CN217822854U - light emitting device - Google Patents
light emitting device Download PDFInfo
- Publication number
- CN217822854U CN217822854U CN202221607865.0U CN202221607865U CN217822854U CN 217822854 U CN217822854 U CN 217822854U CN 202221607865 U CN202221607865 U CN 202221607865U CN 217822854 U CN217822854 U CN 217822854U
- Authority
- CN
- China
- Prior art keywords
- light
- emitting device
- control element
- side edge
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 238000005253 cladding Methods 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052810 boron oxide Inorganic materials 0.000 claims description 4
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- -1 acryl Chemical group 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 62
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 239000012788 optical film Substances 0.000 description 6
- 239000011247 coating layer Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
Abstract
本实用新型提供一种发光装置。发光装置包括一基板、一控制元件、一光反射层以及一发光元件。控制元件设置于基板上,且具有一上表面、一下表面以及四个侧表面,其中下表面面向基板,上表面相反于下表面,且侧表面连接上表面和下表面。光反射层包覆控制元件,且接触上表面和侧表面。发光元件设置于基板上。
The utility model provides a light emitting device. The light emitting device includes a substrate, a control element, a light reflection layer and a light emitting element. The control element is arranged on the substrate and has an upper surface, a lower surface and four side surfaces, wherein the lower surface faces the substrate, the upper surface is opposite to the lower surface, and the side surfaces connect the upper surface and the lower surface. The light reflection layer covers the control element and contacts the upper surface and the side surface. The light emitting element is arranged on the substrate.
Description
技术领域technical field
本实用新型涉及一种发光装置。更具体地来说,本实用新型尤其涉及一种具有控制元件的发光装置。The utility model relates to a light emitting device. More specifically, the present invention relates to a lighting device with a control element.
背景技术Background technique
随着科技的进步,人们对于发光装置的要求日益提高,不仅要求高发光效能,更要求低耗电量,因此发光二极管(LED)技术备受重视。发光二极管的优点在于发光效率高、反应时间快、使用寿命长以及不含汞等。除此之外,发光二极管还具有耐机械冲击、体积小、色域广泛等优点。因此,发光二极管便渐渐取代传统的发光装置。随着近年来发光二极管的快速发展,使发光二极管的应用领域大幅扩张,俨然成为二十一世纪的新型光源。就光源的应用而言,发光效率便是关键性的产品规格,因此许多研究者致力于提高发光二极管光效率。With the advancement of science and technology, people's requirements for light-emitting devices are increasing day by day, not only requiring high luminous efficacy, but also requiring low power consumption. Therefore, light-emitting diode (LED) technology has attracted more and more attention. The advantages of light-emitting diodes are high luminous efficiency, fast response time, long service life and no mercury. In addition, light-emitting diodes also have the advantages of resistance to mechanical shock, small size, and wide color gamut. Therefore, light-emitting diodes are gradually replacing traditional light-emitting devices. With the rapid development of light-emitting diodes in recent years, the application fields of light-emitting diodes have been greatly expanded, and they have become a new type of light source in the 21st century. As far as the application of the light source is concerned, the luminous efficiency is a key product specification, so many researchers are devoted to improving the luminous efficiency of LEDs.
然而,根据发光装置的小型化需求,发光二极管和控制发光二极管的芯片往往会相邻,从而会使得发光装置产生暗区,且发光二极管提供的光线也可能被芯片吸收造成发光效率下降。因此,如何解决前述各项问题始成一重要的课题。However, according to the miniaturization requirements of the light-emitting device, the light-emitting diode and the chip controlling the light-emitting diode are often adjacent to each other, which will cause a dark area in the light-emitting device, and the light provided by the light-emitting diode may also be absorbed by the chip, resulting in a decrease in luminous efficiency. Therefore, how to solve the foregoing problems becomes an important issue.
实用新型内容Utility model content
本实用新型的目的在于提出一种发光装置,以解决上述至少一个问题。The purpose of the present utility model is to provide a light emitting device to solve at least one of the above problems.
为了解决上述公知的问题点,本实用新型提供一种发光装置,包括一基板、一控制元件、一光反射层以及一发光元件。控制元件设置于基板上,且具有一上表面、一下表面以及四个侧表面,其中下表面面向基板,上表面相反于下表面,且侧表面连接上表面和下表面。光反射层包覆控制元件,且接触上表面和侧表面。发光元件设置于基板上。In order to solve the above known problems, the utility model provides a light emitting device, which includes a substrate, a control element, a light reflection layer and a light emitting element. The control element is arranged on the substrate and has an upper surface, a lower surface and four side surfaces, wherein the lower surface faces the substrate, the upper surface is opposite to the lower surface, and the side surfaces connect the upper surface and the lower surface. The light reflection layer covers the control element and contacts the upper surface and the side surface. The light emitting element is arranged on the substrate.
本实用新型一些实施例中,前述发光装置还包括一光穿透层,设置于基板上且包覆光反射层和发光元件。光反射层和光穿透层的一顶面之间形成一间隙。In some embodiments of the present invention, the light-emitting device further includes a light-transmitting layer disposed on the substrate and covering the light-reflecting layer and the light-emitting element. A gap is formed between the light reflection layer and a top surface of the light transmission layer.
本实用新型一些实施例中,前述侧表面包括一第一侧表面和一第二侧表面,且光反射层包括一第一侧边边缘、一第二侧边边缘以及一顶侧边缘。第一侧表面、第二侧表面和上表面分别面向第一侧边边缘、第二侧边边缘和顶侧边缘。第一侧表面和第一侧边边缘之间的距离大致相同于第二侧表面和第二侧边边缘之间的距离。上表面和顶侧边缘之间的距离大于或等于第一侧表面和第一侧边边缘之间的距离。于一些实施例中,上表面和顶侧边缘之间的距离小于第一侧表面和第一侧边边缘之间的距离。In some embodiments of the present invention, the aforementioned side surface includes a first side surface and a second side surface, and the light reflection layer includes a first side edge, a second side edge and a top side edge. The first side surface, the second side surface and the upper surface face the first side edge, the second side edge and the top side edge, respectively. The distance between the first side surface and the first side edge is approximately the same as the distance between the second side surface and the second side edge. The distance between the upper surface and the top side edge is greater than or equal to the distance between the first side surface and the first side edge. In some embodiments, the distance between the top surface and the top side edge is smaller than the distance between the first side surface and the first side edge.
本实用新型一些实施例中,前述光反射层包括一包覆部,且包覆部大致具有一长方体结构。In some embodiments of the present invention, the aforementioned light reflection layer includes a covering portion, and the covering portion generally has a cuboid structure.
本实用新型一些实施例中,前述光反射层还包括一延伸部,连接且围绕包覆部,其中延伸部的厚度小于包覆部的厚度。In some embodiments of the present invention, the aforementioned light reflection layer further includes an extension portion connected to and surrounding the covering portion, wherein the thickness of the extension portion is smaller than the thickness of the covering portion.
本实用新型一些实施例中,前述光反射层大致具有一球缺结构,且球缺结构的直径大致介于1毫米至3毫米。In some embodiments of the present invention, the aforementioned light reflection layer generally has a spherical segment structure, and the diameter of the spherical segment structure is approximately 1 mm to 3 mm.
本实用新型一些实施例中,前述光反射层的厚度大致介于150微米至200微米。In some embodiments of the present invention, the thickness of the aforementioned light reflection layer is approximately between 150 microns and 200 microns.
本实用新型一些实施例中,前述光反射层更接触控制元件的该下表面。In some embodiments of the present invention, the aforementioned light reflection layer is more in contact with the lower surface of the control element.
本实用新型一些实施例中,前述光反射层包括半硬化阶段(B-stage)胶体、硅、树脂或压克力。In some embodiments of the present invention, the aforementioned light reflection layer includes semi-hardened stage (B-stage) colloid, silicon, resin or acrylic.
本实用新型一些实施例中,前述控制元件包括一芯片和一包覆层,包覆层包覆芯片,且光反射层包覆包覆层,其中包覆层可包括二氧化钛、氧化硼或二氧化硅。于一些实施例中,控制元件包括一芯片,且该反射层直接接触芯片。又于一些实施例中,控制元件包括一芯片和一玻璃基板,芯片设置于玻璃基板上,且光反射层包覆芯片和玻璃基板。In some embodiments of the present invention, the aforementioned control element includes a chip and a coating layer, the coating layer covers the chip, and the light reflection layer covers the coating layer, wherein the coating layer can include titanium dioxide, boron oxide or silicon. In some embodiments, the control element includes a chip, and the reflective layer directly contacts the chip. In some embodiments, the control element includes a chip and a glass substrate, the chip is disposed on the glass substrate, and the light reflection layer covers the chip and the glass substrate.
本实用新型亦提供一种发光装置,包括一基板、一控制元件、一光反射层以及多个发光元件。控制元件设置于基板上。光反射层包覆控制元件。发光元件设置于基板上。其中,发光元件的至少部分设置于一范围内,控制元件与此范围相邻,且控制元件与此范围内的发光元件电性连接。The utility model also provides a light emitting device, which includes a substrate, a control element, a light reflection layer and a plurality of light emitting elements. The control element is arranged on the substrate. The light reflective layer covers the control element. The light emitting element is arranged on the substrate. Wherein, at least part of the light-emitting elements are arranged in a range, the control element is adjacent to the range, and the control element is electrically connected with the light-emitting elements in the range.
本实用新型一些实施例中,前述发光元件还包括一另一控制元件和一另一光反射层。另一控制元件设置于基板上,另一光反射层包覆另一控制元件。发光元件的至少部分设置于一另一范围内,另一控制元件与另一范围相邻,且另一控制元件与另一范围内的发光元件电性连接。其中,光反射层大致具有一长方体结构,且另一光反射层大致具有一球缺结构。In some embodiments of the present invention, the aforementioned light-emitting element further includes another control element and another light reflection layer. Another control element is disposed on the substrate, and another light reflection layer covers the other control element. At least part of the light-emitting element is arranged in another range, another control element is adjacent to the other range, and the other control element is electrically connected to the light-emitting element in the other range. Wherein, the light reflection layer roughly has a cuboid structure, and the other light reflection layer roughly has a spherical structure.
附图说明Description of drawings
根据以下的详细说明并配合所附附图可以更加理解本实用新型实施例。应注意的是,根据本产业的标准惯例,附图中的各种部件并未必按照比例绘制。事实上,可能任意的放大或缩小各种部件的尺寸,以做清楚的说明。Embodiments of the present utility model can be better understood according to the following detailed description and accompanying drawings. It should be noted that, in accordance with the standard practice in the industry, various features in the drawings have not necessarily been drawn to scale. In fact, the dimensions of the various features may be arbitrarily expanded or reduced for clarity of illustration.
图1为本实用新型一实施例的发光装置的示意图。FIG. 1 is a schematic diagram of a light emitting device according to an embodiment of the present invention.
图2为图1中沿A-A方向的剖视图。Fig. 2 is a cross-sectional view along A-A direction in Fig. 1 .
图3为本实用新型一实施例中的控制元件和光反射层的示意图。FIG. 3 is a schematic diagram of a control element and a light reflection layer in an embodiment of the present invention.
图4为图1中沿B-B方向的剖视图。Fig. 4 is a cross-sectional view along B-B direction in Fig. 1 .
图5为本实用新型另一实施例中的发光装置的示意图。FIG. 5 is a schematic diagram of a light emitting device in another embodiment of the present invention.
图6为本实用新型另一实施例中的发光装置的示意图。FIG. 6 is a schematic diagram of a light emitting device in another embodiment of the present invention.
图7为本实用新型另一实施例中的发光装置的示意图。FIG. 7 is a schematic diagram of a light emitting device in another embodiment of the present invention.
图8A为本实用新型一些实施例中的控制元件和光反射层的示意图。Figure 8A is a schematic diagram of a control element and a light reflective layer in some embodiments of the present invention.
图8B为本实用新型一些实施例中的控制元件和光反射层的示意图。Figure 8B is a schematic diagram of the control element and the light reflective layer in some embodiments of the present invention.
图8C为本实用新型一些实施例中的控制元件和光反射层的示意图。FIG. 8C is a schematic diagram of control elements and light reflective layers in some embodiments of the present invention.
附图标记如下:The reference signs are as follows:
100:基板100: Substrate
200:控制元件200: control element
201:上表面201: upper surface
202:下表面202: lower surface
203:侧表面203: side surface
203A:第一侧表面203A: first side surface
203B:第二侧表面203B: second side surface
203C:第三侧表面203C: third side surface
203D:第四侧表面203D: fourth side surface
210:芯片210: chip
220:包覆层220: cladding layer
230:玻璃基板230: glass substrate
300:发光元件300: light emitting element
400:光反射层400: light reflection layer
401:第一侧边边缘401: First side edge
402:第二侧边边缘402: Second side edge
403:第三侧边边缘403: third side edge
404:第四侧边边缘404: Fourth side edge
405:顶侧边缘405: top side edge
410:包覆部410: cladding department
420:延伸部420: Extension
500:光穿透层500: light penetrating layer
501:顶面501: top surface
600:光学薄膜600: Optical film
700:荧光胶700: fluorescent glue
A1,A2,A3,A4,B1,B2:范围A1,A2,A3,A4,B1,B2: range
D1,D2,D3,D4,D5:距离D1,D2,D3,D4,D5: distance
E:发光装置E: light emitting device
G:间隙G: Gap
T1,T2:厚度T1, T2: Thickness
具体实施方式Detailed ways
以下说明本实用新型的固定机构。然而,可轻易了解本实用新型提供许多合适的实用新型概念而可实施于广泛的各种特定背景。所公开的特定实施例仅仅用于说明以特定方法使用本实用新型,并非用以局限本实用新型的范围。The fixing mechanism of the present invention will be described below. It should be readily appreciated, however, that the present invention provides many suitable inventive concepts that can be implemented in a wide variety of specific contexts. The disclosed specific embodiments are only used to illustrate the use of the utility model in a specific way, and are not intended to limit the scope of the utility model.
除非另外定义,在此使用的全部用语(包括技术及科学用语)具有与此篇公开所属的本领域技术人员所通常理解的相同涵义。能理解的是这些用语,例如在通常使用的字典中定义的用语,应被解读成具有一与相关技术及本实用新型的背景或上下文一致的意思,而不应该以一理想化或过度正式的方式解读,除非在此特别定义。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It can be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the background or context of the related technology and the present utility model, and should not be interpreted in an idealized or over-formal means of interpretation, unless otherwise defined herein.
本说明书以下的公开内容是叙述各个构件及其排列方式的特定范例,以求简化实用新型的说明。当然,这些特定的范例并非用以限定本实用新型。例如,若是本说明书以下的公开内容叙述了将一第一特征形成于一第二特征之上或上方,即表示其包含了所形成的上述第一特征与上述第二特征是直接接触的实施例,亦包含了还可将附加的特征形成于上述第一特征与上述第二特征之间,而使上述第一特征与上述第二特征可能未直接接触的实施例。再者,为了方便描述附图中一特征与另一特征的关系,可使用空间相关用语,例如“下面”、“下方”、“之下”、“上方”、“之上”以及类似的用语等。除了附图所示出的方位之外,空间相关用语涵盖装置在使用或操作中的不同方位。所述装置也可被另外定位(旋转90度或在其他方位上),且同样可对应地解读于此所使用的空间相关描述。The following disclosure in this specification is a specific example describing each component and its arrangement, in order to simplify the description of the utility model. Of course, these specific examples are not intended to limit the present invention. For example, if the following disclosure in this specification describes that a first feature is formed on or above a second feature, it means that it includes the embodiment in which the above-mentioned first feature and the above-mentioned second feature are formed in direct contact , also includes an embodiment in which additional features may be formed between the above-mentioned first feature and the above-mentioned second feature, so that the above-mentioned first feature and the above-mentioned second feature may not be in direct contact. Furthermore, to facilitate describing the relationship of one feature to another in the drawings, spatially relative terms such as "below", "under", "under", "above", "over" and similar terms may be used. Wait. Spatially relative terms encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise positioned (rotated 90 degrees or at other orientations) as well, and the spatially relative descriptions used herein should be read accordingly.
图1至图4为本实用新型一实施例的发光装置E的示意图。前述发光装置E可使用于具有显示功能的各种电子设备中,例如公共信息显示器(public information display,PID)、电视(television)、显示器(monitor)、平板电脑(tablet computer)、智能智能手机(smart phone)、智能型手表(smart watch)或车用显示器等,但并不限定于此。1 to 4 are schematic diagrams of a light emitting device E according to an embodiment of the present invention. The aforementioned light-emitting device E can be used in various electronic devices with display functions, such as public information display (public information display, PID), television (television), monitor (monitor), tablet computer (tablet computer), smart phone ( smart phone), smart watch (smart watch) or car display, etc., but not limited thereto.
图2为图1中沿着A-A方向的剖视图。如图1和图2所示,发光装置E主要包括一基板100、多个控制元件200、多个发光元件300、多个光反射层400、一光穿透层500、多个光学薄膜600以及多个荧光胶700。Fig. 2 is a sectional view along the direction A-A in Fig. 1 . As shown in Figures 1 and 2, the light emitting device E mainly includes a
控制元件200设置于基板100上。举例而言,控制元件200可为一集成电路(integrated circuit,IC),其可包括一扇出(fan out)结构,且可具有至少一金属接点。控制元件200可具有一上表面201、一下表面202以及四个侧表面203,其中下表面202面向基板100且与基板100接触,上表面201相反于下表面202,且侧表面203连接上表面201和下表面202。于本实施例中,控制元件200大致具有长方体结构,因此上表面201和下表面202大致垂直于四个侧表面203,且四个侧表面203亦彼此相互垂直。The
发光元件300同样设置于基板100上。举例而言,发光元件300可为发光二极管(light-emitting diode,LED),包括无机发光二极管、有机发光二极管(Organic Light-Emitting Diode,OLED)、次毫米发光二极管(mini LED)、微发光二极管(micro LED)、量子点发光二极管(Quantum Dots Light-Emitting Diode,QLED or QD-LED)、其他适当的发光二极管或上述的组合,但并不限定于此。发光元件300可位于多个彼此分开的不同范围内。于本实施例中,发光元件300可分别位于范围A1、A2、A3、A4、B1、B2中,前述控制元件200的其中一个可设置在邻近于范围A1、A2、A3、A4的位置,且可通过基板100上的电路与范围A1、A2、A3、A4内的发光元件300电性连接。此控制元件200可控制范围A1、A2、A3、A4内的发光元件300,使范围A1、A2、A3、A4内的发光元件300发出光线或停止发出光线。The
请一并参阅图2和图3,光反射层400设置于基板100上且包覆控制元件200。具体而言,光反射层400可接触控制元件200的上表面201、四个侧表面203以及部分的基板100,因此,控制元件200将可完全被光反射层400所遮蔽而不会从光反射层400显露。光反射层400例如可包括半硬化阶段(B-stage)胶体、硅、树脂或压克力。由于光反射层400大致呈白色,因此可避免发光装置E运作时在控制元件200的位置产生暗区,进而提升发光效能与亮度。Please refer to FIG. 2 and FIG. 3 together. The light
在本实施例中,光反射层400大致具有一长方体结构,且包括一第一侧边边缘401、一第二侧边边缘402、一第三侧边边缘403、一第四侧边边缘404以及一顶侧边缘405。控制元件200面朝第一侧边边缘401、第二侧边边缘402、第三侧边边缘403以及第四侧边边缘404的侧表面203可被分别定义为第一侧表面203A、第二侧表面203B、第三侧表面203C以及第四侧表面203D。第一侧边边缘401和第一侧表面203A之间的距离D1可大致相同于第二侧边边缘402和第二侧表面203B之间的距离D2、第三侧边边缘403和第三侧表面203C之间的距离D3以及第四侧边边缘404和第四侧表面203D之间的距离D4,以使发光装置E产生均匀的亮度。顶侧边缘405和上表面201之间的距离D5可大于或等于第一侧边边缘401和第一侧表面203A之间的距离D1,以增强减少暗区的效果。于一些实施例中,顶侧边缘405和上表面201之间的距离D5可小于第一侧边边缘401和第一侧表面203A之间的距离D1,以减少发光装置E的厚度,以利发光装置E的小型化/薄型化设计。In this embodiment, the
于本实施例中,发光元件300可发出白光,且荧光胶700可包覆发光元件300。如此一来,发光元件300所提供的光线在穿过荧光胶700后,即可转换为期望颜色的光线(例如蓝光、红光或绿光)。In this embodiment, the
光穿透层500设置于基板100上且包覆光反射层400和荧光胶700。光学薄膜600则设置于光穿透层500的顶面501上,使得光穿透层500位于光学薄膜600和基板100之间。特别的是,光反射层400和光穿透层500的顶面501之间形成有一间隙G,因此发光元件300的部分光线可在间隙G中混光,进而提升发光装置E的发光效果。于本实施例中,光穿透层500的厚度约为25毫米,且光反射层400的厚度可介于150微米至200微米,以提高混光的效率。The light-transmitting
前述光学薄膜600例如可包括扩散膜、增亮膜及/或偏光膜,但并不限定于此。The aforementioned
图4为图1中沿着B-B方向的剖视图。如图1和图4所示,在本实施例中,另一个控制元件200可设置在邻近于范围B1、B2的位置,且可通过基板100上的电路与范围B1、B2内的发光元件300电性连接。此控制元件200可控制范围B1、B2内的发光元件300,使范围B1、B2内的发光元件300发出光线或停止发出光线。包覆此控制元件200的光反射层400可大致具有一球缺结构,其直径大致介于1毫米至3毫米,因此光反射层400和光穿透层500的顶面501之间的间隙G也可以产生良好的混光效果。此外,包覆范围B1、B2内的发光元件300的荧光胶700亦可对应地具有球缺结构。Fig. 4 is a cross-sectional view along B-B direction in Fig. 1 . As shown in FIGS. 1 and 4 , in this embodiment, another
请参阅图5,于一些实施例中,发光元件300可直接发出期望颜色的光线(例如蓝光、红光或绿光),因此荧光胶700可被省略。此外,光学薄膜600亦可依需求省略或添加。Please refer to FIG. 5 , in some embodiments, the
请参阅图6,于一些实施例中,控制元件200的金属接点自控制元件200的下表面202凸出,且光反射层400可接触控制元件200的下表面202,以增强减少暗区的效果。Please refer to FIG. 6 , in some embodiments, the metal contacts of the
请参阅图7,于一些实施例中,光反射层400包括一包覆部410和一延伸部420,其中包覆部410包覆控制元件200且大致具有一长方体结构,延伸部420则连接并围绕前述包覆部410,且与基板100接触。包覆部410的厚度T1大于延伸部420的厚度T2。通过前述结构,可更进一步地提升发光装置E的发光效果。Please refer to FIG. 7 , in some embodiments, the
前述各个实施例中的控制元件200可依需求使用不同的控制元件200。举例而言,如图8A所示,于一些实施例中,控制元件200可包括一芯片210和一包覆层220。包覆层220包覆芯片210,且光反射层400包覆包覆层220。包覆层220例如可包括二氧化钛(TiO2)、氧化硼(BN)或二氧化硅(SiO2),但并不限定于此。The
如图8B所示,于一些实施例中,控制元件200可仅包括一芯片210,且光反射层400可包覆且直接接触此芯片210。如图8C所示,于一些实施例中,控制元件200可包括一芯片210和一玻璃基板230,芯片210可设置于玻璃基板230上,且光反射层400可包覆且直接接触芯片210和玻璃基板230。As shown in FIG. 8B , in some embodiments, the
前述各实施例间特征只要不违背发明精神或相冲突,均可任意混合搭配使用。As long as the features of the aforementioned embodiments do not violate the spirit of the invention or conflict with each other, they can be mixed and matched arbitrarily.
综上所述,本实用新型提供一种发光装置,包括一基板、一控制元件、一光反射层以及一发光元件。控制元件设置于基板上,且具有一上表面、一下表面以及四个侧表面,其中下表面面向基板,上表面相反于下表面,且侧表面连接上表面和下表面。光反射层包覆控制元件,且接触上表面和侧表面。发光元件设置于基板上。To sum up, the present invention provides a light emitting device, which includes a substrate, a control element, a light reflection layer and a light emitting element. The control element is arranged on the substrate and has an upper surface, a lower surface and four side surfaces, wherein the lower surface faces the substrate, the upper surface is opposite to the lower surface, and the side surfaces connect the upper surface and the lower surface. The light reflection layer covers the control element and contacts the upper surface and the side surface. The light emitting element is arranged on the substrate.
本实用新型亦提供一种发光装置,包括一基板、一控制元件、一光反射层以及多个发光元件。控制元件设置于基板上。光反射层包覆控制元件。发光元件设置于基板上。其中,发光元件的至少部分设置于一范围内,控制元件与此范围相邻,且控制元件与此范围内的发光元件电性连接。The utility model also provides a light emitting device, which includes a substrate, a control element, a light reflection layer and a plurality of light emitting elements. The control element is arranged on the substrate. The light reflective layer covers the control element. The light emitting element is arranged on the substrate. Wherein, at least part of the light-emitting elements are arranged in a range, the control element is adjacent to the range, and the control element is electrically connected with the light-emitting elements in the range.
虽然本实用新型的实施例及其优点已公开如上,但应该了解的是,本领域技术人员在不脱离本实用新型的精神和范围内,当可作更动、替代与润饰。此外,本实用新型的保护范围并未局限于说明书内所述特定实施例中的工艺、机器、制造、物质组成、装置、方法及步骤,任何所属技术领域中技术人员可从本实用新型公开内容中理解现行或未来所发展出的工艺、机器、制造、物质组成、装置、方法及步骤,只要可以在此处所述实施例中实施大抵相同功能或获得大抵相同结果皆可根据本实用新型使用。因此,本实用新型的保护范围包括上述工艺、机器、制造、物质组成、装置、方法及步骤。另外,每一权利要求构成个别的实施例,且本实用新型的保护范围也包括各个权利要求及实施例的组合。Although the embodiments of the present invention and their advantages have been disclosed above, it should be understood that those skilled in the art may make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the protection scope of the present utility model is not limited to the process, machine, manufacture, material composition, device, method and steps in the specific embodiments described in the description, any person skilled in the art can learn from the disclosure of the utility model It is understood that the current or future developed processes, machines, manufactures, material compositions, devices, methods and steps can be used according to the present invention as long as they can perform roughly the same functions or obtain roughly the same results in the embodiments described here . Therefore, the protection scope of the present utility model includes the above-mentioned process, machine, manufacture, composition of matter, device, method and steps. In addition, each claim constitutes an individual embodiment, and the protection scope of the present invention also includes the combination of each claim and the embodiment.
虽然本实用新型以前述数个较佳实施例公开如上,然而其并非用以限定本实用新型。本实用新型所属技术领域中技术人员,在不脱离本实用新型的精神和范围内,当可做些许的更动与润饰。因此本实用新型的保护范围当视随附的权利要求所界定者为准。此外,每个权利要求建构成一独立的实施例,且各种权利要求及实施例的组合皆介于本实用新型的范围内。Although the present invention is disclosed above with the aforementioned several preferred embodiments, they are not intended to limit the present invention. Those skilled in the technical field to which the utility model belongs may make some changes and modifications without departing from the spirit and scope of the utility model. Therefore, the scope of protection of the present utility model should be defined by the appended claims. In addition, each claim constitutes an independent embodiment, and combinations of various claims and embodiments fall within the scope of the present invention.
Claims (19)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221607865.0U CN217822854U (en) | 2022-06-24 | 2022-06-24 | light emitting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202221607865.0U CN217822854U (en) | 2022-06-24 | 2022-06-24 | light emitting device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN217822854U true CN217822854U (en) | 2022-11-15 |
Family
ID=83994597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202221607865.0U Active CN217822854U (en) | 2022-06-24 | 2022-06-24 | light emitting device |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN217822854U (en) |
-
2022
- 2022-06-24 CN CN202221607865.0U patent/CN217822854U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11255524B2 (en) | Light emitting device | |
CN110858599B (en) | Pixel array packaging structure and display panel | |
CN102263098B (en) | Luminescent device and there is the light illuminating unit of this luminescent device | |
CN108878626A (en) | A kind of display panel and production method, display device | |
TWM453969U (en) | Light emitting device | |
CN117835760A (en) | Display panel and electronic device | |
US20190326486A1 (en) | Light emitting element and electronic device | |
CN113724578B (en) | electronic device | |
US20240204159A1 (en) | Light emitting diode device | |
CN217822854U (en) | light emitting device | |
TWI813764B (en) | Display device | |
KR101047633B1 (en) | Light emitting device and light unit having same | |
CN115274814A (en) | Display panel and display device | |
TW202238239A (en) | Backlight module and display device | |
TW202200931A (en) | Light-emitting device | |
US8217559B2 (en) | Single chip multicolor package | |
CN219591394U (en) | Pixel unit and display panel | |
CN117594627A (en) | A display panel and display device | |
CN116154087A (en) | Wiring substrate and manufacturing method thereof, light-emitting panel, backlight module and display device | |
CN117239032A (en) | Light emitting device and method of forming the same | |
WO2024260267A1 (en) | Display panel and electronic device | |
CN117525102A (en) | Display panel and preparation method thereof | |
KR20250005684A (en) | Light emitting device package and display device using same | |
CN117673234A (en) | A wiring substrate, a light-emitting substrate, a backlight module and a display device | |
WO2024020805A1 (en) | Backlight module and display device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |