CN114420829A

CN114420829A - Display panel, manufacturing method of display panel and display device

Info

Publication number: CN114420829A
Application number: CN202210345761.5A
Authority: CN
Inventors: 鲜济遥; 马静
Original assignee: HKC Co Ltd
Current assignee: HKC Co Ltd
Priority date: 2022-04-02
Filing date: 2022-04-02
Publication date: 2022-04-29

Abstract

The application provides a display panel, a manufacturing method of the display panel and a display device. The display panel comprises a bottom plate, an array substrate and a light-emitting assembly which are sequentially stacked, wherein the light-emitting assembly comprises a pixel barrier layer, at least one light-reflecting layer, at least one light-emitting element and an insulating packaging layer. The utility model discloses a light emitting device, including array substrate, pixel barrier layer, insulating packaging layer cover, light-emitting element, light reflecting layer, pixel barrier layer, the pixel barrier layer is located one side of array substrate back to the bottom plate, at least one recess has been seted up to one side of pixel barrier layer back to array substrate, the reflector layer is located the inner wall of recess, light-emitting element installs in the recess and is located one side of reflector layer back to the pixel barrier layer, insulating packaging layer cover is located on the recess, insulating packaging layer is equipped with a plurality of protruding structures back to one side of light-emitting element protrudingly, light that light-emitting element sent and the partial light of reflector layer reflection light-emitting element are jetted out from a plurality of protruding structures. The reflecting layer increases the luminous flux of the light-emitting side, the protruding structure prevents the total reflection effect of light rays emitted by the light-emitting element, and the luminous efficiency of the display panel is improved.

Description

Display panel, manufacturing method of display panel and display device

Technical Field

The present disclosure relates to the field of display technologies, and in particular, to a display panel, a method for manufacturing the display panel, and a display device having the display panel.

Background

Micro Light Emitting diodes (Micro LEDs) have the advantages of high brightness, low power consumption, high resolution, long lifetime, high color saturation, wide viewing angle, wide color gamut, etc., and as the manufacturing process is mature and the price is reduced, the related display panels of Micro LEDs are increasing in recent years. Display panels are widely used in various industries and fields as means for transmitting visual information. The mainstream technical route for manufacturing the display panel at the present stage is to transfer the light emitting elements to the corresponding control array substrate, so as to realize the independent driving and control of each light emitting element, thereby achieving the display effect.

However, the light emitting device itself has high light emitting efficiency, and after the light emitting device is transferred to the control array substrate, due to the limitation of the light emitting side structure of the display panel, the total reflection phenomenon, and other factors, part of the light emitted by the light emitting device is lost in the display panel, so that the light emitting efficiency of the display panel is low, and other problems. Therefore, how to reduce the light loss of the light emitting device and improve the light output of the display panel is a problem to be solved by those skilled in the art.

Disclosure of Invention

In view of the above-mentioned shortcomings of the prior art, the present application is directed to a display panel, a method for manufacturing the display panel, and a display device having the display panel. The light emitting device aims to solve the problems that in the prior art, the light loss of a light emitting element is large and the light emitting rate of a display panel is low.

In order to solve the above technical problem, an embodiment of the present application provides a display panel, the display panel includes bottom plate, array substrate and the light emitting component that stacks gradually the setting, the array substrate with the light emitting component electricity is connected. The light emitting assembly includes a pixel blocking layer, at least one light reflecting layer, at least one light emitting element, and an insulating encapsulation layer. The pixel barrier layer is located the array substrate is back to one side of bottom plate, at least one recess has been seted up to one side of pixel barrier layer back to the array substrate, the reflector layer is located on the inner wall of recess, light emitting component install in the recess and be located the reflector layer is back to one side of pixel barrier layer, insulating encapsulation layer cover is located on the recess and with light emitting component encapsulates in the recess, insulating encapsulation layer is back to the protruding a plurality of protruding structures that are equipped with in one side of light emitting component, the light that light emitting component sent and the reflector layer reflection light emitting component's partial light is from a plurality of protruding structure department jets out.

In summary, the display panel provided by the embodiment of the present application includes a light emitting device, an array substrate, and a bottom plate, where the light emitting device includes a pixel blocking layer, at least one light reflecting layer, at least one light emitting element, and an insulating encapsulation layer. At least one groove is formed in one side, back to the array substrate, of the pixel blocking layer, the reflecting layer is attached to the inner wall of the groove, the light-emitting element is installed in the groove and located on one side, back to the pixel blocking layer, of the reflecting layer, the insulating packaging layer covers the groove and encapsulates the light-emitting element in the groove, a plurality of protruding structures are convexly arranged on one side, back to the light-emitting element, of the insulating packaging layer, the light-emitting element is electrically connected with the array substrate, and the light-emitting element emits light to the opening end of the groove. The pixel blocking layer is used for blocking light rays emitted by the adjacent light-emitting elements, and the phenomenon that the light rays emitted by the adjacent light-emitting elements are mutually interfered to further cause poor display effect of the display panel is avoided. The light reflecting layer is used for reflecting the light emitted by the light emitting element, so that the luminous flux of the light emitting side is increased, the optical loss of the light emitting element is reduced, and the power consumption is reduced. The insulating packaging layer is used for insulating and protecting the light-emitting element, so that the service life of the light-emitting element is prolonged. The protruding structure is used for preventing the light emitted by the light-emitting element from generating total reflection effect at the interface between the insulating packaging layer and the air so as to prevent the light from being emitted out, and the luminous efficiency of the display panel is further improved.

In an exemplary embodiment, the display panel further includes at least one substrate electrode and an electrode layer. The substrate electrode is embedded in the pixel blocking layer, the substrate electrode is electrically connected with the light-emitting element and the array substrate respectively, the electrode layer covers the opening end of the groove and is located on the side face, back to the protruding structure, of the insulating packaging layer, and the electrode layer is electrically connected with the light-emitting element.

In an exemplary embodiment, the light emitting element includes a light emitting element body, a first electrode, and a second electrode. The first electrode is fixedly arranged on one side of the light-emitting element body facing the substrate electrode, the first electrode is electrically connected with the light-emitting element body and the substrate electrode, the second electrode is fixedly arranged on one side of the light-emitting element body facing the electrode layer, and the second electrode is electrically connected with the light-emitting element body and the electrode layer.

In an exemplary embodiment, the display panel further includes a bonding pad and a planarization layer. The bonding pad is arranged between the substrate electrode and the first electrode, the bonding pad is used for bonding the substrate electrode and the first electrode, the flat layer is filled in gaps between the light reflecting layer and the electrode layer and between the groove and the electrode layer, and the flat layer is used for fixing the light-emitting element.

In an exemplary embodiment, the insulating encapsulation layer and the protruding structure are made of silicon dioxide, the insulating encapsulation layer has a thickness of 500nm to 5000nm, and the protruding structure has a thickness of 250nm to 2500 nm.

Based on the same inventive concept, the embodiment of the application provides a display device, which comprises a glass cover plate and the display panel, wherein the glass cover plate is covered on the light emergent side of the display panel and used for protecting the display panel.

In summary, the display device provided by the embodiment of the present application includes a glass cover plate and a display panel, the display panel includes a light emitting component, an array substrate and a bottom plate, the light emitting component includes a pixel blocking layer, at least one light reflecting layer, at least one light emitting element and an insulating encapsulation layer. At least one groove is formed in one side, back to the array substrate, of the pixel blocking layer, the reflecting layer is attached to the inner wall of the groove, the light-emitting element is installed in the groove and located on one side, back to the pixel blocking layer, of the reflecting layer, the insulating packaging layer covers the groove and encapsulates the light-emitting element in the groove, a plurality of protruding structures are convexly arranged on one side, back to the light-emitting element, of the insulating packaging layer, the light-emitting element is electrically connected with the array substrate, and the light-emitting element emits light to the opening end of the groove. The pixel blocking layer is used for blocking light rays emitted by the adjacent light-emitting elements, and the phenomenon that the light rays emitted by the adjacent light-emitting elements are mutually interfered to further cause poor display effect of the display panel is avoided. The light reflecting layer is used for reflecting the light emitted by the light emitting element, so that the luminous flux of the light emitting side is increased, the optical loss of the light emitting element is reduced, and the power consumption is reduced. The insulating packaging layer is used for insulating and protecting the light-emitting element, so that the service life of the light-emitting element is prolonged. The protruding structure is used for preventing the light emitted by the light-emitting element from generating total reflection effect at the interface between the insulating packaging layer and the air so as to prevent the light from being emitted out, and the luminous efficiency of the display panel is further improved.

Based on the same inventive concept, an embodiment of the present application further provides a manufacturing method of a display panel, for manufacturing the display panel, where the manufacturing method includes: providing a bottom plate, and forming an array substrate on one side surface of the bottom plate; forming a substrate electrode and a pixel barrier layer on the side surface of the array substrate, which is opposite to the bottom plate, forming a groove on the side surface of the pixel barrier layer, which is opposite to the array substrate, and forming a light reflecting layer on the inner wall of the groove; a light-emitting element is arranged in the groove and on one side of the light reflecting layer opposite to the pixel barrier layer, and the light-emitting element is electrically connected with the substrate electrode; and sequentially forming an electrode layer and an insulating packaging layer at the opening end of the groove so as to package the light-emitting element in the groove.

In an exemplary embodiment, the forming a substrate electrode and a pixel blocking layer on a side of the array substrate opposite to the bottom plate, forming a groove on a side of the pixel blocking layer opposite to the array substrate, and forming a light reflecting layer on an inner wall of the groove includes: forming at least one substrate electrode on a side of the array substrate facing away from the backplane; forming the pixel blocking layer covering the substrate electrode on the side surface of the array substrate opposite to the bottom plate; at least one groove is formed in the side face, back to the array substrate, of the pixel blocking layer, and the substrate electrode is exposed out of the groove; and forming the light reflecting layer on the inner wall of the groove, wherein the substrate electrode is exposed out of the light reflecting layer.

In an exemplary embodiment, the mounting of a light emitting element in the recess and on a side of the light reflecting layer facing away from the pixel blocking layer, the light emitting element being electrically connected to the substrate electrode, includes: forming a bonding pad at one end of the substrate electrode, which is opposite to the array substrate; bonding the light emitting element on a side of the bonding pad opposite to the substrate electrode; and forming a flat layer in the groove to fix the light-emitting element.

In an exemplary embodiment, the sequentially forming an electrode layer and an insulating encapsulation layer at an opening end of the groove to encapsulate the light emitting element in the groove includes: forming the electrode layer at the opening end of the groove to cover the light-emitting element in the groove, wherein the electrode layer is electrically connected with the light-emitting element; forming the insulating packaging layer on the side face, back to the light-emitting element, of the electrode layer so as to package the light-emitting element in the groove; and forming a plurality of convex structures on the surface of the insulating packaging layer, which faces away from the electrode layer.

To sum up, the method for manufacturing a display panel disclosed in the embodiment of the present application includes: providing a bottom plate, and forming an array substrate on one side surface of the bottom plate; forming a substrate electrode and a pixel barrier layer on the side surface of the array substrate, which is opposite to the bottom plate, forming a groove on the side surface of the pixel barrier layer, which is opposite to the array substrate, and forming a light reflecting layer on the inner wall of the groove; a light-emitting element is arranged in the groove and on one side of the light reflecting layer opposite to the pixel barrier layer, and the light-emitting element is electrically connected with the substrate electrode; and sequentially forming an electrode layer and an insulating packaging layer at the opening end of the groove so as to package the light-emitting element in the groove. The light reflecting layer is used for reflecting the light emitted by the light emitting element, so that the luminous flux of the light emitting side is increased, the optical loss of the light emitting element is reduced, and the power consumption is reduced. The insulating packaging layer is used for insulating and protecting the light-emitting element, so that the service life of the light-emitting element is prolonged. The side face, back to the electrode layer, of the insulating packaging layer is provided with a plurality of protruding structures, and the protruding structures are used for preventing light emitted by the light-emitting element from generating a total reflection effect on the insulating packaging layer and an air interface so as to prevent the light from being emitted.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic top view of a display panel according to an embodiment of the present disclosure;

fig. 2 is a schematic cross-sectional view of any pixel of a display panel according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a light emitting element of a display panel according to an embodiment of the present disclosure;

fig. 4 is a schematic flowchart illustrating a manufacturing method of a display panel according to an embodiment of the present disclosure;

fig. 5 is a schematic flowchart illustrating a step S200 in a method for manufacturing a display panel according to an embodiment of the present application;

fig. 6 is a schematic structural diagram corresponding to the step S210 in the method for manufacturing a display panel according to the embodiment of the present application;

fig. 7 is a schematic diagram of a corresponding structure formed in step S220 in the method for manufacturing a display panel according to the embodiment of the present application;

fig. 8 is a schematic forming flow diagram corresponding to step S230 in a manufacturing method of a display panel disclosed in the embodiment of the present application;

fig. 9 is a schematic structural diagram corresponding to the step S230 in the method for manufacturing a display panel according to the embodiment of the present application;

fig. 10 is a schematic structural diagram corresponding to the step S240 in the method for manufacturing a display panel according to the embodiment of the present application;

fig. 11 is a schematic flowchart illustrating a step S300 in a method for manufacturing a display panel according to an embodiment of the present application;

fig. 12 is a schematic structural diagram corresponding to the step S310 in the method for manufacturing a display panel according to the embodiment of the present application;

fig. 13 is a schematic structural diagram corresponding to the step S320 in the method for manufacturing a display panel according to the embodiment of the present application;

fig. 14 is a schematic structural diagram corresponding to the step S330 in the method for manufacturing a display panel according to the embodiment of the present application;

fig. 15 is a schematic flowchart illustrating a step S400 in a method for manufacturing a display panel according to an embodiment of the present application;

fig. 16 is a schematic structural diagram corresponding to the step S410 in the method for manufacturing a display panel according to the embodiment of the present application;

fig. 17 is a schematic structural diagram corresponding to the step S420 in the method for manufacturing a display panel disclosed in the embodiment of the present application.

Description of reference numerals:

1000-a display panel; 10-a pixel blocking layer; 11-a groove; 30-a light-reflecting layer; 40-a light emitting element; 41-a light emitting element body; 43-a first electrode; 45-a second electrode; 50-an insulating encapsulation layer; 52-raised structures; 60-a substrate electrode; 70-an electrode layer; 80-bond pads; 90-a planar layer; 100-a light emitting component; 200-an array substrate; 300-a base plate; s100-step 100; s200-step 200; s210-step 210; s220-step 220; s230-step 230; s240-step 240; s300-step 300; s310-step 310; s320-step 320; s330-step 330; s400-step 400; s410-step 410; s420-step 420; s430-step 430.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

The following description of the various embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments that can be implemented by the application. The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). Directional phrases used in this application, such as, for example, "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "side," and the like, refer only to the orientation of the appended drawings and are, therefore, used herein for better and clearer illustration and understanding of the application and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art. It should be noted that the terms "first", "second", and the like in the description and claims of the present application and in the drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "comprises," "comprising," "includes," "including," or "including," when used in this application, specify the presence of stated features, operations, elements, and/or the like, but do not limit one or more other features, operations, elements, and/or the like. Furthermore, the terms "comprises" or "comprising" indicate the presence of the respective features, numbers, steps, operations, elements, components or combinations thereof disclosed in the specification, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, elements, components or combinations thereof, and are intended to cover non-exclusive inclusions.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic top view structure diagram of a display panel disclosed in an embodiment of the present application, and fig. 2 is a schematic cross-sectional diagram of any pixel of the display panel disclosed in the embodiment of the present application. As shown in fig. 1 and fig. 2, a display panel 1000 provided in the embodiment of the present application may at least include a light emitting assembly 100, an array substrate 200, and a base plate 300, where the base plate 300, the array substrate 200, and the light emitting assembly 100 are sequentially stacked, and the array substrate 200 is located between the base plate 300 and the light emitting assembly 100. The array substrate 200 is respectively fixedly connected to the light emitting assembly 100 and the base plate 300, the array substrate 200 is electrically connected to the light emitting assembly 100, and the array substrate 200 is used for controlling an electrical signal passing through the light emitting assembly 100.

In the embodiment, the light emitting assembly 100 includes a pixel blocking layer 10, at least one light reflecting layer 30, at least one light emitting element 40, and an insulating encapsulation layer 50. The pixel blocking layer 10 is located on a surface of the array substrate 200 facing away from the bottom plate 300, at least one groove 11 is formed in one side of the pixel blocking layer 10 facing away from the array substrate 200, the reflective layer 30 is located on an inner wall of the groove 11, the light emitting element 40 is installed in the groove 11 and located on one side of the reflective layer 30 facing away from the pixel blocking layer 10, the insulating encapsulation layer 50 covers the groove 11 and encapsulates the light emitting element 40 in the groove 11, and a plurality of protruding structures 52 are convexly arranged on one side of the insulating encapsulation layer 50 facing away from the light emitting element 40, that is, the insulating encapsulation layer 50 covers an opening end of the groove 11 or a light emitting side of the light emitting component 100 (that is, one end of the groove 11 facing away from the pixel blocking layer 10). The light emitting elements 40 are electrically connected to the array substrate 200, and when the light emitting elements are operated (i.e., turned on), light is emitted toward the open ends of the grooves 11 (i.e., the ends of the grooves 11 facing away from the pixel blocking layer 10), the pixel blocking layer 10 is used for blocking light emitted from the adjacent light emitting elements 40, the reflective layer 30 is used for reflecting part of the light emitted from the light emitting elements 40 and emitting the reflected light from the open ends of the grooves 11, the protruding structures 52 are used for preventing the light emitted from the light emitting elements 40 from being totally reflected at the interface between the insulating encapsulation layer 50 and the air and further preventing the light from being emitted, i.e., the protruding structures 52 are used for preventing the light emitted from the light emitting elements 40 from being totally emitted at the open ends of the grooves 11 and further preventing the light from being emitted.

It can be understood that a plurality of grooves 11 are formed on a side of the pixel blocking layer 10 opposite to the array substrate 200, and each groove 11 is a pixel point. The number of the grooves 11 may be determined according to the resolution of the display panel 1000, for example, the number of pixels of the display panel with the resolution of 1920 × 1080 is 1920 × 1080, that is, the number of the grooves 11 is 1920 × 1080, the number of the light emitting elements 40 is 1920 × 1080, and the number of the light reflecting layer 30 is 1920 × 1080, that is, the grooves 11 and the light emitting elements 40 are arranged in a 1920 × 1080 matrix. Because the structures of all the pixel points are the same, one pixel point is selected for detailed introduction in the embodiment of the application.

In an exemplary embodiment, the bottom of a portion of the groove 11 is not covered by the light reflecting layer 30, so as to facilitate electrical connection between the light emitting element 40 and the array substrate 200.

In an exemplary embodiment, the overall shape of the recess 11 may be a hemisphere, that is, the recess 11 may be a hemispherical cavity, and accordingly, the light reflecting layer 30 is an annular surface corresponding to the inner wall of the recess 11, and the light reflecting layer 30 may reflect all the light rays emitted to the surface thereof to the insulating encapsulation layer 50 (i.e., the open end of the recess 11), so that the light loss of the light emitting element 40 is reduced, and the power consumption is reduced. In other embodiments, the overall shape of the groove 11 may also be rectangular, truncated cone, and conical, which is not particularly limited in this application. In this embodiment, the inner wall of the middle position of the groove 11 (i.e. the inner wall of the portion where the distance between the groove 11 and the array substrate 200 is the shortest) does not cover the light reflecting layer 30, so as to facilitate the electrical connection between the light emitting element 40 and the array substrate 200.

In an exemplary embodiment, the number of the grooves 11 corresponds to the number of the light reflecting layer 30 and the light emitting elements 40. It will be appreciated that one of the light reflecting layers 30 and one of the light emitting elements 40 are mounted and fixed in one of the recesses 11.

In an exemplary embodiment, the pixel blocking layer 10 may be made of a black positive photoresist. The reflective layer 30 may be a thin film made of molybdenum or silver. In an exemplary embodiment, the Light Emitting element 40 may be a Micro Light-Emitting Diode (Micro-LED), and the Micro-LED is a Light Emitting Diode with a micron size, and the Micro-LED may be used as a pixel on the display panel 1000 because of its small size, and the display panel 1000 manufactured by using the Micro-LED may be referred to as a Micro-LED display panel. The Micro-LED display panel has the advantages of high brightness, low power consumption, high resolution, long service life, high color saturation, wide viewing angle and the like. It is understood that the Light Emitting element 40 is a Micro-LED, which is only one embodiment in this embodiment, and in other embodiments of the present application, the Light Emitting element 40 may also be an Organic Light-Emitting Diode (OLED), which is not particularly limited in this application.

In an exemplary embodiment, the insulating encapsulation layer 50 is used for insulating and protecting the light emitting element 40, and it is understood that the insulating encapsulation layer 50 mainly prevents moisture, dust, oxygen and other impurities from entering the groove 11, so as to protect the light emitting element 40, and increase the service life of the light emitting element 40.

In an exemplary embodiment, a plurality of the protrusion structures 52 are positioned on the insulating encapsulation layer 50 corresponding to the grooves 11. The protruding structure 52 is used to prevent the light emitted from the light emitting device 40 from being totally reflected at the interface between the insulating encapsulation layer 50 and the air, so that the light cannot be emitted.

In an exemplary embodiment, the insulating encapsulation layer 50 may be made of silicon dioxide, and may have a thickness of 500nm to 5000nm, for example, 500nm, 1000nm, 1500nm, 1300nm, 2500nm, 3500nm, 4200nm, 4800nm, 5000nm, or other values.

In an exemplary embodiment, the axial cross-sectional shape of the projection 52 is trapezoidal. In other embodiments, the axial cross-sectional shape of the projection 52 may also be semicircular, rectangular, triangular, polygonal, etc. This is not particularly limited by the present application.

In an exemplary embodiment, the thickness of the protruding structures 52 may be 250nm to 2500nm, for example, 250nm, 550nm, 750nm, 1000nm, 1250nm, 1550nm, 1750nm, 2200nm, 2500nm, or other values. In the embodiment of the present application, the thickness of the protruding structure 52 refers to the distance between the top of the protruding structure 52 and the surface of the insulating encapsulation layer 50 facing away from the light emitting element 40.

In the embodiment of the present application, the array substrate 200 may be a Thin Film Transistor (TFT) control array substrate.

In summary, the display panel 1000 provided in the embodiment of the present application includes a light emitting assembly 100, an array substrate 200 and a bottom plate 300, wherein the light emitting assembly 100 includes a pixel blocking layer 10, at least one light reflecting layer 30, at least one light emitting element 40 and an insulating encapsulation layer 50. At least one groove 11 is formed in one side, back to the array substrate 200, of the pixel blocking layer 10, the reflecting layer 30 is attached to the inner wall of the groove 11, the light-emitting element 40 is installed in the groove 11 and located on one side, back to the pixel blocking layer 10, of the reflecting layer 30, the insulating packaging layer 50 covers the groove 11 and packages the light-emitting element 40 in the groove 11, the protruding structures 52 are arranged on one side, back to the light-emitting element 40, of the insulating packaging layer 50 in a protruding mode, the light-emitting element 40 is electrically connected with the array substrate 200, the array substrate 200 is used for controlling electric signals passing through the light-emitting element 40, and the light-emitting element 40 emits light to the opening end of the groove 11. The pixel blocking layer 10 is used for blocking light emitted by the adjacent light emitting elements 40, so as to avoid interference between light emitted by the adjacent light emitting elements 40 and further avoid poor display effect of the display panel 1000. The light reflecting layer 30 is used to reflect the light emitted from the light emitting element 40, increasing the luminous flux on the light emitting side, reducing the optical loss of the light emitting element 40 and reducing the power consumption. The insulating encapsulation layer 50 serves to insulate and protect the light emitting element 40, increasing the lifetime of the light emitting element 40. The protruding structure 52 is used to prevent the light emitted from the light emitting element 40 from being totally reflected at the interface between the insulating encapsulation layer 50 and the air, so that the light cannot be emitted, and the light emitting efficiency of the display panel is further improved.

As shown in fig. 2, in the embodiment of the present application, the display panel 1000 further includes at least one substrate electrode 60 and an electrode layer 70, the substrate electrode 60 is embedded in the pixel blocking layer 10 and corresponds to the position of the light emitting element 40, and the substrate electrode 60 is electrically connected to both the light emitting element 40 and the array substrate 200. The electrode layer 70 covers one side of the light emitting element 40 facing away from the light reflecting layer 30, one side of the light reflecting layer 30 facing away from the pixel blocking layer 10, and one side of the pixel blocking layer 10 facing away from the array substrate 200, that is, the electrode layer 70 covers the light emitting element 40, the light reflecting layer 30, and the pixel blocking layer 10 and is located on a side surface of the insulating encapsulation layer 50 facing away from the protruding structure 52, that is, the electrode layer 70 is located between the light emitting element 40 and the insulating encapsulation layer 50. The substrate electrode 60 is used to electrically connect the light emitting element 40 and the array substrate 200, and the electrode layer 70 is electrically connected to the light emitting element 40. That is, the light emitting element 40 is located between the substrate electrode 60 and the electrode layer 70, and is electrically connected to the substrate electrode 60 and the electrode layer 70, respectively.

In the embodiment of the present application, the shape of the electrode layer 70 matches with the shape of the side of the insulating encapsulation layer 50 back to the protruding structure 52, and the side of the electrode layer 70 back to the light emitting element 40, the reflective layer 30 and the pixel barrier layer 10 and the side of the insulating encapsulation layer 50 back to the protruding structure 52 are uniformly attached. It will be appreciated that the insulating encapsulation layer 50 also serves to insulate and protect the electrode layer 70, increasing the useful life of the electrode layer 70.

In the embodiment of the present application, the number of the substrate electrodes 60 is the same as the number of the grooves 11, the substrate electrodes 60 penetrate through the pixel blocking layer 10 from the bottom of the groove 11 to the array substrate 200, and the orthographic projection of the light emitting element 40 on the pixel blocking layer 10 coincides with or partially coincides with the substrate electrodes 60, so that the light emitting element 40 is in contact with the substrate electrodes 60 to realize electrical connection.

In an exemplary embodiment, the substrate electrode 60 may be a substrate anode or a substrate cathode, and the electrode layer 70 may be a common anode layer or a common cathode layer. It will be appreciated that the substrate electrode 60 is a substrate anode and, correspondingly, the electrode layer 70 is a common cathode layer; the substrate electrode 60 is a substrate cathode, and the electrode layer 70 is a common anode layer. This is not particularly limited by the present application.

In an exemplary embodiment, the substrate electrode 60 may be made of any one or more of platinum (Pt), gold (Au), aluminum (Al), copper (Cu), titanium (Ti), silver (Ag), scandium (Sc), yttrium (Y), chromium (Cr), nickel (Ni), and the like. The electrode layer 70 may be a thin film of indium tin oxide.

It will be appreciated that one of the light emitting elements 40 is electrically connected to one of the substrate electrodes 60, enabling individual control and driving of each of the light emitting elements 40. Meanwhile, the plurality of light emitting elements 40 are electrically connected to the same electrode layer 70, so that the layout space of the display panel 1000 is saved, and the manufacturing is facilitated.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a light emitting device of a display panel according to an embodiment of the present disclosure. As shown in fig. 3, in the embodiment of the present application, the light emitting device 40 includes a light emitting device body 41, and a first electrode 43 and a second electrode 45 electrically connected to the light emitting device body 41, wherein the first electrode 43 is fixedly disposed on a side of the light emitting device body 41 facing the substrate electrode 60 and electrically connected to the light emitting device body 41. The second electrode 45 is fixedly disposed on a side of the light emitting device body 41 facing the electrode layer 70, and is electrically connected to the light emitting device body 41. That is, the first electrode 43 is located between the light emitting element body 41 and the substrate electrode 60 and is electrically connected to the light emitting element body 41 and the substrate electrode 60, respectively, and the second electrode 45 is located between the light emitting element body 41 and the electrode layer 70 and is electrically connected to the light emitting element body 41 and the electrode layer 70, respectively. The light emitting element body 41 is used for emitting light.

In the present embodiment, the first electrode 43 may be an anode or a cathode, and the second electrode 45 may be a cathode or an anode, respectively. It is understood that the substrate electrode 60 is a substrate anode, the first electrode 43 is a cathode, and the second electrode 45 is an anode; if the substrate electrode 60 is a substrate cathode, the first electrode 43 is an anode, and the second electrode 45 is a cathode.

In the embodiment of the present application, the display panel 1000 further includes a bonding pad 80, the bonding pad 80 is disposed between the substrate electrode 60 and the first electrode 43, and the bonding pad 80 is used for bonding the substrate electrode 60 and the first electrode 43 of the light emitting element 40 and for achieving an electrical connection between the substrate electrode 60 and the first electrode 43 of the light emitting element 40.

In an exemplary embodiment, the bonding pad 80 may be made of metal tin or indium. In the embodiment of the present application, the material of the bonding pad 80 is illustrated as metal tin. It is understood that the metallic tin may be a tin paste.

In the embodiment of the present application, the display panel 1000 further includes a flat layer 90, the flat layer 90 is disposed between the light reflecting layer 30 and the electrode layer 70 and between the pixel blocking layer 10 and the electrode layer 70, and the flat layer 90 is used for filling gaps between the light reflecting layer 30 and the electrode layer 70 and between the groove 11 and the electrode layer 70 and fixing the light emitting element 40.

In an exemplary embodiment, the flat layer 90 is made of a material having good self-flowing properties, insulation properties, and light transmittance, and is cured to form the flat layer 90 after being irradiated with light.

In an exemplary embodiment, the flat layer 90 covers the light emitting element body 41, and the surface of the second electrode 45 facing away from the light emitting element body 41 exposes the flat layer 90, thereby facilitating electrical connection between the second electrode 45 and the electrode layer 70.

In an exemplary embodiment, a side of the second electrode 45 facing away from the light emitting element body 41 is flush with a side of the planarization layer 90 facing away from the light reflecting layer 30.

Based on the same inventive concept, the present application further provides a display device, which includes a glass cover plate and the display panel 1000, wherein the glass cover plate is covered on the light emitting side of the display panel 1000, and the glass cover plate is used for protecting the display panel 1000. Since the display panel 1000 has been described in more detail in the above embodiments, the description is omitted here.

It is understood that the display device may be used in electronic devices including, but not limited to, tablet computers, notebook computers, desktop computers, and the like. According to the embodiment of the present invention, the specific type of the display device is not particularly limited, and those skilled in the art can design the display device according to the specific requirements of the electronic device to which the display device is applied, and the details are not repeated herein.

In one embodiment, the display device further includes other necessary components and compositions such as a driving board, a power board, a high-voltage board, a key control board, etc., and those skilled in the art can supplement the display device accordingly according to the specific type and actual functions of the display device, which are not described herein again.

In summary, the display device provided in the embodiment of the present application includes a glass cover plate and a display panel 1000, the display panel 1000 includes a light emitting element 100, an array substrate 200 and a bottom plate 300, the light emitting element 100 includes a pixel blocking layer 10, at least one light reflecting layer 30, at least one light emitting element 40 and an insulating encapsulation layer 50. At least one groove 11 is formed in one side, back to the array substrate 200, of the pixel blocking layer 10, the reflecting layer 30 is located on the inner wall of the groove 11, the light-emitting element 40 is installed in the groove 11 and located on one side, back to the pixel blocking layer 10, of the reflecting layer 30, the insulating packaging layer 50 covers the groove 11 and packages the light-emitting element 40 in the groove 11, a plurality of protruding structures 52 are convexly arranged on one side, back to the light-emitting element 40, of the insulating packaging layer 50, the light-emitting element 40 is electrically connected with the array substrate 200, the array substrate 200 is used for controlling an electric signal passing through the light-emitting element 40, and the light-emitting element 40 emits light to the opening end of the groove 11. The pixel blocking layer 10 is used for blocking light emitted by the adjacent light emitting elements 40, so as to avoid interference between light emitted by the adjacent light emitting elements 40 and further avoid poor display effect of the display panel 1000. The light reflecting layer 30 is used to reflect the light emitted from the light emitting element 40, increasing the luminous flux on the light emitting side, reducing the optical loss of the light emitting element 40 and reducing the power consumption. The insulating encapsulation layer 50 serves to insulate and protect the light emitting element 40, increasing the lifetime of the light emitting element 40. The protruding structure 52 is used to prevent the light emitted from the light emitting element 40 from being totally reflected at the interface between the insulating encapsulation layer 50 and the air, so that the light cannot be emitted, and the light emitting efficiency of the display panel is further improved.

Based on the same inventive concept, the present application further provides a manufacturing method of a display panel, which is used for manufacturing the display panel 1000 shown in fig. 1 to 3. The content of the portion overlapping with the display panel 1000 in the manufacturing method of the present embodiment can directly refer to the description in the embodiment of the display panel 1000, and is not repeated herein. Referring to fig. 4, fig. 4 is a schematic flow chart illustrating a manufacturing method of a display panel according to an embodiment of the present disclosure, and as shown in fig. 4, the manufacturing method of the display panel at least includes the following steps.

S100, providing a base plate 300, and forming an array substrate 200 on one side of the base plate 300.

Specifically, the bottom plate 300 may be a glass bottom plate or a quartz bottom plate, a gate metal layer, a gate insulating layer, a semiconductor layer, a source drain metal layer, a passivation layer, and a transparent conductive layer are sequentially formed on one side surface of the bottom plate 300, and the gate metal layer, the gate insulating layer, the semiconductor layer, the source drain metal layer, the passivation layer, and the transparent conductive layer constitute the array substrate 200.

In the embodiment of the present application, the array substrate 200 may provide independent current drive for each pixel.

S200, forming a substrate electrode 60 and a pixel barrier layer 10 on the side of the array substrate 200 opposite to the bottom plate 300, forming a groove 11 on the side of the pixel barrier layer 10 opposite to the array substrate 200, and forming a light reflecting layer 30 on the inner wall of the groove 11.

And S300, mounting a light-emitting element 40 in the groove 11 and on the side, opposite to the pixel barrier layer 10, of the light-reflecting layer 30, wherein the light-emitting element 40 is electrically connected with the substrate electrode 60.

And S400, sequentially forming an electrode layer 70 and an insulating packaging layer 50 at the opening end of the groove 11 to package the light-emitting element 40 in the groove 11.

Referring to fig. 5, fig. 5 is a schematic flow chart illustrating a step S200 of a method for manufacturing a display panel according to an embodiment of the present application. As shown in fig. 5, the step 200 includes at least the following steps.

S210, forming at least one substrate electrode 60 on a side of the array substrate 200 opposite to the bottom plate 300.

Specifically, please refer to fig. 6, where fig. 6 is a schematic diagram of a corresponding structure formed in step S210 in a manufacturing method of a display panel disclosed in the embodiment of the present application. As shown in fig. 6, a substrate electrode 60 is formed on a side of the array substrate 200 facing away from the base plate 300 through processes of photoresist coating, exposure using a mask, development, etching, and photoresist removal.

In the present embodiment, the substrate electrode 60 may be made of any one or more of Pt, Au, Al, Cu, Ti, Ag, Sc, Y, Cr, Ni, and other metal materials. The current on the array substrate 200 is output to the light emitting element 40 through the substrate electrode 60.

S220, forming a pixel blocking layer 10 covering the substrate electrode 60 on a side of the array substrate 200 opposite to the bottom plate 300.

Specifically, please refer to fig. 7, and fig. 7 is a schematic diagram of a corresponding structure formed in step S220 in a manufacturing method of a display panel disclosed in the embodiment of the present application. As shown in fig. 7, a thin film of the pixel blocking layer 10 is formed on the side of the array substrate 200 opposite to the bottom plate 300, and the pixel blocking layer 10 covers the substrate electrode 60, that is, the substrate electrode 60 is located in the pixel blocking layer 10.

In the embodiment, the pixel blocking layer 10 may be made of a black positive photoresist.

S230, forming at least one groove 11 on a side surface of the pixel blocking layer 10 opposite to the array substrate 200, wherein the substrate electrode 60 is exposed out of the groove 11.

Specifically, please refer to fig. 8 and 9, in which fig. 8 is a schematic diagram of a forming flow corresponding to step S230 in a manufacturing method of a display panel disclosed in an embodiment of the present application, and fig. 9 is a schematic diagram of a corresponding structure formed in step S230 in the manufacturing method of the display panel disclosed in the embodiment of the present application.

In the embodiment of the present application, the pixel blocking layer 10 is a black positive photoresist, the chemical property of the portion irradiated by the ultraviolet light is changed, and the pixel blocking layer 10 with the changed chemical property can be removed by the developing solution. By controlling the pixel barrier layer 10 to receive ultraviolet light irradiation with different exposure doses, the pixel barrier layer is removed by the developing solution to generate a corresponding shape. In the embodiment of the present application, as shown in fig. 8, the pixel blocking layer 10 receives different degrees of violet light irradiation through the mask with gray level transition, the light flux at the middle part of the mask with gray level transition is the largest, and the light flux gradually decreases towards both sides. The larger the light flux is, the more the portion of the pixel blocking layer 10 where the chemical change occurs is, and after developing with the developer, the groove 11 having a semicircular shape is obtained.

As shown in fig. 9, a groove 11 is formed on a side of the pixel blocking layer 10 opposite to the array substrate 200 through processes such as mask exposure and development, and the overall shape of the groove 11 is semicircular. The substrate electrode 60 corresponds to the bottom of the groove 11, the substrate electrode 60 is exposed out of the groove 11, that is, the substrate electrode 60 is located at the bottom of the groove 11 (i.e., the inner wall of the portion of the groove 11 having the shortest distance to the array substrate 200), and the substrate electrode 60 penetrates through the pixel blocking layer 10.

In an exemplary embodiment, the number of the grooves 11 is multiple, each groove 11 corresponds to one pixel, and the specific number of the grooves 11 may be determined according to the resolution of the display panel 1000.

And S240, forming a light reflecting layer 30 on the inner wall of the groove 11, wherein the substrate electrode 60 is exposed out of the light reflecting layer 30.

Specifically, please refer to fig. 10, fig. 10 is a schematic diagram of a corresponding structure formed in step S240 in a manufacturing method of a display panel disclosed in the embodiment of the present application. As shown in fig. 10, the patterned light-reflecting layer 30 is obtained on the inner wall of the groove 11 by vacuum evaporation, a yellow light process and an etching process in sequence, wherein the yellow light process includes processes of coating, exposure, development and the like. The reflective layer 30 is not formed in the region of the inner wall of the groove 11 corresponding to the substrate electrode 60, that is, the inner wall of the middle position of the groove 11 (i.e., the inner wall of the portion of the groove 11 having the shortest distance to the array substrate 200) does not cover the reflective layer 30, so that the light emitting element 40 and the array substrate 200 are electrically connected.

In the present embodiment, the light reflecting layer 30 may be a thin film made of molybdenum or silver.

Referring to fig. 11, fig. 11 is a schematic flowchart illustrating a step S300 in a method for manufacturing a display panel according to an embodiment of the present application. As shown in fig. 11, the step 300 includes at least the following steps.

And S310, forming a bonding pad 80 at one end of the substrate electrode 60 opposite to the array substrate 200.

Specifically, please refer to fig. 12, fig. 12 is a schematic diagram of a corresponding structure formed in step S310 in the manufacturing method of the display panel according to the embodiment of the present application. As shown in fig. 12, the bonding pad 80 is formed at an end of the substrate electrode 60 opposite to the array substrate 200 by micro-needle holes, that is, the bonding pad 80 is formed at an end of the substrate electrode 60 exposed from the light reflecting layer 30.

In the embodiment of the present application, the bonding pad 80 may be made of tin metal or indium metal. In the embodiment of the present application, the material of the bonding pad 80 is illustrated as metal tin. It is understood that the metallic tin may be a tin paste.

And S320, bonding the light-emitting element 40 on the side, opposite to the substrate electrode 60, of the bonding pad 80.

Specifically, please refer to fig. 13, fig. 13 is a schematic diagram of a corresponding structure formed in step S320 in a manufacturing method of a display panel disclosed in the embodiment of the present application. As shown in fig. 13, the light emitting element 40 is transferred into the groove 11 by a bulk transfer technique, and the light emitting element 40 is bonded to the substrate electrode 60 through the bonding pad 80, so that the light emitting element 40 is electrically connected to the substrate electrode 60.

In an exemplary embodiment, the light emitting element 40 includes a light emitting element body 41 and a first electrode 43 and a second electrode 45 electrically connected to the light emitting element body 41. The first electrode 43 is connected to a side of the light emitting element 40 facing the bonding pad 80, and the second electrode 45 is connected to a side of the light emitting element 40 facing away from the bonding pad 80. The bonding pad 80 bonds the first electrode 43 and the substrate electrode 60, and electrically connects the first electrode 43 and the substrate electrode 60. The light emitting element body 41 is used for emitting light.

And S330, forming a flat layer 90 in the groove 11 to fix the light-emitting element 40.

Specifically, referring to fig. 14, fig. 14 is a schematic view of a corresponding structure formed in step S330 in a manufacturing method of a display panel disclosed in the embodiment of the present application. As shown in fig. 14, the raw material of the flat layer 90 has a good self-fluidity. Gaps between the light reflecting layer 30 and the light emitting element 40 and between the light emitting element 40 and the groove 11 are filled with a flat layer raw material, and the flat layer 90 is formed by light irradiation and curing.

In the present embodiment, the planarization layer 90 covers the light-emitting element body 41, and the second electrode 45 exposes the planarization layer 90. The flat layer 90 is used to fill the gaps between the light reflecting layer 30 and the light emitting element 40 and between the light emitting element 40 and the groove 11, and fix the light emitting element 40. It is understood that the flat layer 90 has good insulation and light transmittance, so that the light emitted from the light emitting element 40 can transmit through the flat layer 90.

Referring to fig. 15, fig. 15 is a schematic flowchart illustrating a step S400 in a method for manufacturing a display panel according to an embodiment of the present application. As shown in fig. 15, the step 400 includes at least the following steps.

And S410, forming an electrode layer 70 at the opening end of the groove 11 to cover the light-emitting element 40 in the groove 11, wherein the electrode layer 70 is electrically connected with the light-emitting element 40.

Specifically, please refer to fig. 16, fig. 16 is a schematic diagram of a corresponding structure formed in step S410 in the manufacturing method of the display panel disclosed in the embodiment of the present application. As shown in fig. 16, an electrode layer 70 is deposited by a physical vapor deposition technique on the side of the light emitting element 40 opposite to the bonding pad 80, the side of the planarization layer 90 opposite to the light reflecting layer 30, and the side of the pixel blocking layer 10 opposite to the array substrate 200, wherein the electrode layer 70 is electrically connected to the second electrode 45 of the light emitting element 40.

In the present embodiment, the electrode layer 70 can be a thin film of indium tin oxide. The plurality of light emitting elements 40 are electrically connected to the same electrode layer 70, so that the layout space of the display panel 1000 is saved, and the manufacturing is facilitated.

And S420, forming an insulating packaging layer 50 on the side surface of the electrode layer 70 opposite to the light-emitting element 40 so as to package the light-emitting element 40 in the groove 11.

Specifically, please refer to fig. 17, where fig. 17 is a schematic diagram of a corresponding structure formed in step S420 in a manufacturing method of a display panel disclosed in the embodiment of the present application. As shown in fig. 17, a dense insulating encapsulating layer 50 is formed on a side of the electrode layer 70 opposite to the light emitting element 40, the planarization layer 90, the light reflecting layer 30 and the pixel blocking layer 10 by chemical vapor deposition, that is, the insulating encapsulating layer 50 covers the electrode layer 70 to encapsulate the light emitting element 40 in the groove 11.

In the embodiment, the insulating encapsulation layer 50 may be made of silicon dioxide, and the thickness thereof may be 500nm to 5000nm, for example, 500nm, 1000nm, 1500nm, 1300nm, 2500nm, 3500nm, 4200nm, 4800nm, 5000nm, or other values. The insulating encapsulation layer 50 is used to insulate and protect the light emitting element 40 and the electrode layer 70, and it is understood that the insulating encapsulation layer 50 mainly insulates water, oxygen, and the like, protects the light emitting element 40 and the electrode layer 70, and increases the service life of the light emitting element 40 and the electrode layer 70.

And S430, forming a plurality of convex structures 52 on the surface of the insulating packaging layer 50 opposite to the electrode layer 70.

Specifically, referring to fig. 2, a plurality of protrusion structures 52 are prepared on a surface of the insulating encapsulation layer 50 opposite to the electrode layer 70 by a yellow light process, and the positions of the plurality of protrusion structures 52 correspond to the positions of the grooves 11.

In the present embodiment, the thickness of the protruding structures 52 may be 250nm to 2500nm,

for example, 250nm, 550nm, 750nm, 1000nm, 1250nm, 1550nm, 1750nm, 2200nm, 2500nm, or other values. In the embodiment of the present application, the thickness of the protruding structure 52 refers to the distance between the top of the protruding structure 52 and the surface of the insulating encapsulation layer 50 facing away from the light emitting element 40.

To sum up, the method for manufacturing a display panel disclosed in the embodiment of the present application includes: providing a base plate 300, and forming an array substrate 200 on one side of the base plate 300; forming a substrate electrode 60 and a pixel barrier layer 10 on the side of the array substrate 200 opposite to the bottom plate 300, forming a groove 11 on the side of the pixel barrier layer 10 opposite to the array substrate 200, and forming a reflective layer 30 on the inner wall of the groove 11; mounting a light emitting element 40 in the groove 11 and on a side of the light reflecting layer 30 opposite to the pixel blocking layer 10, wherein the light emitting element 40 is electrically connected with the substrate electrode 60; an electrode layer 70 and an insulating encapsulation layer 50 are sequentially formed at the open end of the groove 11 to encapsulate the light emitting element 40 in the groove 11. The light reflecting layer 30 is used for reflecting the light emitted from the light emitting element 40, increasing the luminous flux on the light emitting side, reducing the optical loss of the light emitting element 40, and reducing the power consumption. The insulating encapsulation layer 50 serves to insulate and protect the light emitting element 40, increasing the lifetime of the light emitting element 40. The side of the insulating encapsulation layer 50 opposite to the electrode layer 70 is provided with a plurality of protruding structures 52, and the protruding structures 52 are used for preventing the light emitted by the light emitting element 40 from generating a total reflection effect at the interface between the insulating encapsulation layer 50 and the air, so that the light cannot be emitted.

The flow chart described in this application is just one example, and there may be many variations to this diagram or the steps in this application without departing from the spirit of the application. For instance, the steps may be performed in a differing order, or steps may be added, deleted or modified. It will be understood by those skilled in the art that all or a portion of the above-described embodiments may be implemented and equivalents may be substituted for elements thereof without departing from the scope of the invention as defined in the claims.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example" or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

It should be understood that the application of the present application is not limited to the above examples, and that modifications or changes may be made by those skilled in the art based on the above description, and all such modifications and changes are intended to fall within the scope of the appended claims. Those skilled in the art will recognize that all or a portion of the above-described embodiments can be practiced without departing from the scope of the present disclosure, which is encompassed by the claims.

Claims

1. A display panel comprises a bottom plate, an array substrate and a light-emitting assembly which are sequentially stacked, wherein the array substrate is electrically connected with the light-emitting assembly, and the display panel is characterized in that the light-emitting assembly comprises a pixel barrier layer, at least one reflecting layer, at least one light-emitting element and an insulating packaging layer, the pixel barrier layer is positioned on one side of the array substrate back to the bottom plate, at least one groove is formed in one side of the pixel barrier layer back to the array substrate, the reflecting layer is positioned on the inner wall of the groove, the light-emitting element is installed in the groove and positioned on one side of the reflecting layer back to the pixel barrier layer, the insulating packaging layer covers the groove and packages the light-emitting element in the groove, and a plurality of protruding structures are convexly arranged on one side of the insulating packaging layer back to the light-emitting element, the light emitted by the light-emitting element and part of the light reflected by the light-reflecting layer are emitted from the plurality of convex structures.

2. The display panel of claim 1, further comprising at least one substrate electrode embedded in the pixel blocking layer and electrically connected to the light emitting device and the array substrate, and an electrode layer covering the open end of the groove and located on a side of the insulating encapsulation layer opposite to the protrusion structure, the electrode layer being electrically connected to the light emitting device.

3. The display panel according to claim 2, wherein the light-emitting element includes a light-emitting element body, a first electrode and a second electrode, the first electrode is fixedly disposed on a side of the light-emitting element body facing the substrate electrode, the first electrode electrically connects the light-emitting element body and the substrate electrode, the second electrode is fixedly disposed on a side of the light-emitting element body facing the electrode layer, and the second electrode electrically connects the light-emitting element body and the electrode layer.

4. The display panel according to claim 3, wherein the display panel further comprises a bonding pad and a flat layer, the bonding pad is disposed between the substrate electrode and the first electrode, the bonding pad is used for bonding the substrate electrode and the first electrode, the flat layer fills a gap between the light reflecting layer and the electrode layer and between the groove and the electrode layer, and the flat layer is used for fixing the light emitting element.

5. The display panel according to any one of claims 1 to 4, wherein the insulating encapsulation layer and the protrusion structure are made of silicon dioxide, the insulating encapsulation layer has a thickness of 500nm to 5000nm, and the protrusion structure has a thickness of 250nm to 2500 nm.

6. A display device comprising a glass cover plate and the display panel according to any one of claims 1 to 5, wherein the glass cover plate is disposed on a light-emitting side of the display panel to protect the display panel.

7. A method for manufacturing a display panel according to any one of claims 1 to 5, the method comprising:

providing a bottom plate, and forming an array substrate on one side surface of the bottom plate;

forming a substrate electrode and a pixel barrier layer on the side surface of the array substrate, which is opposite to the bottom plate, forming a groove on the side surface of the pixel barrier layer, which is opposite to the array substrate, and forming a light reflecting layer on the inner wall of the groove;

a light-emitting element is arranged in the groove and on one side of the light reflecting layer opposite to the pixel barrier layer, and the light-emitting element is electrically connected with the substrate electrode;

and sequentially forming an electrode layer and an insulating packaging layer at the opening end of the groove so as to package the light-emitting element in the groove.

8. The method of claim 7, wherein the forming a substrate electrode and a pixel blocking layer on a side of the array substrate opposite to the bottom plate, forming a groove on a side of the pixel blocking layer opposite to the array substrate, and forming a light reflecting layer on an inner wall of the groove comprises:

forming at least one substrate electrode on a side of the array substrate facing away from the backplane;

forming the pixel blocking layer covering the substrate electrode on the side surface of the array substrate opposite to the bottom plate;

at least one groove is formed in the side face, back to the array substrate, of the pixel blocking layer, and the substrate electrode is exposed out of the groove;

and forming the light reflecting layer on the inner wall of the groove, wherein the substrate electrode is exposed out of the light reflecting layer.

9. The method according to claim 7, wherein the mounting of a light emitting element in the recess and on a side of the light reflecting layer facing away from the pixel blocking layer, the light emitting element being electrically connected to the substrate electrode, comprises:

forming a bonding pad at one end of the substrate electrode, which is opposite to the array substrate;

bonding the light emitting element on a side of the bonding pad opposite to the substrate electrode;

and forming a flat layer in the groove to fix the light-emitting element.

10. The method according to claim 7, wherein the forming an electrode layer and an insulating encapsulation layer at the opening end of the groove in sequence to encapsulate the light emitting element in the groove comprises:

forming the electrode layer at the opening end of the groove to cover the light-emitting element in the groove, wherein the electrode layer is electrically connected with the light-emitting element;

forming the insulating packaging layer on the side face, back to the light-emitting element, of the electrode layer so as to package the light-emitting element in the groove;

and forming a plurality of convex structures on the surface of the insulating packaging layer, which faces away from the electrode layer.