CN210295019U

CN210295019U - Conduction type heat dissipation equipment

Info

Publication number: CN210295019U
Application number: CN201921533994.8U
Authority: CN
Inventors: 桂强
Original assignee: Chaoen Intelligent Technology Suzhou Co Ltd
Current assignee: Chaoen Intelligent Technology Suzhou Co Ltd
Priority date: 2019-09-16
Filing date: 2019-09-16
Publication date: 2020-04-10
Anticipated expiration: 2029-09-16

Abstract

The utility model discloses a conduction type heat dissipation device, which comprises a shell and a heat dissipation mechanism, wherein a storage groove is formed in the shell, the heat dissipation mechanism comprises a base, the base is fixed on the inner wall of the storage groove, a fixing bolt is fixedly connected between the base and the shell, the outer side surface of the base is fixedly connected with a heat dissipation copper sheet, the outer walls at four ends of the base are fixedly connected with connecting posts, the end surfaces of the connecting posts are fixedly connected with positioning holes, and the outer side wall of the base is fixedly connected with a backing plate; through the base of design, heat dissipation copper sheet and thin copper pipe, it can't in time give off the machine outside to have solved current mainboard production heat, lead to the too high problem that the phenomenon of crashing appears of integrated circuit board temperature, the mainboard passes through the spliced pole to be fixed in the outside of base, the heat conduction that the heat dissipation copper sheet gived off mainboard CPU work to the base, the inside thin copper pipe of base is with heat evenly distributed, the base is with mainboard heat conduction to the casing outside, the heat dissipation in the mainboard working process of being convenient for is used.

Description

Conduction type heat dissipation equipment

Technical Field

The utility model belongs to the technical field of the heat dissipation, concretely relates to conduction formula heat dissipation equipment.

Background

The mainboard can produce the consumption in the use, and the consumption is big more its heat that gives off big more, and wherein mainboard CPU's consumption is the biggest, produces the most heat, and the temperature is the highest, need last for its heat dissipation cooling, guarantees the long-time normal work operation of mainboard and components and parts, and the conduction formula heat-sink equipment that appears on the market at present still has various not enough, can not satisfy the demand of production life.

Although the CPU radiator disclosed by the license bulletin No. CN 207198772U achieves improvement of heat dissipation efficiency and is convenient to detach and install, the problem that the board card is too hot and the crash phenomenon occurs due to the fact that the heat generated by the main board cannot be dissipated to the outside of the machine due to lack of heat dissipation design in a standard 2U case because the main board generates a large amount of heat when the main board is started for a long time is not solved, and therefore a conduction type heat dissipation device is proposed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a conduction formula radiator to solve the mainboard that proposes in the above-mentioned background and can produce a large amount of heats when long-time start uses, lack the heat dissipation design in the standard 2U machine case, the mainboard produces the heat and can't in time give off the machine outside, leads to the too high problem that the phenomenon of halting appears in integrated circuit board temperature.

In order to achieve the above object, the utility model provides a following technical scheme: conduction formula heat dissipation equipment, including casing and heat dissipation mechanism, the storing groove has been seted up to the inside of casing, heat dissipation mechanism includes the base, the inside inner wall in storing groove is fixed to the base, fixedly connected with fixing bolt between base and the casing, the outside fixed surface of base is connected with the heat dissipation copper sheet, the equal fixedly connected with flange of four end outer walls of base, the tip fixed surface of flange is connected with the locating hole, the outside outer wall fixedly connected with backing plate of base.

Preferably, the outer wall of the outer side of the shell is provided with a square groove, the outer wall of the end part of the base is installed inside the port of the square groove, and the outer wall of the port of the square groove is fixedly connected with an expansion plate.

Preferably, the outer wall of the end part of the expansion plate is fixedly connected with a dust cover, the outer wall of the outer side of the dust cover is fixedly connected with an interface, and the expansion plate is fixedly connected with a fixing buckle with the inner wall of the port of the square groove.

Preferably, the outer wall of the end part of the shell is fixedly connected with a fixing plate, the outer wall of the outer side of the fixing plate is provided with a fixing hole, and the surface of the outer side of the shell is provided with a heat dissipation opening.

Preferably, the inner wall of the heat dissipation opening is fixedly connected with a partition plate, a dust guard is arranged inside the port of the heat dissipation opening, and the dust guard is fixedly connected with a bearing with the inner wall of the partition plate.

Preferably, the inner side port of the heat dissipation port is fixedly connected with a limiting plate, the limiting plate is fixed at one end of the inner side of the dustproof plate, and the inside of the heat dissipation port is fixedly connected with a fan.

Preferably, a rubber band is arranged between the dust guard and the limiting plate, one end of the rubber band is fixed on the outer wall of the end part of the dust guard, and the other end of the rubber band is fixed on the surface of the outer side of the limiting plate.

Preferably, the base is provided with a containing groove inside, the inner wall of the containing groove is provided with a connecting hole, and the containing groove and the connecting hole are fixedly connected with a thin copper pipe.

Compared with the prior art, the beneficial effects of the utility model are that:

1. through the base of design, heat dissipation copper sheet and thin copper pipe, it can't in time give off the machine outside to have solved current mainboard production heat, lead to the too high problem that the phenomenon of crashing appears of integrated circuit board temperature, the mainboard passes through the spliced pole to be fixed in the outside of base, the heat conduction that the heat dissipation copper sheet gived off mainboard CPU work to the base, the inside thin copper pipe of base is with heat evenly distributed, the base is with mainboard heat conduction to the casing outside, the heat dissipation in the mainboard working process of being convenient for is used.

2. Through baffle and the dust guard of design, it has been solved current mainboard and has offered a plurality of thermovents usually in the casing outside for the heat dissipation, the thermovent leads to external impurity to get into the inside problem of polluting the mainboard of casing easily, the dust guard covers in the port outside of thermovent and with the mutual block of limiting plate, inside the dust guard prevents that external impurity from getting into the casing through the thermovent, the dust guard passes through bearing outside rotatory slope under the fan effect, the dust guard does not influence the heat dissipation of airing exhaust of the normal of thermovent.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic front view of the structure of the present invention;

FIG. 3 is a schematic diagram of the structure of the expanding plate of the present invention;

FIG. 4 is a schematic view of the base structure of the present invention;

FIG. 5 is a schematic view of the thin copper tube structure of the present invention;

FIG. 6 is a schematic view of the structure of the heat dissipation opening of the present invention;

fig. 7 is a schematic diagram of the structure of the dust guard of the present invention.

In the figure: 1. a storage tank; 2. a dust cover; 3. expanding the board; 4. a fixing plate; 5. a housing; 6. a fixing hole; 7. a heat dissipation port; 8. a square groove; 9. an interface; 10. a fixing buckle; 11. connecting columns; 12. a heat dissipation copper sheet; 13. fixing the bolt; 14. positioning holes; 15. a base plate; 16. a base; 17. a receiving groove; 18. a thin copper tube; 19. connecting holes; 20. a partition plate; 21. a dust-proof plate; 22. a fan; 23. a bearing; 24. a rubber band; 25. and a limiting plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-7, the present invention provides a technical solution: conduction formula heat dissipation equipment, including casing 5 and heat dissipation mechanism, storing groove 1 has been seted up to casing 5's inside, heat dissipation mechanism includes base 16, base 16 fixes the inside inner wall at storing groove 1, fixedly connected with fixing bolt 13 between base 16 and the casing 5, the outside fixed surface of base 16 is connected with heat dissipation copper sheet 12, the equal fixedly connected with pillar 11 of four end outer walls of base 16, the tip fixed surface of pillar 11 is connected with locating hole 14, the outside outer wall fixedly connected with backing plate 15 of base 16, the mainboard passes through pillar 11 to be fixed in the outside of base 16, heat dissipation copper sheet 12 conducts the heat that mainboard CPU work gived off to base 16, the inside thin copper pipe 18 of base 16 is with heat evenly distributed, base 16 conducts the mainboard heat to the casing 5 outside, the heat dissipation in the mainboard working process of being convenient for is used.

In order to facilitate the opening of the square groove 8, in the embodiment, preferably, the outer wall of the outer side of the shell 5 is provided with the square groove 8, the outer wall of the end portion of the base 16 is installed inside the port of the square groove 8, and the outer wall of the port of the square groove 8 is fixedly connected with the expansion plate 3.

In order to facilitate the fixing of the expansion plate 3, in this embodiment, preferably, the outer wall of the end portion of the expansion plate 3 is fixedly connected with a dust cover 2, the outer wall of the outer side of the dust cover 2 is fixedly connected with an interface 9, and the inner wall of the port of the expansion plate 3 and the square groove 8 is fixedly connected with a fixing buckle 10.

In order to facilitate the installation and fixation of the housing 5, in this embodiment, preferably, the outer wall of the end portion of the housing 5 is fixedly connected with the fixing plate 4, the outer wall of the fixing plate 4 is provided with a fixing hole 6, and the outer surface of the housing 5 is provided with a heat dissipation opening 7.

In order to facilitate the rotation and inclination of the dust-proof plate 21, in the present embodiment, it is preferable that a partition plate 20 is fixedly connected to an inner wall of the heat dissipation opening 7, the dust-proof plate 21 is disposed inside a port of the heat dissipation opening 7, and a bearing 23 is fixedly connected between the dust-proof plate 21 and an inner wall of the partition plate 20.

In order to facilitate air exhaust and heat dissipation inside the casing 5, in the embodiment, preferably, the inner side port of the heat dissipation port 7 is fixedly connected with a limiting plate 25, the limiting plate 25 is fixed at one end of the inner side of the dust guard 21, and the inside of the heat dissipation port 7 is fixedly connected with the fan 22.

In order to facilitate automatic resetting of the dust-proof plate 21, in this embodiment, preferably, a rubber band 24 is arranged between the dust-proof plate 21 and the limiting plate 25, one end of the rubber band 24 is fixed on the outer wall of the end portion of the dust-proof plate 21, and the other end of the rubber band 24 is fixed on the outer surface of the limiting plate 25.

In order to facilitate uniform heat conduction of the base 16, in the present embodiment, preferably, the base 16 is provided with a receiving groove 17 inside, an inner wall of the receiving groove 17 is provided with a connecting hole 19, and a thin copper pipe 18 is fixedly connected inside the receiving groove 17 and the connecting hole 19.

The utility model discloses a theory of operation and use flow: after the device is installed, a mainboard is fixed on a base 16 in a storage groove 1 of a shell 5, the mainboard is placed on the base 16 and is firmly fixed with the base 16 through a positioning hole 14 of a screw penetrating a connecting column 11, a backing plate 15 is installed and fixed between the mainboard and the base 16, the backing plate 15 effectively prevents the mainboard from being broken due to being overhead, a radiating copper sheet 12 is fixed at the bottom end of a CPU of the mainboard, thin copper tubes 18 are uniformly distributed in the base 16, the thin copper tubes 18 lead the heat conduction of the base 16 to be uniform, the radiating copper sheet 12 absorbs the heat dissipated in the working process of the CPU of the mainboard, the radiating copper sheet 12 conducts the heat into the base 16, the base 16 conducts the heat to the shell 5 uniformly, thereby effectively radiating the CPU of the mainboard, a fan 22 is started to exhaust the air of the mainboard in the storage groove 1 of the shell 5 for heat dissipation, a dustproof plate 21 rotates and inclines towards the outer side through a bearing 23 under, the dust guard 21 resets automatically under the pulling of rubber band 24 after fan 22 closes, and the dust guard 21 covers the outside port of thermovent 7, and the inside mainboard of storing groove 1 is avoided external impurity pollution to dust guard 21 protection thermovent 7, and limiting plate 25 fixes the inside port at baffle 20, and limiting plate 25 and the mutual block of dust guard 21 cause it only can unidirectional rotation, and dust guard 21 can not be at external pressure internal rotation down.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. Conduction formula heat dissipation equipment, including casing (5) and heat dissipation mechanism, its characterized in that: storing groove (1) has been seted up to the inside of casing (5), heat dissipation mechanism includes base (16), the inside inner wall in storing groove (1) is fixed in base (16), fixedly connected with fixing bolt (13) between base (16) and casing (5), the outside fixed surface of base (16) is connected with heat dissipation copper sheet (12), the equal fixedly connected with flange (11) of four end outer walls of base (16), the tip fixed surface of flange (11) is connected with locating hole (14), the outside outer wall fixedly connected with backing plate (15) of base (16).

2. The conductive heat sink of claim 1, wherein: square groove (8) have been seted up to the outside outer wall of casing (5), the tip outer wall of base (16) is installed inside the port of square groove (8), the port outer wall fixedly connected with expansion board (3) of square groove (8).

3. The conductive heat sink of claim 2, wherein: the expansion plate is characterized in that a dust cover (2) is fixedly connected to the outer wall of the end portion of the expansion plate (3), an interface (9) is fixedly connected to the outer wall of the outer side of the dust cover (2), and a fastener (10) is fixedly connected to the inner wall of the port of the expansion plate (3) and the inner wall of the square groove (8).

4. The conductive heat sink of claim 1, wherein: the outer wall of the end part of the shell (5) is fixedly connected with a fixing plate (4), the outer wall of the outer side of the fixing plate (4) is provided with a fixing hole (6), and the surface of the outer side of the shell (5) is provided with a heat dissipation opening (7).

5. The conductive heat sink of claim 4, wherein: the inner wall fixedly connected with baffle (20) of thermovent (7), port inside of thermovent (7) is provided with dust guard (21), the inner wall fixedly connected with bearing (23) of dust guard (21) and baffle (20).

6. The conductive heat sink of claim 4, wherein: the inboard port fixedly connected with limiting plate (25) of thermovent (7), limiting plate (25) are fixed in the inboard one end of dust guard (21), the inside fixedly connected with fan (22) of thermovent (7).

7. The conductive heat sink of claim 6, wherein: a rubber band (24) is arranged between the dust guard (21) and the limiting plate (25), one end of the rubber band (24) is fixed on the outer wall of the end part of the dust guard (21), and the other end of the rubber band (24) is fixed on the surface of the outer side of the limiting plate (25).

8. The conductive heat sink of claim 1, wherein: the copper tube storage device is characterized in that a storage groove (17) is formed in the base (16), a connecting hole (19) is formed in the inner wall of the storage groove (17), and a thin copper tube (18) is fixedly connected with the interior of the storage groove (17) and the connecting hole (19).