CN217824948U - Communication module - Google Patents
Communication module Download PDFInfo
- Publication number
- CN217824948U CN217824948U CN202222057878.1U CN202222057878U CN217824948U CN 217824948 U CN217824948 U CN 217824948U CN 202222057878 U CN202222057878 U CN 202222057878U CN 217824948 U CN217824948 U CN 217824948U
- Authority
- CN
- China
- Prior art keywords
- radio frequency
- unit
- interface
- communication module
- baseband
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Transceivers (AREA)
Abstract
The application discloses communication module includes: a PCIE interface; the base band unit is connected with the PCIE interface and is used for realizing a base band function and driving the radio frequency unit; the radio frequency interface is connected with the baseband unit; and the radio frequency unit is connected with the radio frequency interface and is used for realizing a radio frequency function. The radio frequency unit and the baseband unit are connected through the radio frequency interface instead of being arranged in one PCB, so that the distance between the radio frequency unit and the baseband unit is increased, the radio frequency unit can be flexibly arranged, the heat dissipation efficiency of the radio frequency unit is improved, and the interference between circuits is avoided.
Description
Technical Field
The application relates to the technical field of wireless communication equipment, in particular to a communication module.
Background
Generally, in an electronic device, a communication module is used for data communication so as to perform data interaction.
In the related art, the communication module is usually designed in an integrated manner, that is, all components are put into a very small PCB (Printed Circuit Board) size. Also, the PCB must be redesigned if devices other than Pin to Pin (Pin) need to be replaced after the design is finalized. The more frequency bands are required, the larger the required PCB size, and the trend toward miniaturization of products is often insufficient to provide sufficient PCB space. On the other hand, the small size causes problems such as difficulty in heat dissipation in the communication module.
Therefore, how to improve the heat dissipation efficiency of the communication module and avoid heat accumulation is a key issue of attention of those skilled in the art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a communication module to the radiating efficiency in the improvement module avoids the heat to pile up, improves communication equipment's performance.
In order to solve the above technical problem, the present application provides a communication module, including:
a PCIE interface;
the baseband unit is connected with the PCIE interface and used for realizing a baseband function and driving the radio frequency unit;
the radio frequency interface is connected with the baseband unit;
and the radio frequency unit is connected with the radio frequency interface and used for realizing a radio frequency function.
Optionally, the radio frequency interface includes a first radio frequency interface connected to the baseband unit and a second radio frequency interface connected to the radio frequency unit;
the first radio frequency interface and the second radio frequency interface.
Optionally, the first radio frequency interface is connected to the second radio frequency interface by a flexible connection line.
Optionally, the radio frequency unit is disposed on an upper side of the baseband unit.
Optionally, the radio frequency unit includes one or more of a low-bandwidth radio frequency subunit, a medium-bandwidth radio frequency subunit, and a high-bandwidth radio frequency subunit.
Optionally, the baseband unit is a preset driving baseband unit, and the preset driving baseband unit is configured to invoke a corresponding radio frequency drive to the radio frequency unit.
Optionally, the radio frequency interface includes a mobile industry processor interface, a supply voltage connection interface, a radio frequency input port, a communication receiving port, and a general input/output port.
Optionally, the general input/output port is configured to transmit configuration information of the radio frequency unit.
Optionally, the power supply voltage connector is configured to supply power to a connected unit.
Optionally, the radio frequency input port is configured to input a radio frequency signal.
The application provides a communication module, includes: a PCIE interface; the baseband unit is connected with the PCIE interface and used for realizing a baseband function and driving the radio frequency unit; the radio frequency interface is connected with the baseband unit; and the radio frequency unit is connected with the radio frequency interface and used for realizing a radio frequency function. The radio frequency unit and the baseband unit are connected through the radio frequency interface instead of being arranged in one PCB, so that the distance between the radio frequency unit and the baseband unit is increased, the radio frequency unit can be flexibly arranged, the heat dissipation efficiency of the radio frequency unit is improved, and the interference between circuits is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only the embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a communication module according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of another communication module according to an embodiment of the present disclosure;
fig. 3 is a schematic diagram of a stacking of communication modules according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a radio frequency interface according to an embodiment of the present disclosure.
Detailed Description
The core of the application is to provide a communication module to improve the heat dissipation efficiency in the module, avoid heat accumulation and improve the performance of communication equipment
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the related art, the communication module is usually designed in an integrated manner, that is, all components are placed in a small PCB size. Also, the PCB must be redesigned if devices other than Pin to Pin need to be replaced after the design is finalized. The more frequency bands are required, the larger the required PCB size, and the trend toward miniaturization of products is often insufficient to provide sufficient PCB space. On the other hand, the small size causes problems such as difficulty in heat dissipation in the communication module.
Therefore, the communication module is provided, the radio frequency unit and the baseband unit are connected through the radio frequency interface instead of being arranged in a PCB, the distance between the radio frequency unit and the baseband unit is increased, the radio frequency unit can be flexibly arranged, the heat dissipation efficiency of the radio frequency unit is improved, and the interference between circuits is avoided.
A communication module provided in the present application is illustrated by an embodiment.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a communication module according to an embodiment of the present disclosure.
In this embodiment, the module may include:
a PCIE interface 10;
the baseband unit 20 connected to the PCIE interface 10 is configured to implement a baseband function and drive the radio frequency unit 40;
a radio frequency interface 30 connected to the baseband unit 20;
and a radio frequency unit 40 connected to the radio frequency interface 30, for implementing a radio frequency function.
It can be seen that the communication module of this embodiment is mainly connected to the device through a PCIE (peripheral component interconnect express) interface, and provides a communication function. Therefore, it is conceivable that the communication module in the middle of this embodiment is a module that is plugged into use in a device. Therefore, the size of the communication module is required. When the design of the communication module is smaller and smaller, the conditions of poor heat dissipation efficiency, signal interference and the like of the communication module can occur. Therefore, in the embodiment of the present application, the baseband unit 20 and the rf unit 40 in the communication module are connected through the rf interface 30, so that the rf unit 40 and the baseband unit 20 can be separated by a certain distance, so as to improve the heat dissipation efficiency of the communication module.
The PCIE interface 10 is an interface for connecting the communication module with the outside. The PCIE interfaces 10 have different types under different usage standards, and the PCIE interface 10 of the corresponding type may be selected based on a specific usage scenario.
The baseband unit 20 is a unit of a frequency band inherent to the original electrical signal without modulation sent out in the communication module, that is, a basic unit in the communication module. Any one of the base band units 20 provided in the prior art may be selected in the actual operation process, and is not specifically limited herein.
The baseband unit 20 is a preset driving baseband unit 20, and the preset driving baseband unit 20 is preset with driving of the asynchronous rf unit 40, and can drive different rf units 40. Therefore, the preset drive baseband unit 20 is used to invoke the corresponding rf drive to the rf unit 40. That is, the type of the rf unit 40 is determined, and then the corresponding rf driver is selected based on the type.
The rf interface 30 is an interface for the baseband unit 20 to connect to the rf unit 40. In the related art, the baseband unit 20 and the rf unit 40 are disposed in a highly integrated PCB, which results in a problem of heat dissipation efficiency decrease and heat accumulation due to a too close distance between the baseband unit 20 and the rf unit 40. Further, problems such as signal interference are likely to occur. Therefore, in the technical scheme of the present application, the baseband unit 20 and the radio frequency unit 40 are connected through the radio frequency interface 30, so as to separate a certain distance between the baseband unit 20 and the radio frequency unit 40, and improve the heat dissipation efficiency at the same time.
The radio frequency unit 40 is used for implementing a radio frequency function. It can be seen that in the present embodiment, since the rf unit 40 is connected to the baseband unit 20 through the rf interface 30, the rf unit 40 is spaced apart from the baseband unit 20 by a certain distance, rather than being spaced too close together in the PCB, which results in heat accumulation.
Referring to fig. 2, fig. 2 is a schematic structural diagram of another communication module according to an embodiment of the present disclosure.
Further, the rf interface 30 includes a first rf interface 31 connected to the baseband unit 20 and a second rf interface 32 connected to the rf unit 40; a first radio frequency interface 31 and a second radio frequency interface 32.
That is, the rf interface 30 includes two-port interfaces, i.e., a first rf interface 31 and a second rf interface 32. The first rf interface 31 is configured to be connected to the baseband unit 20, and the second rf interface 32 is configured to be connected to the rf unit 40. Finally, the first radio interface 31 is connected to the second radio interface 32. Further, the connection line between the first rf interface 31 and the second rf interface 32 may be extended as needed to further extend the distance between the baseband unit 20 and the rf unit 40. Meanwhile, a rigid connection line or a flexible connection line may be used between the first rf interface 31 and the second rf interface 32. When using rigid connection wires, the rf unit 40 may be supported at a plurality of angles to accommodate the space in which the communication module is placed, while avoiding contact of the rf unit 40 with other units. When a flexible connection line is used, the rf unit 40 can be placed on the baseband unit 20, so as to increase the effective distance between the baseband unit 20 and the rf unit 40, improve the utilization rate of the space, and reduce the space occupied by the communication module.
Further, in order to improve the space occupancy rate, the first radio frequency interface 31 and the second radio frequency interface 32 are connected by using a flexible connection line. The flexible connecting line may be any one of the connecting lines provided in the prior art, and is not limited herein.
Referring to fig. 3, fig. 3 is a schematic view of a communication module stacked according to an embodiment of the present disclosure.
Further, when a flexible connection line is used, the rf unit 40 may be disposed on an upper side of the baseband unit 20. Namely, the two are placed in a stacked mode so as to reduce the space occupation and improve the space utilization rate.
Further, the rf unit 40 includes one or more of a low bandwidth rf subunit, a medium bandwidth rf subunit, and a high bandwidth rf subunit. That is, the rf unit 40 is any combination of low bandwidth rf sub-units, medium bandwidth rf sub-units and high bandwidth rf sub-units, so as to adapt the rf function to different rf environments. Therefore, further, the baseband unit 20 is a preset driving baseband unit 20, and may call corresponding rf driving for different rf units 40.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a radio frequency interface according to an embodiment of the present disclosure.
Further, the rf interface 30 includes a mobile industry processor interface, a power supply voltage connector, a rf input port, a communication receiving port, and a general purpose input/output port.
The General-purpose input/output (GPIO) is used to transmit configuration information of the rf unit 40. Accordingly, the baseband unit 20 can determine the model of the rf unit 40 according to the voltage status in the general input/output port, and select the corresponding driver software.
The power supply voltage connector (VCC) is used for supplying power to the connected units.
The Radio Frequency input ports (RF _ IN, radio Frequency _ IN) are used for inputting Radio Frequency signals.
Among them, mobile Industry Processor Interface (MIPI) is an open standard and a specification established for Mobile application processors by MIPI alliance.
Wherein, the communication receiving port (RX, RX receive) corresponds to the output, and the communication receiving unit is arranged inside the communication.
Obviously, in this embodiment, the baseband unit 20 and the rf unit 40 are designed in a standard interface manner, so as to facilitate subsequent replacement of different rf units 40, and the frequency band combination to be supported can be selected in a customized manner. And when the product is used with other products, the radio frequency circuit can be flexibly placed, so that great help is brought to solving of circuit interference and module heat dissipation.
In summary, in the present embodiment, the radio frequency unit 40 is connected to the baseband unit 20 by the radio frequency interface 30, instead of arranging the baseband unit 20 and the radio frequency unit 40 in one PCB, so that the distance between the radio frequency unit 40 and the baseband unit 20 is increased, and meanwhile, the radio frequency unit 40 can be flexibly arranged, thereby improving the heat dissipation efficiency of the radio frequency unit 40 and avoiding interference between circuits.
The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
Those of skill would further appreciate that the various illustrative components and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the components and steps of the various examples have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
A communication module provided by the present application is described in detail above. The principles and embodiments of the present application are described herein using specific examples, which are only used to help understand the method and its core idea of the present application. It should be noted that, for those skilled in the art, without departing from the principle of the present application, the present application can also make several improvements and modifications, and those improvements and modifications also fall into the protection scope of the claims of the present application.
Claims (10)
1. A communication module, comprising:
a PCIE interface;
the baseband unit is connected with the PCIE interface and used for realizing a baseband function and driving the radio frequency unit;
the radio frequency interface is connected with the baseband unit;
and the radio frequency unit is connected with the radio frequency interface and is used for realizing a radio frequency function.
2. The communication module of claim 1, wherein the radio frequency interface comprises a first radio frequency interface connected to the baseband unit and a second radio frequency interface connected to the radio frequency unit;
the first radio frequency interface and the second radio frequency interface.
3. The communication module of claim 2, wherein the first rf interface and the second rf interface are connected by a flexible connection line.
4. The communication module of claim 3, wherein the RF unit is disposed on an upper side of the baseband unit.
5. The communication module of any one of claims 1 to 4, wherein the RF unit comprises one or more of a low bandwidth RF subunit, a medium bandwidth RF subunit, and a high bandwidth RF subunit.
6. The communication module of claim 5, wherein the baseband unit is a preset driver baseband unit, and the preset driver baseband unit is configured to invoke a corresponding RF driver for the RF unit.
7. The communication module of claim 6, wherein the RF interface comprises a Mobil industry processor interface, a supply voltage connection port, a RF input port, a communication reception port, and a general purpose input/output port.
8. The communication module of claim 7, wherein the general purpose input/output port is configured to transmit configuration information of the RF unit.
9. The communication module of claim 7, wherein the supply voltage connector is configured to supply power to a connected unit.
10. The communication module of claim 7, wherein the rf input port is configured to input rf signals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222057878.1U CN217824948U (en) | 2022-08-05 | 2022-08-05 | Communication module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222057878.1U CN217824948U (en) | 2022-08-05 | 2022-08-05 | Communication module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217824948U true CN217824948U (en) | 2022-11-15 |
Family
ID=83973055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222057878.1U Active CN217824948U (en) | 2022-08-05 | 2022-08-05 | Communication module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217824948U (en) |
-
2022
- 2022-08-05 CN CN202222057878.1U patent/CN217824948U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0639314B1 (en) | Modular radio communications system | |
| JPH08107369A (en) | Plug-in radio module for operation with portable host equipment capable of radio communication | |
| CN101820460B (en) | Module for realizing SPI interface | |
| CN102176576A (en) | Universal serial bus (USB) plug, printed circuit board (PCB) connected with same and USB equipment | |
| EP3196761A1 (en) | Mobile terminal, power supply adapter, and upgrading method thereof | |
| CN217824948U (en) | Communication module | |
| EP1739797A1 (en) | Connector plug | |
| CN218006620U (en) | PCB stacked structure and electronic equipment | |
| CN101505163B (en) | Telephone functional module for mobile terminal | |
| CN101359919B (en) | Wireless module switching device | |
| CN204928821U (en) | USB interface and terminal equipment , antennal interface and NFC antenna, communication system | |
| CN213305856U (en) | Wireless module based on M.21216 SD module secondary development | |
| CN212278233U (en) | Communication module of M.2 interface based on 5G | |
| CN201656197U (en) | Switching device with wireless internet function | |
| CN102869187A (en) | Printed circuit board (PCB) as well as universal serial bus (USB) plug and USB device connected with same | |
| CN201289941Y (en) | Connection device with transmission and acceptance signal function | |
| CN201113102Y (en) | Mobile phone interface connector | |
| CN215645092U (en) | Signal integration device | |
| CN106685465A (en) | Communication terminal and wireless communication module | |
| CN110931943A (en) | External antenna and terminal equipment | |
| CN214591402U (en) | Wireless receiver and data transmission system | |
| CN209232775U (en) | A kind of wireless communication chips and wireless communication module | |
| CN220586500U (en) | High-speed wireless network card for notebook | |
| CN101771729A (en) | Communication method, module, system and terminal | |
| CN113890558B (en) | Hardware circuit structure compatible with LTEBand5 downlink carrier aggregation function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |