CN114411091A - A kind of mask, production method and production fixture - Google Patents
A kind of mask, production method and production fixture Download PDFInfo
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- CN114411091A CN114411091A CN202210105205.0A CN202210105205A CN114411091A CN 114411091 A CN114411091 A CN 114411091A CN 202210105205 A CN202210105205 A CN 202210105205A CN 114411091 A CN114411091 A CN 114411091A
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- 238000004519 manufacturing process Methods 0.000 title abstract description 23
- 238000000576 coating method Methods 0.000 claims abstract description 112
- 239000011248 coating agent Substances 0.000 claims abstract description 107
- 238000004140 cleaning Methods 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 4
- 238000007665 sagging Methods 0.000 abstract description 18
- 229910052751 metal Inorganic materials 0.000 abstract description 17
- 239000002184 metal Substances 0.000 abstract description 17
- 239000000463 material Substances 0.000 abstract description 14
- 230000005484 gravity Effects 0.000 abstract description 7
- 238000001704 evaporation Methods 0.000 description 8
- 230000008020 evaporation Effects 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 7
- 230000005611 electricity Effects 0.000 description 5
- 239000011368 organic material Substances 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000007751 thermal spraying Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
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- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
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- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
本发明公开了一种掩膜版、制作方法及制作夹具,涉及显示设备技术领域;技术方案:掩膜版本体工作面上拱,能够提高掩膜版本体的结构强度,减小掩膜版本体因材料本身刚度、重力和受热膨胀的下垂量,或避免掩膜版本体下垂,以通过掩膜版本体支撑金属精细掩膜版,减小金属精细掩膜版的下垂量或避免金属精细掩膜版,从而降低显示屏混色比例和混色风险,提高显示屏的成品率。掩膜版制作方法,在掩膜版本体的工作面涂覆张应力涂层或在掩膜版本体结构面涂覆压应力涂层,均可获得前述的掩膜版本体。掩膜版制作夹具,包括掩膜版边框装载框和支撑板,支撑板位于装载框上端且各侧与装载框对应的侧壁连接,可通过支撑板可对掩膜版提供支撑。
The invention discloses a mask, a manufacturing method and a manufacturing fixture, and relates to the technical field of display equipment. Due to the stiffness of the material itself, gravity and the amount of sagging due to thermal expansion, or to avoid the sagging of the mask version body, to support the metal fine mask through the mask version body, reduce the sag of the metal fine mask or avoid the metal fine mask version, thereby reducing the display color mixing ratio and risk of color mixing, and improving the yield of the display. The mask version body can be obtained by applying a tensile stress coating on the working surface of the mask version body or coating a compressive stress coating on the structural surface of the mask version body in the mask version manufacturing method. The mask making jig includes a mask frame loading frame and a support plate. The support plate is located at the upper end of the loading frame and each side is connected with the side walls corresponding to the loading frame. The support plate can provide support for the mask.
Description
技术领域technical field
本发明涉及显示设备技术领域,具体涉及一种掩膜版、制作方法及制作夹具。The invention relates to the technical field of display devices, in particular to a mask, a manufacturing method and a manufacturing fixture.
背景技术Background technique
金属精细掩膜版在使用过程中,由于重力和受热膨胀的原因,存在一定的下垂量(根据掩膜版的尺寸不同下垂量不同,如500μm),因此,采用支撑掩膜版做支撑,改善掩膜版下垂量,进而将精细金属掩膜版的下垂量控制在200μm以下,而掩膜版的下垂量越大,造成的混色的比例和风险越高,尤其对高分辨率的产品影响尤为严重;此外,在真空腔室蒸镀时,掩膜版与玻璃产生静电,可能击穿蒸镀的有机材料和背板电路。During the use of the metal fine mask, due to gravity and thermal expansion, there is a certain amount of sag (the amount of sag is different according to the size of the mask, such as 500μm). Therefore, the support mask is used as a support to improve Mask sag, and then control the sag of fine metal mask below 200μm, and the greater the mask sag, the higher the proportion and risk of color mixing, especially for high-resolution products. Serious; in addition, during the vacuum chamber evaporation, the mask and the glass generate static electricity, which may break down the evaporated organic materials and the backplane circuit.
发明内容SUMMARY OF THE INVENTION
针对现有的金属精细掩膜版和公共层掩膜版在工作时,存在较大的下垂量,导致显示屏次品率高的技术问题及蒸镀静电问题;本发明提供了一种掩膜版、制作方法及制作夹具,能够减小金属精细掩膜版工作时的下垂量和防止静电击穿,以降低显示屏混色比例和混色风险和静电击穿风险,提高显示屏的成品率。Aiming at the fact that the existing metal fine mask and the common layer mask have a large amount of sag during operation, which leads to the technical problem of high defective rate of the display screen and the problem of vapor deposition static electricity; the invention provides a mask The plate, the production method and the production fixture can reduce the sagging amount of the metal fine mask during operation and prevent electrostatic breakdown, so as to reduce the color mixing ratio of the display screen, the risk of color mixing and the risk of electrostatic breakdown, and improve the yield of the display screen.
本发明通过以下技术方案实现:The present invention is achieved through the following technical solutions:
第一方面,本发明提供了一种掩膜版,包括掩膜版本体,所述掩膜版本体的工作面上拱。In a first aspect, the present invention provides a reticle, comprising a reticle version body, and the working surface of the reticle version body is arched.
在一可选的实施例中,所述掩膜版本体的工作面覆有张应力涂层。In an optional embodiment, the working surface of the mask version body is covered with a tensile stress coating.
在一可选的实施例中,所述张应力涂层中部的厚度大于两端的厚度。In an optional embodiment, the thickness of the middle part of the tensile stress coating is greater than the thickness of both ends.
在一可选的实施例中,所述张应力涂层为氧化铝涂层和类金刚石涂层中的一种。In an optional embodiment, the tensile stress coating is one of an alumina coating and a diamond-like carbon coating.
在一可选的实施例中,所述掩膜版本体的结构面覆有压应力涂层。In an optional embodiment, the structural surface of the mask version body is covered with a compressive stress coating.
在一可选的实施例中,所述压应力涂层中部的厚度大于两端的厚度。In an optional embodiment, the thickness of the middle part of the compressive stress coating is greater than the thickness of both ends.
在一可选的实施例中,所述压应力涂层为氧化铝涂层和类金刚石涂层中的一种。In an optional embodiment, the compressive stress coating is one of an alumina coating and a diamond-like carbon coating.
第二方面,本发明提供了一种掩膜版制作方法,包括以下步骤:In a second aspect, the present invention provides a method for making a mask, comprising the following steps:
S1、获得掩膜版本体;S1. Obtain the mask version body;
S2、在所述掩膜版本体(工作面涂覆张应力涂层或在所述掩膜版本体结构面涂覆压应力涂层。S2. Coating a tensile stress coating on the mask version body (working surface or coating a compressive stress coating on the structural surface of the mask version body.
具体的,步骤S2包括子步骤:Specifically, step S2 includes sub-steps:
S21、清洗掩膜版本体;S21, cleaning the mask version body;
S22、将清洗后的掩膜版本体移入涂层设备,并对喷涂腔抽真空、对掩膜版本体加热;S22, moving the cleaned mask version body into the coating equipment, vacuuming the spraying chamber, and heating the mask version body;
S23、清洁掩膜版本体待涂层面;S23, clean the to-be-coated surface of the mask version body;
S24、对掩膜版本体清洁后的表面涂层;S24, the surface coating of the mask version body after cleaning;
S25、掩膜版本体降至室温后,给喷涂腔充入保护气。S25. After the mask version body is lowered to room temperature, fill the spray chamber with protective gas.
第三方面,本发明提供了一种掩膜版制作夹具,用于制作前述的掩膜版,包括用于装载掩膜版边框的装载框,所述装载框上端设有支撑板,所述支撑板用于支撑掩膜版本体,所述支撑板各侧与所述装载框对应的侧壁连接,且所述支撑板到所述装载框间的投影距离可调。In a third aspect, the present invention provides a reticle manufacturing jig for making the aforementioned reticle, comprising a loading frame for loading a reticle frame, a support plate is provided on the upper end of the loading frame, and the support The plate is used to support the mask version body, each side of the support plate is connected with the side walls corresponding to the loading frame, and the projection distance between the support plate and the loading frame is adjustable.
本发明具有的有益效果:The beneficial effects that the present invention has:
1、本发明提供的掩膜版,掩膜版本体工作面上拱,能够提高掩膜版本体的结构强度,可减小掩膜版本体因材料本身刚度、重力和受热膨胀的下垂量,或避免掩膜版本体下垂,以通过掩膜版本体支撑金属精细掩膜版,减小金属精细掩膜版的下垂量,从而降低显示屏混色比例和混色风险,提高显示屏的成品率。1. In the mask provided by the present invention, the working surface of the mask version body is arched, which can improve the structural strength of the mask version body, and can reduce the sagging amount of the mask version body due to the rigidity of the material itself, gravity and thermal expansion, or Avoid sagging of the mask version body, so as to support the metal fine mask through the mask version body, reduce the sagging amount of the metal fine mask, thereby reducing the display color mixing ratio and the risk of color mixing, and improving the yield of the display screen.
2、本发明提供的掩膜版,掩膜版工作面涂层,能够减小显示屏蒸镀时有机材料和背板电路被静电击穿的风险,提高显示屏生产良率。2. The mask and the working surface coating of the mask provided by the present invention can reduce the risk of electrostatic breakdown of organic materials and backplane circuits during the evaporation of the display screen, and improve the production yield of the display screen.
3、本发明提供的掩膜版制作方法,在掩膜版本体的工作面涂覆张应力涂层或在掩膜版本体结构面涂覆压应力涂层,均可获得工作面上拱的掩膜版本体,从而提高支撑板本体的结构强度,减小掩膜版本体因材料本身刚度、重力和受热膨胀的下垂量,或抵消掩膜版本体因材料本身刚度、重力和受热膨胀的下垂量。3. In the mask manufacturing method provided by the present invention, a tensile stress coating is applied to the working surface of the mask version body or a compressive stress coating is applied to the structural surface of the mask version body to obtain a mask that is arched on the working surface. film version body, thereby improving the structural strength of the support plate body, reducing the sagging amount of the mask version body due to the stiffness, gravity and thermal expansion of the material itself, or offsetting the sagging amount of the mask version body due to the stiffness, gravity and thermal expansion of the material itself .
4、本发明提供的掩膜版制作夹具,包括掩膜版边框装载框和支撑板,支撑板位于装载框上端且各侧与装载框对应的侧壁连接,将掩膜版放入掩膜版边框内时,支撑板可对掩膜版提供支撑。4. The mask manufacturing fixture provided by the present invention includes a mask frame loading frame and a support plate. The support plate is located at the upper end of the loading frame and each side is connected to the side wall corresponding to the loading frame, and the mask is placed in the mask. When inside the frame, the support plate can provide support for the reticle.
附图说明Description of drawings
为了更清楚地说明本申请实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,应当理解,以下附图仅示出了本申请的某些实施例,因此不应被看作是对范围的限定,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他相关的附图。In order to illustrate the technical solutions of the embodiments of the present application more clearly, the following drawings will briefly introduce the drawings that need to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore do not It should be regarded as a limitation of the scope, and for those of ordinary skill in the art, other related drawings can also be obtained according to these drawings without any creative effort.
图1为本发明实施例掩膜版结构示意图;1 is a schematic diagram of a mask structure according to an embodiment of the present invention;
图2为本发明实施例掩膜版制作夹具结构示意图;2 is a schematic structural diagram of a reticle manufacturing fixture according to an embodiment of the present invention;
图3为本发明实施例高度调节机构结构示意图。3 is a schematic structural diagram of a height adjustment mechanism according to an embodiment of the present invention.
附图标记:Reference number:
1-掩膜版本体,2-装载框,3-掩膜版边框,31-连接件,4-高度调节机构,41-竖杆,42-调节垫块,43-固定螺母,5-支撑板。1-mask version body, 2-loading frame, 3-mask frame, 31-connector, 4-height adjustment mechanism, 41-vertical rod, 42-adjustment spacer, 43-fixing nut, 5-supporting plate .
具体实施方式Detailed ways
为使本申请实施例的目的、技术方案和优点更加清楚,下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本申请一部分实施例,而不是全部的实施例。通常在此处附图中描述和示出的本申请实施例的组件可以以各种不同的配置来布置和设计。In order to make the purposes, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of the present application, but not all of the embodiments. The components of the embodiments of the present application generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.
因此,以下对在附图中提供的本申请的实施例的详细描述并非旨在限制要求保护的本申请的范围,而是仅仅表示本申请的选定实施例。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。Thus, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the application as claimed, but is merely representative of selected embodiments of the application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步定义和解释。It should be noted that like numerals and letters refer to like items in the following figures, so once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.
在本申请实施例的描述中,术语“中心”、“上”、“下”、“左”、“右”、“竖向”、“纵向”、“侧向”、“水平”、“内”、“外”、“前”、“后”、“顶”、“底”等指示的方位或位置关系为基于附图所示的方位或位置关系,或者是该申请产品使用时惯常摆放的方位或位置关系,或者是本领域技术人员惯常理解的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的设备或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。In the description of the embodiments of the present application, the terms "center", "upper", "lower", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "inner" ", "outside", "front", "rear", "top", "bottom", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the attached drawings, or the application product is usually placed in use. The orientation or positional relationship, or the orientation or positional relationship commonly understood by those skilled in the art, is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, with a specific orientation. The configuration and operation of the orientation should not be construed as a limitation on this application.
在本发明的描述中,除非另有明确的规定和限定,术语“设置”、“开有”、“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, unless otherwise expressly specified and limited, the terms "arranged", "opened", "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection, or It can be a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication between the two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.
需要说明的是,在不冲突的情况下,本申请中的实施例及实施例中的特征可以相互组合。It should be noted that the embodiments in the present application and the features of the embodiments may be combined with each other in the case of no conflict.
实施例1Example 1
结合附图1,本实施例提供了一种掩膜版,包括掩膜版本体1,掩膜版本体1的工作面上拱。With reference to FIG. 1 , this embodiment provides a mask, including a
具体来说,掩膜版本体1的工作面上拱,可通过冲压弯曲、涂层弯曲等弯曲的方式实现。Specifically, the arching of the working surface of the
在申请人实际生产过程中,通常通过支撑版本体1支撑金属精细掩膜版。可以理解的是,支撑版本体1的下垂量小于金属精细掩膜版的下垂量,从而在一定程度上减小金属精细掩膜版的下垂量,但因支撑版本体1材料本身刚度、重力和受热膨胀的支撑版也存在一定的下垂量,减小金属精细掩膜版的下垂量有限,如从500μm降到200μm;In the actual production process of the applicant, the metal fine mask is usually supported by the supporting
此外,在真空腔室蒸镀时,掩膜版与玻璃产生静电,可能击穿蒸镀的有机材料和背板电路,可能的原因为真空蒸镀时金属金属精细掩膜版和有机材料或背板电路在对位时产生摩擦或分离时的摩擦或在材料蒸镀过程中高温环境(40℃~150℃)导致紧密贴合的有机层或背板电路与掩膜版发生电子转移。In addition, in the vacuum chamber evaporation, the mask and the glass generate static electricity, which may break down the evaporated organic materials and the backplane circuit. The possible reason is that the metal metal fine mask and organic materials or backplanes are caused by vacuum evaporation. The friction or separation of the board circuit during alignment or the high temperature environment (40°C ~ 150°C) during the material evaporation process leads to electron transfer between the closely attached organic layer or the backplane circuit and the mask.
而本实施例提供的掩膜版,掩膜版本体1工作面上拱,能够提高掩膜版本体1的结构强度,可减小掩膜版本体1因材料本身刚度、重力和受热膨胀的下垂量,或避免掩膜版本体下垂。从而通过掩膜版本体1支撑金属精细掩膜版时,能够减小金属精细掩膜版的下垂量或避免金属精细掩膜版下垂,可使得金属精细掩膜版保持平整,从而降低显示屏混色比例和混色风险,提高显示屏的成品率。In the mask provided in this embodiment, the working surface of the
本实施例提供的掩膜版,掩膜版工作面涂层,涂层材料可以选择高阻抗材料,进而提升了背板玻璃和掩膜版间的介电常数系数,使得静电产生后,静电不会击穿该电容,减小有机材料和背板电路击穿的风险,提高显示屏的成品率。The mask provided in this embodiment, the mask working surface coating, and the coating material can be made of high-impedance materials, thereby improving the dielectric constant coefficient between the backplane glass and the mask, so that after static electricity is generated, the static electricity does not The capacitor will be broken down, reducing the risk of breakdown of organic materials and backplane circuits, and improving the yield of the display.
实施例2Example 2
结合图1,本实施例提供了一种掩膜版,基于实施例1所记载的结构和原理,本实施例在掩膜版本体1的工作面覆有张应力涂层(涂层应力为负),如通过热喷涂、溅射、磁控等表面涂层技术,在掩膜版本体1的工作面涂覆张应力涂层,使得掩膜版本体1工作面上拱。同时,在掩膜版本体1工作面覆有涂层,能够增加其耐磨性。With reference to FIG. 1 , this embodiment provides a mask. Based on the structure and principle described in
可以理解的是,掩膜版本体1包括上下两个端面,其上端面为工作面,而其下端面仅是掩膜版本体1的一个结构面,在本实施例中简称为结构面。It can be understood that the
应当理解的是,为使掩膜版本体1工作面上拱,张应力涂层中部的厚度大于两端的厚度,可以是张应力涂层长度方向的两端厚度小于中部厚度,也可以是张应力涂层宽度方向的两端厚度小于中部厚度。可知的是,通过控涂层长度方向的厚度变化,更容易控制支撑版的凸起量,因此,通常是张应力涂层长度方向的两端厚度小于中部厚度。It should be understood that, in order to make the working surface of the
对于张应力涂层的材质只需满足与支撑版本体1有足够的粘接力即可,在本实施例中,张应力涂层为氧化铝涂层和类金刚石涂层中的一种,当然也可以是其他类型的涂层。其中在掩膜版本体1上涂覆张应力涂层,可增强其表面的耐磨性。As for the material of the tensile stress coating, it only needs to have sufficient adhesion with the supporting
需要说明的是,掩膜版本体1工作面涂层应力可通过控制覆层时的参数进行控制,如;如热喷涂氧化铝涂层时,电流为150A,电压为32V时,掩膜版本体1工作面涂层应力为-5Pa。It should be noted that the stress of the coating on the working surface of the
实施例3Example 3
结合图1,本实施例提供了一种掩膜版,基于实施例1所记载的结构和原理,本实施例在掩膜版本体1的结构面覆有压应力涂层(涂层应力为正),如通过热喷涂、溅射、磁控等表面涂层技术,在掩膜版本体1的结构面涂覆压应力涂层,使得掩膜版本体1工作面上拱。Referring to FIG. 1 , this embodiment provides a mask. Based on the structure and principle described in
可以理解的是,掩膜版本体1包括上下两个端面,其上端面为工作面,而其下端面仅是掩膜版本体1的一个结构面,在本实施例中简称为结构面。It can be understood that the
应当理解的是,为使掩膜版本体1工作面上拱,压应力涂层中部的厚度大于两端的厚度,可以是压应力涂层长度方向的两端厚度小于中部厚度,也可以是压应力涂层宽度方向的两端厚度小于中部厚度。可知的是,通过控涂层长度方向的厚度变化,更容易控制掩膜版本体1工作面的凸起量,因此,通常是压应力涂层长度方向的两端厚度小于中部厚度。It should be understood that, in order to make the working surface of the
对于压应力涂层的材质只需满足与掩膜版本体1有足够的粘接力即可,在本实施例中,压应力涂层为氧化铝涂层和类金刚石涂层中的一种,当然也可以是其他类型的涂层。For the material of the compressive stress coating, it only needs to have sufficient adhesion with the
需要说明的是,掩膜版本体1结构面涂层应力可通过控制覆层时的参数进行控制,如;如热喷涂氧化铝涂层时,电流为250A,电压为36V时,掩膜版本体1结构面涂层应力为5Pa。It should be noted that the stress of the surface coating of the
实施例4Example 4
本实施例提供了一种掩膜版制作方法,用于制作实施例2所述的掩膜版,包括以下步骤:The present embodiment provides a method for manufacturing a mask, which is used to manufacture the mask described in Embodiment 2, including the following steps:
S1、获得掩膜版本体1;S1. Obtain the
S2、在所述掩膜版本体1工作面涂覆张应力涂层,如通过热喷涂、溅射、磁控等表面涂层技术,在掩膜版本体1的工作面涂覆张应力涂层,使得掩膜版本体1工作面上拱。S2. Coating a tensile stress coating on the working surface of the
其中,步骤S2包括子步骤:Wherein, step S2 includes sub-steps:
S21、清洗掩膜版本体1;S21, cleaning the
清洗掩膜版本体1时,清洗液采用弱碱性药液,并用去离子水冲洗,确保掩膜版本体1表面无药液残留并烘干。When cleaning the
S22、将清洗后的掩膜版本体1移入涂层设备,并对喷涂腔抽真空、对掩膜版本体1加热;S22, moving the cleaned
掩膜版本体1进入涂层设备后,先进行抽真空和加热,加热温度为80~100℃,比蒸镀时掩膜版本体1表面温度高10~20℃即可,真空度达到0.001pa,保证掩膜版本体1、支撑夹具和装载框充分脱气,避免影响蒸镀材料的纯净度。After the
S23、清洁掩膜版本体1待涂层面,以去除待涂层表面的氧化层,确保涂层与掩膜版本体1有足够的结合力。S23 , cleaning the surface to be coated of the
S24、对掩膜版本体1清洁后的表面涂层;S24, the surface coating of the
具体来说,张应力涂层长度方向的两端厚度小于中部厚度,张应力涂层为氧化铝涂层和类金刚石涂层中的一种,当然也可以是其他类型的涂层。Specifically, the thickness of the two ends in the longitudinal direction of the tensile stress coating is smaller than the thickness of the middle part, and the tensile stress coating is one of an alumina coating and a diamond-like coating, and of course other types of coatings are also possible.
当热喷涂氧化铝涂层时,电流为150A,电压为32V时,掩膜版本体1工作面涂层应力为-5Pa。;When the aluminum oxide coating is thermally sprayed, the current is 150A and the voltage is 32V, the stress of the working surface of the
S25、掩膜版本体1降至室温后,给喷涂腔充入保护气,如充入氮气使涂层腔内的压力升至常压。S25. After the
实施例5Example 5
本实施例提供了一种掩膜版制作方法,用于制作实施例3所述的掩膜版,包括以下步骤:The present embodiment provides a method for manufacturing a mask, which is used to manufacture the mask described in
S1、获得掩膜版本体1;S1. Obtain the
S2、在所述掩膜版本体1工作面涂覆压应力涂层,如通过热喷涂、溅射、磁控等表面涂层技术,在掩膜版本体1的结构面涂覆压应力涂层,使得掩膜版本体1工作面上拱。S2. Coating a compressive stress coating on the working surface of the
其中,步骤S2包括子步骤:Wherein, step S2 includes sub-steps:
S21、清洗掩膜版本体1;S21, cleaning the
清洗掩膜版本体1时,清洗液采用弱碱性药液,并用去离子水冲洗,确保掩膜版本体1表面无药液残留并烘干。When cleaning the
S22、将清洗后的掩膜版本体1移入涂层设备,并对喷涂腔抽真空、对掩膜版本体1加热;S22, moving the cleaned
掩膜版本体1进入涂层设备后,先进行抽真空和加热,加热温度为80~100℃,比蒸镀时掩膜版本体1表面温度高10~20℃即可,真空度达到0.001pa,保证掩膜版本体1、支撑夹具和装载框充分脱气,避免影响蒸镀材料的纯净度。After the
S23、清洁掩膜版本体1待涂层面,以去除待涂层表面的氧化层,确保涂层与掩膜版本体1有足够的结合力。S23 , cleaning the surface to be coated of the
S24、对掩膜版本体1清洁后的表面涂层;S24, the surface coating of the
具体来说,压应力涂层长度方向的两端厚度小于中部厚度,压应力涂层为氧化铝涂层和类金刚石涂层中的一种,当然也可以是其他类型的涂层。Specifically, the thickness of the two ends in the longitudinal direction of the compressive stress coating is smaller than the thickness of the middle part, and the compressive stress coating is one of an alumina coating and a diamond-like coating, and of course other types of coatings are also possible.
当热喷涂氧化铝涂层时,电流为250A,电压为36V时,掩膜版本体1结构面涂层应力为5Pa。When the aluminum oxide coating is thermally sprayed, the current is 250A and the voltage is 36V, the stress of the surface coating of the
S25、掩膜版本体1降至室温后,给喷涂腔充入保护气,如充入氮气使涂层腔内的压力升至常压。S25. After the
实施例6Example 6
本实施例提供了一种掩膜版制作方法,用于制作实施例1-3中任意一个实施例所记载的掩膜版,包括以下步骤:The present embodiment provides a method for manufacturing a mask, which is used for manufacturing the mask described in any one of Embodiments 1-3, including the following steps:
S1、根据所述掩膜版边框3的深度、掩膜版涂层时的下垂量,按照预设的高度将支撑板5固定在所述装载框2上,即选择相应厚度的调节垫块42安装在连接件31和装载框2之间;S1. According to the depth of the
S2、将掩膜版边框3装载在所述装载框2内,使支撑板5位于所述掩膜版边框3内;S2, loading the
S3、将掩膜版本体1放置在掩膜版边框3内,并进行涂层处理。S3. The
需要说明的是,在装夹掩膜版本体1前,需要执行实施例4或实施例5的步骤S21,装夹完成后,执行实施例4或实施例5的步骤S22~S25。It should be noted that, before the
实施例7Example 7
本实施例提供了一种掩膜版制作夹具,用于实施实施例6所记载的方法,包括用于装载掩膜版边框3的装载框2,装载框2上端设有支撑板5,支撑板5各侧与装载框2对应的侧壁连接。This embodiment provides a reticle manufacturing jig for implementing the method described in Embodiment 6, including a loading frame 2 for loading a
其中,支撑板5与装载框2的连接,只需满足,在掩膜版边框3装载在装载框2内时,夹具凸起的高度为掩膜版边框3深度与支撑版工作时的下垂量之和。如掩膜版边框3深度30mm、支撑版工作时的下垂量为0.2mm,则支撑板5凸起的高度为3.2mm。Among them, the connection between the support plate 5 and the loading frame 2 only needs to satisfy that when the
而掩膜版边框3内孔的尺寸与掩膜版的尺寸适配,即掩膜版边框3长度方向或宽度方向的长度与掩膜版对应方向长度的尺寸差值为0-0.1mm,通常使得支撑板5的长度和宽度均小于掩膜版本体1对应的长度和宽度,以避免在装夹或拆卸掩膜版本1时划伤掩膜版本体1。The size of the inner hole of the
为适应不同下垂量的掩膜版,支撑版到装载框2间的投影距离可调,即支撑板5在装载框2上的高度可调节。可以理解的是,支撑板5可通过片状连接件31、杆状连接件31、U形连接件31、L型连接件31等形状的连接件31与装载框2连接,只需避免连接件31对掩膜版支撑框的安装造成影响即可。在支撑板5的各侧均设置有两个连接件31,从而确保支撑板5与装载框2连接的稳定性。In order to adapt to masks with different sagging amounts, the projection distance between the support plate and the loading frame 2 can be adjusted, that is, the height of the support plate 5 on the loading frame 2 can be adjusted. It can be understood that the support plate 5 can be connected to the loading frame 2 through the connecting
结合图2具体来说,对于支撑板5在装载框2上的高度可调的实施方式,装载框2各侧均设有高度调节机构4,支撑板5各侧通过连接件31与对应的高度调节机构4相连。高度调节机构4可以是螺杆调节结构,微动直线驱动器(压电陶瓷驱动器)等。2, for the embodiment in which the height of the support plate 5 on the loading frame 2 is adjustable, each side of the loading frame 2 is provided with a
结合图3,为精确控制支撑板5的高度和确保高度调节机构4的稳定性,在本实施例中,高度调节机构4包括与装载框2相连的竖杆41,竖杆41上由下往上依次穿设有调节垫块42、连接件31和固定螺母43,调节垫块42和连接件31均与竖杆41活动连接,以通过更换不同厚度的调节垫块42,改变支撑版的高度。3, in order to precisely control the height of the support plate 5 and ensure the stability of the
对于装载框2、连接件31和支撑板5的材质,通常采用不锈钢或铁镍合金,为降低生产制造成本,在本实施例中,装载框2、支撑板5和连接件31的材质均为不锈钢。The materials of the loading frame 2 , the connecting
需要说明的是,涂层前,先将掩膜版本体1固定到装载框2,并使支撑板5紧贴掩膜版本体1的非涂层面,然后通过连接杆31将支撑板5稳当固定在装载框2上,并选择合适高度的调节垫块42,保证掩膜版本体1工作面凸起高度为目标值。涂层时,掩膜版本体1垂直于水平面。It should be noted that, before coating, firstly fix the
以上所述,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,依据本发明的技术实质,在本发明的精神和原则之内,对以上实施例所作的任何简单的修改、等同替换与改进等,均仍属于本发明技术方案的保护范围之内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. According to the technical essence of the present invention, within the spirit and principles of the present invention, any simple Modifications, equivalent replacements and improvements, etc., still fall within the protection scope of the technical solution of the present invention.
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106048521A (en) * | 2016-06-12 | 2016-10-26 | 鄂尔多斯市源盛光电有限责任公司 | Preparation method of metal mask plate and metal mask plate |
CN206692714U (en) * | 2017-04-14 | 2017-12-01 | 信利(惠州)智能显示有限公司 | A kind of accurate mask plate framework |
CN108385058A (en) * | 2018-05-31 | 2018-08-10 | 京东方科技集团股份有限公司 | The manufacturing method of mask plate and mask plate |
CN108943670A (en) * | 2018-06-28 | 2018-12-07 | 信利光电股份有限公司 | A kind of 3D cover board and its processing method |
CN112011757A (en) * | 2020-08-26 | 2020-12-01 | 昆山国显光电有限公司 | Mask and evaporation device |
CN112251716A (en) * | 2020-10-21 | 2021-01-22 | 云谷(固安)科技有限公司 | Mask plate preparation method and mask plate |
-
2022
- 2022-01-28 CN CN202210105205.0A patent/CN114411091A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106048521A (en) * | 2016-06-12 | 2016-10-26 | 鄂尔多斯市源盛光电有限责任公司 | Preparation method of metal mask plate and metal mask plate |
CN206692714U (en) * | 2017-04-14 | 2017-12-01 | 信利(惠州)智能显示有限公司 | A kind of accurate mask plate framework |
CN108385058A (en) * | 2018-05-31 | 2018-08-10 | 京东方科技集团股份有限公司 | The manufacturing method of mask plate and mask plate |
CN108943670A (en) * | 2018-06-28 | 2018-12-07 | 信利光电股份有限公司 | A kind of 3D cover board and its processing method |
CN112011757A (en) * | 2020-08-26 | 2020-12-01 | 昆山国显光电有限公司 | Mask and evaporation device |
CN112251716A (en) * | 2020-10-21 | 2021-01-22 | 云谷(固安)科技有限公司 | Mask plate preparation method and mask plate |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN115896690A (en) * | 2022-11-30 | 2023-04-04 | 京东方科技集团股份有限公司 | Fine mask |
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