CN217839183U - High-performance PCB electroplating device - Google Patents

Abstract

The utility model discloses a device is electroplated to high performance PCB board, including electroplating bath, electroplating bath installs the hydraulic stem in both sides, the hydraulic stem top is connected with the lifter plate, the lifter plate is connected with the crane through the connecting rod, the crane bottom is equipped with the centre gripping subassembly, install the water conservancy diversion subassembly on the electroplating bath, the centre gripping subassembly includes U type frame, fixed plush copper, activity plush copper, fixing bolt, U type frame inner wall is located to fixed plush copper, activity plush copper fixed connection fixing bolt, fixing bolt threaded connection U type frame, the water conservancy diversion subassembly includes drawing liquid mouth, first honeycomb duct, guide pump, second honeycomb duct, flowing back, violently managing the mouth, the drawing liquid mouth is through first honeycomb duct connection guide pump, the guide pump is violently managed through second honeycomb duct connection flowing back, and the PCB board is peripheral to carry the solution of electroplating bath bottom, makes the more even of solution concentration distribution in the electroplating bath, guarantees the quality of PCB board.

Description

High-performance PCB electroplating device

Technical Field

The utility model relates to a PCB board electroplating technology field particularly, relates to a device is plated to high performance PCB board.

Background

The PCB is manufactured by electronic printing, so it is called "printed" circuit board, which is an important electronic component, a support of electronic components, a carrier for electrical interconnection of electronic components, and a connecting wire of the PCB is made of copper and attached to an insulating base plate by electroplating, and then etched to draw a circuit.

However, the concentration distribution of the electroplating solution in the electroplating pool is not uniform due to local consumption in the electroplating process, so that the electroplating layer of the PCB is not uniform, and the quality of the PCB is affected.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

To the problem among the correlation technique, the utility model provides a device is plated to high performance PCB board to overcome the above-mentioned technical problem that current correlation technique exists.

Therefore, the utility model discloses a specific technical scheme as follows:

a high-performance PCB electroplating device comprises an electroplating pool, wherein hydraulic rods are arranged on two sides of the electroplating pool, the top of each hydraulic rod is connected with a lifting plate, the lifting plate is connected with a lifting frame through a connecting rod, a clamping assembly is arranged at the bottom of the lifting frame, and a flow guide assembly is arranged on the electroplating pool;

the clamping assembly comprises a U-shaped frame, a fixed raised head, a movable raised head and a fixed bolt, the fixed raised head is arranged on the inner wall of the U-shaped frame, the movable raised head is fixedly connected with the fixed bolt, and the fixed bolt is in threaded connection with the U-shaped frame;

the diversion assembly comprises a liquid pumping port, a first diversion pipe, a diversion pump, a second diversion pipe, a drainage pipe horizontal pipe and a drainage port, the liquid pumping port is connected with the diversion pump through the first diversion pipe, the diversion pump is connected with the drainage pipe horizontal pipe through the second diversion pipe, and the drainage port is arranged on the drainage pipe horizontal pipe.

Preferably, a liquid discharge pipe is arranged at a position, close to the bottom, of one side of the electroplating pool, and a valve is arranged on the liquid discharge pipe.

Preferably, the crane comprises diaphragm and vertical pole, the vertical pole equidistance sets up in the diaphragm both sides.

Preferably, a threaded hole is formed in the position, corresponding to the fixing bolt, of the U-shaped frame, and the threaded hole is in threaded connection with the fixing bolt.

Preferably, a filter screen is arranged in the liquid pumping port.

Preferably, one side of the electroplating pool is provided with a fixed box, and the guide pump is arranged in the fixed box.

The utility model has the advantages that: 1. the flow guide assembly is arranged and structurally comprises a liquid suction port, a first flow guide pipe, a flow guide pump, a second flow guide pipe, a transverse liquid discharge pipe and a liquid discharge port, and the solution at the bottom of the electroplating pool is conveyed to the periphery of the PCB, so that the concentration distribution of the solution in the electroplating pool is more uniform, and the quality of the PCB is ensured;

2. the clamping assembly is arranged, the structure of the clamping assembly comprises a U-shaped frame, a fixed raised head, a movable raised head and a fixing bolt, the structure is simple, the operation is convenient and fast, and the improvement of the working efficiency is facilitated.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic diagram of an overall structure of a high-performance PCB electroplating apparatus according to an embodiment of the present invention;

fig. 2 is a cross-sectional view of a clamping assembly of a high performance PCB board electroplating apparatus according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a diversion assembly of a high-performance PCB electroplating apparatus according to an embodiment of the present invention;

fig. 4 is an external view of a liquid suction port of a high-performance PCB board electroplating apparatus according to an embodiment of the present invention.

In the figure:

1. an electroplating pool; 2. a hydraulic lever; 3. a lifting plate; 4. a connecting rod; 5. a lifting frame; 6. a clamping assembly; 7. a flow guide assembly; 8. a U-shaped frame; 9. fixing the raised head; 10. a movable raised head; 11. fixing the bolt; 12. a liquid extraction port; 13. a first draft tube; 14. a diversion pump; 15. a second draft tube; 16. a horizontal drainage pipe; 17. a liquid discharge port; 18. a liquid discharge pipe; 19. a transverse plate; 20. a longitudinal bar; 21. a threaded hole; 22. a filter screen; 23. and (5) fixing the box.

Detailed Description

For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.

According to the utility model discloses an embodiment provides a high performance PCB board electroplating device.

Example one

As shown in fig. 1-4, according to the utility model discloses a device is electroplated to high performance PCB board, including electroplating bath 1, electroplating bath 1 both sides are installed hydraulic stem 2, 2 tops of hydraulic stem are connected with lifter plate 3, lifter plate 3 is connected with crane 5 through connecting rod 4, crane 5 bottom is equipped with clamping component 6, install water conservancy diversion subassembly 7 on the electroplating bath 1, clamping component 6 includes U type frame 8, fixed plush copper 9, activity plush copper 10, fixing bolt 11, U type frame 8 inner wall is located to fixed plush copper 9, activity plush copper 10 fixed connection fixing bolt 11, fixing bolt 11 threaded connection U type frame 8, simple structure's clamping component 6 is convenient for operate, and reduce the area of contact with the PCB board, guarantee the electroplating quality of PCB board.

Example two

As shown in fig. 1-4, according to the utility model discloses a high performance PCB board electroplating device of embodiment, including electroplating bath 1, electroplating bath 1 installs hydraulic stem 2 in both sides, 2 tops of hydraulic stem are connected with lifter plate 3, lifter plate 3 is connected with crane 5 through connecting rod 4, crane 5 bottom is equipped with clamping component 6, install water conservancy diversion subassembly 7 on the electroplating bath 1, clamping component 6 includes U type frame 8, fixed plush 9, activity plush 10, fixing bolt 11, fixed plush 9 locates U type frame 8 inner wall, activity plush 10 fixed connection fixing bolt 11, fixing bolt 11 threaded connection U type frame 8, water conservancy diversion subassembly 7 includes drawing liquid mouth 12, first honeycomb duct 13, guide pump 14, second honeycomb duct 15, violently manage 16, leakage fluid dram 17, drawing liquid mouth 12 connects guide pump 14 through first honeycomb duct 13, guide pump 14 connects violently managing 16 through second honeycomb duct 15, leakage fluid drainage dram 17 locates on violently managing 16, carry the solution of electroplating bath 1 bottom to the PCB board, make the interior peripheral quality of concentration distribution more even, guarantee the electroplating board of PCB.

EXAMPLE III

As shown in fig. 1-4, according to the utility model discloses a high performance PCB board electroplating device of embodiment, including electroplating bath 1, electroplating bath 1 both sides are installed hydraulic stem 2, 2 tops of hydraulic stem are connected with lifter plate 3, lifter plate 3 is connected with crane 5 through connecting rod 4, crane 5 bottom is equipped with clamping component 6, install water conservancy diversion subassembly 7 on the electroplating bath 1, clamping component 6 includes U type frame 8, fixed raised head 9, activity raised head 10, fixing bolt 11, fixed raised head 9 locates the 8 inner walls of U type frame, activity raised head 10 fixed connection fixing bolt 11, fixing bolt 11 threaded connection U type frame 8, water conservancy diversion subassembly 7 includes drawing liquid mouth 12, first honeycomb duct 13, guide pump 14, second honeycomb duct 15, violently manage 16, leakage fluid dram 17, drawing liquid mouth 12 connects guide pump 14 through first honeycomb duct 13, guide pump 14 connects violently managing 16 through second honeycomb duct 15, drainage dram 17 locates on violently managing 16, drainage dram 17 locates on one side electroplating bath 1, the position that is close to the bottom is equipped with fluid- discharge pipe 18, 5 by crane 19 and correspond the screw hole 20 in the fixed honeycomb duct 20, it is equipped with screw hole 21 to electroplate screw hole 20 to electroplate the screw bolt, it is equipped with the screw hole 21, it corresponds the screw hole to be equipped with the screw hole 20 to electroplate 1, it is equipped with the fixed bolt to be equipped with the screw hole 21 in electroplating bath 1, the fixed honeycomb duct 21, it connects to electroplate the screw hole, the screw hole 21, the filter screen 21, it is equipped with the fixing bolt 21.

To sum up, with the help of the above technical scheme of the utility model, this device is when using, puts PCB board top in 8 inboards of U type frame, rotating fixing bolt 11 makes the fixed PCB board of fixed plush copper 9 and the mutual centre gripping of activity plush copper 10, starts hydraulic stem 2, makes the PCB board move down to the plating solution in, in electroplating, starts guide pump 14, and it is peripheral to carry the PCB board with the solution of 1 bottom of electroplating bath, makes the more even of solution concentration distribution in the electroplating bath, guarantees the quality of PCB board.

The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (6)

1. A high-performance PCB electroplating device comprises an electroplating pool (1) and is characterized in that hydraulic rods (2) are installed on two sides of the electroplating pool (1), the top of each hydraulic rod (2) is connected with a lifting plate (3), each lifting plate (3) is connected with a lifting frame (5) through a connecting rod (4), a clamping assembly (6) is arranged at the bottom of each lifting frame (5), and a flow guide assembly (7) is installed on the electroplating pool (1);

the clamping assembly (6) comprises a U-shaped frame (8), a fixed raised head (9), a movable raised head (10) and a fixing bolt (11), the fixed raised head (9) is arranged on the inner wall of the U-shaped frame (8), the movable raised head (10) is fixedly connected with the fixing bolt (11), and the fixing bolt (11) is in threaded connection with the U-shaped frame (8);

the flow guide assembly (7) comprises a liquid suction port (12), a first guide pipe (13), a guide pump (14), a second guide pipe (15), a transverse liquid drainage pipe (16) and a liquid drainage port (17), the liquid suction port (12) is connected with the guide pump (14) through the first guide pipe (13), the guide pump (14) is connected with the transverse liquid drainage pipe (16) through the second guide pipe (15), and the liquid drainage port (17) is arranged on the transverse liquid drainage pipe (16).

2. A high performance PCB board electroplating apparatus according to claim 1, wherein a drain pipe (18) is provided at a position near the bottom of one side of the electroplating tank (1), and a valve is provided on the drain pipe (18).

3. A high performance PCB plating apparatus as claimed in claim 2, wherein the lifting rack (5) is composed of a horizontal plate (19) and a vertical rod (20), the vertical rod (20) is disposed at both sides of the horizontal plate (19) with equal distance.

4. A high-performance PCB electroplating apparatus according to claim 3, wherein a screw hole (21) is formed on the U-shaped frame (8) at a position corresponding to the fixing bolt (11), and the screw hole (21) is in threaded connection with the fixing bolt (11).

5. A high-performance PCB electroplating device according to claim 4, characterized in that a filter screen (22) is arranged in the liquid extraction port (12).

6. A high-performance PCB electroplating device according to claim 5, wherein a fixed box (23) is arranged at one side of the electroplating pool (1), and the flow guide pump (14) is arranged in the fixed box (23).

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