sides of the water storage shell 6 are fixedly provided with two groups of plate-shaped plates, the plate-shaped plates are provided with screws, the screws penetrate through the plate-shaped plates and are in threaded connection with the pin frame 1, the input end of the micro water pump 7 is fixedly connected with a suction pipe, one end of the suction pipe extends into the water storage shell 6, the output end of the micro water pump 7 is fixedly connected with a water outlet pipe, one end of the water outlet pipe penetrates through the water storage shell 6 and extends into the heat dissipation water tank 3, a return pipe is fixedly arranged between the heat dissipation water tank 3 and the water storage shell 6, the front side of the water storage shell 6 is fixedly provided with a protective cover 9, the front side of the water storage shell 6 is provided with a heat guide port, the inner wall of the water storage shell is fixedly provided with a heat dissipation aluminum sheet 8, when the temperature of the pin frame 1 is higher, the heat absorption silica gel 2 automatically absorbs heat, and the heat dissipation water tank 3 cools the heat absorption silica gel 2, immediately controlling the starting of the micro water pump 7, wherein the micro water pump 7 pumps cooling liquid which is not absorbed by heat in the water storage shell 6 through a suction pipe, then the cooling liquid is discharged into the heat dissipation water tank 3 through a water outlet pipe, the water absorbed by the heat in the heat dissipation water tank 3 is discharged into the water storage shell 6 through a return pipe, the heat dissipation aluminum sheet 8 conducts heat conduction and heat dissipation treatment on the water, so that the heat of the pin frame 1 is absorbed, the subsequent cooling treatment is facilitated, the heat absorption silica gel 2 and the pin frame 1 are conveniently conducted in a water cooling mode, the condition that the pin frame 1 conducts the temperature to a chip arranged on the pin frame 1 due to high heat is avoided, the practicability of the pin frame is effectively improved, the micro water pump 7 is positioned in the protective cover 9, a cover plate is arranged on the front side of the protective cover 9, and screws are arranged on the cover plate, the screw passes through the cover plate and is screwed with the shield 9.
The working principle is as follows: the pin frame 1 is installed by penetrating through the installation hole by using a bolt, the sleeve block 52 of the pin frame 1 automatically retracts when the pin frame is installed, then the spring 55 can automatically buffer the pin frame 1, when the temperature of the pin frame 1 is higher, the heat absorption silica gel 2 automatically absorbs heat, the heat dissipation water tank 3 cools the heat absorption silica gel 2, the micro water pump 7 is immediately controlled to be started, the micro water pump 7 pumps out the cooling liquid which is not absorbed by heat in the water storage shell 6 through a suction pipe, then the cooling liquid is discharged into the heat dissipation water tank 3 through a water outlet pipe, the water absorbed by heat in the heat dissipation water tank 3 is discharged into the water storage shell 6 through a return pipe, and the heat dissipation aluminum sheet 8 conducts heat dissipation treatment on the water.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (7)
1. A high-density lead frame, comprising:
the heat dissipation structure comprises a pin frame (1), a cavity is formed in the front side of the pin frame (1), heat absorption silica gel (2) is fixedly installed in the cavity, a heat dissipation water tank (3) is fixedly installed on the inner wall of the rear side of the heat absorption silica gel (2), installation pieces (4) are fixedly installed on the top and the bottom of the pin frame (1), and installation holes are formed in the installation pieces (4);
the water storage shell (6) is arranged on the front side of the pin frame (1), and a micro water pump (7) is arranged on the front side of the water storage shell (6);
the number of the buffer mechanisms (5) is four, the buffer mechanisms are all arranged on one side of the lead frame (1), and the buffer mechanisms (5) have a buffer effect when the lead frame (1) is installed.
2. A high-density lead frame as recited in claim 1, wherein: the quantity of installation piece (4) is four groups and is the rectangle setting, and the opposite side fixed mounting of installation piece (4) has the rubber packing ring.
3. A high-density lead frame as recited in claim 2, wherein: two groups of sheet-shaped plates are fixedly mounted on the outer walls of the two sides of the water storage shell (6), screws are arranged on the sheet-shaped plates, and the screws penetrate through the sheet-shaped plates and are in threaded connection with the pin frame (1).
4. A high-density lead frame as recited in claim 3, wherein: the water storage device is characterized in that a suction pipe is fixedly connected to the input end of the micro water pump (7), one end of the suction pipe extends into the water storage shell (6), a water outlet pipe is fixedly connected to the output end of the micro water pump (7), one end of the water outlet pipe penetrates through the water storage shell (6) and extends into the heat dissipation water tank (3), and a return pipe is fixedly installed between the heat dissipation water tank (3) and the water storage shell (6).
5. The high-density lead frame of claim 4, wherein: the front side fixed mounting of water storage shell (6) has protection casing (9), and the front side of water storage shell (6) is opened and is equipped with in leading the thermovent and its inner wall fixed mounting has heat dissipation aluminum sheet (8).
6. The high-density lead frame of claim 5, wherein: the miniature water pump (7) is located inside the protective cover (9), a cover plate is arranged on the front side of the protective cover (9), screws are arranged on the cover plate, and the screws penetrate through the cover plate and are in threaded connection with the protective cover (9).
7. The high-density lead frame of claim 6, wherein: buffer gear (5) including fixed block (51), nest block (52), soft rubber pad (53), slide (54) and spring (55), fixed block (51) fixed mounting has been seted up in one side of pin frame (1), notch and cavity have been seted up to the opposite side of nest block (52), slide (54) slidable mounting is in the cavity, fixed block (51) pass the notch and with slide (54) fixed connection, spring (55) fixed mounting is between slide (54) and cavity, soft rubber pad (53) fixed mounting is in one side of nest block (52).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221957544.3U CN217847944U (en) | 2022-07-27 | 2022-07-27 | High-density lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221957544.3U CN217847944U (en) | 2022-07-27 | 2022-07-27 | High-density lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217847944U true CN217847944U (en) | 2022-11-18 |
Family
ID=84039769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221957544.3U Active CN217847944U (en) | 2022-07-27 | 2022-07-27 | High-density lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217847944U (en) |
-
2022
- 2022-07-27 CN CN202221957544.3U patent/CN217847944U/en active Active
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