CN217831314U

CN217831314U - Device for improving target binding flatness

Info

Publication number: CN217831314U
Application number: CN202220559177.5U
Authority: CN
Inventors: 岳晓聪; 黄宇彬; 毛远兴; 童培云; 朱刘
Original assignee: Vital Thin Film Materials Guangdong Co Ltd
Current assignee: Vital Thin Film Materials Guangdong Co Ltd
Priority date: 2022-03-15
Filing date: 2022-03-15
Publication date: 2022-11-18
Anticipated expiration: 2032-03-15

Abstract

The utility model relates to the field of metal binding, and discloses a device for improving the binding flatness of a target, which comprises a base and a target arranged on the base, wherein one side of the target, which is far away from the base, is provided with a baffle, and the top of the baffle is provided with a power compression device for applying fastening force to the target; the base is provided with a heating device. Through the structural design among the target, the base and the baffle, the power compression device can adjust the compression force according to different deformations of the target, the flatness of the target can be adjusted more effectively by the whole device, and the operation is simple. The device adopts the independent arrangement of the power compression device, can adjust the pressure in time according to the actual situation, and adjust the flatness of the target material; and set up the base into heatable structure, make the target release stress in the heating process, reduce the deflection, make whole device more practical, effectual.

Description

Device for improving target binding flatness

Technical Field

The utility model relates to a metal target field, more specifically relates to a improve device that flatness was bound to target.

Background

At present, sputtering target materials are widely applied in the fields of electronics and information industry, glass coating and the like. In the sputtering machine, high-purity metal atoms are deposited on a silicon wafer by bombarding the surface of a target material in a vacuum state.

Most target materials are limited in physical or chemical properties, so that the target materials cannot be directly installed for coating, a target blank and a back plate need to be welded and connected with each other by adopting metal solder, and the effective surface welding rate needs to be more than 95%. The target material can be prevented from being broken due to uneven heating through binding, and the target material can be prevented from being deformed at low cost.

The requirements of sputtering targets are higher than those of the traditional material industry, such as size, flatness, purity, impurity content and the like, but the target is bent in the binding process due to the large difference of the thermal expansion coefficients of the target blank and the back plate, so that the flatness of the target is influenced.

CN209753688U discloses a flat target leveling device, which comprises a frame, a workbench, a leveling measuring device and a manual leveling device, wherein the workbench is used for driving a flat target to be leveled to horizontally move along the length direction of the flat target and is matched with the manual leveling device in a leveling way, the workbench is movably arranged in the middle of the frame, at least two supporting pieces for movably supporting the flat target are movably arranged on the table surface of the workbench, the supporting pieces are respectively distributed at intervals along the moving direction of the workbench, a leveling interval is formed between every two adjacent supporting pieces, a supporting part is arranged at the top of each supporting piece, and the supporting parts movably abut against the bottom surface of the flat target; the leveling and measuring device is used for detecting the flatness of the planar target and is arranged in the middle of the rack, and the leveling and measuring device is provided with a measuring rod which movably abuts against the upper surface of the planar target so as to measure the flatness tolerance and the leveling amount of the planar target; the manual leveling device is used for manually leveling each part of the planar target material corresponding to each leveling interval, the manual leveling device is installed at the middle upper part of the rack, the manual leveling device is provided with a pressing rod capable of doing lifting motion, the pressing rod is located above the planar target material and perpendicular to the workbench, a pressing part is arranged at the end part of the pressing rod, the pressing part movably presses the planar target material on the leveling interval, and the pressing rod presses the upward convex deformation part of the planar target material downwards to perform cold leveling on the planar target material.

The device needs manual leveling, and does not consider the problem that the flatness of the target material is influenced due to the fact that the target material is bent in the cooling process because the thermal expansion coefficients of the target blank and the back plate are greatly different in the binding process.

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the utility model is to solve the defects of the prior art, and disclose a device for improving the binding flatness of a target, through the structural design among the target, a base and a baffle, a power compression device is adopted to adjust the compression force according to the deformation difference of the target, the pressure can be timely adjusted according to the actual situation, and the flatness of the target is adjusted; and the base is arranged into a heatable structure, so that the target releases stress in the heating process, the deformation is reduced, the whole device is more practical, and the effect is better.

The purpose of the utility model is realized through the following technical scheme:

the device for improving the binding flatness of the target comprises a base and the target arranged on the base, wherein a baffle is arranged on one side of the target, which is far away from the base, and a power compression device for applying fastening force to the target is arranged at the top of the baffle; the base is provided with a heating device.

The device for improving the binding flatness of the target material has the advantages that through the structural design among the target material, the base and the baffle, the compression force can be adjusted according to different deformations of the target material by adopting the power compression device, the flatness of the target material can be adjusted more effectively by the whole device, and the operation is simple.

The utility model discloses require that the base is high temperature resistant and hardness is higher, the outward appearance is clean, smooth level and smooth and the plane degree needs in the plane degree within range that the target required.

Furthermore, the baffle and the base clamp and fix the target material in the middle to form a sandwich structure. The baffle plate in the device is used for balancing and adjusting the pressure of the power compression device, and prevents the target from being uneven or warped again due to uneven stress.

Further, the baffle plate completely covers the target. The arrangement ensures that the whole target can be pressed by the power compression device.

The baffle is high temperature resistant and has higher hardness, the appearance is clean, smooth and flat, and the flatness needs to be in the flatness range required by the target material. And the size requirement is more than or equal to that of the target material.

Furthermore, the power compression device is a hydraulic cylinder, and the hydraulic cylinders are uniformly distributed on the top of the baffle.

Furthermore, the hydraulic cylinders are arranged at the edge and the center of the top of the baffle plate, so that the force dispersed on the target material is uniform and even.

Furthermore, the heating devices are uniformly distributed in the base or at the bottom of the base.

Furthermore, the device also comprises a temperature sensor arranged on the base. The temperature sensor can monitor the temperature of the base in real time.

In the target cooling process, the shrinkage of the target needs to be fastened timely by applying pressure of a hydraulic cylinder on time, so that the flatness of the target is increased, the target fastening by the hydraulic cylinder needs to be kept for more than half an hour (different targets are kept for different fastening time), and the target is taken down after the target is completely cooled to detect the flatness. If the target flatness is not satisfactory, the device needs to be reinstalled and heated (the heating temperature is lower than the melting point of the solder) for the cooling step, increasing the target fastening time.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses a to the structural design between target, base, the baffle, adopt power compressor arrangement can adjust the compressive force according to the deformation difference of target, can be according to the size of the real condition in time adjustment pressure, the roughness of adjustment target, whole device is more practical, and is effectual.

The utility model discloses a thereby the plane degree of increase target of the deflection of control target in the cooling process.

The utility model discloses a exert pressure to the target with independent power compressor arrangement, can be according to the size of the real condition in time adjustment pressure, the roughness of adjustment target.

Drawings

Fig. 1 is a schematic view of a top view structure of the device for improving the binding flatness of the target according to the present invention.

Fig. 2 is a schematic side view of the device for improving the binding flatness of the target according to the present invention.

Detailed Description

The present invention will be further described with reference to the following specific examples. The following examples are illustrative only and do not constitute undue limitations on the invention, which can be implemented in a number of different ways that are defined and covered by the teachings of the invention. Unless otherwise indicated, the reagents, compounds and apparatus employed in the present invention are conventional in the art.

Example 1

As shown in fig. 1-2, the device for improving the binding flatness of the target includes a base 1, the base 1 is provided with a heating device 5, the heating device 5 may be a heating platform or a disc-shaped heating pipe or other shapes arranged inside the base 1, in this embodiment, the heating device 5 is a disc-shaped heating pipe, and the heating device 5 heats the temperature of the base 1 to release the stress of the target 2. The target 2 is placed on the base 1, the baffle 3 is pressed on the top of the target 2, and then the power compression device is used for applying pressure on the baffle 3 for fastening. The baffle 3 and the base 1 clamp and fix the target 2 in the middle to form a sandwich structure.

In this embodiment, the shutter 3 completely covers the target 2. In this embodiment, the target 2 is a cylinder, and accordingly, the upper and lower surfaces of the baffle 3 are also circular structures, and the target 2 and the surface of the baffle 3 are concentrically arranged, so that the uniform stress of the whole target is facilitated.

The power compression device of this embodiment is hydraulic cylinder 4, and wherein hydraulic cylinder 4 is 5, has 4 outer fringe departments of evenly distributed in the top of

baffle

3, and 1 sets up the central point at baffle 3. So that the force spread over the target 2 is uniform and even. The diameter of the hydraulic cylinder 4 of the embodiment is larger than 110mm, and the five hydraulic cylinders are evenly distributed, so that the force dispersed on the target 2 is even and equal. The force of the intermediate hydraulic cylinder 4 can be increased appropriately if a central bulge of the target 2 occurs. The shrinkage of the target 2 needs to be timely fastened by applying the pressure of the hydraulic cylinder 4 in the cooling process of the target 2, so that the flatness of the target 2 is increased. After the target 2 is completely cooled, the hydraulic cylinder 4 is required to hold the target 2 for more than half an hour (different targets are held for different holding time), and the target 2 is taken down to detect the flatness. If the flatness of the target 2 is not satisfactory, reheating (heating temperature is lower than the melting point of the solder) is required for the cooling step, and the fastening time of the target 2 is prolonged.

In order to detect the temperature of the base in real time, a temperature sensor (not shown) is further provided on the base 1.

The method for using the device for improving the binding planeness of the target comprises the following steps: first, after the target blank and the target material 2 are bonded together with solder, the temperature of the pedestal 1 is measured. When the base 1 and the temperature are the same as the temperature of the target 2, the target 2 is gently placed on the base 1, and then pressed on the top of the target 2 by the baffle 3.

After the device is installed, the temperature of the base 1 is lowered in stages, the shrinkage of the target 2 needs to be fastened to the hydraulic cylinder 4 in time by exerting force every 30min in the cooling process, after the temperature of the target 2 is lowered to the room temperature, the fastening time is kept for 30min, the flatness of the target 2 is measured, the flatness of the target 2 is found to be still not satisfactory, the target 2 is heated again, the temperature is lower than the melting point of solder, and the pressure of the hydraulic cylinder 4 is properly exerted in the heating process when secondary heating is carried out. And when the bonding layer step begins to melt, stopping heating and waiting for cooling.

And in the cooling process, the shrinkage of the target 2 is fastened by applying the force of the hydraulic cylinder 4 every 30min and is kept for more than 8 hours, the target 2 obtained by releasing the die is not bent any more, and the flatness meets the requirement.

It should be understood that the above-mentioned embodiments are only examples for clearly illustrating the technical solutions of the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection of the claims of the present invention.

Claims

1. A device for improving the binding flatness of a target comprises a base (1) and the target (2) arranged on the base (1), and is characterized in that a baffle (3) is arranged on one side, far away from the base (1), of the target (2), and a power compression device for applying fastening force to the target (2) is arranged at the top of the baffle (3); the base (1) is provided with a heating device (5).

2. The device for improving the target binding flatness according to claim 1, wherein the baffle (3) and the base (1) clamp and fix the target (2) therebetween to form a "sandwich" structure.

3. The device for improving the binding flatness of a target according to claim 2, wherein the baffle (3) completely covers the target (2).

4. The device for improving the binding flatness of a target according to claim 1, wherein the power compression device is a hydraulic cylinder (4).

5. The device for improving the binding flatness of the target according to claim 4, wherein the hydraulic cylinders (4) are arranged in plurality and uniformly distributed on the top of the baffle plate (3).

6. The device for improving the binding flatness of a target according to claim 5, wherein the hydraulic cylinder (4) is arranged at the top edge and the center of the baffle plate (3).

7. The device for improving the binding flatness of a target according to claim 6, wherein the heating devices (5) are uniformly distributed inside or at the bottom of the base (1).

8. The apparatus according to claim 1~7 further comprising a temperature sensor disposed on the base (1).