CN217822854U - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
CN217822854U
CN217822854U CN202221607865.0U CN202221607865U CN217822854U CN 217822854 U CN217822854 U CN 217822854U CN 202221607865 U CN202221607865 U CN 202221607865U CN 217822854 U CN217822854 U CN 217822854U
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China
Prior art keywords
light
emitting device
control element
side edge
substrate
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CN202221607865.0U
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Chinese (zh)
Inventor
陈富鑫
林峻弘
施理健
林俊民
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Lextar Electronics Corp
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Lextar Electronics Corp
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Abstract

The utility model provides a light-emitting device. The light-emitting device comprises a substrate, a control element, a light reflecting layer and a light-emitting element. The control element is disposed on the substrate and has an upper surface, a lower surface and four side surfaces, wherein the lower surface faces the substrate, the upper surface is opposite to the lower surface, and the side surfaces connect the upper surface and the lower surface. The light reflection layer covers the control element and contacts the upper surface and the side surface. The light emitting element is disposed on the substrate.

Description

Light emitting device
Technical Field
The utility model relates to a light-emitting device. More particularly, the present invention relates to a light emitting device having a control element.
Background
With the progress of technology, the demand of light emitting devices is increasing, and not only high light emitting efficiency but also low power consumption is required, so Light Emitting Diode (LED) technology is receiving attention. The light emitting diode has the advantages of high luminous efficiency, quick response time, long service life, no mercury and the like. Besides, the light emitting diode also has the advantages of mechanical impact resistance, small volume, wide color gamut and the like. Therefore, the light emitting diode gradually replaces the conventional light emitting device. With the rapid development of light emitting diodes in recent years, the application field of light emitting diodes is greatly expanded, and the light emitting diodes become a novel light source in twenty-first century. For light source applications, the luminous efficiency is a critical product specification, and many researchers are working on improving the luminous efficiency of the led.
However, according to the miniaturization requirement of the light emitting device, the light emitting diode and the chip for controlling the light emitting diode are often adjacent to each other, so that the light emitting device generates a dark region, and the light provided by the light emitting diode may be absorbed by the chip to cause a decrease in light emitting efficiency. Therefore, how to solve the above problems is an important issue.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to provide a light emitting device to solve the above-mentioned at least one problem.
In order to solve the above-mentioned conventional problems, the present invention provides a light emitting device, which includes a substrate, a control element, a light reflecting layer and a light emitting element. The control element is disposed on the substrate and has an upper surface, a lower surface and four side surfaces, wherein the lower surface faces the substrate, the upper surface is opposite to the lower surface, and the side surfaces connect the upper surface and the lower surface. The light reflection layer covers the control element and contacts the upper surface and the side surface. The light emitting element is disposed on the substrate.
In some embodiments of the present invention, the light-emitting device further includes a light-penetrating layer disposed on the substrate and covering the light-reflecting layer and the light-emitting element. A gap is formed between the light reflecting layer and a top surface of the light transmitting layer.
In some embodiments, the side surface includes a first side surface and a second side surface, and the light reflecting layer includes a first side edge, a second side edge and a top side edge. The first side surface, the second side surface, and the upper surface face the first side edge, the second side edge, and the top side edge, respectively. The distance between the first side surface and the first side edge is substantially the same as the distance between the second side surface and the second side edge. The distance between the upper surface and the top side edge is greater than or equal to the distance between the first side surface and the first side edge. In some embodiments, the distance between the upper surface and the top side edge is less than the distance between the first side surface and the first side edge.
In some embodiments of the present invention, the light reflecting layer includes a cladding portion, and the cladding portion has a rectangular parallelepiped structure.
In some embodiments, the light reflecting layer further includes an extension portion connected to and surrounding the cladding portion, wherein the extension portion has a thickness smaller than that of the cladding portion.
In some embodiments of the present invention, the light reflecting layer substantially has a spherical segment structure, and a diameter of the spherical segment structure is substantially between 1 mm and 3 mm.
In some embodiments, the thickness of the light reflecting layer is approximately between 150 micrometers and 200 micrometers.
In some embodiments of the present invention, the light reflecting layer further contacts the lower surface of the control element.
In some embodiments of the present invention, the light reflecting layer includes a semi-hardening stage (B-stage) colloid, silicon, resin or acryl.
In some embodiments, the control element comprises a chip and a coating layer, the coating layer covers the chip, and the light reflecting layer covers the coating layer, wherein the coating layer may comprise titanium dioxide, boron oxide or silicon dioxide. In some embodiments, the control element comprises a chip, and the reflective layer directly contacts the chip. In some embodiments, the control device includes a chip and a glass substrate, the chip is disposed on the glass substrate, and the light-reflecting layer covers the chip and the glass substrate.
The present invention also provides a light emitting device, which includes a substrate, a control element, a light reflecting layer and a plurality of light emitting elements. The control element is arranged on the substrate. The light reflection layer covers the control element. The light emitting element is disposed on the substrate. At least part of the light-emitting elements are arranged in a range, the control elements are adjacent to the range, and the control elements are electrically connected with the light-emitting elements in the range.
In some embodiments, the light emitting device further includes another control element and another light reflecting layer. The other control element is arranged on the substrate, and the other light reflecting layer coats the other control element. At least part of the light emitting elements are arranged in another range, another control element is adjacent to the another range, and the another control element is electrically connected with the light emitting elements in the another range. The light reflecting layer has a rectangular structure, and the other light reflecting layer has a segment structure.
Drawings
Embodiments of the present invention will be understood more fully from the detailed description given below, taken together with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, the various components in the drawings are not necessarily drawn to scale. In fact, the dimensions of the various elements may be arbitrarily expanded or reduced for clarity of illustration.
Fig. 1 is a schematic view of a light emitting device according to an embodiment of the present invention.
Fig. 2 isbase:Sub>A sectional view taken alongbase:Sub>A-base:Sub>A in fig. 1.
Fig. 3 is a schematic diagram of a control element and a light reflecting layer according to an embodiment of the invention.
Fig. 4 is a sectional view taken along the direction B-B in fig. 1.
Fig. 5 is a schematic view of a light emitting device according to another embodiment of the present invention.
Fig. 6 is a schematic view of a light-emitting device according to another embodiment of the present invention.
Fig. 7 is a schematic view of a light-emitting device according to another embodiment of the present invention.
Fig. 8A is a schematic view of a control element and a light reflecting layer in some embodiments of the invention.
Fig. 8B is a schematic diagram of a control element and a light reflecting layer in some embodiments of the invention.
Fig. 8C is a schematic view of a control element and a light reflecting layer in some embodiments of the invention.
The reference numbers are as follows:
100 substrate
200 control element
201 upper surface
202 lower surface
203 side surface
203A first side surface
203B the second side surface
203C third side surface
203D fourth side surface
210 chip
220 coating layer
230 glass substrate
300 light emitting element
400 light reflecting layer
401 first side edge
402 second side edge
403 third side edge
404 fourth side edge
405 top side edge
410 coating part
420 an extension part
500 light transmitting layer
501 top surface
600 optical film
700 fluorescent glue
A1, A2, A3, A4, B1, B2: the ranges
Distance D1, D2, D3, D4, D5
E, a light-emitting device
G is clearance
T1, T2 thickness
Detailed Description
The fixing mechanism of the present invention will be described below. It should be appreciated, however, that the present invention provides many applicable inventive concepts that can be embodied in a wide variety of specific contexts. The particular embodiments disclosed are illustrative only of the use of the invention in a particular manner and are not intended to limit the scope of the invention.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The following disclosure of the present invention describes specific examples of components and their arrangement in order to simplify the description of the invention. Of course, these specific examples are not intended to limit the present invention. For example, if the following disclosure of the present specification states a first feature being formed on or above a second feature, that description includes embodiments in which the first feature is formed in direct contact with the second feature, and also includes embodiments in which additional features may be formed interposing the first feature and the second feature, such that the first feature and the second feature may not be in direct contact. Furthermore, spatially relative terms, such as "lower," "below," "lower," "above," "upper," and the like, may be used herein for ease of describing the relationship of one feature to another in the figures. Spatially relative terms encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may also be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Fig. 1 to 4 are schematic views of a light emitting device E according to an embodiment of the present invention. The light emitting device E may be used in various electronic devices having a display function, such as a Public Information Display (PID), a television (television), a monitor (monitor), a tablet computer (tablet computer), a smart phone (smart phone), a smart watch (smart watch), a vehicle display, and the like, but is not limited thereto.
Fig. 2 isbase:Sub>A sectional view taken alongbase:Sub>A-base:Sub>A in fig. 1. As shown in fig. 1 and fig. 2, the light emitting device E mainly includes a substrate 100, a plurality of control elements 200, a plurality of light emitting elements 300, a plurality of light reflecting layers 400, a light transmitting layer 500, a plurality of optical films 600, and a plurality of fluorescent glue 700.
The control device 200 is disposed on the substrate 100. For example, the control device 200 may be an Integrated Circuit (IC), which may include a fan-out (fan out) structure, and may have at least one metal contact. The control device 200 may have an upper surface 201, a lower surface 202 and four side surfaces 203, wherein the lower surface 202 faces the substrate 100 and contacts the substrate 100, the upper surface 201 is opposite to the lower surface 202, and the side surfaces 203 connect the upper surface 201 and the lower surface 202. In the present embodiment, the control element 200 has a substantially rectangular parallelepiped structure, so the upper surface 201 and the lower surface 202 are substantially perpendicular to the four side surfaces 203, and the four side surfaces 203 are also perpendicular to each other.
The light emitting device 300 is also disposed on the substrate 100. For example, the Light Emitting element 300 may be a Light-Emitting Diode (LED), including an inorganic LED, an Organic Light-Emitting Diode (OLED), a sub-millimeter Light-Emitting Diode (mini LED), a micro LED, a Quantum dot Light-Emitting Diode (QLED or QD-LED), other suitable LEDs, or a combination thereof, but is not limited thereto. The light emitting elements 300 may be located in a plurality of different ranges that are separated from each other. In the present embodiment, the light emitting devices 300 can be respectively located in the ranges A1, A2, A3, A4, B1, and B2, one of the control devices 200 can be disposed at a position adjacent to the ranges A1, A2, A3, and A4, and can be electrically connected to the light emitting devices 300 in the ranges A1, A2, A3, and A4 through the circuit on the substrate 100. The control device 200 can control the light emitting devices 300 in the ranges A1, A2, A3, and A4 to make the light emitting devices 300 in the ranges A1, A2, A3, and A4 emit light or stop emitting light.
Referring to fig. 2 and 3, the light reflecting layer 400 is disposed on the substrate 100 and covers the control device 200. Specifically, the light reflecting layer 400 may contact the upper surface 201, the four side surfaces 203, and a portion of the substrate 100 of the control element 200, and therefore, the control element 200 may be completely shielded by the light reflecting layer 400 without being exposed from the light reflecting layer 400. The light reflective layer 400 may comprise, for example, a semi-cured (B-stage) colloid, silicon, resin, or acryl. Since the light reflecting layer 400 is substantially white, a dark region at the position of the control element 200 can be avoided when the light emitting device E operates, thereby enhancing the light emitting efficiency and brightness.
In the present embodiment, the light reflective layer 400 has a substantially rectangular parallelepiped structure and includes a first side edge 401, a second side edge 402, a third side edge 403, a fourth side edge 404 and a top side edge 405. The side surfaces 203 of the control element 200 facing the first side edge 401, the second side edge 402, the third side edge 403, and the fourth side edge 404 may be defined as a first side surface 203A, a second side surface 203B, a third side surface 203C, and a fourth side surface 203D, respectively. The distance D1 between the first side edge 401 and the first side surface 203A may be substantially the same as the distance D2 between the second side edge 402 and the second side surface 203B, the distance D3 between the third side edge 403 and the third side surface 203C, and the distance D4 between the fourth side edge 404 and the fourth side surface 203D, so that the light-emitting device E generates uniform luminance. Distance D5 between top side edge 405 and upper surface 201 may be greater than or equal to distance D1 between first side edge 401 and first side surface 203A to enhance the dark space reduction effect. In some embodiments, a distance D5 between top edge 405 and upper surface 201 may be smaller than a distance D1 between first side edge 401 and first side surface 203A, so as to reduce the thickness of light-emitting device E, thereby facilitating the miniaturization/thinning design of light-emitting device E.
In the present embodiment, the light emitting device 300 can emit white light, and the fluorescent glue 700 can cover the light emitting device 300. In this way, the light provided by the light emitting device 300 can be converted into light of a desired color (e.g., blue light, red light, or green light) after passing through the fluorescent glue 700.
The light transmissive layer 500 is disposed on the substrate 100 and covers the light reflective layer 400 and the fluorescent glue 700. The optical film 600 is disposed on the top surface 501 of the light transmissive layer 500 such that the light transmissive layer 500 is located between the optical film 600 and the substrate 100. Particularly, a gap G is formed between the light reflecting layer 400 and the top surface 501 of the light penetrating layer 500, so that part of the light emitting element 300 can be mixed in the gap G, thereby improving the light emitting effect of the light emitting device E. In the present embodiment, the thickness of the light transmissive layer 500 is about 25 mm, and the thickness of the light reflective layer 400 may be between 150 microns and 200 microns, so as to improve the light mixing efficiency.
The optical film 600 may include, for example, a diffusion film, a brightness enhancement film and/or a polarizing film, but is not limited thereto.
Fig. 4 is a sectional view taken along the direction B-B in fig. 1. As shown in fig. 1 and 4, in the present embodiment, another control device 200 may be disposed at a position adjacent to the ranges B1 and B2, and may be electrically connected to the light emitting devices 300 in the ranges B1 and B2 through a circuit on the substrate 100. The control device 200 can control the light emitting devices 300 in the ranges B1 and B2 to make the light emitting devices 300 in the ranges B1 and B2 emit light or stop emitting light. The light reflecting layer 400 covering the control device 200 may have a substantially spherical segment structure with a diameter of about 1 mm to 3 mm, so that the gap G between the light reflecting layer 400 and the top surface 501 of the light transmissive layer 500 may also produce a good light mixing effect. In addition, the fluorescent glue 700 covering the light emitting elements 300 in the ranges B1 and B2 may also have a corresponding spherical segment structure.
Referring to fig. 5, in some embodiments, the light emitting device 300 can directly emit light of a desired color (e.g., blue light, red light, or green light), and thus the fluorescent glue 700 can be omitted. In addition, the optical film 600 can be omitted or added as required.
Referring to fig. 6, in some embodiments, the metal contacts of the control device 200 protrude from the lower surface 202 of the control device 200, and the light reflective layer 400 may contact the lower surface 202 of the control device 200 to enhance the effect of reducing dark areas.
Referring to fig. 7, in some embodiments, the light reflecting layer 400 includes a cladding portion 410 and an extension portion 420, wherein the cladding portion 410 wraps the control device 200 and has a substantially rectangular parallelepiped structure, and the extension portion 420 is connected to and surrounds the cladding portion 410 and contacts the substrate 100. The thickness T1 of the cladding 410 is greater than the thickness T2 of the extension 420. By the structure, the light-emitting effect of the light-emitting device E can be further improved.
The control device 200 in the above embodiments may use different control devices 200 according to the requirement. For example, as shown in fig. 8A, in some embodiments, the control device 200 may include a chip 210 and a cladding 220. The cladding layer 220 wraps the chip 210, and the light reflecting layer 400 wraps the cladding layer 220. The cladding 220 may comprise, for example, titanium dioxide (TiO) 2 ) Boron oxide (BN) or silicon dioxide (SiO) 2 ) However, the present invention is not limited thereto.
As shown in fig. 8B, in some embodiments, the control device 200 may include only one chip 210, and the light reflective layer 400 may cover and directly contact the chip 210. As shown in fig. 8C, in some embodiments, the control device 200 may include a chip 210 and a glass substrate 230, the chip 210 may be disposed on the glass substrate 230, and the light reflective layer 400 may cover and directly contact the chip 210 and the glass substrate 230.
Features of the foregoing embodiments may be combined in any suitable manner without departing from the spirit or ambit of the invention.
To sum up, the present invention provides a light emitting device, which includes a substrate, a control element, a light reflecting layer and a light emitting element. The control element is disposed on the substrate and has an upper surface, a lower surface and four side surfaces, wherein the lower surface faces the substrate, the upper surface is opposite to the lower surface, and the side surfaces connect the upper surface and the lower surface. The light reflection layer covers the control element and contacts the upper surface and the side surface. The light-emitting element is arranged on the substrate.
The present invention also provides a light emitting device, which includes a substrate, a control element, a light reflecting layer and a plurality of light emitting elements. The control element is arranged on the substrate. The light reflection layer covers the control element. The light emitting element is disposed on the substrate. At least part of the light-emitting elements are arranged in a range, the control element is adjacent to the range, and the control element is electrically connected with the light-emitting elements in the range.
Although the embodiments of the present invention and their advantages have been disclosed in the foregoing description, it should be understood that various changes, substitutions and alterations can be made herein by those skilled in the art without departing from the spirit and scope of the invention. Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification, but rather, the process, machine, manufacture, composition of matter, means, methods and steps described in connection with the embodiment disclosed herein will be understood to one skilled in the art from the disclosure to be included within the scope of the present application as presently perceived, or in any future developed process, machine, manufacture, composition of matter, means, method and steps. Accordingly, the scope of the present application includes the processes, machines, manufacture, compositions of matter, means, methods, or steps described in the specification. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present invention also includes combinations of the respective claims and embodiments.
Although the present invention has been described with reference to several preferred embodiments, it is not intended to be limited thereto. The technical personnel in the technical field of the utility model can change and decorate a little without departing from the spirit and scope of the utility model. Therefore, the scope of the present invention should be determined by the appended claims. Furthermore, each claim constitutes a separate embodiment, and various combinations of claims and embodiments are within the scope of the invention.

Claims (19)

1. A light-emitting device, comprising:
a substrate;
a control element disposed on the substrate and having an upper surface, a lower surface and four side surfaces, wherein the lower surface faces the substrate, the upper surface is opposite to the lower surface, and the side surfaces connect the upper surface and the lower surface;
a light reflecting layer, which covers the control element and contacts the upper surface and the plurality of side surfaces; and
a light emitting element disposed on the substrate.
2. The light-emitting device according to claim 1, further comprising a light-transmissive layer disposed on the substrate and covering the light-reflective layer and the light-emitting element.
3. The light-emitting device according to claim 2, wherein a gap is formed between the light-reflecting layer and a top surface of the light-transmitting layer.
4. The light-emitting device according to claim 1, wherein the plurality of side surfaces includes a first side surface and a second side surface, and the light-reflecting layer includes a first side edge and a second side edge, wherein the first side surface and the second side surface face the first side edge and the second side edge, respectively, and a distance between the first side surface and the first side edge is the same as a distance between the second side surface and the second side edge.
5. The light-emitting device according to claim 1, wherein the plurality of side surfaces includes a first side surface, and the light-reflecting layer includes a first side edge and a top edge, wherein the first side surface and the top surface face the first side edge and the top edge, respectively, and a distance between the top surface and the top edge is greater than or equal to a distance between the first side surface and the first side edge.
6. The light-emitting device according to claim 1, wherein the plurality of side surfaces includes a first side surface, and the light-reflecting layer includes a first side edge and a top side edge, wherein the first side surface and the top surface face the first side edge and the top side edge, respectively, and a distance between the top surface and the top side edge is smaller than a distance between the first side surface and the first side edge.
7. The light-emitting device according to claim 1, wherein the light-reflecting layer includes a cladding portion, and the cladding portion has a rectangular parallelepiped structure.
8. The light-emitting device according to claim 7, wherein the reflector layer further comprises an extension portion connected to and surrounding the cladding portion, wherein the extension portion has a thickness smaller than that of the cladding portion.
9. The light-emitting device according to claim 1, wherein the reflector layer has a spherical segment structure.
10. The light-emitting device according to claim 9, wherein the diameter of the segment structure is between 1 mm and 3 mm.
11. The light-emitting device according to claim 1, wherein the light-reflecting layer has a thickness of 150 to 200 μm.
12. The light-emitting device according to claim 1, wherein the reflector layer further contacts the bottom surface of the control element.
13. The light-emitting device according to claim 1, wherein the light-reflecting layer comprises semi-cured stage glue, silicon, resin or acryl.
14. The light-emitting device according to claim 1, wherein the control element comprises a chip and a cladding layer, the cladding layer covers the chip, and the light-reflecting layer covers the cladding layer.
15. The light-emitting device according to claim 14, wherein the clad layer comprises titanium dioxide, boron oxide, or silicon dioxide.
16. The light-emitting device according to claim 1, wherein the control element comprises a chip, and the reflector layer directly contacts the chip.
17. The light-emitting device according to claim 1, wherein the control element comprises a chip and a glass substrate, the chip is disposed on the glass substrate, and the light-reflecting layer covers the chip and the glass substrate.
18. A light-emitting device, comprising:
a substrate;
a control element disposed on the substrate;
a light reflection layer for coating the control element; and
the light-emitting elements are arranged on the substrate, at least part of the light-emitting elements are arranged in a range, the control element is adjacent to the range, and the control element is electrically connected with the light-emitting elements in the range.
19. The light-emitting device according to claim 18, wherein the light-emitting element further comprises:
another control element disposed on the substrate; and
and the other light reflecting layer coats the other control element, wherein at least part of the light emitting elements are arranged in another range, the other control element is adjacent to the another range, and the other control element is electrically connected with the light emitting elements in the another range, wherein the light reflecting layer has a cuboid structure, and the other light reflecting layer has a spherical segment structure.
CN202221607865.0U 2022-06-24 2022-06-24 Light emitting device Active CN217822854U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202221607865.0U CN217822854U (en) 2022-06-24 2022-06-24 Light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202221607865.0U CN217822854U (en) 2022-06-24 2022-06-24 Light emitting device

Publications (1)

Publication Number Publication Date
CN217822854U true CN217822854U (en) 2022-11-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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CN (1) CN217822854U (en)

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